类别是'category.PLDs(可编程逻辑器件)' (2797)

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品牌

数据表

库存

价格(含增值税)

数量

Rohs

表面安装

终端数量

JESD-609代码

无铅代码

ECCN 代码

端子表面处理

附加功能

HTS代码

包装方式

端子位置

终端形式

峰值回流焊温度(摄氏度)

端子间距

Reach合规守则

时间@峰值回流温度-最大值(s)

引脚数量

JESD-30代码

输出的数量

资历状况

温度等级

传播延迟

建筑学

输入数量

组织结构

座位高度-最大

可编程逻辑类型

输出功能

宏细胞数

JTAG BST

专用输入数量

系统内可编程

产品条款数量

长度

宽度

PZ5064NS12A44
PZ5064NS12A44
NXP Semiconductors 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

44

-40 °C

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

5.5 V

4.5 V

5 V

Obsolete

NXP SEMICONDUCTORS

67 MHz

32

85 °C

64 MACROCELLS

8542.39.00.01

QUAD

J BEND

1.27 mm

unknown

S-PQCC-J44

不合格

INDUSTRIAL

14 ns

2 DEDICATED INPUTS, 32 I/O

4.57 mm

EE PLD

MACROCELL

2

16.5862 mm

16.5862 mm

PALC16R4Q-25CQ
PALC16R4Q-25CQ
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

20

CERAMIC

DIP

DIP20,.3

RECTANGULAR

IN-LINE

5 V

Obsolete

ADVANCED MICRO DEVICES INC

DIP, DIP20,.3

28.5 MHz

70 °C

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

DUAL

THROUGH-HOLE

2.54 mm

unknown

R-XDIP-T20

4

不合格

COMMERCIAL

PAL-TYPE

16

EE PLD

REGISTERED

64

PALC16R4Q-25CQ
PALC16R4Q-25CQ
Rochester Electronics LLC 数据表

N/A

-

最小起订量: 1

最小包装量: 1

活跃

ROCHESTER ELECTRONICS LLC

,

8542.39.00.01

未说明

unknown

未说明

OT PLD

PZ3032NS12BC
PZ3032NS12BC
NXP Semiconductors 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

44

PLASTIC, TQFP-44

47 MHz

32

85 °C

-40 °C

PLASTIC/EPOXY

TQFP

SQUARE

FLATPACK, THIN PROFILE

3.63 V

3 V

3.3 V

Obsolete

NXP SEMICONDUCTORS

QFP

32 MACROCELLS

8542.39.00.01

QUAD

鸥翼

0.8 mm

unknown

44

S-PQFP-G44

不合格

INDUSTRIAL

15 ns

2 DEDICATED INPUTS, 32 I/O

1.2 mm

EE PLD

MACROCELL

2

10 mm

10 mm

XC95432-10HQ304C
XC95432-10HQ304C
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

304

3

232

70 °C

PLASTIC/EPOXY

HFQFP

SQUARE

FLATPACK, HEAT SINK/SLUG, FINE PITCH

5 V

Obsolete

XILINX INC

QFP

HFQFP,

e0

3A991.D

锡铅

8542.39.00.01

QUAD

鸥翼

0.5 mm

compliant

304

S-PQFP-G304

不合格

COMMERCIAL

10 ns

0 DEDICATED INPUTS, 232 I/O

4.5 mm

闪存 PLD

MACROCELL

40 mm

40 mm

XH95288-10HQG304C
XH95288-10HQG304C
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

304

FLATPACK, HEAT SINK/SLUG, FINE PITCH

5 V

Transferred

XILINX INC

QFP

HEAT SINK, QFP-304

192

PLASTIC/EPOXY

HFQFP

SQUARE

e3

哑光锡

8542.39.00.01

QUAD

鸥翼

0.5 mm

compliant

304

S-PQFP-G304

不合格

0 DEDICATED INPUTS, 192 I/O

4.5 mm

MASK PLD

MACROCELL

40 mm

40 mm

PZ3128IS15BB2
PZ3128IS15BB2
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

160

PLASTIC/EPOXY

QFP

QFP160,1.2SQ

SQUARE

FLATPACK

3.3 V

Obsolete

XILINX INC

3

85 °C

-40 °C

e0

锡铅

YES

8542.39.00.01

QUAD

鸥翼

225

0.635 mm

not_compliant

30

S-PQFP-G160

不合格

INDUSTRIAL

17.5 ns

EE PLD

128

YES

YES

PZ3128IS15BB2
PZ3128IS15BB2
NXP Semiconductors 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

160

QFP

28 X 28 X 3.40 MM, PLASTIC, SOT-322-2, QFP-160

59 MHz

96

85 °C

-40 °C

PLASTIC/EPOXY

QFP

QFP160,1.2SQ

SQUARE

FLATPACK

3.6 V

3 V

3.3 V

Obsolete

NXP SEMICONDUCTORS

8542.39.00.01

QUAD

鸥翼

0.65 mm

unknown

160

S-PQFP-G160

不合格

INDUSTRIAL

17.5 ns

2 DEDICATED INPUTS, 96 I/O

4.07 mm

EE PLD

MACROCELL

2

28 mm

28 mm

XC73108-12BG225C
XC73108-12BG225C
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

225

Obsolete

XILINX INC

BGA

PLASTIC, BGA-225

55.6 MHz

3

78

70 °C

PLASTIC/EPOXY

BGA

BGA225,15X15

SQUARE

网格排列

5.25 V

4.75 V

5 V

e0

锡铅

108 MACROCELLS; CONFIGURABLE I/O OPERATION-3.3V OR 5V; 3 EXTERNAL CLOCKS; 198 FLIP-FLOPS

8542.39.00.01

BOTTOM

BALL

225

1.5 mm

not_compliant

30

225

S-PBGA-B225

不合格

COMMERCIAL

30 ns

12 DEDICATED INPUTS, 78 I/O

3.5 mm

OT PLD

MACROCELL

108

NO

12

NO

27 mm

27 mm

LC-407403-204
LC-407403-204
Amphenol Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

XH95144-7PQ160C
XH95144-7PQ160C
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

160

PLASTIC/EPOXY

QFP

QFP160,1.2SQ

SQUARE

FLATPACK

5 V

Obsolete

ADVANCED MICRO DEVICES INC

PLASTIC, QFP-160

3

133

e0

锡铅

QUAD

鸥翼

0.65 mm

compliant

S-PQFP-G160

不合格

0 DEDICATED INPUTS, 133 I/O

3.94 mm

MASK PLD

MACROCELL

28 mm

28 mm

XH95144-7PQ160C
XH95144-7PQ160C
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

160

3

133

PLASTIC/EPOXY

QFP

QFP160,1.2SQ

SQUARE

FLATPACK

5 V

Transferred

XILINX INC

QFP

PLASTIC, QFP-160

e0

锡铅

8542.39.00.01

QUAD

鸥翼

0.65 mm

compliant

160

S-PQFP-G160

不合格

0 DEDICATED INPUTS, 133 I/O

3.94 mm

MASK PLD

MACROCELL

28 mm

28 mm

PZ3128IS15BB1-S
PZ3128IS15BB1-S
NXP Semiconductors 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

100

80

85 °C

-40 °C

PLASTIC/EPOXY

QFP

RECTANGULAR

FLATPACK

3.6 V

3 V

3.3 V

Transferred

NXP SEMICONDUCTORS

QFP,

59 MHz

8542.39.00.01

QUAD

鸥翼

0.65 mm

unknown

R-PQFP-G100

不合格

INDUSTRIAL

17.5 ns

2 DEDICATED INPUTS, 80 I/O

3.4 mm

EE PLD

MACROCELL

2

20 mm

14 mm

PZ3128IS15BB1-S
PZ3128IS15BB1-S
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

100

Obsolete

XILINX INC

QFP

14 X 20 MM, 2.80 MM HEIGHT, PLASTIC, MO-108CC1, QFP-100

59 MHz

3

80

85 °C

-40 °C

PLASTIC/EPOXY

QFP

QFP100,.7X.9

RECTANGULAR

FLATPACK

3.63 V

2.97 V

3.3 V

e0

锡铅

128 MACROCELLS

8542.39.00.01

TRAY

QUAD

鸥翼

225

0.65 mm

not_compliant

30

100

R-PQFP-G100

不合格

INDUSTRIAL

17.5 ns

2 DEDICATED INPUTS, 80 I/O

3.4 mm

EE PLD

MACROCELL

128

YES

2

YES

20 mm

14 mm

PZ3128IS15BB1-S
PZ3128IS15BB1-S
Philips Semiconductors 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

100

PLASTIC/EPOXY

QFP

QFP100,.7X.9

RECTANGULAR

FLATPACK

3.3 V

Transferred

飞利浦半导体

QFP, QFP100,.7X.9

85 °C

-40 °C

e0

Tin/Lead (Sn/Pb)

YES

8542.39.00.01

TRAY

QUAD

鸥翼

0.635 mm

unknown

R-PQFP-G100

不合格

INDUSTRIAL

17.5 ns

EE PLD

128

YES

YES

PZ5032-10BC-T
PZ5032-10BC-T
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

PZ5032-10BC-T
PZ5032-10BC-T
NXP Semiconductors 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

44

70 °C

PLASTIC/EPOXY

TQFP

SQUARE

FLATPACK, THIN PROFILE

5.25 V

4.75 V

5 V

Transferred

NXP SEMICONDUCTORS

TQFP,

59 MHz

32

8542.39.00.01

QUAD

鸥翼

0.8 mm

unknown

S-PQFP-G44

不合格

COMMERCIAL

15 ns

2 DEDICATED INPUTS, 32 I/O

1.2 mm

EE PLD

MACROCELL

2

10 mm

10 mm

EP900IPC-60
EP900IPC-60
Altera Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

40

PLASTIC/EPOXY

DIP

DIP40,.6

RECTANGULAR

IN-LINE

5 V

Obsolete

ALTERA CORP

DIP, DIP40,.6

16.7 MHz

70 °C

e0

锡铅

8542.39.00.01

DUAL

THROUGH-HOLE

220

2.54 mm

unknown

R-PDIP-T40

24

不合格

COMMERCIAL

60 ns

PAL-TYPE

36

MACROCELL

240

XC95288-10HQG304C
XC95288-10HQG304C
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

304

HFQFP

SQUARE

FLATPACK, HEAT SINK/SLUG, FINE PITCH

5 V

Obsolete

XILINX INC

QFP

HFQFP,

192

70 °C

PLASTIC/EPOXY

e3

哑光锡

8542.39.00.01

QUAD

鸥翼

0.5 mm

unknown

304

S-PQFP-G304

不合格

COMMERCIAL

10 ns

0 DEDICATED INPUTS, 192 I/O

4.5 mm

闪存 PLD

MACROCELL

40 mm

40 mm

XH95180-10HQ208C
XH95180-10HQ208C
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

208

168

PLASTIC/EPOXY

HFQFP

SQUARE

FLATPACK, HEAT SINK/SLUG, FINE PITCH

5 V

Transferred

XILINX INC

QFP

HEAT SINK, QFP-208

3

e0

锡铅

8542.39.00.01

QUAD

鸥翼

0.5 mm

compliant

208

S-PQFP-G208

不合格

0 DEDICATED INPUTS, 168 I/O

4.1 mm

MASK PLD

MACROCELL

28 mm

28 mm

XC95108F-10PQG100I
XC95108F-10PQG100I
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

100

Obsolete

XILINX INC

QFP

QFP,

67 MHz

3

81

85 °C

-40 °C

PLASTIC/EPOXY

QFP

RECTANGULAR

FLATPACK

5.5 V

4.5 V

5 V

e3

哑光锡

8542.39.00.01

QUAD

鸥翼

0.65 mm

compliant

100

R-PQFP-G100

不合格

INDUSTRIAL

10 ns

0 DEDICATED INPUTS, 81 I/O

3.4 mm

闪存 PLD

MACROCELL

20 mm

14 mm

EP22V10PI-15
EP22V10PI-15
Altera Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

24

Obsolete

ALTERA CORP

DIP

DIP, DIP24,.3

64.5 MHz

10

85 °C

-40 °C

PLASTIC/EPOXY

DIP

DIP24,.3

RECTANGULAR

IN-LINE

5.5 V

4.5 V

5 V

e0

锡铅

MACROCELLS INTERCONNECTED BY GLOBAL BUS; 10 MACROCELLS; 1 EXTERNAL CLOCK

8542.39.00.01

DUAL

THROUGH-HOLE

220

2.54 mm

unknown

24

R-PDIP-T24

10

不合格

INDUSTRIAL

15 ns

PAL-TYPE

22

11 DEDICATED INPUTS, 10 I/O

4.32 mm

OT PLD

MACROCELL

11

132

31.68 mm

7.62 mm

XC95216-15BGG352C
XC95216-15BGG352C
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

352

Obsolete

XILINX INC

BGA

LBGA,

55.6 MHz

3

166

70 °C

PLASTIC/EPOXY

LBGA

BGA352,26X26,50

SQUARE

GRID ARRAY, LOW PROFILE

5.25 V

4.75 V

5 V

e1

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

216 MACROCELLS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V

8542.39.00.01

BOTTOM

BALL

260

1.27 mm

compliant

30

352

S-PBGA-B352

不合格

COMMERCIAL

15 ns

0 DEDICATED INPUTS, 166 I/O

1.4 mm

闪存 PLD

MACROCELL

35 mm

35 mm

XC73144-15PG184I
XC73144-15PG184I
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

184

PGA,

45.5 MHz

120

85 °C

-40 °C

CERAMIC, METAL-SEALED COFIRED

PGA

SQUARE

网格排列

5.5 V

4.5 V

5 V

Obsolete

XILINX INC

PGA

144 MACROCELLS WITH PROGRAMMABLE I/O ARCHITECTURE

8542.39.00.01

PERPENDICULAR

PIN/PEG

unknown

184

S-CPGA-P184

不合格

INDUSTRIAL

36 ns

0 DEDICATED INPUTS, 120 I/O

UV PLD

MACROCELL

PZ3064-12A44-T
PZ3064-12A44-T
NXP Semiconductors 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

44

3.3 V

2.97 V

3.63 V

CHIP CARRIER

SQUARE

QCCJ

PLASTIC/EPOXY

70 °C

Transferred

NXP SEMICONDUCTORS

QCCJ,

67 MHz

32

8542.39.00.01

QUAD

J BEND

1.27 mm

unknown

S-PQCC-J44

不合格

COMMERCIAL

14.5 ns

2 DEDICATED INPUTS, 32 I/O

4.57 mm

EE PLD

MACROCELL

2

16.5862 mm

16.5862 mm