category.集成电路IC_category.集成电路IC品牌厂家，型号_价格_规格

类别是'category.片上系统（SoC）' (7695)

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产品型号	品牌	数据表	库存	价格(含增值税)	数量	触点镀层	包装/外壳	表面安装	供应商器件包装	终端数量															厂商																												操作温度	包装	系列	JESD-609代码	零件状态	温度系数	类型	电阻	端子表面处理	性别	HTS代码	子类别	额定功率	技术	端子位置	终端形式	端子间距	电阻器类型	Reach合规守则	引脚数量	JESD-30代码	资历状况	工作电源电压	电源	内存大小	电缆长度	核心处理器	周边设备	程序内存大小	建筑学	座位高度-最大	可编程逻辑类型
AGFB012R24C2E3V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	活跃	Tray	744				0°C ~ 100°C (TJ)		Agilex F																							1.4GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA								FPGA - 1.2M Logic Elements				-
XCVE1752-1MSINSVG1369	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	AMD	Tray	活跃								*
AGFB027R24C2E4X	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	744	Tray	活跃				0°C ~ 100°C (TJ)		Agilex F																							1.4GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA								FPGA - 2.7M Logic Elements				-
XCZU6EG-1FFVB1156I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	AMD	328	Tray	XCZU6	活跃				-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG																							500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA								Zynq®UltraScale+™ FPGA, 469K+ Logic Cells				-
XCZU5CG-2SFVC784E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	784-BFBGA, FCBGA	784-FCBGA (23x23)	AMD	252	Tray	XCZU5	活跃				0°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC CG																							533MHz, 1.3GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA								Zynq®UltraScale+™ FPGA, 256K+ Logic Cells				-
AGFB008R24C2I1V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	576	Tray	活跃				-40°C ~ 100°C (TJ)		Agilex F																							1.4GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA								FPGA - 764K Logic Elements				-
AGFA022R25A3E4X	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	624	Tray	活跃				0°C ~ 100°C (TJ)		Agilex F																							1.4GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA								FPGA - 2.2M Logic Elements				-
AGFB027R31C3I3V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	720	Tray	活跃				-40°C ~ 100°C (TJ)		Agilex F																							1.4GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA								FPGA - 2.7M Logic Elements				-
AGFA022R24C3E3V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	744	Tray	活跃				0°C ~ 100°C (TJ)		Agilex F																							1.4GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA								FPGA - 2.2M Logic Elements				-
XCVM1502-2MSEVFVC1760	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	AMD	Tray	活跃								*
AGIB019R18A1E2V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	480	Tray	活跃				0°C ~ 100°C (TJ)		Agilex I																							1.4GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA								FPGA - 1.9M Logic Elements				-
XCZU7EV-2FFVC1156E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	AMD	360	Tray	XCZU7	活跃				0°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EV																							533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA								Zynq®UltraScale+™ FPGA, 504K+ Logic Cells				-
AGFA027R25A2I3E	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	624	Tray	活跃				-40°C ~ 100°C (TJ)		Agilex F																							1.4GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA								FPGA - 2.7M Logic Elements				-
XCZU5EV-1FBVB900E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	900-BBGA, FCBGA	900-FCBGA (31x31)	AMD	204	Tray	XCZU5	活跃				0°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EV																							500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA								Zynq®UltraScale+™ FPGA, 256K+ Logic Cells				-
XCVC1802-1LSIVSVD1760	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BFBGA, FCBGA	1760-FCBGA (40x40)	AMD	692	Tray	活跃				-40°C ~ 100°C (TJ)		Versal™ AI Core																							400MHz, 1GHz	256KB		Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA								Versal™ AI Core FPGA, 1.5M Logic Cells				-
AGFB023R31C2E3E	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	3184-BFBGA Exposed Pad	3184-BGA (56x45)					480	0°C ~ 100°C (TJ)	Tray	Agilex F		活跃																					1.4GHz	256KB		Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA								FPGA - 2.3M Logic Elements
AGIC035R39A2E3E	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	3948-BFBGA Exposed Pad	3948-BGA (56x56)					576	0°C ~ 100°C (TJ)	Tray	Agilex I		活跃																					1.4GHz	256KB		Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA								FPGA - 3.54M Logic Elements
R8A77970LA01BA#GB	Renesas Electronics Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1								Tray			活跃
AGIA035R39A2E3E	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	3948-BFBGA Exposed Pad	3948-BGA (56x56)					576	0°C ~ 100°C (TJ)	Tray	Agilex I		活跃																					1.4GHz	256KB		Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA								FPGA - 3.54M Logic Elements
AGFD019R31C2E3V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	3184-BFBGA Exposed Pad	3184-BGA (56x45)					480	0°C ~ 100°C (TJ)	Tray	Agilex F		活跃																					1.4GHz	256KB		Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA								FPGA - 1.9M Logic Elements
XC7Z045-1FFG900I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	900-BBGA, FCBGA	900-FCBGA (31x31)	AMD	Tray	XC7Z045	活跃				Thumb-2	1.2, 3.3 V	FCBGA	2	表面贴装	130	-40 to 100 °C		Zynq®-7000																	900				1 V		667MHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32 Bit							Kintex™-7 FPGA, 350K Logic Cells				-		ARM Cortex A9
XC7Z030-2FB484I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-BBGA, FCBGA	484-FCBGA (23x23)	AMD	Tray	XC7Z030	活跃				RISC	1.2, 3.3 V	FCBGA	1	表面贴装	130	-40 to 100 °C		Zynq®-7000																	484						800MHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32 Bit							Kintex™-7 FPGA, 125K Logic Cells				-		ARM Cortex A9
M2S010T-1FGG484I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-BGA	YES	484-FPBGA (23x23)	484	-	64 kB	FBGA-484	微芯片技术	网格排列	3	PLASTIC/EPOXY	BGA484,22X22,40	1.2 V	40	1.14 V	有	M2S010T-1FGG484I	BGA	SQUARE	Microsemi Corporation	活跃	MICROSEMI CORP	1.26 V	5.77	1.2000 V	1.14 V	1.26 V	233	Tray	M2S010	活跃	-	166 MHz	12084 LE	SMD/SMT	-40 to 100 °C		SmartFusion®2	e1		100 ppm/K		60.4 kOhm	Tin/Silver/Copper (Sn/Ag/Cu)		8542.39.00.01	现场可编程门阵列	1 W	CMOS	BOTTOM	BALL	250	1 mm	通用型	compliant		S-PBGA-B484	233	不合格		1.2 V	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	233	2.44 mm	现场可编程门阵列	1	1	FPGA - 10K Logic Modules	12084	1 Core	256KB	23 mm	23 mm
XCVC1502-2MSEVSVA2197	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	AMD	60/62.5 W/VA	178 Ohm	表面贴装	Tray	活跃						Non-Latching	0.5 Vdc	Palladium Ruthenium/Gold	-40 to 85 °C		*				信号继电器																															1 ms						SPST-NO		10 mm
XCVM1302-1MLINSVF1369	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Gold	1369-BFBGA	1369-BGA (35x35)	AMD	磷青铜	316	Tray	活跃			Crimp	26 AWG	-55 to 150 °C		Versal™ Prime							Receptacle																600MHz, 1.3GHz	-	0.45 m	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA								Versal™ Prime FPGA, 70k Logic Cells				-