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类别是'category.片上系统（SoC）' (7695)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 底架 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 厂商 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 端子表面处理 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 工作电源电流 | 速度 | 内存大小 | uPs/uCs/外围ICs类型 | 核心处理器 | 周边设备 | 连接方式 | 数据率 | 建筑学 | 输入数量 | 可编程逻辑类型 | 逻辑元件/单元数 | 核心架构 | 阀门数量 | 速度等级 | 主要属性 | 逻辑单元数 | 闪光大小 | 座位高度(最大) | 长度 | 宽度 | RoHS状态 | 无铅 | ||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | AGIB027R31A1E1VB | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | 720 | 0°C ~ 100°C (TJ) | Tray | Agilex I | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| AGIB022R31A1I2VB | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | 720 | -40°C ~ 100°C (TJ) | Tray | Agilex I | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| A2F500M3G-FGG256 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 256-LBGA | 256-FPBGA (17x17) | MCU - 25, FPGA - 66 | 微芯片技术 | Tray | A2F500 | 活跃 | 0°C ~ 85°C (TJ) | SmartFusion® | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | STD | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||
| MPFS460T-1FCG1152IPP | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | 1152-FCBGA (35x35) | MCU - 136, FPGA - 468 | 微芯片技术 | Tray | 活跃 | -40°C ~ 100°C | PolarFire™ | - | 3.95MB | RISC-V | DMA, PCI, PWM | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 461K Logic Modules | 128kB | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | AMA3B2KK-KBR | Ambiq Micro, Inc. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 108-BGA | 108-BGA (5.3x4.3) | 74 | AMA3B2KK | -40°C ~ 85°C | Tape & Reel (TR) | Apollo3 Blue Plus | 活跃 | 96MHz | 768KB | ARM? Cortex?-M4F | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | GPIO, I2C, SPI, UART/USART, USB OTG | MCU | 2MB | |||||||||||||||||||||||||||||||||||||||||||||||||||
| SOM-2533BN0C-U0A1 | Advantech Corp | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Module | 8 | 0°C ~ 60°C | Box | SMARC | 活跃 | 3.6GHz | 4GB | Intel® N97 | HDMI, LCD, LVDS, SATA | CANbus, Ethernet, I2C, I2S, MMC/SD/SDIO, PCIe, SPDIF, SPI, UART, USB | MPU | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SOM-2533BN0C-S0A1 | Advantech Corp | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Module | 8 | 0°C ~ 60°C | Box | SMARC | 活跃 | 3.7GHz | 4GB | Intel® N200 | HDMI, LCD, LVDS, SATA | CANbus, Ethernet, I2C, I2S, MMC/SD/SDIO, PCIe, SPDIF, SPI, UART, USB | MPU | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SOM-2533DNCC-S8A1 | Advantech Corp | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Module | 8 | 0°C ~ 60°C | Box | SMARC | 活跃 | 3.8GHz | 16GB | Intel® i3-N305 | HDMI, LCD, LVDS, SATA | CANbus, Ethernet, I2C, I2S, MMC/SD/SDIO, PCIe, SPDIF, SPI, UART, USB | MPU | 64GB | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| SOM-2533CCBC-S5A1 | Advantech Corp | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Module | 8 | 0°C ~ 60°C | Box | SMARC | 活跃 | 3.4GHz | 8GB | Intel® Atom® x7425E | HDMI, LCD, LVDS, SATA | CANbus, Ethernet, I2C, I2S, MMC/SD/SDIO, PCIe, SPDIF, SPI, UART, USB | MPU | 32GB | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 10AS048H2F34I1HG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 11 Weeks | 1152-BBGA, FCBGA | 492 | -40°C~100°C TJ | Tray | Arria 10 SX | 活跃 | 3 (168 Hours) | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 480K Logic Elements | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | 5CSEBA4U19I7LN | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 15 Weeks | 484-FBGA | MCU - 151, FPGA - 66 | -40°C~100°C TJ | Tray | 2018 | Cyclone® V SE | 活跃 | compliant | 925MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 现场可编程门阵列 | FPGA - 40K Logic Elements | |||||||||||||||||||||||||||||||||||||||||||||||||
| 5ASXFB5H4F40I3NES | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FBGA, FC (40x40) | MCU - 208, FPGA - 540 | -40°C~100°C TJ | Tray | Arria V SX | Obsolete | 3 (168 Hours) | 5ASXFB5 | 1.05GHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 462K Logic Elements | ||||||||||||||||||||||||||||||||||||||||||||||||||
| 1SX280LU3F50I2VG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 2397-BBGA, FCBGA | 704 | -40°C~100°C TJ | Tray | Stratix® 10 SX | 活跃 | 3 (168 Hours) | 1.5GHz | 256KB | 微处理器电路 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 2800K Logic Elements | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||
| 10AS032H2F35E1HG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | 384 | 0°C~100°C TJ | Tray | Arria 10 SX | 活跃 | 3 (168 Hours) | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 320K Logic Elements | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||
| 10AS032H2F34E1HG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 1152-BBGA, FCBGA | 384 | 0°C~100°C TJ | Tray | Arria 10 SX | 活跃 | 3 (168 Hours) | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 320K Logic Elements | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||
| 10AS066H2F34E1HG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 1152-BBGA, FCBGA | 492 | 0°C~100°C TJ | Tray | Arria 10 SX | 活跃 | 3 (168 Hours) | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 660K Logic Elements | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||
| 10AS032H2F35I1HG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | 384 | -40°C~100°C TJ | Tray | Arria 10 SX | 活跃 | 3 (168 Hours) | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 320K Logic Elements | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | 10AS048E2F29I1HG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 780-BBGA, FCBGA | 360 | -40°C~100°C TJ | Tray | Arria 10 SX | 活跃 | 3 (168 Hours) | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 480K Logic Elements | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||
 | 5CSEBA5U23C7SN | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 672-FBGA | YES | MCU - 181, FPGA - 145 | 0°C~85°C TJ | Tray | 2018 | Cyclone® V SE | 活跃 | 3 (168 Hours) | 672 | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.1V | 0.8mm | 未说明 | 5CSEBA5 | S-PBGA-B672 | 145 | 不合格 | 1.13V | 1.11.2/3.32.5V | 1.07V | 800MHz | 64KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | 现场可编程门阵列 | FPGA - 85K Logic Elements | 85000 | 1.85mm | 23mm | 23mm | 符合RoHS标准 | |||||||||||||||||||||||||||
| 5CSXFC6C6U23I7LN | Intel | 数据表 | 2409 In Stock | - | 最小起订量: 1 最小包装量: 1 | 15 Weeks | 672-FBGA | MCU - 181, FPGA - 145 | -40°C~100°C TJ | Tray | 2018 | Cyclone® V SX | 活跃 | compliant | 925MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 现场可编程门阵列 | FPGA - 110K Logic Elements | |||||||||||||||||||||||||||||||||||||||||||||||||
| BCM3383DUKFEBG | Broadcom Limited | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 活跃 | 1 (Unlimited) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | A2F200M3F-FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2 Weeks | 484-BGA | YES | 484 | MCU - 41, FPGA - 94 | 0°C~85°C TJ | Tray | 2011 | SmartFusion® | e1 | 活跃 | 3 (168 Hours) | 484 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 250 | 1.5V | 1mm | 80MHz | 40 | A2F200 | 94 | 不合格 | 1.5V | 1.51.82.53.3V | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 1.575V | 1.425V | 4.5kB | 7mA | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | 400 kbps | MCU, FPGA | 现场可编程门阵列 | 2500 | ARM | 200000 | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 256KB | 2.44mm | 23mm | 23mm | 符合RoHS标准 | 无铅 | |||||||||||||||||
| BCM1125HA2K600 | Broadcom Limited | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA | Obsolete | 1 (Unlimited) | 600MHz | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 1SX280LU3F50E2LG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2397-BBGA, FCBGA | 704 | 0°C~100°C TJ | Tray | Stratix® 10 SX | 活跃 | 3 (168 Hours) | 1.5GHz | 256KB | 微处理器电路 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 2800K Logic Elements | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||
| 1SX280LU2F50I2VG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 2397-BBGA, FCBGA | 704 | -40°C~100°C TJ | Tray | Stratix® 10 SX | 活跃 | 3 (168 Hours) | 1.5GHz | 256KB | 微处理器电路 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 2800K Logic Elements | 符合RoHS标准 |
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AGIB027R31A1E1VB
Intel
分类:Embedded - System On Chip (SoC)
-
AGIB022R31A1I2VB
Intel
分类:Embedded - System On Chip (SoC)
-
A2F500M3G-FGG256
Microchip
分类:Embedded - System On Chip (SoC)
-
MPFS460T-1FCG1152IPP
Microchip
分类:Embedded - System On Chip (SoC)
-
AMA3B2KK-KBR
Ambiq Micro, Inc.
分类:Embedded - System On Chip (SoC)
-
SOM-2533BN0C-U0A1
Advantech Corp
分类:Embedded - System On Chip (SoC)
-
SOM-2533BN0C-S0A1
Advantech Corp
分类:Embedded - System On Chip (SoC)
-
SOM-2533DNCC-S8A1
Advantech Corp
分类:Embedded - System On Chip (SoC)
-
SOM-2533CCBC-S5A1
Advantech Corp
分类:Embedded - System On Chip (SoC)
-
10AS048H2F34I1HG
Intel
分类:Embedded - System On Chip (SoC)
-
5CSEBA4U19I7LN
Intel
分类:Embedded - System On Chip (SoC)
-
5ASXFB5H4F40I3NES
Intel
分类:Embedded - System On Chip (SoC)
-
1SX280LU3F50I2VG
Intel
分类:Embedded - System On Chip (SoC)
-
10AS032H2F35E1HG
Intel
分类:Embedded - System On Chip (SoC)
-
10AS032H2F34E1HG
Intel
分类:Embedded - System On Chip (SoC)
-
10AS066H2F34E1HG
Intel
分类:Embedded - System On Chip (SoC)
-
10AS032H2F35I1HG
Intel
分类:Embedded - System On Chip (SoC)
-
10AS048E2F29I1HG
Intel
分类:Embedded - System On Chip (SoC)
-
5CSEBA5U23C7SN
Intel
分类:Embedded - System On Chip (SoC)
-
5CSXFC6C6U23I7LN
Intel
分类:Embedded - System On Chip (SoC)
-
BCM3383DUKFEBG
Broadcom Limited
分类:Embedded - System On Chip (SoC)
-
A2F200M3F-FGG484
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
-
BCM1125HA2K600
Broadcom Limited
分类:Embedded - System On Chip (SoC)
-
1SX280LU3F50E2LG
Intel
分类:Embedded - System On Chip (SoC)
-
1SX280LU2F50I2VG
Intel
分类:Embedded - System On Chip (SoC)