N/A

-

表面贴装

100-TFBGA

YES

100-MBGA (6x6)

100

3

PLASTIC/EPOXY

BGA100,11X11,20

2.5 V

40

2.375 V

有

EPM570M100I5N

BGA

SQUARE

Intel Corporation

活跃

76

INTEL CORP

2.625 V

1.34

76

440

BGA, BGA100,11X11,20

网格排列

-40°C ~ 100°C (TJ)

Tray

MAX® II

e1

活跃

EAR99

锡银铜

IT CAN ALSO OPERATE AT 3.3V

8542.39.00.01

可编程逻辑器件

CMOS

BOTTOM

BALL

260

0.5 mm

compliant

EPM570

S-PBGA-B100

不合格

1.5/3.3,2.5/3.3 V

系统内可编程

8.7 ns

0 DEDICATED INPUTS, 76 I/O

闪存 PLD

MACROCELL

440

YES

2.5V, 3.3V

5.4ns

570

YES

N/A

-

表面贴装

100-LBGA

YES

100-FBGA (11x11)

100

LBGA, BGA100,10X10,40

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA100,10X10,40

2.5 V

40

2.375 V

85 °C

有

EPM570F100C5N

LBGA

SQUARE

Intel Corporation

活跃

76

INTEL CORP

2.625 V

0.75

76

440

0°C ~ 85°C (TJ)

Tray

MAX® II

e1

活跃

EAR99

Tin/Silver/Copper (Sn/Ag/Cu)

IT CAN ALSO OPERATE AT 3.3V

8542.39.00.01

可编程逻辑器件

CMOS

BOTTOM

BALL

260

1 mm

compliant

EPM570

S-PBGA-B100

不合格

1.5/3.3,2.5/3.3 V

OTHER

系统内可编程

8.7 ns

0 DEDICATED INPUTS, 76 I/O

1.7 mm

闪存 PLD

MACROCELL

440

YES

2.5V, 3.3V

5.4ns

570

YES

11 mm

11 mm

N/A

-

表面贴装

100-LBGA

YES

100-FBGA (11x11)

100

LBGA, BGA100,10X10,40

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA100,10X10,40

2.5 V

30

2.375 V

85 °C

有

EPM240F100C5N

LBGA

SQUARE

Intel Corporation

活跃

80

INTEL CORP

2.625 V

1.36

80

192

0°C ~ 85°C (TJ)

Tray

MAX® II

e1

活跃

EAR99

Tin/Silver/Copper (Sn/Ag/Cu)

IT CAN ALSO OPERATE AT 3.3V

8542.39.00.01

可编程逻辑器件

CMOS

BOTTOM

BALL

260

1 mm

compliant

EPM240

S-PBGA-B100

不合格

1.5/3.3,2.5/3.3 V

OTHER

系统内可编程

7.5 ns

0 DEDICATED INPUTS, 80 I/O

1.7 mm

闪存 PLD

MACROCELL

192

YES

2.5V, 3.3V

4.7ns

240

YES

11 mm

11 mm

N/A

-

表面贴装

160-BQFP

160-PQFP (28x28)

AMD

XC95108

Obsolete

108

Tray

108

-40°C ~ 85°C (TA)

XC9500

In System Programmable (min 10K program/erase cycles)

2400

4.5V ~ 5.5V

20 ns

6

N/A

-

表面贴装

352-LBGA Exposed Pad, Metal

352-MBGA (35x35)

AMD

XC95288

Obsolete

192

Tray

288

0°C ~ 70°C (TA)

XC9500

In System Programmable (min 10K program/erase cycles)

6400

4.75V ~ 5.25V

10 ns

16

N/A

-

表面贴装

44-TQFP

44-VQFP (10x10)

AMD

XC9536XV

Obsolete

34

Tray

36

0°C ~ 70°C (TA)

XC9500XV

系统内可编程

800

2.37V ~ 2.62V

7.5 ns

2

N/A

-

表面贴装

256-BGA

256-FBGA (17x17)

212

980

0°C ~ 85°C (TJ)

Tray

MAX® II

活跃

EPM1270

系统内可编程

2.5V, 3.3V

6.2ns

1270

N/A

-

N/A

-

NO

84

EPM5192GM883B-2

40 MHz

WPGA

SQUARE

Rochester Electronics LLC

活跃

64

ROCHESTER ELECTRONICS LLC

5.73

PGA

WPGA,

GRID ARRAY, WINDOW

CERAMIC, METAL-SEALED COFIRED

-55 °C

5 V

125 °C

LABS INTERCONNECTED BY PIA; 12 LABS; 192 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK

CMOS

PERPENDICULAR

PIN/PEG

2.54 mm

unknown

84

S-CPGA-P84

MILITARY

MILITARY

45 ns

7 DEDICATED INPUTS, 64 I/O

4.96 mm

UV PLD

MACROCELL

7

28.45 mm

28.45 mm

N/A

-

8542390000, 8542390000/8542390000/8542390000/8542390000/8542390000

MAX®

125C

Military

LCC

-55C to 125C

52

128

2500

8

5.5(V)

5(V)

无

4.5(V)

-55C

有

表面贴装

EPROM

100(MHz)

68

N/A

-

Ultra 37000

125C

Military

QFP

-55C to 125C

165

512

15000

32

5.5(V)

5(V)

无

4.5(V)

-55C

有

表面贴装

EEPROM

83(MHz)

208

N/A

-

无

表面贴装

LCC

44

N/A

-

表面贴装

100-LQFP

100-TQFP (14x14)

Infineon Technologies

CY37128

Obsolete

69

Tray

128

-40°C ~ 85°C (TA)

Ultra37000™

In-System Reprogrammable™ (ISR™) CMOS

3V ~ 3.6V

15 ns

N/A

-

表面贴装

256-BGA

256-FBGA (17x17)

164

256

0°C ~ 70°C (TA)

Tray

MAX® 7000B

Obsolete

EPM7256

系统内可编程

5000

2.375 V ~ 2.625 V

7.5ns

16

N/A

-

表面贴装

44-LCC (J-Lead)

YES

44-PLCC (16.59x16.59)

44

3.1

LCC

34

32

PLASTIC, LCC-44

CHIP CARRIER

3

PLASTIC/EPOXY

LDCC44,.7SQ

3.3 V

40

3 V

70 °C

有

EPM3032ALC44-10N

103.1 MHz

QCCJ

SQUARE

Altera Corporation

Transferred

34

ALTERA CORP

3.6 V

0°C ~ 70°C (TA)

Tray

MAX® 3000A

e3

有

Obsolete

EAR99

Matte Tin (Sn) - annealed

YES

8542.39.00.01

可编程逻辑器件

CMOS

QUAD

J BEND

245

1.27 mm

unknown

EPM3032

44

S-PQCC-J44

不合格

2.5/3.3,3.3 V

COMMERCIAL

系统内可编程

10 ns

0 DEDICATED INPUTS, 34 I/O

4.572 mm

EE PLD

600

MACROCELL

32

YES

3 V ~ 3.6 V

10.0ns

2

YES

16.5862 mm

16.5862 mm

N/A

-

表面贴装

144-LQFP

144-TQFP (20x20)

116

256

0°C ~ 70°C (TA)

Tray

MAX® 3000A

Obsolete

EPM3256

系统内可编程

5000

3 V ~ 3.6 V

7.5ns

16

N/A

-

表面贴装

292-BGA

292-PBGA (27x27)

Infineon Technologies

CY37256

Obsolete

197

Tray

256

0°C ~ 70°C (TA)

Ultra37000™

In-System Reprogrammable™ (ISR™) CMOS

3V ~ 3.6V

12 ns

N/A

-

表面贴装

100-TQFP

YES

100-TQFP (14x14)

100

TFQFP, TQFP100,.63SQ

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

TQFP100,.63SQ

2.5 V

30

2.375 V

85 °C

无

EPM240T100C4

TFQFP

SQUARE

Intel Corporation

活跃

80

INTEL CORP

2.625 V

1.39

80

192

0°C ~ 85°C (TJ)

Tray

MAX® II

e0

活跃

EAR99

锡铅

IT CAN ALSO OPERATE AT 3.3V

8542.39.00.01

可编程逻辑器件

CMOS

QUAD

鸥翼

235

0.5 mm

compliant

EPM240

S-PQFP-G100

不合格

1.5/3.3,2.5/3.3 V

商业扩展

系统内可编程

6.1 ns

0 DEDICATED INPUTS, 80 I/O

1.2 mm

闪存 PLD

MACROCELL

192

YES

2.5V, 3.3V

4.7ns

240

YES

14 mm

14 mm

N/A

-

表面贴装

100-TQFP

YES

100-TQFP (14x14)

100

Altera

5

76

440

Bulk

活跃

TFQFP, TQFP100,.63SQ

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

TQFP100,.63SQ

2.5 V

30

2.375 V

85 °C

无

EPM570T100C3

TFQFP

SQUARE

Intel Corporation

活跃

76

INTEL CORP

2.625 V

0°C ~ 85°C (TJ)

Tray

MAX® II

e0

活跃

EAR99

锡铅

IT CAN ALSO OPERATE AT 3.3V

8542.39.00.01

可编程逻辑器件

CMOS

QUAD

鸥翼

235

0.5 mm

compliant

EPM570

S-PQFP-G100

不合格

1.5/3.3,2.5/3.3 V

商业扩展

系统内可编程

5.4 ns

0 DEDICATED INPUTS, 76 I/O

1.2 mm

闪存 PLD

MACROCELL

440

YES

2.5V, 3.3V

5.4ns

570

YES

14 mm

14 mm

N/A

-

表面贴装

44-TQFP

44-TQFP (10x10)

36

64

0°C ~ 70°C (TA)

Tray

MAX® 7000S

Obsolete

EPM7064

系统内可编程

1250

4.75 V ~ 5.25 V

10.0ns

4

N/A

-

表面贴装

208-BFQFP

208-PQFP (28x28)

Infineon Technologies

CY39030

Obsolete

136

Tray

512

0°C ~ 70°C (TA)

Delta 39K™ ISR™

In-System Reprogrammable™ (ISR™) Flash

48000

2.5V, 3.3V

10 ns

N/A

-

N/A

-

表面贴装

20-UFQFN

20-STQFN (2x3)

Renesas Design Germany GmbH

活跃

9

Tape & Reel (TR)

4

-40°C ~ 85°C (TA)

GreenPAK™

OTP

2.3V ~ 5.5V

N/A

-

表面贴装

20-UFQFN

20-STQFN (2x3)

Renesas Design Germany GmbH

活跃

9

Tape & Reel (TR)

4

-40°C ~ 85°C (TA)

GreenPAK™

OTP

2.3V ~ 5.5V

N/A

-

表面贴装

208-BFQFP

208-PQFP (28x28)

AMD

XC2C512

Obsolete

173

Tray

512

0°C ~ 70°C (TA)

CoolRunner II

系统内可编程

12000

1.7V ~ 1.9V

7.1 ns

32