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产品型号	品牌	数据表	库存	价格(含增值税)	数量	包装/外壳	表面安装	供应商器件包装	终端数量												厂商																												操作温度	包装	系列	JESD-609代码	零件状态	端子表面处理	HTS代码	子类别	技术	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	Reach合规守则	JESD-30代码	输出的数量	资历状况	工作电源电压	电源	温度等级	速度	内存大小	核心处理器	周边设备	程序内存大小	连接方式	建筑学	输入数量	座位高度-最大	可编程逻辑类型	产品类别	主要属性
XCZU3EG-L2UBVA530E	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	530-WFBGA, FCBGA	530-FCBGA (16x9.5)	AMD 赛灵思	活跃	2 x 32 kB, 4 x 32 kB	154350 LE	+ 110 C	0 C	SMD/SMT	2 x 32 kB, 4 x 32 kB	256 kB			82	Tray	0°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG															850 mV			533MHz, 600MHz, 1.333GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA					Zynq®UltraScale+™ FPGA, 154K+ Logic Cells		7 Core	-
10AS032E2F29E2SG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FBGA-780	YES	780	320000 LE	1	SMD/SMT	40000 LAB	965337	Intel		Intel / Altera	Arria 10 SoC	Details	2 x 32 kB	-	BGA, BGA780,28X28,40	网格排列	PLASTIC/EPOXY	BGA780,28X28,40	0.9 V	未说明	0.87 V	100 °C	有	10AS032E2F29E2SG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.44		360	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	0°C ~ 100°C (TJ)	Tray	Arria 10 SX		活跃		8542.39.00.01	SOC - Systems on a Chip	CMOS	BOTTOM	BALL	未说明	1 mm	compliant	S-PBGA-B780	360	不合格		0.9 V	OTHER	1.5GHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	360	3.35 mm	现场可编程门阵列	SoC FPGA	FPGA - 320K Logic Elements	320000	2 Core	--	SoC FPGA	29 mm	29 mm
AGFA022R31C3I3E	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel			720	Tray	活跃	-40°C ~ 100°C (TJ)		Agilex F																		1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA					FPGA - 2.2M Logic Elements			-
XCZU2EG-1SFVC784I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	784-BFBGA, FCBGA	784-FCBGA (23x23)	AMD	XCZU2	活跃			252	Tray	-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG																		500MHz, 600MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 103K+ Logic Cells			-
XC7Z030-1FBG484I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-BBGA, FCBGA	484-FCBGA (23x23)	AMD	XC7Z030	活跃			130	Tray	-40°C ~ 100°C (TJ)		Zynq®-7000																		667MHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Kintex™-7 FPGA, 125K Logic Cells			-
M2S005S-1TQ144I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	144-LQFP	YES	144-TQFP (20x20)	144	微芯片技术	1.26 V	5.88	84	Tray	Obsolete	LFQFP, QFP144,.87SQ,20	FLATPACK, LOW PROFILE, FINE PITCH	3	PLASTIC/EPOXY	QFP144,.87SQ,20	1.2 V	30	1.14 V	无	M2S005S-1TQ144I	LFQFP	SQUARE	Microsemi Corporation	Obsolete	MICROSEMI CORP	-40°C ~ 100°C (TJ)		SmartFusion®2	e0		Tin/Lead (Sn/Pb)	8542.39.00.01	现场可编程门阵列	CMOS	QUAD	鸥翼	240	0.5 mm	not_compliant	S-PQFP-G144	84	不合格		1.2 V		166MHz	64KB	ARM® Cortex®-M3	-		CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	84	1.6 mm	现场可编程门阵列		FPGA - 5K Logic Modules	6060		128KB		20 mm	20 mm
XCVM1802-1MSEVSVA2197	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	2197-BFBGA, FCBGA	2197-FCBGA (45x45)	AMD 赛灵思			770	活跃	0°C ~ 100°C (TJ)																				600MHz, 1.3GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA					Versal™ Prime FPGA, 1.9M Logic Cells			-
XCVM1802-2MSEVSVD1760	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BFBGA, FCBGA	1760-FCBGA (40x40)	AMD 赛灵思			726	Tray	活跃	0°C ~ 100°C (TJ)		Versal™ Prime																		600MHz, 1.4GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA					Versal™ Prime FPGA, 1.9M Logic Cells			-
XCVM1802-2MLEVSVA2197	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	2197-BFBGA, FCBGA	2197-FCBGA (45x45)	AMD 赛灵思			770	Tray	活跃	0°C ~ 100°C (TJ)		Versal™ Prime																		600MHz, 1.4GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA					Versal™ Prime FPGA, 1.9M Logic Cells			-
XCVC1902-1MSIVSVA2197	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	2197-BFBGA, FCBGA	2197-FCBGA (45x45)	AMD 赛灵思			770	Tray	活跃	-40°C ~ 100°C (TJ)		Versal™ AI Core																		600MHz, 1.3GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA					Versal™ AI Core FPGA, 1.9M Logic Cells			-
XCVC1802-2MSEVSVD1760	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BFBGA, FCBGA	1760-FCBGA (40x40)	AMD 赛灵思			692	Tray	活跃	0°C ~ 100°C (TJ)		Versal™ AI Core																		600MHz, 1.4GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA					Versal™ AI Core FPGA, 1.5M Logic Cells			-
XCVC1802-1MSEVSVD1760	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BFBGA, FCBGA	1760-FCBGA (40x40)	AMD 赛灵思			692	Tray	活跃	0°C ~ 100°C (TJ)		Versal™ AI Core																		600MHz, 1.3GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA					Versal™ AI Core FPGA, 1.5M Logic Cells			-
XCVC1802-2MLIVSVA2197	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	2197-BFBGA, FCBGA	2197-FCBGA (45x45)	AMD 赛灵思			770	Tray	活跃	-40°C ~ 100°C (TJ)		Versal™ AI Core																		600MHz, 1.4GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA					Versal™ AI Core FPGA, 1.5M Logic Cells			-
XCVC1802-2MLIVSVD1760	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BFBGA, FCBGA	1760-FCBGA (40x40)	AMD 赛灵思			692	Tray	活跃	-40°C ~ 100°C (TJ)		Versal™ AI Core																		600MHz, 1.4GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA					Versal™ AI Core FPGA, 1.5M Logic Cells			-
XCVC1802-2MLIVIVA1596	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1596-BFBGA, FCBGA	1596-FCBGA (40x40)	AMD 赛灵思			500	Tray	活跃	-40°C ~ 100°C (TJ)		Versal™ AI Core																		600MHz, 1.4GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA					Versal™ AI Core FPGA, 1.5M Logic Cells			-
XCVC1902-2MLEVSVD1760	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BFBGA, FCBGA	1760-FCBGA (40x40)	AMD 赛灵思			692	Tray	活跃	0°C ~ 100°C (TJ)		Versal™ AI Core																		600MHz, 1.4GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA					Versal™ AI Core FPGA, 1.9M Logic Cells			-
XCVC1802-1MSIVSVA2197	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	2197-BFBGA, FCBGA	2197-FCBGA (45x45)	AMD 赛灵思			770	Tray	活跃	-40°C ~ 100°C (TJ)		Versal™ AI Core																		600MHz, 1.3GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA					Versal™ AI Core FPGA, 1.5M Logic Cells			-
XCVC1802-2MSIVSVD1760	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BFBGA, FCBGA	1760-FCBGA (40x40)	AMD 赛灵思			692	Tray	活跃	-40°C ~ 100°C (TJ)		Versal™ AI Core																		600MHz, 1.4GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA					Versal™ AI Core FPGA, 1.5M Logic Cells			-
XCVM1302-2MLINBVB1024	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1024-BFBGA	1024-BGA (31x31)	AMD 赛灵思			+ 110 C	- 40 C	1	Xilinx	Xilinx	316	Tray	活跃	-40°C ~ 100°C (TJ)		Versal™ Prime					SOC - Systems on a Chip										800 mV			600MHz, 1.4GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA				System-On-Modules - SOM	Versal™ Prime FPGA, 70k Logic Cells			-	SoC FPGA
XCVM1402-2MLENBVB1024	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1024-BFBGA	1024-BGA (31x31)	AMD 赛灵思			Xilinx	Xilinx	1	0 C	+ 110 C	424	Tray	活跃	0°C ~ 100°C (TJ)		Versal™ Prime					SOC - Systems on a Chip										800 mV			600MHz, 1.4GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA				System-On-Modules - SOM	Versal™ Prime FPGA, 1.2M Logic Cells			-	SoC FPGA
XCVM1302-2MLENBVB1024	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1024-BFBGA	1024-BGA (31x31)	AMD 赛灵思			+ 110 C	0 C	1	Xilinx	Xilinx	316	Tray	活跃	0°C ~ 100°C (TJ)		Versal™ Prime					SOC - Systems on a Chip										800 mV			600MHz, 1.4GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA				System-On-Modules - SOM	Versal™ Prime FPGA, 70k Logic Cells			-	SoC FPGA
XCVM1802-2LSEVFVC1760-5189	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	+ 110 C	0 C		1	Xilinx	Xilinx												SOC - Systems on a Chip										700 mV													System-On-Modules - SOM					SoC FPGA
XCVM1302-2MSINBVB1024	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1024-BFBGA	1024-BGA (31x31)	AMD 赛灵思			+ 110 C	- 40 C	1	Xilinx	Xilinx	316	Tray	活跃	-40°C ~ 100°C (TJ)		Versal™ Prime					SOC - Systems on a Chip										800 mV			600MHz, 1.4GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA				System-On-Modules - SOM	Versal™ Prime FPGA, 70k Logic Cells			-	SoC FPGA
XCVE1752-2MLIVSVG1369	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	+ 110 C					Xilinx	Xilinx	- 40 C									SOC - Systems on a Chip										800 mV													System-On-Modules - SOM					SoC FPGA
XCVE1752-1LLIVSVA2197	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	2197-BFBGA, FCBGA	2197-FCBGA (45x45)	AMD 赛灵思			+ 110 C	- 40 C	1	Xilinx	Xilinx	608	Tray	活跃	-40°C ~ 100°C (TJ)		Versal™ AI Core					SOC - Systems on a Chip										700 mV			400MHz, 1GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA				System-On-Modules - SOM	Versal™ AI Core FPGA, 1M Logic Cells			-	SoC FPGA