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类别是'category.片上系统（SoC）' (7695)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 安装类型 | 包装/外壳 | 表面安装 | 越来越多的功能 | 外壳材料 | 供应商器件包装 | 插入材料 | 终端数量 | 后壳材料，电镀 | 厂商 | 操作温度 | 系列 | JESD-609代码 | 终端 | 连接器类型 | 定位的数量 | 端子表面处理 | 颜色 | 应用 | HTS代码 | 紧固类型 | 子类别 | 额定电流 | 技术 | 端子位置 | 方向 | 终端形式 | 屏蔽/屏蔽 | 峰值回流焊温度（摄氏度） | 入口保护 | 端子间距 | Reach合规守则 | 外壳完成 | 外壳尺寸-插入 | JESD-30代码 | 输出的数量 | 资历状况 | 电源 | 界面 | 速度 | 内存大小 | 外壳尺寸，MIL | 核心处理器 | 周边设备 | 程序内存大小 | 连接方式 | 电缆开口 | 建筑学 | 输入数量 | 座位高度-最大 | 可编程逻辑类型 | 主要属性 | 逻辑单元数 | 核数量 | 闪光大小 | 特征 | 长度 | 宽度 | 触点表面处理厚度 - 配套 | 材料可燃性等级 | ||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | XCZU65DR-2FSVE1156I | AMD | 数据表 | 678 In Stock |
- | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU1EG-L1SFVC784I | AMD | 数据表 | 2275 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | AMD | - | Tray | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ | CAN/Serial I2C/SPI/U | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | MPU, FPGA | - | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVM1402-1MSIVFVC1596 | AMD | 数据表 | 657 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1596-BFBGA | 1596-BGA (37.5x37.5) | AMD | 748 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.3GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU1EG-1SFVA625E | AMD | 数据表 | 2491 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | AMD | - | Tray | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | MPU, FPGA | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVM1402-2LLENBVB1024 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1024-BFBGA | 1024-BGA (31x31) | AMD | 424 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal™ Prime | 450MHz, 1.08GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVM1402-2MLEVFVC1596 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1596-BFBGA | 1596-BGA (37.5x37.5) | AMD | 748 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.4GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XAZU1EG-L1SFVC784I | AMD | 数据表 | 2635 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | AMD | 180 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq®UltraScale+™ FPGA, 82K Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVC1502-1LSEVSVA2197 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD | 586 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal™ AI Core | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 80k Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVM1402-2HSINSVF1369 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1369-BFBGA | 1369-BGA (35x35) | AMD | 424 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Versal™ Prime | 800MHz, 1.65GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVM1402-1MSENSVF1369 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1369-BFBGA | 1369-BGA (35x35) | AMD | 424 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.3GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVM1302-1LSINSVF1369 | AMD | 数据表 | 845 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1369-BFBGA | 1369-BGA (35x35) | AMD | 316 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Versal™ Prime | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU65DR-L1FSVE1156I | AMD | 数据表 | 880 In Stock |
- | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVC1802-2MSEVSVD1760 | AMD | 数据表 | 735 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 692 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal™ AI Core | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVC1702-1LLINSVG1369 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1369-BFBGA | 1369-BGA (35x35) | AMD | 500 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Versal™ AI Core | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU1CG-L2SBVA484E | AMD | 数据表 | 2336 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | AMD | - | Tray | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ | CAN/Serial I2C/SPI/U | 533MHz, 1.333GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | MPU, FPGA | - | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVM1802-2MLEVSVD1760 | AMD | 数据表 | 909 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 726 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S025T-VFG400 | Microchip | 数据表 | 2586 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 400-LFBGA | 400-VFBGA (17x17) | 微芯片技术 | 207 | Tray | M2S025 | 活跃 | - | 166 MHz | 27696 LE | - | 64 kB | 0°C ~ 85°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MPFS250T-FCVG784EES | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | 微芯片技术 | MCU - 136, FPGA - 372 | Tray | 活跃 | 0°C ~ 100°C | PolarFire™ | - | 2.2MB | RISC-V | DMA, PCI, PWM | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 254K Logic Modules | 128kB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S150-1FC1152I | Microchip | 数据表 | 2707 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 1152 | 574 | Tray | M2S150 | 活跃 | - | 166 MHz | 146124 LE | SMD/SMT | - | 64 kB | 微芯片技术 | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | 1.2 V | 30 | 1.14 V | 无 | M2S150-1FC1152I | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.26 V | 5.81 | -40°C ~ 100°C (TJ) | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B1152 | 574 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 574 | 2.9 mm | 现场可编程门阵列 | FPGA - 150K Logic Modules | 146124 | 1 Core | 512KB | 35 mm | 35 mm | |||||||||||||||||||||||||||||
| XCZU43DR-L2FSVG1517I | AMD | 数据表 | 550 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD | 561 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU47DR-L2FSVE1156I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | 366 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AGFA008R16A2E2V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Free Hanging (In-Line) | - | - | Aluminum | - | - | - | Amphenol Aerospace Operations | Copper Alloy | Gold | 活跃 | MS27467E25B | Metal | Bulk | - | 384 | -65°C ~ 175°C | Military, MIL-DTL-38999 Series I, LJT | Crimp | Plug, Male Pins | 19 | 橄榄色 | Aviation, Military | 卡口锁 | - | A | Shielded | 抗环境干扰 | 橄榄色镉包镍 | 25-19 | 1.4GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MPU, FPGA | FPGA - 764K Logic Elements | - | 联接螺母 | 50.0µin (1.27µm) | - | |||||||||||||||||||||||||||||||||||||||||||||||||
| AGFA014R24B2E3V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Kamaya Inc. | Tape & Reel (TR) | 活跃 | 768 | 0°C ~ 100°C (TJ) | * | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVE1752-1LSIVSVA1596 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1596-BFBGA | 1596-BGA (37.5x37.5) | AMD | 500 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Versal™ AI Core | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU67DR-L2FFVE1156I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 |
-
XCZU65DR-2FSVE1156I
AMD
分类:Embedded - System On Chip (SoC)
155,918.568672
-
XCZU1EG-L1SFVC784I
AMD
分类:Embedded - System On Chip (SoC)
2,853.828119
-
XCVM1402-1MSIVFVC1596
AMD
分类:Embedded - System On Chip (SoC)
49,822.234878
-
XCZU1EG-1SFVA625E
AMD
分类:Embedded - System On Chip (SoC)
1,985.271738
-
XCVM1402-2LLENBVB1024
AMD
分类:Embedded - System On Chip (SoC)
-
XCVM1402-2MLEVFVC1596
AMD
分类:Embedded - System On Chip (SoC)
-
XAZU1EG-L1SFVC784I
AMD
分类:Embedded - System On Chip (SoC)
2,911.281487
-
XCVC1502-1LSEVSVA2197
AMD
分类:Embedded - System On Chip (SoC)
-
XCVM1402-2HSINSVF1369
AMD
分类:Embedded - System On Chip (SoC)
-
XCVM1402-1MSENSVF1369
AMD
分类:Embedded - System On Chip (SoC)
-
XCVM1302-1LSINSVF1369
AMD
分类:Embedded - System On Chip (SoC)
32,478.347465
-
XCZU65DR-L1FSVE1156I
AMD
分类:Embedded - System On Chip (SoC)
122,255.052782
-
XCVC1802-2MSEVSVD1760
AMD
分类:Embedded - System On Chip (SoC)
164,022.016757
-
XCVC1702-1LLINSVG1369
AMD
分类:Embedded - System On Chip (SoC)
-
XCZU1CG-L2SBVA484E
AMD
分类:Embedded - System On Chip (SoC)
2,506.017801
-
XCVM1802-2MLEVSVD1760
AMD
分类:Embedded - System On Chip (SoC)
84,599.574022
-
M2S025T-VFG400
Microchip
分类:Embedded - System On Chip (SoC)
992.620095
-
MPFS250T-FCVG784EES
Microchip
分类:Embedded - System On Chip (SoC)
-
M2S150-1FC1152I
Microchip
分类:Embedded - System On Chip (SoC)
3,975.546880
-
XCZU43DR-L2FSVG1517I
AMD
分类:Embedded - System On Chip (SoC)
220,294.741425
-
XCZU47DR-L2FSVE1156I
AMD
分类:Embedded - System On Chip (SoC)
-
AGFA008R16A2E2V
Intel
分类:Embedded - System On Chip (SoC)
-
AGFA014R24B2E3V
Intel
分类:Embedded - System On Chip (SoC)
-
XCVE1752-1LSIVSVA1596
AMD
分类:Embedded - System On Chip (SoC)
-
XCZU67DR-L2FFVE1156I
AMD
分类:Embedded - System On Chip (SoC)