类别是'category.片上系统(SoC)' (7695)

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Rohs

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包装/外壳

表面安装

越来越多的功能

外壳材料

供应商器件包装

材料

插入材料

形状

终端数量

后壳材料,电镀

厂商

Voltage Rating AC

操作温度

包装

系列

尺寸/尺寸

容差

零件状态

湿度敏感性等级(MSL)

终止次数

终端

温度系数

连接器类型

类型

电阻

定位的数量

组成

颜色

应用

功率(瓦特)

HTS代码

紧固类型

子类别

额定电流

技术

电压 - 供电

端子位置

方向

终端形式

屏蔽/屏蔽

峰值回流焊温度(摄氏度)

入口保护

端子间距

Reach合规守则

额定电流

频率

频率稳定性

输出量

外壳完成

外壳尺寸-插入

JESD-30代码

功能

基本谐振器

最大电流源

输出的数量

资历状况

工作电源电压

ESR(等效串联电阻)

失败率

电源

温度等级

电流 - 电源(禁用)(最大值)

镀层

附着方法

负载电容

速度

内存大小

反向泄漏电流@ Vr

操作模式

外壳尺寸,MIL

不同 If 时电压 - 正向 (Vf)

核心处理器

频率容差

周边设备

电源线保护

程序内存大小

扩频带宽

连接方式

电压 - 击穿

功率 - 最大

电缆开口

功率 - 脉冲峰值

峰值脉冲电流(10/1000μs)

回应时间

不同 Ipp 时电压 - 箝位(最大值)

建筑学

电压 - 反向断态(典型值)

输入数量

保险丝类型

座位高度-最大

单向通道

可编程逻辑类型

分断能力@额定电压

电压 - 齐纳(标准值)(Vz)

产品类别

电容@频率

收发器数量

绝对牵引范围 (APR)

主要属性

逻辑单元数

核数量

闪光大小

特征

产品类别

高度

座位高度(最大)

长度

宽度

电镀厚度

触点表面处理厚度 - 配套

材料可燃性等级

评级结果

AGIB027R31B2E3E
AGIB027R31B2E3E
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

Intel

活跃

Tray

720

0°C ~ 100°C (TJ)

Agilex I

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.7M Logic Elements

-

BCM3382DKFEBG
BCM3382DKFEBG
AVAGO 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Holder

Rectangular, Blade

--

CSA, UR

--

Compliant

1.3kV

--

Bulk

--

2.913 L x 2.402 W x 3.032 H (74.00mm x 61.00mm x 77.00mm)

活跃

--

Electrical, Industrial

350A

--

Square

100kA

Indicating

BCM33843MKFSBGB0T
BCM33843MKFSBGB0T
Broadcom 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

Broadcom Limited

-

Tray

BCM33843

活跃

-

-

2.4GHz, 5GHz

-

-

-

-

-

-

-

10AS066H1F34I1HG
10AS066H1F34I1HG
ALTERA 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1152-BBGA, FCBGA

1152-FBGA (35x35)

82500 LAB

973529

Intel

Intel / Altera

Arria 10 SoC

KYOCERA AVX

Details

2 x 32 kB

-

10AS066H1F34I1HG

活跃

INTEL CORP

5.66

Bulk

活跃

492

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

660000 LE

+ 100 C

- 40 C

24

SMD/SMT

-40°C ~ 100°C (TJ)

Tray

*

活跃

SOC - Systems on a Chip

unknown

950 mV

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

SoC FPGA

FPGA - 660K Logic Elements

2 Core

--

SoC FPGA

AGFA014R24C2I3E
AGFA014R24C2I3E
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

DO-218AC

DO-218AC

Intel

--

744

Tray

活跃

-55°C ~ 175°C (TJ)

Automotive, AEC-Q101, PAR®

活跃

Zener

汽车

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

16.7V

3600W (3.6kW)

148A

24.4V

MPU, FPGA

15V

1

--

FPGA - 1.4M Logic Elements

-

XC7Z007S-1CLG400C
XC7Z007S-1CLG400C
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Free Hanging (In-Line)

400-LFBGA, CSPBGA

-

Thermoplastic

400-CSPBGA (17x17)

Thermoplastic

Thermoplastic

Conxall/Switchcraft

600VAC/DC

Bulk

Plastic

活跃

Copper Alloy

Gold

100

XC7Z007

-40°C ~ 85°C

Multi-Con-X®, Insta-Click™

焊杯

Plug, Male Pins

4

Black

-

卡口锁

Keyed

Unshielded

IP67 - Dust Tight, Waterproof

因线规而异

-

-

667MHz

256KB

-

Single ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

0.280 ~ 0.290 (7.11mm ~ 7.37mm)

MCU, FPGA

Artix™-7 FPGA, 23K Logic Cells

-

Backshell, UV Resistant

-

UL94 HB

XCZU15EG-2FFVB1156I
XCZU15EG-2FFVB1156I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

4-SMD, No Lead

1156-FCBGA (35x35)

SiTime

活跃

Tape & Reel (TR)

328

XCZU15

-40°C ~ 85°C

SiT8208

0.197 L x 0.126 W (5.00mm x 3.20mm)

XO (Standard)

2.5V

66.666 MHz

±10ppm

LVCMOS, LVTTL

Enable/Disable

MEMS

33mA

31mA

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

-

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

-

Zynq®UltraScale+™ FPGA, 747K+ Logic Cells

-

0.031 (0.80mm)

-

XCZU19EG-L2FFVC1760E
XCZU19EG-L2FFVC1760E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1760-BBGA, FCBGA

1760-FCBGA (42.5x42.5)

PEI-Genesis

Bulk

活跃

512

XCZU19

0°C ~ 100°C (TJ)

*

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells

-

XC7Z007S-1CLG225I
XC7Z007S-1CLG225I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

225-LFBGA, CSPBGA

225-CSPBGA (13x13)

铍铜

--

AMD

XC7Z007

活跃

54

Tray

121°C

插槽安装

活跃

Fingerstock

Zinc + Clear Chromate

Slot

667MHz

256KB

Single ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Artix™-7 FPGA, 23K Logic Cells

-

0.130 (3.30mm)

0.975 (24.77mm)

0.370 (9.40mm)

299.21µin (7.60µm)

AGFA022R24C2E1V
AGFA022R24C2E1V
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

Intel

Non-Compliant

744

Tray

活跃

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.2M Logic Elements

-

XCZU47DR-1FSVE1156I
XCZU47DR-1FSVE1156I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

366

Tray

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCZU49DR-L1FSVF1760I
XCZU49DR-L1FSVF1760I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1760-BBGA, FCBGA

1760-FCBGA (42.5x42.5)

AMD

活跃

Tray

622

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCZU5EV-3FBVB900E
XCZU5EV-3FBVB900E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

204

Tray

XCZU5

活跃

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EV

600MHz, 1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 256K+ Logic Cells

-

XC7Z030-1FF676I
XC7Z030-1FF676I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

676-BBGA, FCBGA

676-FCBGA (27x27)

AMD

Tray

XC7Z030

活跃

-40°C ~ 100°C (TJ)

Zynq®-7000

667MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Kintex™-7 FPGA, 125K Logic Cells

-

XCZU46DR-2FFVH1760I
XCZU46DR-2FFVH1760I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1760-BBGA, FCBGA

1760-FCBGA (42.5x42.5)

AMD

574

Tray

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCZU7EG-3FBVB900E
XCZU7EG-3FBVB900E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

204

Tray

XCZU7

活跃

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

600MHz, 667MHz, 1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-

10AS066K2F40E1HG
10AS066K2F40E1HG
ALTERA 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

1517-FBGA (40x40)

21

SMD/SMT

82500 LAB

965026

Intel

Intel / Altera

ITT Cannon, LLC

Arria 10 SoC

Details

2 x 32 kB

-

10AS066K2F40E1HG

活跃

INTEL CORP

5.66

Bulk

KJB0T

活跃

696

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

660000 LE

+ 100 C

0 C

0°C ~ 100°C (TJ)

Tray

*

活跃

SOC - Systems on a Chip

unknown

950 mV

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

SoC FPGA

FPGA - 660K Logic Elements

2 Core

--

SoC FPGA

10AS066H2F34I2SG
10AS066H2F34I2SG
ALTERA 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

1206 (3216 Metric)

YES

1206

1152

最后一次购买

492

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

660000 LE

1

SMD/SMT

82500 LAB

973532

Intel

Intel / Altera

Arria 10 SoC

Diodes Incorporated

Details

2 x 32 kB

-

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

-40 °C

0.9 V

未说明

0.87 V

100 °C

10AS066H2F34I2SG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.46

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

LZ52C

55 Ohms

-65°C ~ 175°C (TJ)

Tray

-

±2%

活跃

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

492

不合格

0.9 V

INDUSTRIAL

1.5GHz

256KB

100 nA @ 15 V

1.5 V @ 200 mA

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

500 mW

MCU, FPGA

492

3.65 mm

现场可编程门阵列

20 V

SoC FPGA

FPGA - 660K Logic Elements

660000

2 Core

--

SoC FPGA

35 mm

35 mm

10AS048H4F34I3LG
10AS048H4F34I3LG
ALTERA 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

HC-49/US

YES

1152

Suntsu Electronics, Inc.

INTEL CORP

0.93 V

5.47

Bulk

活跃

492

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

-40 °C

0.9 V

未说明

0.87 V

100 °C

10AS048H4F34I3LG

BGA

SQUARE

Intel Corporation

活跃

-20°C ~ 70°C

Tray

SXTHM2

0.524 L x 0.197 W (13.30mm x 5.00mm)

活跃

兆赫晶体

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

30 MHz

±50ppm

S-PBGA-B1152

492

不合格

30 Ohms

0.9 V

INDUSTRIAL

18pF

1.5GHz

256KB

Fundamental

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

±20ppm

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

492

3.65 mm

现场可编程门阵列

FPGA - 480K Logic Elements

480000

--

0.177 (4.50mm)

35 mm

35 mm

1SX250LU2F50E2VG
1SX250LU2F50E2VG
ALTERA 数据表

N/A

-

最小起订量: 1

最小包装量: 1

PEI-Genesis

Bulk

活跃

704

0°C ~ 100°C (TJ)

Tray

*

活跃

1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

FPGA - 2500K Logic Elements

--

10AS032E1F27I1HG
10AS032E1F27I1HG
ALTERA 数据表

N/A

-

最小起订量: 1

最小包装量: 1

672-BBGA, FCBGA

672-FBGA (27x27)

Intel

Intel / Altera

Arria 10 SoC

Details

KYOCERA AVX

2 x 32 kB

-

10AS032E1F27I1HG

活跃

INTEL CORP

5.66

Bulk

活跃

240

2 x 32 kB

1.2 GHz

320000 LE

+ 100 C

- 40 C

40

SMD/SMT

40000 LAB

965053

-40°C ~ 100°C (TJ)

Tray

*

活跃

SOC - Systems on a Chip

unknown

950 mV

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

SoC FPGA

12 Transceiver

FPGA - 320K Logic Elements

2 Core

--

SoC FPGA

10AS048H2F34I2LG
10AS048H2F34I2LG
ALTERA 数据表

N/A

-

最小起订量: 1

最小包装量: 1

0805 (2012 Metric)

YES

0805

1152

KOA Speer Electronics, Inc.

Intel Corporation

活跃

INTEL CORP

0.93 V

5.47

Tape & Reel (TR)

RS73G2ART

活跃

492

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

-40 °C

0.9 V

未说明

0.87 V

100 °C

10AS048H2F34I2LG

BGA

SQUARE

-55°C ~ 155°C

Tray

RS73-RT

0.079 L x 0.049 W (2.00mm x 1.25mm)

±0.1%

活跃

2

±50ppm/°C

680 Ohms

厚膜

0.25W, 1/4W

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

492

不合格

-

0.9 V

INDUSTRIAL

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

492

3.65 mm

现场可编程门阵列

FPGA - 480K Logic Elements

480000

--

Automotive AEC-Q200

0.023 (0.60mm)

35 mm

35 mm

AEC-Q200

10AS032E3F27I2LG
10AS032E3F27I2LG
ALTERA 数据表

N/A

-

最小起订量: 1

最小包装量: 1

FBGA-672

YES

672

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

320000 LE

1

SMD/SMT

40000 LAB

965000

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

PEI-Genesis

-

BGA, BGA672,26X26,40

网格排列

PLASTIC/EPOXY

BGA672,26X26,40

-40 °C

0.9 V

未说明

0.87 V

100 °C

10AS032E3F27I2LG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.45

Bulk

活跃

240

-40°C ~ 100°C (TJ)

Tray

*

活跃

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B672

240

不合格

0.9 V

INDUSTRIAL

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

240

3.25 mm

现场可编程门阵列

SoC FPGA

FPGA - 320K Logic Elements

320000

2 Core

--

SoC FPGA

27 mm

27 mm

10AS066K2F40I1HG
10AS066K2F40I1HG
ALTERA 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

1517-FBGA (40x40)

82500 LAB

973538

Intel

Intel / Altera

Arria 10 SoC

PEI-Genesis

Details

2 x 32 kB

-

10AS066K2F40I1HG

活跃

INTEL CORP

5.66

Bulk

活跃

696

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

660000 LE

+ 100 C

- 40 C

21

SMD/SMT

-40°C ~ 100°C (TJ)

Tray

*

活跃

SOC - Systems on a Chip

unknown

950 mV

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

SoC FPGA

FPGA - 660K Logic Elements

2 Core

--

SoC FPGA

10AS027H3F34I2LG
10AS027H3F34I2LG
ALTERA 数据表

N/A

-

最小起订量: 1

最小包装量: 1

0805 (2012 Metric)

YES

0805

1152

384

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

270000 LE

1

SMD/SMT

33750 LAB

964820

Intel

Intel / Altera

Arria 10 SoC

Details

KOA Speer Electronics, Inc.

2 x 32 kB

-

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

-40 °C

0.9 V

未说明

0.87 V

100 °C

10AS027H3F34I2LG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.43

Tape & Reel (TR)

RS73G2ART

活跃

-55°C ~ 155°C

Tray

RS73-RT

0.079 L x 0.049 W (2.00mm x 1.25mm)

±0.5%

活跃

2

±50ppm/°C

464 kOhms

厚膜

0.25W, 1/4W

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

384

不合格

-

0.9 V

INDUSTRIAL

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

384

3.65 mm

现场可编程门阵列

SoC FPGA

FPGA - 270K Logic Elements

270000

2 Core

--

Automotive AEC-Q200

SoC FPGA

0.023 (0.60mm)

35 mm

35 mm

AEC-Q200