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产品型号	品牌	数据表	库存	价格(含增值税)	数量	生命周期状态	安装类型	包装/外壳	表面安装	越来越多的功能	外壳材料	供应商器件包装	终端数量															厂商																												操作温度	系列	尺寸/尺寸	容差	JESD-609代码	无铅代码	终止次数	终端	温度系数	连接器类型	类型	电阻	定位的数量	端子表面处理	组成	颜色	功率(瓦特)	附加功能	HTS代码	紧固类型	子类别	额定电流	技术	端子位置	方向	终端形式	屏蔽/屏蔽	峰值回流焊温度（摄氏度）	入口保护	端子间距	Reach合规守则	频率	时间@峰值回流温度-最大值(s)	频率稳定性	外壳完成	引脚数量	外壳尺寸-插入	JESD-30代码	输出的数量	资历状况	ESR（等效串联电阻）	失败率	电源	温度等级	负载电容	速度	内存大小	操作模式	外壳尺寸，MIL	核心处理器	频率容差	周边设备	程序内存大小	连接方式	建筑学	输入数量	座位高度-最大	可编程逻辑类型	筛选水平
XCZU4CG-2FBVB900I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	900-BBGA, FCBGA	900-FCBGA (31x31)	AMD	Tray	XCZU4	活跃	Industrial grade							192,150	FCBGA	0.8500 V	0.808 V	204	0.892 V	204	-40 to 100 °C	Zynq® UltraScale+™ MPSoC CG																																		900										533MHz, 1.3GHz	256KB			Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™		DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				Industrial	2	Zynq®UltraScale+™ FPGA, 192K+ Logic Cells	175,680			-
M2S150-FCV484I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-BFBGA	484-FBGA (19x19)	微芯片技术	64 kB							1.2000 V	273	Tray	M2S150	活跃	-	166 MHz	146124 LE	-	-40 to 100 °C	SmartFusion®2																																												166MHz	64KB			ARM® Cortex®-M3		DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA					STD	FPGA - 150K Logic Modules			1 Core	512KB
M2S025TS-1VFG400T2	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	400-LFBGA	400-VFBGA (17x17)	微芯片技术	40	有	M2S025TS-1VFG400T2	Microsemi Corporation	活跃	MICROSEMI CORP	5.81							1.2000 V	207	Tray	M2S025	活跃	0 to 85 °C	Automotive, AEC-Q100, SmartFusion®2			e1	有								Tin/Silver/Copper (Sn/Ag/Cu)														250			compliant															166MHz	64KB			ARM® Cortex®-M3		DDR, PCIe, SERDES		CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA			现场可编程门阵列		1	FPGA - 25K Logic Modules				256KB
XCVM1402-2MSINBVB1024	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	表面贴装	4-SMD, No Lead	1024-BGA (31x31)	Suntsu Electronics, Inc.	活跃	424						Bulk	-10°C ~ 70°C	SXT224	0.098 L x 0.079 W (2.50mm x 2.00mm)								兆赫晶体																					14.31818 MHz		±20ppm							120 Ohms				11pF	600MHz, 1.4GHz	-	Fundamental		Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	±20ppm	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						Versal™ Prime FPGA, 1.2M Logic Cells				-			0.026 (0.65mm)				-
XCVM1802-2MSEVFVC1760	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BFBGA, FCBGA	1760-FCBGA (40x40)	PEI-Genesis					Bulk	活跃	500			0°C ~ 100°C (TJ)	*																																												600MHz, 1.4GHz	256KB			Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™		DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						Versal™ Prime FPGA, 1.9M Logic Cells				-
XC7Z014S-2CLG400I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1206 (3216 Metric)	1206	KOA Speer Electronics, Inc.	RN73R2B	活跃	125							Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;	-55°C ~ 155°C	RN73R	0.126 L x 0.063 W (3.20mm x 1.60mm)	±1%			2		±10ppm/°C			142 Ohms			Thin Film		0.25W, 1/4W																									-				766MHz	256KB			Single ARM® Cortex®-A9 MPCore™ with CoreSight™		DMA		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Artix™-7 FPGA, 65K Logic Cells				-		Automotive AEC-Q200, Moisture Resistant	0.028 (0.70mm)				AEC-Q200
XCZU6EG-L1FFVB1156I	AMD	数据表	173 In Stock	-	最小起订量: 1 最小包装量: 1	表面贴装	4-SMD, No Lead	1156-FCBGA (35x35)	Suntsu Electronics, Inc.					Bulk	活跃	328	XCZU6		-40°C ~ 85°C	SXT214	0.079 L x 0.063 W (2.00mm x 1.60mm)								兆赫晶体																					37.4 MHz		±25ppm							100 Ohms				15pF	500MHz, 600MHz, 1.2GHz	256KB	Fundamental		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	±25ppm	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 469K+ Logic Cells				-			0.020 (0.50mm)				-
XCZU9EG-2FFVB1156E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1210 (3225 Metric)	1210	KOA Speer Electronics, Inc.	活跃	0.8500 V	0.808 V	0.892 V	328							Tape & Reel (TR)	SG73P2	-55°C ~ 155°C	SG73P-RT	0.126 L x 0.102 W (3.20mm x 2.60mm)	±0.5%			2		±200ppm/°C			6.19 kOhms			厚膜		0.5W, 1/2W																									-				533MHz, 600MHz, 1.3GHz	256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2		DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					2	Zynq®UltraScale+™ FPGA, 599K+ Logic Cells				-		Anti-Sulfur, Automotive AEC-Q200, Pulse Withstanding	0.028 (0.70mm)				AEC-Q200
M2S060T-VFG400	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	400-LFBGA	YES	400-VFBGA (17x17)	400	PEI-Genesis	M2S060T-VFG400	LFBGA	SQUARE	Microsemi Corporation	活跃	MICROSEMI CORP	1.26 V	5.81				Bulk	活跃	Non-Compliant	207	M2S060	VFBGA-400	GRID ARRAY, LOW PROFILE, FINE PITCH	3	PLASTIC/EPOXY	BGA400,20X20,32	1.2 V	40	1.14 V	85 °C	有	0°C ~ 85°C (TJ)	*			e1									Tin/Silver/Copper (Sn/Ag/Cu)					8542.39.00.01		现场可编程门阵列		CMOS	BOTTOM		BALL		250		0.8 mm	compliant							S-PBGA-B400	207	不合格			1.2 V	OTHER		166MHz	64KB			ARM® Cortex®-M3		DDR, PCIe, SERDES		CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	207	1.51 mm	现场可编程门阵列			FPGA - 60K Logic Modules		56520		256KB				17 mm	17 mm
M2S010T-VF400I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 1 month ago)	400-LFBGA	YES	400-VFBGA (17x17)	400	-	64 kB	VFBGA-400	GRID ARRAY, LOW PROFILE, FINE PITCH	Amphenol PCD	PLASTIC/EPOXY	BGA400,20X20,32	1.2 V	30	1.14 V	无	M2S010T-VF400I	LFBGA	SQUARE	Microsemi Corporation	活跃	MICROSEMI CORP	1.26 V	5.81				Box	SJT5	-	活跃	Non-Compliant	195	-	166 MHz	12084 LE	SMD/SMT	-40°C ~ 100°C (TJ)	SJT	4.144 L x 0.885 W x 0.900 H (105.26mm x 22.48mm x 22.86mm)		e0						Rail			Tin/Lead (Sn/Pb)					8542.39.00.01		现场可编程门阵列		CMOS	BOTTOM		BALL		240		0.8 mm	not_compliant							S-PBGA-B400	195	不合格			1.2 V			166MHz	64KB			ARM® Cortex®-M3		DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	195	1.51 mm	现场可编程门阵列			FPGA - 10K Logic Modules		12084	1 Core	256KB	8			17 mm	17 mm
XCZU43DR-1FFVG1517I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)	Knowles Syfer					Tape & Reel (TR)	活跃	561			-40°C ~ 100°C (TJ)	*																																												500MHz, 1.2GHz	256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™		DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 930K+ Logic Cells				-
M2S090TS-FG484	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-BGA	YES	484-FPBGA (23x23)	484	网格排列	3	PLASTIC/EPOXY	BGA484,22X22,40	PEI-Genesis	1.2 V	30	1.14 V	85 °C	无	M2S090TS-FG484	BGA	SQUARE	Microsemi Corporation	活跃	MICROSEMI CORP	1.26 V	5.86					Bulk	活跃	267	M2S090	-	166 MHz	86316 LE	-	64 kB	FBGA-484	0°C ~ 85°C (TJ)	*			e0									Tin/Lead (Sn/Pb)					8542.39.00.01		现场可编程门阵列		CMOS	BOTTOM		BALL		240		1 mm	not_compliant							S-PBGA-B484	267	不合格			1.2 V	OTHER		166MHz	64KB			ARM® Cortex®-M3		DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	267	2.44 mm	现场可编程门阵列			FPGA - 90K Logic Modules		86316	1 Core	512KB				23 mm	23 mm
XCZU43DR-2FSVG1517I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	表面贴装	4-SMD, No Lead	1517-FCBGA (40x40)	TXC CORPORATION	活跃	561						Tape & Reel (TR)	-20°C ~ 70°C	8Y	0.079 L x 0.063 W (2.00mm x 1.60mm)								兆赫晶体																					36 MHz		±10ppm							80 Ohms				8pF	533MHz, 1.333GHz	256KB	Fundamental		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	±10ppm	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 930K+ Logic Cells				-			0.020 (0.50mm)				-
M2S060TS-VFG400	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	400-LFBGA	YES	400-VFBGA (17x17)	400	3	PLASTIC/EPOXY	BGA400,20X20,32	PEI-Genesis	1.2 V	1.14 V	85 °C	有	M2S060TS-VFG400	LFBGA	SQUARE	Microsemi Corporation	活跃	MICROSEMI CORP	1.26 V	5.8					Bulk	活跃	207	M2S060	-	166 MHz	56520 LE	-	64 kB	VFBGA-400	GRID ARRAY, LOW PROFILE, FINE PITCH	0°C ~ 85°C (TJ)	*			e1									Tin/Silver/Copper (Sn/Ag/Cu)					8542.39.00.01		现场可编程门阵列		CMOS	BOTTOM		BALL		250		0.8 mm	compliant		40					S-PBGA-B400	207	不合格			1.2 V	OTHER		166MHz	64KB			ARM® Cortex®-M3		DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	207	1.51 mm	现场可编程门阵列			FPGA - 60K Logic Modules		56520	1 Core	256KB				17 mm	17 mm
XCZU47DR-L1FFVG1517I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)	PEI-Genesis					Bulk	活跃	561			-40°C ~ 100°C (TJ)	*																																												500MHz, 1.2GHz	256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™		DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 930K+ Logic Cells				-
M2S090T-1FCS325I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	325-TFBGA, FCBGA	325-FCBGA (11x13.5)	PEI-Genesis	64 kB							活跃	Bulk	180	M2S090	-	166 MHz	86316 LE	SMD/SMT	-	-40°C ~ 100°C (TJ)	*																																												166MHz	64KB			ARM® Cortex®-M3		DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA						FPGA - 90K Logic Modules			1 Core	512KB
A2F500M3G-CSG288	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	288-TFBGA, CSPBGA	288-CSP (11x11)	微芯片技术		1.5000 V	1.425 V	500000	1.575 V	MCU - 31, FPGA - 78	Tray	A2F500	活跃						0 to 85 °C	SmartFusion®																																												80MHz	64KB			ARM® Cortex®-M3		DMA, POR, WDT		EBI/EMI, Ethernet, I²C, SPI, UART/USART	MCU, FPGA					STD	ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops				512KB
XCZU7EG-L2FBVB900E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	900-BBGA, FCBGA	900-FCBGA (31x31)	AMD	Tray	XCZU7	活跃							204	0°C ~ 100°C (TJ)	Zynq® UltraScale+™ MPSoC EG																																												533MHz, 600MHz, 1.3GHz	256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2		DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 504K+ Logic Cells				-
XCZU7EG-L1FFVC1156I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	AMD	Tray	XCZU7	活跃							360	-40°C ~ 100°C (TJ)	Zynq® UltraScale+™ MPSoC EG																																												500MHz, 600MHz, 1.2GHz	256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2		DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 504K+ Logic Cells				-
XCZU4EV-1FBVB900I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	900-BBGA, FCBGA	900-FCBGA (31x31)	AMD	0.892 V	204	Tray	XCZU4	活跃							0.8500 V	0.808 V	-40 to 100 °C	Zynq® UltraScale+™ MPSoC EV																																												500MHz, 600MHz, 1.2GHz	256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2		DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					1	Zynq®UltraScale+™ FPGA, 192K+ Logic Cells				-
XAZU2EG-L1SFVC784I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	784-BFBGA, FCBGA	784-FCBGA (23x23)	AMD	Tray	XAZU2	活跃							128	-40°C ~ 100°C (TJ)	Zynq® UltraScale+™ MPSoC EG																																												500MHz, 1.2GHz	1.2MB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2		DMA, WDT		CANbus, I²C, SPI, UART/USART, USB	MPU, FPGA						Zynq®UltraScale+™ FPGA, 154K+ Logic Cells				-
M2S090T-FCSG325I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	325-TFBGA, FCBGA	YES	325-FCBGA (11x13.5)	325	TFBGA, BGA325,21X21,20	GRID ARRAY, THIN PROFILE, FINE PITCH	3	PLASTIC/EPOXY	BGA325,21X21,20	1.2 V	40	微芯片技术	1.14 V	有	M2S090T-FCSG325I	TFBGA	RECTANGULAR	Microsemi Corporation	活跃	MICROSEMI CORP	1.26 V	5.74	-	166 MHz	86316 LE	SMD/SMT	-	64 kB					1.2000 V	1.14 V	1.26 V	180	Tray	M2S090	活跃	-40 to 100 °C	SmartFusion®2			e1									Tin/Silver/Copper (Sn/Ag/Cu)				LG-MIN, WD-MIN	8542.39.00.01		现场可编程门阵列		CMOS	BOTTOM		BALL		250		0.5 mm	compliant							R-PBGA-B325	180	不合格			1.2 V			166MHz	64KB			ARM® Cortex®-M3		DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	180	1.16 mm	现场可编程门阵列		STD	FPGA - 90K Logic Modules		86316	1 Core	512KB				13.5 mm	11 mm
M2S025TS-1FGG484I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-BGA	484-FPBGA (23x23)	微芯片技术	267	Tray	M2S025	活跃	-	166 MHz	27696 LE	SMD/SMT	-	64 kB							1.2000 V	1.14 V	1.26 V	-40 to 100 °C	SmartFusion®2																																												166MHz	64KB			ARM® Cortex®-M3		DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA					1	FPGA - 25K Logic Modules			1 Core	256KB
M2S090TS-FGG484I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-BGA	YES	484-FPBGA (23x23)	484	BGA484,22X22,40	1.2 V	40	1.14 V	有	微芯片技术	M2S090TS-FGG484I	BGA	SQUARE	Microsemi Corporation	活跃	MICROSEMI CORP	1.26 V	5.8	-	166 MHz	86316 LE	SMD/SMT	-	64 kB					1.2000 V	267	Tray	M2S090	活跃	FBGA-484	网格排列	3	PLASTIC/EPOXY	-40 to 100 °C	SmartFusion®2			e1									Tin/Silver/Copper (Sn/Ag/Cu)					8542.39.00.01		现场可编程门阵列		CMOS	BOTTOM		BALL		250		1 mm	compliant							S-PBGA-B484	267	不合格			1.2 V			166MHz	64KB			ARM® Cortex®-M3		DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	267	2.44 mm	现场可编程门阵列		STD	FPGA - 90K Logic Modules		86316	1 Core	512KB				23 mm	23 mm
XCVC1502-2LSEVSVA1596	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	面板安装	1596-BFBGA	Flange	铝合金	1596-BGA (37.5x37.5)	ITT Cannon, LLC	Bulk	Metal	CA310	活跃	Gold	500				50V	-55°C ~ 125°C	MIL-DTL-5015, CA						Crimp		Receptacle, Female Sockets			26			橄榄色				Threaded		22A			N (Normal)		-		IP65 - Dust Tight, Water Resistant						橄榄色镉		28-12									450MHz, 1.08GHz	-		-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™		DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						Versal™ AI Core FPGA, 800k Logic Cells				-		-				20.0µin (0.51µm)