类别是'category.片上系统(SoC)' (7695)

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越来越多的功能

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房屋颜色

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注意

界面

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外壳尺寸,MIL

电压 - 供电 (Vcc/Vdd)

核心处理器

周边设备

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程序内存大小

连接方式

电缆开口

电压 - 输出

拓扑

建筑学

数据总线宽度

包括

EEPROM 大小

筛选水平

调光

主要属性

核数量

闪光大小

特征

设备核心

触点表面处理厚度 - 配套

材料可燃性等级

辐射硬化

评级结果

XCVM1302-1LLINSVF1369
XCVM1302-1LLINSVF1369
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1369-BFBGA

1369-BGA (35x35)

316

AMD

Tray

活跃

-40°C ~ 100°C (TJ)

Versal™ Prime

400MHz, 1GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 70k Logic Cells

-

XCVM1302-2HSIVFVC1596
XCVM1302-2HSIVFVC1596
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1596-BFBGA

1596-BGA (37.5x37.5)

532

AMD

Tray

活跃

-40°C ~ 100°C (TJ)

Versal™ Prime

800MHz, 1.65GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 70k Logic Cells

-

XCVC1802-2MLEVSVD1760
XCVC1802-2MLEVSVD1760
AMD 数据表

933 In Stock

-

最小起订量: 1

最小包装量: 1

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

692

AMD

Tray

活跃

0°C ~ 100°C (TJ)

Versal™ AI Core

600MHz, 1.4GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.5M Logic Cells

-

XCVM1402-2MSIVFVC1596
XCVM1402-2MSIVFVC1596
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1596-BFBGA

1596-BGA (37.5x37.5)

748

AMD

Tray

活跃

-40°C ~ 100°C (TJ)

Versal™ Prime

600MHz, 1.4GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1.2M Logic Cells

-

XCVC1802-2MSEVSVA2197
XCVC1802-2MSEVSVA2197
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

2197-BFBGA, FCBGA

2197-FCBGA (45x45)

770

AMD

Tray

活跃

0°C ~ 100°C (TJ)

Versal™ AI Core

600MHz, 1.4GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.5M Logic Cells

-

XCVM1402-1LSIVSVD1760
XCVM1402-1LSIVSVD1760
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

726

AMD

Tray

活跃

-40°C ~ 100°C (TJ)

Versal™ Prime

400MHz, 1GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1.2M Logic Cells

-

XCZU42DR-1FFVE1156I
XCZU42DR-1FFVE1156I
AMD 数据表

891 In Stock

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

Tray

活跃

AMD

RISC

1.8/2.5/3.3 V

CAN/Serial I2C/SPI/UART/USB

FPGA/Microcontroller

366

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

CAN/Serial I2C/SPI/U

500MHz, 1.2GHz

256 KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

32 Bit

Zynq®UltraScale+™ FPGA, 489K+ Logic Cells

-

ARM Cortex-A53/ARM Cortex-R5F

XCVM1302-1MLIVSVD1760
XCVM1302-1MLIVSVD1760
AMD 数据表

596 In Stock

-

最小起订量: 1

最小包装量: 1

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

402

AMD

Tray

活跃

-40°C ~ 100°C (TJ)

Versal™ Prime

600MHz, 1.3GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 70k Logic Cells

-

XCZU3EG-1UBVA530I
XCZU3EG-1UBVA530I
AMD 数据表

2353 In Stock

-

最小起订量: 1

最小包装量: 1

530-WFBGA, FCBGA

530-FCBGA (16x9.5)

82

AMD

Tray

活跃

-40°C ~ 100°C (TJ)

-

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

-

XCZU47DR-2FSVE1156E
XCZU47DR-2FSVE1156E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

100-BQFP

100-QFP (14x20)

Infineon Technologies

Discontinued at Digi-Key

A/D 8x8/10b

MB90F546

Tray

81

-40°C ~ 105°C (TA)

F²MC-16LX MB90545G

External

16MHz

8K x 8

4.5V ~ 5.5V

F²MC-16LX

POR, WDT

FLASH

16-Bit

256KB (256K x 8)

CANbus, EBI/EMI, SCI, Serial I/O, UART/USART

MCU, FPGA

-

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

M2S060-1FCS325
M2S060-1FCS325
Microchip 数据表

2461 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

Free Hanging (In-Line)

325-TFBGA, FCBGA

-

Circular

Aluminum

325-FCBGA (11x11)

-

-

64 kB

Amphenol Aerospace Operations

Bulk

D38999/26ZA

22D

活跃

Non-Compliant

200

-

166 MHz

56520 LE

-65°C ~ 175°C

Military, MIL-DTL-38999 Series III, Tri-Start™ TV

Plug Housing

用于内螺纹插座

6

Threaded

Crimp

A

Shielded

抗环境干扰

锌 镍

9-35

Black

不包括触点

166MHz

64KB

A

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

-

FPGA - 60K Logic Modules

1 Core

256KB

Coupling Nut, Self Locking

-

XCZU46DR-1FSVH1760I
XCZU46DR-1FSVH1760I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Free Hanging (In-Line)

1760-BBGA, FCBGA

-

铝合金

1760-FCBGA (42.5x42.5)

Rubber

-

Gold

RISC

6

JTAG

574

Industrial grade

ITT Cannon, LLC

500VAC, 700VDC

Bulk

Metal

FRCIR

活跃

Copper Alloy

-40°C ~ 125°C

CIR

Crimp

Plug, Male Pins

35

Black

Aerospace, Medical, Military

卡口锁

13A

W

Shielded

环境防护

黑色阳极氧化

1760

28-15

0.85 V

JTAG

500MHz, 1.2GHz

38 Mb

-

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

0.610 ~ 0.937 (15.49mm ~ 23.80mm)

MCU, FPGA

32 Bit

Industrial

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

Backshell, Cable Clamp, Coupling Nut, Flame Retardant

Arm Cortex A53/Arm Cortex R5

-

Flame Retardant

XCZU48DR-2FFVE1156E
XCZU48DR-2FFVE1156E
AMD 数据表

546 In Stock

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

Bulk

PEI-Genesis

活跃

366

0°C ~ 100°C (TJ)

*

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

M2S060TS-FG484I
M2S060TS-FG484I
Microchip 数据表

2603 In Stock

-

最小起订量: 1

最小包装量: 1

484-BGA

484-FPBGA (23x23)

166 MHz

56520 LE

-

64 kB

Mallory Sonalert Products Inc.

Bulk

活跃

267

M2S060

-

-40°C ~ 100°C (TJ)

*

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 60K Logic Modules

1 Core

256KB

XCZU48DR-L2FFVE1156I
XCZU48DR-L2FFVE1156I
AMD 数据表

739 In Stock

-

最小起订量: 1

最小包装量: 1

底座安装

1156-BBGA, FCBGA

1156-FCBGA (35x35)

1.7 lbs (771.1 g)

LXV76

Advanced Energy

Obsolete

366

Box

-35°C ~ 70°C

LXV76 (76W)

6.97 L x 2.66 W x 1.46 H (177.0mm x 67.5mm x 37.0mm)

恒压

76 W

电线引线

1

CE, cULus, EN

89%

3 kV

305VAC

90VAC

1.81A

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

42V

交流直流转换器

MCU, FPGA

-

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

OTP, OVP, SCP

IP67

M2S060-VF400
M2S060-VF400
Microchip 数据表

2983 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

面板安装

400-LFBGA

Flange

铝合金

400-VFBGA (17x17)

Silver

207

Non-Compliant

-

166 MHz

56520 LE

-

64 kB

ITT Cannon, LLC

50V

Bulk

Metal

CB2

活跃

-55°C ~ 125°C

MIL-DTL-5015, CB

Crimp

Receptacle, Male Pins

22

Black

反向卡口锁

22A, 41A

N (Normal)

-

IP67 - Dust Tight, Waterproof

黑锌钴

28-11

166MHz

64KB

-

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 60K Logic Modules

1 Core

256KB

-

-

M2S060-FG676I
M2S060-FG676I
Microchip 数据表

2695 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

676-BGA

676-FBGA (27x27)

-

166 MHz

56520 LE

-

64 kB

PEI-Genesis

Bulk

活跃

Non-Compliant

387

M2S060

-40°C ~ 100°C (TJ)

*

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 60K Logic Modules

1 Core

256KB

XCVM1402-1MSINSVF1369
XCVM1402-1MSINSVF1369
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

1369-BFBGA

1369-BGA (35x35)

Non-Compliant

AMD

424

Tray

活跃

-40°C ~ 100°C (TJ)

Tape & Reel

Versal™ Prime

20 %

1 kΩ

125 °C

-55 °C

600MHz, 1.3GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1.2M Logic Cells

-

XCVM1402-1MSIVSVD1760
XCVM1402-1MSIVSVD1760
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

726

AMD

Tray

活跃

-40°C ~ 100°C (TJ)

Versal™ Prime

600MHz, 1.3GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1.2M Logic Cells

-

XCZU1CG-1SBVA484E
XCZU1CG-1SBVA484E
AMD 数据表

2149 In Stock

-

最小起订量: 1

最小包装量: 1

484-BFBGA, FCBGA

484-FCBGA (19x19)

AMD

Non-Compliant

-

Tray

活跃

0°C ~ 100°C (TJ)

Zynq® UltraScale+™

CAN/Serial I2C/SPI/U

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

-

MPU, FPGA

-

-

XCZU1CG-1SFVA625I
XCZU1CG-1SFVA625I
AMD 数据表

2703 In Stock

-

最小起订量: 1

最小包装量: 1

625-BFBGA, FCBGA

625-FCBGA (21x21)

AMD

Non-Compliant

-

Tray

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

CAN/Serial I2C/SPI/U

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

-

MPU, FPGA

-

-

XCVM1802-1MSEVFVC1760
XCVM1802-1MSEVFVC1760
AMD 数据表

961 In Stock

-

最小起订量: 1

最小包装量: 1

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

500

AMD

Tray

活跃

0°C ~ 100°C (TJ)

Versal™ Prime

600MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1.9M Logic Cells

-

XCVC1902-1MSIVSVD1760
XCVC1902-1MSIVSVD1760
AMD 数据表

968 In Stock

-

最小起订量: 1

最小包装量: 1

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

692

AMD

Tray

活跃

-40°C ~ 100°C (TJ)

*

Obsolete

600MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.9M Logic Cells

-

XCZU1CG-2SFVA625E
XCZU1CG-2SFVA625E
AMD 数据表

2913 In Stock

-

最小起订量: 1

最小包装量: 1

625-BFBGA, FCBGA

625-FCBGA (21x21)

-

AMD

Tray

活跃

0°C ~ 100°C (TJ)

*

活跃

CAN/Serial I2C/SPI/U

533MHz, 1.333GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

-

MPU, FPGA

-

-

XCVM1302-1MSEVFVC1596
XCVM1302-1MSEVFVC1596
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1596-BFBGA

1596-BGA (37.5x37.5)

532

AMD

Tray

活跃

0°C ~ 100°C (TJ)

*

活跃

600MHz, 1.3GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 70k Logic Cells

-