类别是'category.片上系统(SoC)' (7695)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 越来越多的功能 | 触点形状 | 外壳材料 | 供应商器件包装 | 质量 | 插入材料 | 后壳材料,电镀 | 厂商 | 操作温度 | 包装 | 系列 | 尺寸/尺寸 | 容差 | 零件状态 | 终端 | 连接器类型 | 类型 | 电阻 | 定位的数量 | 最高工作温度 | 最小工作温度 | 颜色 | 应用 | 功率(瓦特) | 紧固类型 | 触点类型 | 额定电流 | 方向 | 屏蔽/屏蔽 | 入口保护 | 外壳完成 | 引脚数量 | 外壳尺寸-插入 | 终端样式 | 输出的数量 | 审批机构 | 效率 | 电压-隔离度 | 电压 - 输入(最大值) | 房屋颜色 | 工作电源电压 | 电压 - 输入(最小值) | 注意 | 界面 | 振荡器类型 | 最大输出电流 | 速度 | 内存大小 | 外壳尺寸,MIL | 电压 - 供电 (Vcc/Vdd) | 核心处理器 | 周边设备 | 程序存储器类型 | 芯尺寸 | 程序内存大小 | 连接方式 | 电缆开口 | 电压 - 输出 | 拓扑 | 建筑学 | 数据总线宽度 | 包括 | EEPROM 大小 | 筛选水平 | 调光 | 主要属性 | 核数量 | 闪光大小 | 特征 | 设备核心 | 触点表面处理厚度 - 配套 | 材料可燃性等级 | 辐射硬化 | 评级结果 | |||||||||||||||||||||||
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![]() | XCVM1302-1LLINSVF1369 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1369-BFBGA | 1369-BGA (35x35) | 316 | AMD | Tray | 活跃 | -40°C ~ 100°C (TJ) | Versal™ Prime | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1302-2HSIVFVC1596 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1596-BFBGA | 1596-BGA (37.5x37.5) | 532 | AMD | Tray | 活跃 | -40°C ~ 100°C (TJ) | Versal™ Prime | 800MHz, 1.65GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1802-2MLEVSVD1760 | AMD | 数据表 | 933 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | 692 | AMD | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal™ AI Core | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1402-2MSIVFVC1596 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1596-BFBGA | 1596-BGA (37.5x37.5) | 748 | AMD | Tray | 活跃 | -40°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.4GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1802-2MSEVSVA2197 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | 770 | AMD | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal™ AI Core | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1402-1LSIVSVD1760 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | 726 | AMD | Tray | 活跃 | -40°C ~ 100°C (TJ) | Versal™ Prime | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU42DR-1FFVE1156I | AMD | 数据表 | 891 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | Tray | 活跃 | AMD | RISC | 1.8/2.5/3.3 V | CAN/Serial I2C/SPI/UART/USB | 有 | FPGA/Microcontroller | 366 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | CAN/Serial I2C/SPI/U | 500MHz, 1.2GHz | 256 KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32 Bit | Zynq®UltraScale+™ FPGA, 489K+ Logic Cells | - | ARM Cortex-A53/ARM Cortex-R5F | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1302-1MLIVSVD1760 | AMD | 数据表 | 596 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | 402 | AMD | Tray | 活跃 | -40°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.3GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU3EG-1UBVA530I | AMD | 数据表 | 2353 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 530-WFBGA, FCBGA | 530-FCBGA (16x9.5) | 82 | AMD | Tray | 活跃 | -40°C ~ 100°C (TJ) | - | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU47DR-2FSVE1156E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 100-BQFP | 100-QFP (14x20) | Infineon Technologies | Discontinued at Digi-Key | A/D 8x8/10b | MB90F546 | Tray | 81 | -40°C ~ 105°C (TA) | F²MC-16LX MB90545G | External | 16MHz | 8K x 8 | 4.5V ~ 5.5V | F²MC-16LX | POR, WDT | FLASH | 16-Bit | 256KB (256K x 8) | CANbus, EBI/EMI, SCI, Serial I/O, UART/USART | MCU, FPGA | - | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S060-1FCS325 | Microchip | 数据表 | 2461 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | Free Hanging (In-Line) | 325-TFBGA, FCBGA | - | Circular | Aluminum | 325-FCBGA (11x11) | - | - | 64 kB | Amphenol Aerospace Operations | Bulk | D38999/26ZA | 22D | 活跃 | Non-Compliant | 200 | - | 166 MHz | 56520 LE | -65°C ~ 175°C | Military, MIL-DTL-38999 Series III, Tri-Start™ TV | Plug Housing | 用于内螺纹插座 | 6 | Threaded | Crimp | A | Shielded | 抗环境干扰 | 锌 镍 | 9-35 | Black | 不包括触点 | 166MHz | 64KB | A | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | FPGA - 60K Logic Modules | 1 Core | 256KB | Coupling Nut, Self Locking | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU46DR-1FSVH1760I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Free Hanging (In-Line) | 1760-BBGA, FCBGA | - | 铝合金 | 1760-FCBGA (42.5x42.5) | Rubber | - | Gold | RISC | 6 | JTAG | 有 | 574 | Industrial grade | ITT Cannon, LLC | 500VAC, 700VDC | Bulk | Metal | FRCIR | 活跃 | Copper Alloy | -40°C ~ 125°C | CIR | Crimp | Plug, Male Pins | 35 | Black | Aerospace, Medical, Military | 卡口锁 | 13A | W | Shielded | 环境防护 | 黑色阳极氧化 | 1760 | 28-15 | 0.85 V | JTAG | 500MHz, 1.2GHz | 38 Mb | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 0.610 ~ 0.937 (15.49mm ~ 23.80mm) | MCU, FPGA | 32 Bit | Industrial | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | Backshell, Cable Clamp, Coupling Nut, Flame Retardant | Arm Cortex A53/Arm Cortex R5 | - | Flame Retardant | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU48DR-2FFVE1156E | AMD | 数据表 | 546 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | Bulk | PEI-Genesis | 活跃 | 366 | 0°C ~ 100°C (TJ) | * | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S060TS-FG484I | Microchip | 数据表 | 2603 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 484-BGA | 484-FPBGA (23x23) | 166 MHz | 56520 LE | - | 64 kB | Mallory Sonalert Products Inc. | Bulk | 活跃 | 267 | M2S060 | - | -40°C ~ 100°C (TJ) | * | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU48DR-L2FFVE1156I | AMD | 数据表 | 739 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 底座安装 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | 1.7 lbs (771.1 g) | LXV76 | Advanced Energy | Obsolete | 366 | Box | -35°C ~ 70°C | LXV76 (76W) | 6.97 L x 2.66 W x 1.46 H (177.0mm x 67.5mm x 37.0mm) | 恒压 | 76 W | 电线引线 | 1 | CE, cULus, EN | 89% | 3 kV | 305VAC | 90VAC | 1.81A | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 42V | 交流直流转换器 | MCU, FPGA | - | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | OTP, OVP, SCP | IP67 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S060-VF400 | Microchip | 数据表 | 2983 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 面板安装 | 400-LFBGA | Flange | 铝合金 | 400-VFBGA (17x17) | Silver | 207 | Non-Compliant | - | 166 MHz | 56520 LE | - | 64 kB | ITT Cannon, LLC | 50V | Bulk | Metal | CB2 | 活跃 | -55°C ~ 125°C | MIL-DTL-5015, CB | Crimp | Receptacle, Male Pins | 22 | Black | 反向卡口锁 | 22A, 41A | N (Normal) | - | IP67 - Dust Tight, Waterproof | 黑锌钴 | 28-11 | 166MHz | 64KB | - | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 1 Core | 256KB | - | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S060-FG676I | Microchip | 数据表 | 2695 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 676-BGA | 676-FBGA (27x27) | - | 166 MHz | 56520 LE | - | 64 kB | PEI-Genesis | Bulk | 活跃 | Non-Compliant | 387 | M2S060 | -40°C ~ 100°C (TJ) | * | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1402-1MSINSVF1369 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 1369-BFBGA | 1369-BGA (35x35) | Non-Compliant | AMD | 424 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Tape & Reel | Versal™ Prime | 20 % | 1 kΩ | 125 °C | -55 °C | 600MHz, 1.3GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1402-1MSIVSVD1760 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | 726 | AMD | Tray | 活跃 | -40°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.3GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU1CG-1SBVA484E | AMD | 数据表 | 2149 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | AMD | Non-Compliant | - | Tray | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ | CAN/Serial I2C/SPI/U | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | MPU, FPGA | - | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU1CG-1SFVA625I | AMD | 数据表 | 2703 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | AMD | Non-Compliant | - | Tray | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | CAN/Serial I2C/SPI/U | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | MPU, FPGA | - | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1802-1MSEVFVC1760 | AMD | 数据表 | 961 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | 500 | AMD | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1902-1MSIVSVD1760 | AMD | 数据表 | 968 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | 692 | AMD | Tray | 活跃 | -40°C ~ 100°C (TJ) | * | Obsolete | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU1CG-2SFVA625E | AMD | 数据表 | 2913 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | - | AMD | Tray | 活跃 | 0°C ~ 100°C (TJ) | * | 活跃 | CAN/Serial I2C/SPI/U | 533MHz, 1.333GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | MPU, FPGA | - | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1302-1MSEVFVC1596 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1596-BFBGA | 1596-BGA (37.5x37.5) | 532 | AMD | Tray | 活跃 | 0°C ~ 100°C (TJ) | * | 活跃 | 600MHz, 1.3GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - |
XCVM1302-1LLINSVF1369
AMD
分类:Embedded - System On Chip (SoC)
XCVM1302-2HSIVFVC1596
AMD
分类:Embedded - System On Chip (SoC)
XCVC1802-2MLEVSVD1760
AMD
分类:Embedded - System On Chip (SoC)
221,031.436803
XCVM1402-2MSIVFVC1596
AMD
分类:Embedded - System On Chip (SoC)
XCVC1802-2MSEVSVA2197
AMD
分类:Embedded - System On Chip (SoC)
XCVM1402-1LSIVSVD1760
AMD
分类:Embedded - System On Chip (SoC)
XCZU42DR-1FFVE1156I
AMD
分类:Embedded - System On Chip (SoC)
94,404.982560
XCVM1302-1MLIVSVD1760
AMD
分类:Embedded - System On Chip (SoC)
39,276.616530
XCZU3EG-1UBVA530I
AMD
分类:Embedded - System On Chip (SoC)
3,935.326359
XCZU47DR-2FSVE1156E
AMD
分类:Embedded - System On Chip (SoC)
M2S060-1FCS325
Microchip
分类:Embedded - System On Chip (SoC)
1,210.286598
XCZU46DR-1FSVH1760I
AMD
分类:Embedded - System On Chip (SoC)
XCZU48DR-2FFVE1156E
AMD
分类:Embedded - System On Chip (SoC)
200,396.583648
M2S060TS-FG484I
Microchip
分类:Embedded - System On Chip (SoC)
1,970.468501
XCZU48DR-L2FFVE1156I
AMD
分类:Embedded - System On Chip (SoC)
271,975.046652
M2S060-VF400
Microchip
分类:Embedded - System On Chip (SoC)
1,301.632504
M2S060-FG676I
Microchip
分类:Embedded - System On Chip (SoC)
1,722.007475
XCVM1402-1MSINSVF1369
AMD
分类:Embedded - System On Chip (SoC)
XCVM1402-1MSIVSVD1760
AMD
分类:Embedded - System On Chip (SoC)
XCZU1CG-1SBVA484E
AMD
分类:Embedded - System On Chip (SoC)
1,755.459796
XCZU1CG-1SFVA625I
AMD
分类:Embedded - System On Chip (SoC)
2,522.701952
XCVM1802-1MSEVFVC1760
AMD
分类:Embedded - System On Chip (SoC)
61,078.498582
XCVC1902-1MSIVSVD1760
AMD
分类:Embedded - System On Chip (SoC)
203,380.149025
XCZU1CG-2SFVA625E
AMD
分类:Embedded - System On Chip (SoC)
2,565.836182
XCVM1302-1MSEVFVC1596
AMD
分类:Embedded - System On Chip (SoC)
