类别是'category.片上系统(SoC)' (7695)
- 所有品牌
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 安装类型 | 包装/外壳 | 表面安装 | 供应商器件包装 | 终端数量 | 厂商 | 操作温度 | 包装 | 系列 | HTS代码 | 子类别 | 技术 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | JESD-30代码 | 工作电源电压 | 温度等级 | 振荡器类型 | 速度 | 内存大小 | 电压 - 供电 (Vcc/Vdd) | uPs/uCs/外围ICs类型 | 核心处理器 | 周边设备 | 程序存储器类型 | 芯尺寸 | 程序内存大小 | 连接方式 | 建筑学 | 座位高度-最大 | 产品类别 | EEPROM 大小 | 边界扫描 | 低功率模式 | 格式 | 集成缓存 | 主要属性 | 核数量 | 闪光大小 | 产品类别 | 长度 | 宽度 | |||||||||||||||||||||||||||||||
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![]() | XCVM1402-1MSIVSVF1369 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Xilinx | Xilinx | + 110 C | - 40 C | SOC - Systems on a Chip | 800 mV | System-On-Modules - SOM | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1502-1LSEVFVB1369 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Xilinx | Xilinx | + 100 C | 0 C | SOC - Systems on a Chip | 700 mV | System-On-Modules - SOM | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1702-2HSIVSVG1369 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Xilinx | Xilinx | + 110 C | - 40 C | SOC - Systems on a Chip | 880 mV | System-On-Modules - SOM | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY8C4147AZE-S265T | Infineon | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 64-LQFP | 64-TQFP (10x10) | Infineon Technologies | Infineon | Infineon Technologies | Details | 54 | Tape & Reel (TR) | CY8C4147 | 活跃 | A/D 16x10b, 20x12b SAR | 有 | 1500 | -40°C ~ 125°C (TA) | Reel | Automotive, AEC-Q100, PSOC® 4 CY8C4100S Plus | SOC - Systems on a Chip | Internal | 24MHz | 16K x 8 | 1.71V ~ 5.5V | ARM® Cortex®-M0+ | Brown-out Detect/Reset, CapSense, LCD, POR, PWM, WDT | FLASH | 32-Bit | 128KB (128K x 8) | I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART | ARM Microcontrollers - MCU | - | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY8C4147LQS-S273T | Infineon | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Surface Mount, Wettable Flank | 40-UFQFN Exposed Pad | 40-QFN (6x6) | Infineon Technologies | Infineon | Infineon Technologies | Details | 34 | Tape & Reel (TR) | CY8C4147 | A/D 16x10b, 20x12b SAR | 活跃 | 有 | 2500 | -40°C ~ 105°C (TA) | Reel | Automotive, AEC-Q100, PSOC® 4 CY8C4100 | SOC - Systems on a Chip | External, Internal | 24MHz | 16K x 8 | 1.71V ~ 5.5V | ARM® Cortex®-M0+ | Brown-out Detect/Reset, CapSense, DMA, LCD, POR, PWM, Temp Sensor, WDT | FLASH | 32-Bit | 128KB (128K x 8) | FIFO, I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART | ARM Microcontrollers - MCU | - | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA027R24C3E4X | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | Tray | 活跃 | 744 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7Z035-3FFG676E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 676-BBGA, FCBGA | 676-FCBGA (27x27) | AMD | 活跃 | 130 | Tray | XC7Z035 | 0°C ~ 100°C (TJ) | Zynq®-7000 | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 275K Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MSCMMX6QZDK08AB | NXP | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 500 | 5.83 | FBGA, | GRID ARRAY, FINE PITCH | 3 | PLASTIC/EPOXY | 未说明 | 85 °C | 有 | MSCMMX6QZDK08AB | FBGA | RECTANGULAR | 恩智浦半导体 | Obsolete | NXP SEMICONDUCTORS | 8542.31.00.01 | CMOS | BOTTOM | BALL | 260 | 0.65 mm | compliant | R-PBGA-B500 | OTHER | 800 MHz | MICROPROCESSOR, RISC | 1.8 mm | YES | YES | 固定点 | YES | 17 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||
![]() | XQZU59DR-L1FSQF1760I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1 | Xilinx | Xilinx | SOC - Systems on a Chip | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XQZU58DR-1FFRE1156M | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1 | Xilinx | Xilinx | SOC - Systems on a Chip | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XQZU59DR-L2FFQF1760I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1 | Xilinx | Xilinx | SOC - Systems on a Chip | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XQZU58DR-L2FFQG1517I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU7EV-1FBVB900E4524 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XQZU27DR-2FSQG1517I4956 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Xilinx | Zynq UltraScale+ RFSoC | 1 | Xilinx | XQZU27DR | SOC - Systems on a Chip | FPGA - Field Programmable Gate Array | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1902-1LSIVIVA1596-ES9749 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | + 110 C | - 40 C | 1 | Xilinx | Xilinx | SOC - Systems on a Chip | 700 mV | System-On-Modules - SOM | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU67DR-2FSVE1156I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1 | Xilinx | Xilinx | SOC - Systems on a Chip | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY8C4147LQE-S473T | Infineon | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Surface Mount, Wettable Flank | 40-UFQFN Exposed Pad | 40-QFN (6x6) | Infineon Technologies | Infineon | Infineon Technologies | Details | 34 | Tape & Reel (TR) | CY8C4147 | A/D 16x10b, 20x12b SAR | 活跃 | 有 | 2500 | -40°C ~ 125°C (TA) | Reel | Automotive, AEC-Q100, PSOC® 4 CY8C4100S Plus | SOC - Systems on a Chip | External, Internal | 24MHz | 16K x 8 | 1.71V ~ 5.5V | ARM® Cortex®-M0+ | Brown-out Detect/Reset, CapSense, DMA, LCD, POR, PWM, Temp Sensor, WDT | FLASH | 32-Bit | 128KB (128K x 8) | CANbus, FIFO, I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART | ARM Microcontrollers - MCU | - | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY8C4126AZE-S455T | Infineon | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 64-LQFP | 64-TQFP (10x10) | Infineon Technologies | 54 | Tape & Reel (TR) | A/D 16x10b, 20x12b SAR | 活跃 | 有 | 1500 | Infineon | Infineon Technologies | Details | -40°C ~ 125°C (TA) | Reel | Automotive, AEC-Q100, PSOC® 4 CY8C4100S Plus | SOC - Systems on a Chip | External, Internal | 24MHz | 8K x 8 | 1.71V ~ 5.5V | ARM® Cortex®-M0+ | Brown-out Detect/Reset, CapSense, DMA, LCD, POR, PWM, Temp Sensor, WDT | FLASH | 32-Bit | 64KB (64K x 8) | FIFO, I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART | ARM Microcontrollers - MCU | - | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY8C4147LQS-S283T | Infineon | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Surface Mount, Wettable Flank | 40-UFQFN Exposed Pad | 40-QFN (6x6) | Infineon Technologies | Infineon | Infineon Technologies | Details | 34 | Tape & Reel (TR) | CY8C4147 | A/D 16x10b, 20x12b SAR | 活跃 | 有 | 2500 | -40°C ~ 105°C (TA) | Reel | Automotive, AEC-Q100, PSOC® 4 CY8C4100 | SOC - Systems on a Chip | External, Internal | 24MHz | 16K x 8 | 1.71V ~ 5.5V | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT | FLASH | 32-Bit | 128KB (128K x 8) | CANbus, FIFO, I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART | ARM Microcontrollers - MCU | - | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA014R24C3E3V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | Tray | 活跃 | 744 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU5EG-2SFVC784I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | AMD | 活跃 | 252 | Tray | XCZU5 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA022R31C2E2VAA | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | Tray | 活跃 | 720 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU48DR-2FFVG1517I | Xilinx | 数据表 | 968 In Stock | - | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD 赛灵思 | Tray | 活跃 | 561 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU2CG-1UBVA530E | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 530-WFBGA, FCBGA | 530-FCBGA (16x9.5) | AMD 赛灵思 | 2 x 32 kB, 2 x 32 kB | 256 kB | 82 | 活跃 | 2 x 32 kB, 2 x 32 kB | 103320 LE | + 100 C | 0 C | SMD/SMT | 0°C ~ 100°C (TJ) | 850 mV | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | 4 Core | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA014R24B3E4X | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | Tray | 活跃 | 768 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | - |
XCVM1402-1MSIVSVF1369
Xilinx
分类:Embedded - System On Chip (SoC)
XCVM1502-1LSEVFVB1369
Xilinx
分类:Embedded - System On Chip (SoC)
XCVC1702-2HSIVSVG1369
Xilinx
分类:Embedded - System On Chip (SoC)
CY8C4147AZE-S265T
Infineon
分类:Embedded - System On Chip (SoC)
CY8C4147LQS-S273T
Infineon
分类:Embedded - System On Chip (SoC)
AGFA027R24C3E4X
Intel
分类:Embedded - System On Chip (SoC)
XC7Z035-3FFG676E
AMD
分类:Embedded - System On Chip (SoC)
MSCMMX6QZDK08AB
NXP
分类:Embedded - System On Chip (SoC)
XQZU59DR-L1FSQF1760I
Xilinx
分类:Embedded - System On Chip (SoC)
XQZU58DR-1FFRE1156M
Xilinx
分类:Embedded - System On Chip (SoC)
XQZU59DR-L2FFQF1760I
Xilinx
分类:Embedded - System On Chip (SoC)
XQZU58DR-L2FFQG1517I
Xilinx
分类:Embedded - System On Chip (SoC)
XCZU7EV-1FBVB900E4524
Xilinx
分类:Embedded - System On Chip (SoC)
XQZU27DR-2FSQG1517I4956
Xilinx
分类:Embedded - System On Chip (SoC)
XCVC1902-1LSIVIVA1596-ES9749
Xilinx
分类:Embedded - System On Chip (SoC)
XCZU67DR-2FSVE1156I
Xilinx
分类:Embedded - System On Chip (SoC)
CY8C4147LQE-S473T
Infineon
分类:Embedded - System On Chip (SoC)
CY8C4126AZE-S455T
Infineon
分类:Embedded - System On Chip (SoC)
CY8C4147LQS-S283T
Infineon
分类:Embedded - System On Chip (SoC)
AGFA014R24C3E3V
Intel
分类:Embedded - System On Chip (SoC)
XCZU5EG-2SFVC784I
AMD
分类:Embedded - System On Chip (SoC)
AGFA022R31C2E2VAA
Intel
分类:Embedded - System On Chip (SoC)
XCZU48DR-2FFVG1517I
Xilinx
分类:Embedded - System On Chip (SoC)
XCZU2CG-1UBVA530E
Xilinx
分类:Embedded - System On Chip (SoC)
AGFA014R24B3E4X
Intel
分类:Embedded - System On Chip (SoC)
