类别是'category.片上系统(SoC)' (7695)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 终端数量 | 厂商 | 操作温度 | 包装 | 系列 | JESD-609代码 | 零件状态 | 类型 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 应用 | HTS代码 | 子类别 | 技术 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 频率 | 基本部件号 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 温度等级 | 界面 | 内存大小 | 速度 | 内存大小 | 核心处理器 | 周边设备 | 电源线保护 | 程序内存大小 | 连接方式 | 电压 - 击穿 | 功率 - 脉冲峰值 | 峰值脉冲电流(10/1000μs) | 不同 Ipp 时电压 - 箝位(最大值) | 建筑学 | 电压 - 反向断态(典型值) | 输入数量 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | 逻辑元件/单元数 | 产品类别 | 双向通道 | 核心架构 | 电容@频率 | 速度等级 | 收发器数量 | 主要属性 | 逻辑块数量 | 逻辑单元数 | 核数量 | 闪光大小 | 产品类别 | 长度 | 宽度 | |||||||||||||||||||||||||||||||||||||||
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![]() | AGFB008R24C2E4X | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 576 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 764K Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5CSEBA2U19I7SN | ALTERA | 数据表 | 2219 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 484-FBGA | YES | 484 | 484-UBGA (19x19) | 484 | Molex | SQUARE | Intel Corporation | 活跃 | INTEL CORP | 1.13 V | 2 | 活跃 | 121050 | Bulk | MCU - 151, FPGA - 66 | 8542390000 | Compliant | FBGA, BGA484,22X22,32 | GRID ARRAY, FINE PITCH | PLASTIC/EPOXY | BGA484,22X22,32 | 1.1 V | 未说明 | 1.07 V | 有 | 5CSEBA2U19I7SN | FBGA | -40°C ~ 100°C (TJ) | Tray | Brad 121050 mPm | 活跃 | 100 °C | -40 °C | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 未说明 | 0.8 mm | compliant | 800 MHz | 5CSEBA2 | S-PBGA-B484 | 66 | 不合格 | 1.1 V | 1.1,1.2/3.3,2.5 V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 1.5 MB | 800MHz | 64KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 66 | 1.9 mm | 现场可编程门阵列 | 25000 | ARM | FPGA - 25K Logic Elements | 25000 | -- | 19 mm | 19 mm | |||||||||||||||||||||||||||||||||||||||||
![]() | XCZU4EV-3SFVC784E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | AMD | 252 | Tray | XCZU4 | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EV | 600MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3 | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU11EG-L2FFVB1517E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD | 488 | Tray | XCZU11 | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA027R25A1E1V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | DO-214AB, SMC | DO-214AB (SMCJ) | MDE Semiconductor Inc | Tape & Reel (TR) | 活跃 | 624 | -55°C ~ 150°C (TJ) | 5.0SMDJ | Zener | 通用型 | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | 无 | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 86.7V | 5000W (5kW) | 39.7A | 126V | MPU, FPGA | 78V | 1 | - | FPGA - 2.7M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XAZU2EG-1SFVC784I | AMD | 数据表 | 2011 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | AMD | 128 | Tray | XAZU2 | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 1.2GHz | 1.2MB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, I²C, SPI, UART/USART, USB | MPU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA006R24C3E4X | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 576 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 573K Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MSC7104ZQF | Freescale | 数据表 | 4 In Stock | - | 最小起订量: 1 最小包装量: 1 | 456-BBGA | 456-PBGA (35x35) | Freescale Semiconductor - NXP | 48 | Bulk | Obsolete | - | - | 266MHz | - | PowerPC e300 | DDR2, JTAG | Ethernet, I²C, SPI, UART/USART | MPU | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1702-2MSEVSVA1596 | AMD | 数据表 | 653 In Stock |
- | 最小起订量: 1 最小包装量: 1 | AMD | Tray | 活跃 | * | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 1SX280LH3F55E1VG | ALTERA | 数据表 | 975 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FBGA-2912 | Details | 4 x 32 kB | - | 1160 | 有 | This product may require additional documentation to export from the United States. | 4 x 32 kB | 1 GHz | 2800000 LE | + 100 C | 0 C | 10 | SMD/SMT | 350000 LAB | 956208 | Intel | Intel / Altera | Stratix | 0°C ~ 100°C (TJ) | Tray | Stratix® 10 SX | 活跃 | SOC - Systems on a Chip | 0.85 V | 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | 24 Transceiver | FPGA - 2800K Logic Elements | 4 Core | -- | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS027H1F34E1HG | ALTERA | 数据表 | 738 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | - | 有 | 10AS027H1F34E1HG | 活跃 | INTEL CORP | 5.64 | 384 | 有 | 2 x 32 kB | 1.2 GHz | 270000 LE | + 100 C | 0 C | 24 | SMD/SMT | 33750 LAB | 964941 | Intel | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | 活跃 | SOC - Systems on a Chip | unknown | 950 mV | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | 24 Transceiver | FPGA - 270K Logic Elements | 2 Core | -- | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5ASXMB5E4F31I5N | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 896-BBGA, FCBGA | YES | 896-FBGA (31x31) | 896 | FBGA-896 | 5.28 | MCU - 208, FPGA - 250 | PLASTIC/EPOXY | BGA896,30X30,40 | -40 °C | 1.1 V | 未说明 | 1.07 V | 100 °C | 有 | 5ASXMB5E4F31I5N | BGA | SQUARE | Intel Corporation | 生命周期结束 | INTEL CORP | 1.13 V | 网格排列 | -40°C ~ 100°C (TJ) | Tray | Arria V SX | e1 | 活跃 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 未说明 | 1 mm | compliant | 5ASXMB5 | S-PBGA-B896 | 250 | INDUSTRIAL | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 250 | 17434 CLBS | 2.7 mm | 现场可编程门阵列 | FPGA - 462K Logic Elements | 17434 | 462000 | -- | 31 mm | 31 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5CSXFC5D6F31C6N | ALTERA | 数据表 | 2295 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 896-BGA | YES | 896-FBGA (31x31) | 896 | MCU - 181, FPGA - 288 | BGA, BGA896,30X30,40 | 网格排列 | PLASTIC/EPOXY | BGA896,30X30,40 | 1.1 V | 未说明 | 1.07 V | 85 °C | 有 | 5CSXFC5D6F31C6N | BGA | SQUARE | Intel Corporation | 活跃 | INTEL CORP | 1.13 V | 5.57 | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SX | 活跃 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | 5CSXFC5 | S-PBGA-B896 | 288 | 不合格 | 1.1,1.2/3.3,2.5 V | OTHER | 925MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 288 | 2 mm | 现场可编程门阵列 | FPGA - 85K Logic Elements | 85000 | -- | 31 mm | 31 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5CSEBA6U19A7N | ALTERA | 数据表 | 2760 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 484-FBGA | 484-UBGA (19x19) | MCU - 151, FPGA - 66 | -40°C ~ 125°C (TJ) | Tray | Automotive, AEC-Q100, Cyclone® V SE | 活跃 | 5CSEBA6 | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 110K Logic Elements | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5CSEBA2U23I7LN | ALTERA | 数据表 | 2075 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Tray | * | 活跃 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5ASXBB5D4F35C5N | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | MCU - 208, FPGA - 385 | 0°C ~ 85°C (TJ) | Tray | Arria V SX | 活跃 | 5ASXBB5 | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 462K Logic Elements | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5CSXFC6C6U23A7N | ALTERA | 数据表 | 2640 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 672-FBGA | 672-UBGA (23x23) | MCU - 181, FPGA - 145 | -40°C ~ 125°C (TJ) | Tray | Automotive, AEC-Q100, Cyclone® V SE | 活跃 | 5CSXFC6 | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 110K Logic Elements | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7Z030-3SBG485E | AMD | 数据表 | 2756 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 484-FBGA, FCBGA | 484-FCBGA (19x19) | AMD | 130 | Tray | XC7Z030 | 活跃 | 0°C ~ 100°C (TJ) | Zynq®-7000 | 1GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 125K Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFB022R24C3E3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 744 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU9CG-L2FFVC900E | AMD | 数据表 | 514 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | 204 | Bulk | XCZU9 | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1502-1LSINFVB1369 | AMD | 数据表 | 870 In Stock |
- | 最小起订量: 1 最小包装量: 1 | AMD | 478 | Tray | 活跃 | Versal™ Prime | 400MHz, 1GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1402-2MSINBVB1024 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1024-BFBGA | 1024-BGA (31x31) | AMD 赛灵思 | Xilinx | Xilinx | 424 | Tray | 活跃 | 1 | - 40 C | + 110 C | -40°C ~ 100°C (TJ) | Versal™ Prime | SOC - Systems on a Chip | 800 mV | 600MHz, 1.4GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | System-On-Modules - SOM | Versal™ Prime FPGA, 1.2M Logic Cells | - | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1302-1MLINBVB1024 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1024-BFBGA | 1024-BGA (31x31) | AMD 赛灵思 | Xilinx | Xilinx | 316 | Tray | 活跃 | + 110 C | - 40 C | 1 | -40°C ~ 100°C (TJ) | Versal™ Prime | SOC - Systems on a Chip | 800 mV | 600MHz, 1.3GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | System-On-Modules - SOM | Versal™ Prime FPGA, 70k Logic Cells | - | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1302-1LSENBVB1024 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1024-BFBGA | 1024-BGA (31x31) | AMD 赛灵思 | Xilinx | Xilinx | 316 | Tray | 活跃 | + 100 C | 0 C | 1 | 0°C ~ 100°C (TJ) | Versal™ Prime | SOC - Systems on a Chip | 700 mV | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | System-On-Modules - SOM | Versal™ Prime FPGA, 70k Logic Cells | - | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1302-1LSINBVB1024 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1024-BFBGA | 1024-BGA (31x31) | AMD 赛灵思 | Xilinx | Xilinx | 316 | Tray | 活跃 | + 110 C | - 40 C | 1 | -40°C ~ 100°C (TJ) | Versal™ Prime | SOC - Systems on a Chip | 700 mV | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | System-On-Modules - SOM | Versal™ Prime FPGA, 70k Logic Cells | - | SoC FPGA |
AGFB008R24C2E4X
Intel
分类:Embedded - System On Chip (SoC)
5CSEBA2U19I7SN
ALTERA
分类:Embedded - System On Chip (SoC)
841.566221
XCZU4EV-3SFVC784E
AMD
分类:Embedded - System On Chip (SoC)
XCZU11EG-L2FFVB1517E
AMD
分类:Embedded - System On Chip (SoC)
AGFA027R25A1E1V
Intel
分类:Embedded - System On Chip (SoC)
XAZU2EG-1SFVC784I
AMD
分类:Embedded - System On Chip (SoC)
2,698.405264
AGFA006R24C3E4X
Intel
分类:Embedded - System On Chip (SoC)
MSC7104ZQF
Freescale
分类:Embedded - System On Chip (SoC)
XCVC1702-2MSEVSVA1596
AMD
分类:Embedded - System On Chip (SoC)
162,990.034025
1SX280LH3F55E1VG
ALTERA
分类:Embedded - System On Chip (SoC)
171,724.420111
10AS027H1F34E1HG
ALTERA
分类:Embedded - System On Chip (SoC)
19,101.982622
5ASXMB5E4F31I5N
ALTERA
分类:Embedded - System On Chip (SoC)
5CSXFC5D6F31C6N
ALTERA
分类:Embedded - System On Chip (SoC)
3,002.143343
5CSEBA6U19A7N
ALTERA
分类:Embedded - System On Chip (SoC)
2,990.328692
5CSEBA2U23I7LN
ALTERA
分类:Embedded - System On Chip (SoC)
1,313.754721
5ASXBB5D4F35C5N
ALTERA
分类:Embedded - System On Chip (SoC)
5CSXFC6C6U23A7N
ALTERA
分类:Embedded - System On Chip (SoC)
4,139.175694
XC7Z030-3SBG485E
AMD
分类:Embedded - System On Chip (SoC)
3,533.224513
AGFB022R24C3E3E
Intel
分类:Embedded - System On Chip (SoC)
XCZU9CG-L2FFVC900E
AMD
分类:Embedded - System On Chip (SoC)
33,286.573529
XCVM1502-1LSINFVB1369
AMD
分类:Embedded - System On Chip (SoC)
68,374.831898
XCVM1402-2MSINBVB1024
Xilinx
分类:Embedded - System On Chip (SoC)
XCVM1302-1MLINBVB1024
Xilinx
分类:Embedded - System On Chip (SoC)
XCVM1302-1LSENBVB1024
Xilinx
分类:Embedded - System On Chip (SoC)
XCVM1302-1LSINBVB1024
Xilinx
分类:Embedded - System On Chip (SoC)
