类别是'category.片上系统(SoC)' (7695)

  • 所有品牌

对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

安装类型

包装/外壳

表面安装

引脚数

供应商器件包装

终端数量

厂商

操作温度

包装

系列

JESD-609代码

零件状态

类型

端子表面处理

最高工作温度

最小工作温度

应用

HTS代码

子类别

技术

端子位置

终端形式

峰值回流焊温度(摄氏度)

端子间距

Reach合规守则

频率

基本部件号

JESD-30代码

输出的数量

资历状况

工作电源电压

电源

温度等级

界面

内存大小

速度

内存大小

核心处理器

周边设备

电源线保护

程序内存大小

连接方式

电压 - 击穿

功率 - 脉冲峰值

峰值脉冲电流(10/1000μs)

不同 Ipp 时电压 - 箝位(最大值)

建筑学

电压 - 反向断态(典型值)

输入数量

组织结构

座位高度-最大

可编程逻辑类型

逻辑元件/单元数

产品类别

双向通道

核心架构

电容@频率

速度等级

收发器数量

主要属性

逻辑块数量

逻辑单元数

核数量

闪光大小

产品类别

长度

宽度

AGFB008R24C2E4X
AGFB008R24C2E4X
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

Intel

576

Tray

活跃

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 764K Logic Elements

-

5CSEBA2U19I7SN
5CSEBA2U19I7SN
ALTERA 数据表

2219 In Stock

-

最小起订量: 1

最小包装量: 1

484-FBGA

YES

484

484-UBGA (19x19)

484

Molex

SQUARE

Intel Corporation

活跃

INTEL CORP

1.13 V

2

活跃

121050

Bulk

MCU - 151, FPGA - 66

8542390000

Compliant

FBGA, BGA484,22X22,32

GRID ARRAY, FINE PITCH

PLASTIC/EPOXY

BGA484,22X22,32

1.1 V

未说明

1.07 V

5CSEBA2U19I7SN

FBGA

-40°C ~ 100°C (TJ)

Tray

Brad 121050 mPm

活跃

100 °C

-40 °C

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

未说明

0.8 mm

compliant

800 MHz

5CSEBA2

S-PBGA-B484

66

不合格

1.1 V

1.1,1.2/3.3,2.5 V

CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

1.5 MB

800MHz

64KB

Single ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

66

1.9 mm

现场可编程门阵列

25000

ARM

FPGA - 25K Logic Elements

25000

--

19 mm

19 mm

XCZU4EV-3SFVC784E
XCZU4EV-3SFVC784E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

252

Tray

XCZU4

活跃

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EV

600MHz, 1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

3

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

-

XCZU11EG-L2FFVB1517E
XCZU11EG-L2FFVB1517E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

1517-FCBGA (40x40)

AMD

488

Tray

XCZU11

活跃

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 653K+ Logic Cells

-

AGFA027R25A1E1V
AGFA027R25A1E1V
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

DO-214AB, SMC

DO-214AB (SMCJ)

MDE Semiconductor Inc

Tape & Reel (TR)

活跃

624

-55°C ~ 150°C (TJ)

5.0SMDJ

Zener

通用型

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

86.7V

5000W (5kW)

39.7A

126V

MPU, FPGA

78V

1

-

FPGA - 2.7M Logic Elements

-

XAZU2EG-1SFVC784I
XAZU2EG-1SFVC784I
AMD 数据表

2011 In Stock

-

最小起订量: 1

最小包装量: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

128

Tray

XAZU2

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

500MHz, 1.2GHz

1.2MB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, I²C, SPI, UART/USART, USB

MPU, FPGA

Zynq®UltraScale+™ FPGA, 103K+ Logic Cells

-

AGFA006R24C3E4X
AGFA006R24C3E4X
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

Intel

576

Tray

活跃

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 573K Logic Elements

-

MSC7104ZQF
MSC7104ZQF
Freescale 数据表

4 In Stock

-

最小起订量: 1

最小包装量: 1

456-BBGA

456-PBGA (35x35)

Freescale Semiconductor - NXP

48

Bulk

Obsolete

-

-

266MHz

-

PowerPC e300

DDR2, JTAG

Ethernet, I²C, SPI, UART/USART

MPU

-

-

XCVC1702-2MSEVSVA1596
XCVC1702-2MSEVSVA1596
AMD 数据表

653 In Stock

-

最小起订量: 1

最小包装量: 1

AMD

Tray

活跃

*

1SX280LH3F55E1VG
1SX280LH3F55E1VG
ALTERA 数据表

975 In Stock

-

最小起订量: 1

最小包装量: 1

FBGA-2912

Details

4 x 32 kB

-

1160

This product may require additional documentation to export from the United States.

4 x 32 kB

1 GHz

2800000 LE

+ 100 C

0 C

10

SMD/SMT

350000 LAB

956208

Intel

Intel / Altera

Stratix

0°C ~ 100°C (TJ)

Tray

Stratix® 10 SX

活跃

SOC - Systems on a Chip

0.85 V

1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™

DMA, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

SoC FPGA

24 Transceiver

FPGA - 2800K Logic Elements

4 Core

--

SoC FPGA

10AS027H1F34E1HG
10AS027H1F34E1HG
ALTERA 数据表

738 In Stock

-

最小起订量: 1

最小包装量: 1

1152-BBGA, FCBGA

1152-FBGA (35x35)

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-

10AS027H1F34E1HG

活跃

INTEL CORP

5.64

384

2 x 32 kB

1.2 GHz

270000 LE

+ 100 C

0 C

24

SMD/SMT

33750 LAB

964941

Intel

0°C ~ 100°C (TJ)

Tray

Arria 10 SX

活跃

SOC - Systems on a Chip

unknown

950 mV

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

SoC FPGA

24 Transceiver

FPGA - 270K Logic Elements

2 Core

--

SoC FPGA

5ASXMB5E4F31I5N
5ASXMB5E4F31I5N
ALTERA 数据表

N/A

-

最小起订量: 1

最小包装量: 1

896-BBGA, FCBGA

YES

896-FBGA (31x31)

896

FBGA-896

5.28

MCU - 208, FPGA - 250

PLASTIC/EPOXY

BGA896,30X30,40

-40 °C

1.1 V

未说明

1.07 V

100 °C

5ASXMB5E4F31I5N

BGA

SQUARE

Intel Corporation

生命周期结束

INTEL CORP

1.13 V

网格排列

-40°C ~ 100°C (TJ)

Tray

Arria V SX

e1

活跃

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

BALL

未说明

1 mm

compliant

5ASXMB5

S-PBGA-B896

250

INDUSTRIAL

800MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

250

17434 CLBS

2.7 mm

现场可编程门阵列

FPGA - 462K Logic Elements

17434

462000

--

31 mm

31 mm

5CSXFC5D6F31C6N
5CSXFC5D6F31C6N
ALTERA 数据表

2295 In Stock

-

最小起订量: 1

最小包装量: 1

896-BGA

YES

896-FBGA (31x31)

896

MCU - 181, FPGA - 288

BGA, BGA896,30X30,40

网格排列

PLASTIC/EPOXY

BGA896,30X30,40

1.1 V

未说明

1.07 V

85 °C

5CSXFC5D6F31C6N

BGA

SQUARE

Intel Corporation

活跃

INTEL CORP

1.13 V

5.57

0°C ~ 85°C (TJ)

Tray

Cyclone® V SX

活跃

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

5CSXFC5

S-PBGA-B896

288

不合格

1.1,1.2/3.3,2.5 V

OTHER

925MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

288

2 mm

现场可编程门阵列

FPGA - 85K Logic Elements

85000

--

31 mm

31 mm

5CSEBA6U19A7N
5CSEBA6U19A7N
ALTERA 数据表

2760 In Stock

-

最小起订量: 1

最小包装量: 1

484-FBGA

484-UBGA (19x19)

MCU - 151, FPGA - 66

-40°C ~ 125°C (TJ)

Tray

Automotive, AEC-Q100, Cyclone® V SE

活跃

5CSEBA6

700MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

FPGA - 110K Logic Elements

--

5CSEBA2U23I7LN
5CSEBA2U23I7LN
ALTERA 数据表

2075 In Stock

-

最小起订量: 1

最小包装量: 1

Tray

*

活跃

5ASXBB5D4F35C5N
5ASXBB5D4F35C5N
ALTERA 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1152-BBGA, FCBGA

1152-FBGA (35x35)

MCU - 208, FPGA - 385

0°C ~ 85°C (TJ)

Tray

Arria V SX

活跃

5ASXBB5

800MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

FPGA - 462K Logic Elements

--

5CSXFC6C6U23A7N
5CSXFC6C6U23A7N
ALTERA 数据表

2640 In Stock

-

最小起订量: 1

最小包装量: 1

672-FBGA

672-UBGA (23x23)

MCU - 181, FPGA - 145

-40°C ~ 125°C (TJ)

Tray

Automotive, AEC-Q100, Cyclone® V SE

活跃

5CSXFC6

700MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

FPGA - 110K Logic Elements

--

XC7Z030-3SBG485E
XC7Z030-3SBG485E
AMD 数据表

2756 In Stock

-

最小起订量: 1

最小包装量: 1

484-FBGA, FCBGA

484-FCBGA (19x19)

AMD

130

Tray

XC7Z030

活跃

0°C ~ 100°C (TJ)

Zynq®-7000

1GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Kintex™-7 FPGA, 125K Logic Cells

-

AGFB022R24C3E3E
AGFB022R24C3E3E
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

Intel

744

Tray

活跃

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.2M Logic Elements

-

XCZU9CG-L2FFVC900E
XCZU9CG-L2FFVC900E
AMD 数据表

514 In Stock

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

204

Bulk

XCZU9

活跃

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 599K+ Logic Cells

-

XCVM1502-1LSINFVB1369
XCVM1502-1LSINFVB1369
AMD 数据表

870 In Stock

-

最小起订量: 1

最小包装量: 1

AMD

478

Tray

活跃

Versal™ Prime

400MHz, 1GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1M Logic Cells

-

XCVM1402-2MSINBVB1024
XCVM1402-2MSINBVB1024
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1024-BFBGA

1024-BGA (31x31)

AMD 赛灵思

Xilinx

Xilinx

424

Tray

活跃

1

- 40 C

+ 110 C

-40°C ~ 100°C (TJ)

Versal™ Prime

SOC - Systems on a Chip

800 mV

600MHz, 1.4GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

System-On-Modules - SOM

Versal™ Prime FPGA, 1.2M Logic Cells

-

SoC FPGA

XCVM1302-1MLINBVB1024
XCVM1302-1MLINBVB1024
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1024-BFBGA

1024-BGA (31x31)

AMD 赛灵思

Xilinx

Xilinx

316

Tray

活跃

+ 110 C

- 40 C

1

-40°C ~ 100°C (TJ)

Versal™ Prime

SOC - Systems on a Chip

800 mV

600MHz, 1.3GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

System-On-Modules - SOM

Versal™ Prime FPGA, 70k Logic Cells

-

SoC FPGA

XCVM1302-1LSENBVB1024
XCVM1302-1LSENBVB1024
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1024-BFBGA

1024-BGA (31x31)

AMD 赛灵思

Xilinx

Xilinx

316

Tray

活跃

+ 100 C

0 C

1

0°C ~ 100°C (TJ)

Versal™ Prime

SOC - Systems on a Chip

700 mV

400MHz, 1GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

System-On-Modules - SOM

Versal™ Prime FPGA, 70k Logic Cells

-

SoC FPGA

XCVM1302-1LSINBVB1024
XCVM1302-1LSINBVB1024
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1024-BFBGA

1024-BGA (31x31)

AMD 赛灵思

Xilinx

Xilinx

316

Tray

活跃

+ 110 C

- 40 C

1

-40°C ~ 100°C (TJ)

Versal™ Prime

SOC - Systems on a Chip

700 mV

400MHz, 1GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

System-On-Modules - SOM

Versal™ Prime FPGA, 70k Logic Cells

-

SoC FPGA