类别是'category.片上系统(SoC)' (7695)
- 所有品牌
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 安装类型 | 包装/外壳 | 表面安装 | 供应商器件包装 | 终端数量 | 厂商 | 操作温度 | 包装 | 系列 | 零件状态 | 类型 | 最高工作温度 | 最小工作温度 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 频率 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 温度等级 | 界面 | 内存大小 | 速度 | 内存大小 | 核心处理器 | 周边设备 | 程序内存大小 | 连接方式 | 建筑学 | 数据总线宽度 | 输入数量 | 座位高度-最大 | 可编程逻辑类型 | 产品类别 | 议定书 | 核心架构 | 功率 - 输出 | 无线电频率系列/标准 | 收发器数量 | 敏感度 | 数据率(最大) | 主要属性 | 串行接口 | 接收电流 | 传输电流 | 逻辑单元数 | 调制 | 核数量 | [医]GPIO | 闪光大小 | 产品类别 | 长度 | 宽度 | |||||||||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | XCVE1752-1LLINSVG1369 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1369-BFBGA | 1369-BGA (35x35) | AMD 赛灵思 | Tray | 活跃 | 500 | -40°C ~ 100°C (TJ) | Versal™ AI Core | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1402-1LLIVFVC1596 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1596-BFBGA | 1596-BGA (37.5x37.5) | AMD 赛灵思 | + 110 C | - 40 C | 748 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Versal™ Prime | 700 mV | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1502-1LSENSVG1369 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1369-BFBGA | 1369-BGA (35x35) | AMD 赛灵思 | Tray | 活跃 | 478 | 0°C ~ 100°C (TJ) | Versal™ AI Core | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 80k Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1402-1MSINSVF1369 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1369-BFBGA | 1369-BGA (35x35) | AMD 赛灵思 | Tray | 活跃 | 424 | -40°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.3GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1702-1LSINSVG1369 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1369-BFBGA | 1369-BGA (35x35) | AMD 赛灵思 | Tray | 活跃 | 500 | -40°C ~ 100°C (TJ) | Versal™ AI Core | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 1SX250LH3F55I2VG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FBGA-2912 | Stratix | Details | 4 x 32 kB | - | 1160 | 有 | This product may require additional documentation to export from the United States. | 4 x 32 kB | 1 GHz | 2500000 LE | + 100 C | - 40 C | 10 | SMD/SMT | 312500 LAB | 956205 | Intel | Intel / Altera | -40°C ~ 100°C (TJ) | Tray | Stratix® 10 SX | 活跃 | SOC - Systems on a Chip | 0.85 V | 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | 24 Transceiver | FPGA - 2500K Logic Elements | 4 Core | -- | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS066K1F35E1HG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | 965382 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | - | 有 | 10AS066K1F35E1HG | 活跃 | INTEL CORP | 5.66 | 396 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 660000 LE | + 100 C | 0 C | 24 | SMD/SMT | 82500 LAB | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | 活跃 | SOC - Systems on a Chip | unknown | 950 mV | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | FPGA - 660K Logic Elements | 2 Core | -- | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS057K2F40E2SG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | YES | 1517-FCBGA (40x40) | 1517 | 21 | SMD/SMT | 71250 LAB | 973526 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | - | BGA, | 网格排列 | PLASTIC/EPOXY | 0.9 V | 0.87 V | 100 °C | 有 | 10AS057K2F40E2SG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.45 | 696 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 570000 LE | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | 活跃 | 8542.39.00.01 | SOC - Systems on a Chip | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1517 | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3.5 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 570K Logic Elements | 2 Core | -- | SoC FPGA | 40 mm | 40 mm | |||||||||||||||||||||||||||||||||||||||
![]() | XCZU2EG-3SBVA484E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | AMD | Tray | Obsolete | 82 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 600MHz, 667MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS066N4F40E3SG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | 588 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 660000 LE | 21 | SMD/SMT | 82500 LAB | 965356 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | - | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | 活跃 | 100 °C | 0 °C | SOC - Systems on a Chip | 1.5 GHz | EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | ARM | FPGA - 660K Logic Elements | 2 Core | -- | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS057N4F40E3SG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | YES | 1517-FCBGA (40x40) | 1517 | 1.2 GHz | 570000 LE | 21 | SMD/SMT | 71250 LAB | 966145 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | - | BGA, BGA1517,39X39,40 | 网格排列 | PLASTIC/EPOXY | BGA1517,39X39,40 | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS057N4F40E3SG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.45 | 588 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | 活跃 | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1517 | 588 | 不合格 | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 588 | 3.5 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 570K Logic Elements | 570000 | 2 Core | -- | SoC FPGA | 40 mm | 40 mm | ||||||||||||||||||||||||||||||
![]() | AGIB027R31B2I1V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | Tray | 活跃 | 720 | -40°C ~ 100°C (TJ) | Agilex I | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVP1502-2LSEVSVA2785 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2785-BFBGA | 2785-BGA (50x50) | AMD | Tray | 活跃 | 702 | 0°C ~ 100°C (TJ) | Versal® Premium | 450MHz, 1.08GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Premium FPGA, 3.7M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TDA4VE88TGAALZRQ1 | Texas Instruments | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 770-BFBGA, FCBGA | 770-FCBGA (23x23) | 德州仪器 | 48 kB | 12.5 MHz | + 125 C | - 40 C | SMD/SMT | 155 | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | 活跃 | 32 kB | -40°C ~ 125°C (TJ) | Automotive, AEC-Q100 | 1.71 V to 1.89 V | 2GHz, 1GHz, 1GHz | 2MB | ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x | DMA, PWM, WDT | MCAN, MMC/SD/SDIO, I²C, SPI, UART, USB | DSP, MCU, MPU | 64 bit | - | 3 Core | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 1SX040HH2F35I2VG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | Intel | Tray | 活跃 | 374 | -40°C ~ 100°C (TJ) | Stratix® 10 SX | 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 400K Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7Z035-2FFV676E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 676-BBGA, FCBGA | 676-FCBGA (27x27) | AMD | Bulk | Obsolete | 130 | 0°C ~ 100°C (TJ) | Zynq®-7000 | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 275K Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CYW20835PB1KML1GGF | Infineon | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 60-VFQFN Exposed Pad | PG-VQFN-60-800 | Infineon Technologies | 活跃 | Tray | CYW20835 | -30°C ~ 85°C | AIROC™ Bluetooth | TxRx + MCU | 1.625V ~ 1.775V | 2.4GHz | 2MB ROM, 384kB RAM | Bluetooth v5.2, CDMA, EDGE, GSM, WCDMA | 12dBm | Bluetooth | -94.5dBm | 2Mbps | ADC, GPIO, HCI, I²C, I²S, JTAG, PCM, PWM, SPI, UART | 8mA | 18mA | GFSK | 24 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFB027R31C3I3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | Tray | 活跃 | 720 | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU3EG-2SFVC784I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | AMD | 252 | XCZU3 | 活跃 | Tray | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU2CG-1SBVA484I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | AMD | Tray | 活跃 | XCZU2 | 82 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA006R16A3I3V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | Tray | 活跃 | 384 | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 573K Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM2202-1LSIVSVC2197 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | + 110 C | - 40 C | 700 mV | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1302-1LSENSVF1369 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1369-BFBGA | 1369-BGA (35x35) | AMD 赛灵思 | Tray | 活跃 | 424 | 0°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5CSEBA6U19I7NTS | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Tray | * | 活跃 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU5CG-1FBVB900I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | Tray | 活跃 | XCZU5 | 204 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - |
XCVE1752-1LLINSVG1369
Xilinx
分类:Embedded - System On Chip (SoC)
XCVM1402-1LLIVFVC1596
Xilinx
分类:Embedded - System On Chip (SoC)
XCVC1502-1LSENSVG1369
Xilinx
分类:Embedded - System On Chip (SoC)
XCVM1402-1MSINSVF1369
Xilinx
分类:Embedded - System On Chip (SoC)
XCVC1702-1LSINSVG1369
Xilinx
分类:Embedded - System On Chip (SoC)
1SX250LH3F55I2VG
ALTERA
分类:Embedded - System On Chip (SoC)
10AS066K1F35E1HG
ALTERA
分类:Embedded - System On Chip (SoC)
10AS057K2F40E2SG
ALTERA
分类:Embedded - System On Chip (SoC)
XCZU2EG-3SBVA484E
AMD
分类:Embedded - System On Chip (SoC)
10AS066N4F40E3SG
ALTERA
分类:Embedded - System On Chip (SoC)
10AS057N4F40E3SG
ALTERA
分类:Embedded - System On Chip (SoC)
AGIB027R31B2I1V
Intel
分类:Embedded - System On Chip (SoC)
XCVP1502-2LSEVSVA2785
AMD
分类:Embedded - System On Chip (SoC)
TDA4VE88TGAALZRQ1
Texas Instruments
分类:Embedded - System On Chip (SoC)
1SX040HH2F35I2VG
Intel
分类:Embedded - System On Chip (SoC)
XC7Z035-2FFV676E
AMD
分类:Embedded - System On Chip (SoC)
CYW20835PB1KML1GGF
Infineon
分类:Embedded - System On Chip (SoC)
AGFB027R31C3I3E
Intel
分类:Embedded - System On Chip (SoC)
XCZU3EG-2SFVC784I
AMD
分类:Embedded - System On Chip (SoC)
XCZU2CG-1SBVA484I
AMD
分类:Embedded - System On Chip (SoC)
AGFA006R16A3I3V
Intel
分类:Embedded - System On Chip (SoC)
XCVM2202-1LSIVSVC2197
Xilinx
分类:Embedded - System On Chip (SoC)
XCVM1302-1LSENSVF1369
Xilinx
分类:Embedded - System On Chip (SoC)
5CSEBA6U19I7NTS
ALTERA
分类:Embedded - System On Chip (SoC)
XCZU5CG-1FBVB900I
AMD
分类:Embedded - System On Chip (SoC)
