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产品型号	品牌	数据表	库存	价格(含增值税)	数量	安装类型	包装/外壳	表面安装	供应商器件包装	终端数量												厂商																											操作温度	包装	系列	零件状态	类型	最高工作温度	最小工作温度	HTS代码	子类别	技术	电压 - 供电	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	Reach合规守则	频率	JESD-30代码	输出的数量	资历状况	工作电源电压	电源	温度等级	界面	内存大小	速度	内存大小	核心处理器	周边设备	程序内存大小	连接方式	建筑学	数据总线宽度	输入数量	可编程逻辑类型	产品类别	议定书	核心架构	敏感度	主要属性	串行接口	接收电流	传输电流	逻辑单元数	调制
XCVE1752-1LLINSVG1369	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1369-BFBGA	1369-BGA (35x35)	AMD 赛灵思	Tray	活跃				500	-40°C ~ 100°C (TJ)		Versal™ AI Core																						400MHz, 1GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA													Versal™ AI Core FPGA, 1M Logic Cells								-
XCVM1402-1LLIVFVC1596	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1596-BFBGA	1596-BGA (37.5x37.5)	AMD 赛灵思				+ 110 C	- 40 C	748	Tray	活跃	-40°C ~ 100°C (TJ)		Versal™ Prime																		700 mV				400MHz, 1GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA													Versal™ Prime FPGA, 1.2M Logic Cells								-
XCVC1502-1LSENSVG1369	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1369-BFBGA	1369-BGA (35x35)	AMD 赛灵思	Tray	活跃				478	0°C ~ 100°C (TJ)		Versal™ AI Core																						400MHz, 1GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA													Versal™ Prime FPGA, 80k Logic Cells								-
XCVM1402-1MSINSVF1369	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1369-BFBGA	1369-BGA (35x35)	AMD 赛灵思	Tray	活跃				424	-40°C ~ 100°C (TJ)		Versal™ Prime																						600MHz, 1.3GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA													Versal™ Prime FPGA, 1.2M Logic Cells								-
XCVC1702-1LSINSVG1369	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1369-BFBGA	1369-BGA (35x35)	AMD 赛灵思	Tray	活跃				500	-40°C ~ 100°C (TJ)		Versal™ AI Core																						400MHz, 1GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA													Versal™ AI Core FPGA, 1M Logic Cells								-
1SX250LH3F55I2VG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FBGA-2912	Stratix	Details	4 x 32 kB	-					1160	有	This product may require additional documentation to export from the United States.	4 x 32 kB	1 GHz	2500000 LE	+ 100 C	- 40 C	10	SMD/SMT	312500 LAB		956205	Intel	Intel / Altera	-40°C ~ 100°C (TJ)	Tray	Stratix® 10 SX	活跃					SOC - Systems on a Chip												0.85 V				1.5GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™	DMA, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					SoC FPGA					24 Transceiver			FPGA - 2500K Logic Elements						4 Core		--	SoC FPGA
10AS066K1F35E1HG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1152-BBGA, FCBGA	1152-FBGA (35x35)		965382	Intel	Intel / Altera	Arria 10 SoC	Details	2 x 32 kB	-	有	10AS066K1F35E1HG	活跃	INTEL CORP	5.66				396	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	660000 LE	+ 100 C	0 C	24	SMD/SMT	82500 LAB	0°C ~ 100°C (TJ)	Tray	Arria 10 SX	活跃					SOC - Systems on a Chip							unknown					950 mV				1.5GHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					SoC FPGA								FPGA - 660K Logic Elements					2 Core		--	SoC FPGA
10AS057K2F40E2SG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	YES	1517-FCBGA (40x40)	1517	21	SMD/SMT	71250 LAB	973526	Intel		Intel / Altera	Arria 10 SoC	Details	2 x 32 kB	-	BGA,	网格排列	PLASTIC/EPOXY	0.9 V	0.87 V	100 °C	有	10AS057K2F40E2SG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.45		696	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	570000 LE	0°C ~ 100°C (TJ)	Tray	Arria 10 SX	活跃				8542.39.00.01	SOC - Systems on a Chip			BOTTOM	BALL		1 mm	compliant		S-PBGA-B1517					OTHER		1.5GHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			3.5 mm	现场可编程门阵列	SoC FPGA							FPGA - 570K Logic Elements			2 Core	--	SoC FPGA	40 mm	40 mm
XCZU2EG-3SBVA484E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-BFBGA, FCBGA	484-FCBGA (19x19)	AMD	Tray	Obsolete				82	0°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG																						600MHz, 667MHz, 1.5GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA													Zynq®UltraScale+™ FPGA, 103K+ Logic Cells								-
10AS066N4F40E3SG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)			588	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	660000 LE	21	SMD/SMT	82500 LAB	965356	Intel		Intel / Altera	Arria 10 SoC	Details	2 x 32 kB	-		0°C ~ 100°C (TJ)	Tray	Arria 10 SX	活跃		100 °C	0 °C		SOC - Systems on a Chip								1.5 GHz							EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	1.5GHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					SoC FPGA		ARM						FPGA - 660K Logic Elements						2 Core		--	SoC FPGA
10AS057N4F40E3SG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	YES	1517-FCBGA (40x40)	1517	1.2 GHz	570000 LE	21	SMD/SMT	71250 LAB	966145	Intel		Intel / Altera	Arria 10 SoC	Details	2 x 32 kB	-	BGA, BGA1517,39X39,40	网格排列	PLASTIC/EPOXY	BGA1517,39X39,40	0.9 V	未说明	0.87 V	100 °C	有	10AS057N4F40E3SG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.45		588	有	This product may require additional documentation to export from the United States.	2 x 32 kB	0°C ~ 100°C (TJ)	Tray	Arria 10 SX	活跃				8542.39.00.01	SOC - Systems on a Chip	CMOS		BOTTOM	BALL	未说明	1 mm	compliant		S-PBGA-B1517	588	不合格		0.9 V	OTHER		1.5GHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		588	3.5 mm	现场可编程门阵列	SoC FPGA							FPGA - 570K Logic Elements	570000	2 Core		--	SoC FPGA	40 mm	40 mm
AGIB027R31B2I1V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	Tray	活跃				720	-40°C ~ 100°C (TJ)		Agilex I																						1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA													FPGA - 2.7M Logic Elements								-
XCVP1502-2LSEVSVA2785	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	2785-BFBGA	2785-BGA (50x50)	AMD	Tray	活跃				702	0°C ~ 100°C (TJ)		Versal® Premium																						450MHz, 1.08GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA													Versal™ Premium FPGA, 3.7M Logic Cells								-
TDA4VE88TGAALZRQ1	Texas Instruments	数据表	N/A	-	最小起订量: 1 最小包装量: 1	770-BFBGA, FCBGA	770-FCBGA (23x23)	德州仪器	48 kB	12.5 MHz	+ 125 C	- 40 C	SMD/SMT	155	Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;	活跃				32 kB	-40°C ~ 125°C (TJ)		Automotive, AEC-Q100																		1.71 V to 1.89 V				2GHz, 1GHz, 1GHz	2MB	ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x	DMA, PWM, WDT		MCAN, MMC/SD/SDIO, I²C, SPI, UART, USB	DSP, MCU, MPU	64 bit												-						3 Core		-
1SX040HH2F35I2VG	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1152-BBGA, FCBGA	1152-FBGA (35x35)	Intel	Tray	活跃				374	-40°C ~ 100°C (TJ)		Stratix® 10 SX																						1.5GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA													FPGA - 400K Logic Elements								-
XC7Z035-2FFV676E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	676-BBGA, FCBGA	676-FCBGA (27x27)	AMD	Bulk	Obsolete				130	0°C ~ 100°C (TJ)		Zynq®-7000																						800MHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA													Kintex™-7 FPGA, 275K Logic Cells								-
CYW20835PB1KML1GGF	Infineon	数据表	N/A	-	最小起订量: 1 最小包装量: 1	表面贴装	60-VFQFN Exposed Pad	PG-VQFN-60-800	Infineon Technologies	活跃			Tray	CYW20835	-30°C ~ 85°C		AIROC™ Bluetooth		TxRx + MCU						1.625V ~ 1.775V						2.4GHz									2MB ROM, 384kB RAM											Bluetooth v5.2, CDMA, EDGE, GSM, WCDMA		12dBm	Bluetooth		-94.5dBm	2Mbps		ADC, GPIO, HCI, I²C, I²S, JTAG, PCM, PWM, SPI, UART	8mA	18mA		GFSK		24
AGFB027R31C3I3E	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	Tray	活跃				720	-40°C ~ 100°C (TJ)		Agilex F																						1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA													FPGA - 2.7M Logic Elements								-
XCZU3EG-2SFVC784I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	784-BFBGA, FCBGA	784-FCBGA (23x23)	AMD	252	XCZU3				活跃	Tray	-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG																						533MHz, 600MHz, 1.3GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA													Zynq®UltraScale+™ FPGA, 154K+ Logic Cells								-
XCZU2CG-1SBVA484I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-BFBGA, FCBGA	484-FCBGA (19x19)	AMD	Tray	活跃				XCZU2	82	-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC CG																						500MHz, 1.2GHz	256KB	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA													Zynq®UltraScale+™ FPGA, 103K+ Logic Cells								-
AGFA006R16A3I3V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	Tray	活跃				384	-40°C ~ 100°C (TJ)		Agilex F																						1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA													FPGA - 573K Logic Elements								-
XCVM2202-1LSIVSVC2197	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1		+ 110 C	- 40 C																										700 mV
XCVM1302-1LSENSVF1369	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1369-BFBGA	1369-BGA (35x35)	AMD 赛灵思	Tray	活跃				424	0°C ~ 100°C (TJ)		Versal™ Prime																						600MHz, 1.3GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA													Versal™ Prime FPGA, 70k Logic Cells								-
5CSEBA6U19I7NTS	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1								Tray	*	活跃
XCZU5CG-1FBVB900I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	900-BBGA, FCBGA	900-FCBGA (31x31)	AMD	Tray	活跃				XCZU5	204	-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC CG																						500MHz, 1.2GHz	256KB	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA													Zynq®UltraScale+™ FPGA, 256K+ Logic Cells								-