类别是'category.片上系统(SoC)' (7695)
- 所有品牌
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 包装/外壳 | 供应商器件包装 | 厂商 | 操作温度 | 包装 | 系列 | 零件状态 | 温度系数 | 电阻 | 性别 | 子类别 | 额定功率 | 电阻器类型 | 频率稳定性 | 引脚数量 | 工作电源电压 | 速度 | 内存大小 | 核心处理器 | 周边设备 | 程序内存大小 | 连接方式 | 家人 | 建筑学 | 数据总线宽度 | 产品类别 | 筛选水平 | 速度等级 | 电阻公差 | 主要属性 | 寄存器数量 | 核数量 | 输出电平 | 闪光大小 | 产品类别 | 产品长度 | 产品宽度 | 设备核心 | ||||||||||||||||||||||||||||||
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![]() | AGFA027R25A3E4X | Intel | 数据表 | 746 In Stock |
- | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 624 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7Z045-2FBG676E | AMD | 数据表 | 48 In Stock | - | 最小起订量: 1 最小包装量: 1 | 676-BBGA, FCBGA | 676-FCBGA (27x27) | AMD | Tray | 活跃 | XC7Z045 | 130 | 0°C ~ 100°C (TJ) | Zynq®-7000 | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 350K Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU46DR-DIE4058 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU47DR-1FFVG1517IES9819 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | 533 MHz, 1.3 GHz | 930300 LE | - | XCZU47DR | - | 6 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7Z100-1FF900I | AMD | 数据表 | 741 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | 2 | CAN/I2C/SPI/UART | 130 | Tray | XC7Z100 | 活跃 | Straight | Solder | 法兰安装 | RISC | 1.5, 2, 2.5 V | FBGA | -40 to 100 °C | Zynq®-7000 | Plug | 900 | 1, 1.8 V | 667MHz | 256 KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32 Bit | Kintex™-7 FPGA, 444K Logic Cells | - | 86.1 mm | ARM Cortex A9 | |||||||||||||||||||||||||||||||||||||||
![]() | XA7Z010-1CLG400I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 400-LFBGA, CSPBGA | 400-CSPBGA (17x17) | AMD | 1 | CAN/GPIO/SPI/UART | 表面贴装 | 130 | Tray | 活跃 | RISC | 1.8, 3.3 V | CSBGA | -40 to 100 °C | Automotive, AEC-Q100, Zynq®-7000 XA | 400 | 1 V | 667MHz | 256 KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32 Bit | Artix™-7 FPGA, 28K Logic Cells | - | ARM Cortex A9 | ||||||||||||||||||||||||||||||||||||||||||||
![]() | AGIA040R39A1I2VB | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 3948-BFBGA Exposed Pad | 3948-BGA (56x56) | 576 | -40°C ~ 100°C (TJ) | Tray | Agilex I | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 4.047M Logic Elements | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7Z035-1FFG900I | AMD | 数据表 | 941 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | 表面贴装 | 130 | Tray | XC7Z035 | 活跃 | Industrial grade | 275,000 | FCBGA | 1.0000 V | 0.95 V | 362 | 1.05 V | -40 to 100 °C | Zynq®-7000 | 900 | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Industrial | 1 | Kintex™-7 FPGA, 275K Logic Cells | 343,800 | - | |||||||||||||||||||||||||||||||||||||||||
![]() | AGFA023R31C3E3V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | 480 | 0°C ~ 100°C (TJ) | Tray | Agilex F | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFB023R31C2E3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | 480 | 0°C ~ 100°C (TJ) | Tray | Agilex F | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | R8A77970LA01BA#GB | Renesas Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Tray | 活跃 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGIC035R39A2E3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 3948-BFBGA Exposed Pad | 3948-BGA (56x56) | 576 | 0°C ~ 100°C (TJ) | Tray | Agilex I | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 3.54M Logic Elements | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM2902-1LSEVFVF1760 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 0 C | 1 | Xilinx | Xilinx | + 100 C | SOC - Systems on a Chip | 700 mV | System-On-Modules - SOM | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1302-2LLEVFVC1596 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1596-BFBGA | 1596-BGA (37.5x37.5) | AMD 赛灵思 | Tray | 活跃 | + 110 C | 0 C | 1 | Xilinx | Xilinx | 532 | 0°C ~ 100°C (TJ) | Versal™ Prime | 50 ppm/°C | 162 kOhm | SOC - Systems on a Chip | 0.25 W | 高可靠性 | 700 mV | 450MHz, 1.08GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | System-On-Modules - SOM | 1 | Versal™ Prime FPGA, 70k Logic Cells | - | SoC FPGA | 3.2 | 1.6 | ||||||||||||||||||||||||||||||||||||||
![]() | XCVM1102-2MSISFVA784 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Xilinx | AEC-Q200 | + 110 C | - 40 C | 1 | Xilinx | 100 ppm/K | 825 Ohm | SOC - Systems on a Chip | 0.1 W | 通用型 | 800 mV | System-On-Modules - SOM | 1 | SoC FPGA | 1.55 mm | 0.85 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVP1402-1LSEVFVF1760 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 0 C | 1 | Xilinx | Xilinx | + 100 C | SOC - Systems on a Chip | 125 mW | High Reliability, MIL-PRF-55182 | 700 mV | System-On-Modules - SOM | 1 | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XQVP1202-1LSIVSRC2197 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - 40 C | 1 | Xilinx | Xilinx | + 110 C | 100.0000 ppm/°C | 2.26 kOhm | SOC - Systems on a Chip | 0.125 W | High Reliability, MIL-PRF-39017 | 700 mV | System-On-Modules - SOM | 1 | SoC FPGA | 4.75 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XQVC1902-2MLIVIQA1596 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - 40 C | 1 | Xilinx | Xilinx | + 110 C | 100 ppm/°C | 24.3 kOhm | SOC - Systems on a Chip | 0.15 W | 高可靠性 | 800 mV | System-On-Modules - SOM | 0.1 | SoC FPGA | 2.03 | 1.27 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVP1402-2MSIVFVF1760 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - 40 C | 1 | Xilinx | Xilinx | + 110 C | 50.0000 ppm/°C | 49.9 Ohm | SOC - Systems on a Chip | 0.125 W | High Reliability, MIL-PRF-55182 | 800 mV | System-On-Modules - SOM | 1 | SoC FPGA | 7.62 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XQVP1202-1MSMVSRC2197 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - 55 C | 1 | Xilinx | Xilinx | + 125 C | -40 to 85 °C | SOC - Systems on a Chip | 800 mV | System-On-Modules - SOM | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVP1102-1LSIVFVF1760 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - 40 C | 1 | Xilinx | Xilinx | + 110 C | SOC - Systems on a Chip | 700 mV | 高频继电器 | System-On-Modules - SOM | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1402-1LSIVSVD1760 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD 赛灵思 | Tray | 活跃 | + 110 C | - 40 C | 1 | Xilinx | Xilinx | 726 | -40°C ~ 100°C (TJ) | Versal™ Prime | 100 ppm/K | 24.9 Ohm | SOC - Systems on a Chip | 1 W | 通用型 | 700 mV | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | System-On-Modules - SOM | 1 | Versal™ Prime FPGA, 1.2M Logic Cells | - | SoC FPGA | 6.3 | 3.15 | ||||||||||||||||||||||||||||||||||||||
![]() | XCVM2302-1LSEVFVF1760 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 20.83 MHz | CSMD | 表面贴装 | + 100 C | 0 C | 1 | Xilinx | Xilinx | -20 to 70 °C | SOC - Systems on a Chip | 50 ppm | 4 | 700 mV | System-On-Modules - SOM | HCMOS/TTL | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVP1402-1MLIVFVF1760 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - 40 C | 1 | Xilinx | Xilinx | + 110 C | 50.0000 ppm/°C | 30.1 Ohm | SOC - Systems on a Chip | 0.125 W | High Reliability, MIL-PRF-55182 | 800 mV | System-On-Modules - SOM | 1 | SoC FPGA | 7.62 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1302-3HSEVFVC1596 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Xilinx | MIL-PRF-39009 | + 100 C | 0 C | 1 | Xilinx | ± 20ppm/°C | 27 Ohm | SOC - Systems on a Chip | 30 W | 880 mV | System-On-Modules - SOM | ± 1% | SoC FPGA | 49.99 mm | 28.96 mm |
AGFA027R25A3E4X
Intel
分类:Embedded - System On Chip (SoC)
174,764.609093
XC7Z045-2FBG676E
AMD
分类:Embedded - System On Chip (SoC)
XCZU46DR-DIE4058
Xilinx
分类:Embedded - System On Chip (SoC)
XCZU47DR-1FFVG1517IES9819
Xilinx
分类:Embedded - System On Chip (SoC)
XC7Z100-1FF900I
AMD
分类:Embedded - System On Chip (SoC)
23,308.177107
XA7Z010-1CLG400I
AMD
分类:Embedded - System On Chip (SoC)
AGIA040R39A1I2VB
Intel
分类:Embedded - System On Chip (SoC)
XC7Z035-1FFG900I
AMD
分类:Embedded - System On Chip (SoC)
15,764.042118
AGFA023R31C3E3V
Intel
分类:Embedded - System On Chip (SoC)
AGFB023R31C2E3E
Intel
分类:Embedded - System On Chip (SoC)
R8A77970LA01BA#GB
Renesas Electronics Corporation
分类:Embedded - System On Chip (SoC)
AGIC035R39A2E3E
Intel
分类:Embedded - System On Chip (SoC)
XCVM2902-1LSEVFVF1760
Xilinx
分类:Embedded - System On Chip (SoC)
XCVM1302-2LLEVFVC1596
Xilinx
分类:Embedded - System On Chip (SoC)
XCVM1102-2MSISFVA784
Xilinx
分类:Embedded - System On Chip (SoC)
XCVP1402-1LSEVFVF1760
Xilinx
分类:Embedded - System On Chip (SoC)
XQVP1202-1LSIVSRC2197
Xilinx
分类:Embedded - System On Chip (SoC)
XQVC1902-2MLIVIQA1596
Xilinx
分类:Embedded - System On Chip (SoC)
XCVP1402-2MSIVFVF1760
Xilinx
分类:Embedded - System On Chip (SoC)
XQVP1202-1MSMVSRC2197
Xilinx
分类:Embedded - System On Chip (SoC)
XCVP1102-1LSIVFVF1760
Xilinx
分类:Embedded - System On Chip (SoC)
XCVM1402-1LSIVSVD1760
Xilinx
分类:Embedded - System On Chip (SoC)
XCVM2302-1LSEVFVF1760
Xilinx
分类:Embedded - System On Chip (SoC)
XCVP1402-1MLIVFVF1760
Xilinx
分类:Embedded - System On Chip (SoC)
XCVM1302-3HSEVFVC1596
Xilinx
分类:Embedded - System On Chip (SoC)
