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类别是'category.片上系统（SoC）' (7695)

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产品型号	品牌	数据表	库存	价格(含增值税)	数量	触点镀层	底架	安装类型	包装/外壳	表面安装	供应商器件包装	终端数量														厂商																								包装	系列	尺寸/尺寸	容差	零件状态	终止次数	终端	温度系数	连接器类型	类型	电阻	定位的数量	最高工作温度	最小工作温度	组成	性别	功率(瓦特)	HTS代码	紧固类型	子类别	技术	电压 - 供电	端子位置	方向	终端形式	峰值回流焊温度（摄氏度）	端子间距	深度	Reach合规守则	输出量	终端样式	输出的数量	资历状况	接头数量	电源	温度等级	电路数量	镀层	速度	内存大小	核心处理器	周边设备	建筑学	输入数量	座位高度-最大	可编程逻辑类型	比率-输入：输出	主要属性	逻辑单元数
AMA3B1KK-KCR-TB	Ambiq Micro, Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	66-UFBGA, CSPBGA	66-CSP (3.38x3.25)						37	AMA3B1KK		-40°C ~ 85°C (TA)	Tape & Reel (TR)	Apollo3 Blue			活跃																														96MHz	384KB	ARM® Cortex®-M4F		Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT		I2C, SPI, UART/USART	MCU											1MB
AGFA023R24C3E3V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	2340-BFBGA Exposed Pad	2340-BGA (45x42)						480		0°C ~ 100°C (TJ)	Tray	Agilex F			活跃																														1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point		DMA, WDT		EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA								FPGA - 2.3M Logic Elements
AGFA006R24C2I1VB	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	2340-BFBGA Exposed Pad	2340-BGA (45x42)						576		-40°C ~ 100°C (TJ)	Tray	Agilex F			活跃																														1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point		DMA, WDT		EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA								FPGA - 573K Logic Elements
AGFA008R24C2E1VB	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	2340-BFBGA Exposed Pad	2340-BGA (45x42)						576		0°C ~ 100°C (TJ)	Tray	Agilex F			活跃																														1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point		DMA, WDT		EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA								FPGA - 764K Logic Elements
XCZU3CG-1SFVC784E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	784-BFBGA, FCBGA	784-FCBGA (23x23)	AMD	252	Tray	XCZU3	活跃						Non-Compliant	0°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC CG																																	500MHz, 1.2GHz	256KB	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™		DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA								Zynq®UltraScale+™ FPGA, 154K+ Logic Cells			-
XCVE1752-2MLEVSVA1596	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1596-BFBGA, FCBGA	AMD	Sensata	不发光	AIRPAX	AIRPAX	500	Tray	活跃							+ 85 C	3.174657 oz	- 40 C	3	面板安装			IAL/IDL/IML/IUL								Hydraulic-Magnetic								断路器							Stud					Handle					600MHz, 1.4GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	1 Pole	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA					磁性断路器						-	断路器	断路器
XCZU3CG-1SBVA484I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-BFBGA, FCBGA	484-FCBGA (19x19)	AMD	XCZU3	活跃						+ 85 C	- 40 C	3	面板安装	Sensata	不发光	AIRPAX	82	Tray	-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC CG																断路器							Push-On					Toggle					500MHz, 1.2GHz	256KB	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	2 Pole	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA							Zynq®UltraScale+™ FPGA, 154K+ Logic Cells			-	断路器		断路器
XCZU19EG-2FFVB1517I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)	AMD	XCZU19	活跃						TE Connectivity / AMP	TE Connectivity	5000	644	Tray	-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG																Wire & Cable Management																	533MHz, 600MHz, 1.3GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2		DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Wire Labels & Markers			Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells			-			Wire Labels & Markers
10AS016E3F29I1SG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	780-BBGA, FCBGA	780-FBGA (29x29)						288	Non-Compliant		-40°C ~ 100°C (TJ)	Tray	Arria 10 SX			Discontinued at Digi-Key																														1.5GHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™		DMA, POR, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA								FPGA - 160K Logic Elements			--
10AS027H3F34I2SG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FBGA-1152	YES	1152	1.2 GHz	270000 LE	1	SMD/SMT	33750 LAB	964831	Intel	Intel / Altera	Arria 10 SoC		Details	2 x 32 kB	-	BGA, BGA1152,34X34,40	网格排列	PLASTIC/EPOXY	BGA1152,34X34,40	-40 °C	0.9 V	未说明	0.87 V	100 °C	有	10AS027H3F34I2SG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.45			384	有	This product may require additional documentation to export from the United States.	2 x 32 kB	-40°C ~ 100°C (TJ)	Tray	Arria 10 SX	活跃											8542.39.00.01		SOC - Systems on a Chip	CMOS		BOTTOM		BALL	未说明	1 mm		compliant			S-PBGA-B1152	384	不合格			0.9 V	INDUSTRIAL		1.5GHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	384	3.65 mm	现场可编程门阵列	SoC FPGA	FPGA - 270K Logic Elements	270000	2 Core	--	SoC FPGA	35 mm	35 mm
LH79525N0Q100A0，55	NXP	数据表	N/A	-	最小起订量: 1 最小包装量: 1
AGFB006R24C3E3V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Gold	Bulkhead, Front Side Nut, Jam Nut, Panel	-	-	Intel		Compliant	576	Tray	活跃			0°C ~ 100°C (TJ)	Bulk	Agilex F					Crimp		Crimp, Receptacle			66	175 °C	-65 °C		Female			Threaded			Straight				46.02 mm					66			Cadmium	1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point		DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA								FPGA - 573K Logic Elements			-					31.57 mm		无	抗环境干扰
AGFB006R24C2I3E	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	Tray	活跃						576	-40°C ~ 100°C (TJ)		Agilex F																																	1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point		DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA								FPGA - 573K Logic Elements			-
AGFA012R24C3E3V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel					Non-Compliant	744	Tray	活跃		0°C ~ 100°C (TJ)		Agilex F																																	1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point		DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA								FPGA - 1.2M Logic Elements			-
XCZU3EG-1SFVC784E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	784-BFBGA, FCBGA	784-FCBGA (23x23)	AMD					252	Tray	XCZU3	活跃		0°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG																																	500MHz, 600MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2		DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA								Zynq®UltraScale+™ FPGA, 154K+ Logic Cells			-
XCZU47DR-L2FSVE1156I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	Panduit Corp	Obsolete	366						Bulk	-40°C ~ 100°C (TJ)		*																																	533MHz, 1.333GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™		DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA								Zynq®UltraScale+™ FPGA, 930K+ Logic Cells			-
XCZU47DR-2FSVE1156E	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	0805 (2012 Metric)	0805	KOA Speer Electronics, Inc.					Tape & Reel (TR)	RN732A	Obsolete	366		-55°C ~ 155°C		RN73	0.079 L x 0.049 W (2.00mm x 1.25mm)	±0.5%		2		±25ppm/°C			1.18 kOhms				Thin Film		0.1W, 1/10W																		533MHz, 1.333GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™		DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA								Zynq®UltraScale+™ FPGA, 930K+ Logic Cells			-		Moisture Resistant		0.024 (0.60mm)
XCZU47DR-L2FFVG1517I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)	Molex					Bulk	505433	活跃	561		-40°C ~ 100°C (TJ)		*																																	533MHz, 1.333GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™		DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA								Zynq®UltraScale+™ FPGA, 930K+ Logic Cells			-
XCZU48DR-1FFVE1156I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	Pulse Electronics	Obsolete	366						Bulk	-40°C ~ 100°C (TJ)		-																																	500MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™		DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA								Zynq®UltraScale+™ FPGA, 930K+ Logic Cells			-
XCZU46DR-2FSVH1760E	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BBGA, FCBGA	1760-FCBGA (42.5x42.5)	NXP USA Inc.					Tube	BLF6	活跃	574		0°C ~ 100°C (TJ)		*																																	533MHz, 1.333GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™		DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA								Zynq®UltraScale+™ FPGA, 930K+ Logic Cells			-
XCZU47DR-L2FFVE1156I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	表面贴装	24-VFQFN Exposed Pad	24-QFN (4x4)	Skyworks Solutions Inc.					Tray	SI5330	Obsolete	350 MHz	366	-40°C ~ 85°C		-								Fanout Buffer (Distribution), Translator										1.71V ~ 3.63V								LVPECL					1		533MHz, 1.333GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™		DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				CMOS, HSTL, LVTTL, SSTL		1:4	No/Yes	Zynq®UltraScale+™ FPGA, 930K+ Logic Cells			-
XCZU48DR-L1FSVE1156I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	Molex					Bulk	120084	活跃	366		-40°C ~ 100°C (TJ)		*																																	500MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™		DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA								Zynq®UltraScale+™ FPGA, 930K+ Logic Cells			-
XCZU48DR-L1FFVE1156I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	TE Connectivity Deutsch 连接器					Bag	YDL68G	活跃	366		-40°C ~ 100°C (TJ)		*																																	500MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™		DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA								Zynq®UltraScale+™ FPGA, 930K+ Logic Cells			-
XCZU49DR-L1FSVF1760I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BBGA, FCBGA	1760-FCBGA (42.5x42.5)	Molex					Bulk	073404	活跃	622		-40°C ~ 100°C (TJ)		*																																	500MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™		DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA								Zynq®UltraScale+™ FPGA, 930K+ Logic Cells			-
XCZU48DR-2FSVG1517I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)	Molex					Bulk	098853	活跃	561		-40°C ~ 100°C (TJ)		*																																	533MHz, 1.333GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™		DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA								Zynq®UltraScale+™ FPGA, 930K+ Logic Cells			-