category.集成电路IC_category.集成电路IC品牌厂家，型号_价格_规格

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产品型号	品牌	数据表	库存	价格(含增值税)	数量	生命周期状态	包装/外壳	表面安装	引脚数	供应商器件包装	终端数量		Core															厂商																																	操作温度	包装	系列	JESD-609代码	无铅代码	ECCN 代码	端子表面处理	最高工作温度	最小工作温度	附加功能	HTS代码	技术	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	Reach合规守则	引脚数量	JESD-30代码	输出的数量	资历状况	工作电源电压	电源	温度等级	界面	速度	内存大小	核心处理器	周边设备	程序内存大小	连接方式	建筑学	数据总线宽度	输入数量	座位高度-最大	可编程逻辑类型
M2S060T-1FGG484I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	484-BGA	YES	484	484-FPBGA (23x23)	484	ARM Cortex M3	微芯片技术	活跃	FBGA-484	网格排列	3	PLASTIC/EPOXY	BGA484,22X22,40	1.2 V	40	1.14 V	有	M2S060T-1FGG484I	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.81	This product may require additional documentation to export from the United States.	Details	166 MHz	-	-	64 kB	56520 LE	有	4710 LAB	60	SmartFusion2	1.2000 V	267	Tray	M2S060	-40 to 100 °C	Tray	SmartFusion2	e1			Tin/Silver/Copper (Sn/Ag/Cu)	100 °C	-40 °C		8542.39.00.01	CMOS	BOTTOM	BALL	250	1 mm	compliant		S-PBGA-B484	267	不合格	1.2 V	1.2 V			166MHz	164.3 kB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		267	2.44 mm	现场可编程门阵列		1	FPGA - 60K Logic Modules	56520	1 Core	256KB		23 mm	23 mm
M2S025T-VF256	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	256-LFBGA	YES	256-FPBGA (14x14)	256	ARM Cortex M3	微芯片技术	PLASTIC/EPOXY	BGA256,16X16,32	1.2 V	30	1.14 V	85 °C	无	M2S025T-VF256	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.84		This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	27696 LE	有	2308 LAB	119	138	Tray	M2S025	活跃	VFBGA-256	GRID ARRAY, LOW PROFILE, FINE PITCH	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0			Tin/Lead (Sn/Pb)			LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant		S-PBGA-B256	138	不合格		1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		138	1.56 mm	现场可编程门阵列			FPGA - 25K Logic Modules	27696	1 Core	256KB		14 mm	14 mm
M2S010TS-VF400	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 1 month ago)	400-LFBGA	YES	400-VFBGA (17x17)	400	ARM Cortex M3	微芯片技术	PLASTIC/EPOXY	BGA400,20X20,32	1.2 V	30	1.14 V	85 °C	无	M2S010TS-VF400	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.88		This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	12084 LE	有	1007 LAB	90	195	Tray	M2S010	活跃	VFBGA-400	GRID ARRAY, LOW PROFILE, FINE PITCH	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0			Tin/Lead (Sn/Pb)				8542.39.00.01	CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant		S-PBGA-B400	195	不合格		1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		195	1.51 mm	现场可编程门阵列			FPGA - 10K Logic Modules	12084	1 Core	256KB		17 mm	17 mm
M2S150-FCSG536	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	536-LFBGA, CSPBGA	YES	536-CSPBGA (16x16)	536	ARM Cortex M3	FBGA-536	微芯片技术	网格排列	3	PLASTIC/EPOXY	BGA536,30X30,20	1.2 V	40	1.14 V	85 °C	有	M2S150-FCSG536	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.77			This product may require additional documentation to export from the United States.	Details	166 MHz	-	-	64 kB	146124 LE	有	12177 LAB	90	293	Tray	M2S150	活跃	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e1			Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01	CMOS	BOTTOM	BALL	250		compliant		S-PBGA-B536	293	不合格		1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		293		现场可编程门阵列			FPGA - 150K Logic Modules	146124	1 Core	512KB
M2S050TS-VF400	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	400-LFBGA	400-VFBGA (17x17)	ARM Cortex M3	微芯片技术	活跃				This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	56340 LE	有	4695 LAB	90	207	Tray	M2S050	0°C ~ 85°C (TJ)	Tray	SmartFusion2																							166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA							FPGA - 50K Logic Modules		1 Core	256KB
M2S090T-1FCS325	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FCBGA-325	YES	325-FCBGA (11x13.5)	325	ARM Cortex M3	活跃	微芯片技术	FBGA-325	GRID ARRAY, THIN PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA325,21X21,20	1.2 V	30	1.14 V	85 °C	无	M2S090T-1FCS325	TFBGA	RECTANGULAR	活跃	MICROSEMI CORP	1.26 V	5.83			This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	86316 LE	有	7193 LAB	176	180	Tray	M2S090	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0			Tin/Lead (Sn/Pb)			LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.5 mm	not_compliant		R-PBGA-B325	180	不合格		1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		180	1.16 mm	现场可编程门阵列			FPGA - 90K Logic Modules	86316	1 Core	512KB		13.5 mm	11 mm
M2S060TS-FGG484	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-BGA	484-FPBGA (23x23)	ARM Cortex M3	微芯片技术	60	SmartFusion2	267	Tray	M2S060	活跃					This product may require additional documentation to export from the United States.	Details	166 MHz	-	-	64 kB	56520 LE	有	4710 LAB	0°C ~ 85°C (TJ)	Tray	SmartFusion2																							166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA							FPGA - 60K Logic Modules		1 Core	256KB
M2S150-FCS536I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	536-LFBGA, CSPBGA	YES	536-CSPBGA (16x16)	536	ARM Cortex M3	293	Tray	微芯片技术	M2S150	活跃	FBGA-536	网格排列	PLASTIC/EPOXY	BGA536,30X30,20	1.2 V	30	1.14 V	无	M2S150-FCS536I	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.81			This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	146124 LE	有	12177 LAB	90	1.2000 V	1.14 V	1.26 V	-40 to 100 °C	Tray	SmartFusion2	e0			Tin/Lead (Sn/Pb)				8542.39.00.01	CMOS	BOTTOM	BALL	240		not_compliant	536	S-PBGA-B536	293	不合格		1.2 V			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		293		现场可编程门阵列		STD	FPGA - 150K Logic Modules	146124	1 Core	512KB
M2S150-1FCS536	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	536-LFBGA, CSPBGA	YES	536-CSPBGA (16x16)	536	ARM Cortex M3	微芯片技术	网格排列	PLASTIC/EPOXY	BGA536,30X30,20	1.2 V	30	1.14 V	85 °C	无	M2S150-1FCS536	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.81			This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	146124 LE	有	12177 LAB	90	293	Tray	M2S150	活跃	FBGA-536	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0			Tin/Lead (Sn/Pb)				8542.39.00.01	CMOS	BOTTOM	BALL	240		not_compliant		S-PBGA-B536	293	不合格		1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		293		现场可编程门阵列			FPGA - 150K Logic Modules	146124	1 Core	512KB
M2S090TS-FG676I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	BGA-676	676-FBGA (27x27)	ARM Cortex M3	微芯片技术	7193 LAB	40	425	Tray	M2S090	活跃					This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	86316 LE	有	-40°C ~ 100°C (TJ)	Tray	SmartFusion2																							166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA							FPGA - 90K Logic Modules		1 Core	512KB
M2S090-FG484	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-BGA	YES	484-FPBGA (23x23)	484	ARM Cortex M3	有	7193 LAB	60	RISC	1.2, 1.5, 1.8, 2.5, 3.3 V	CAN/Ethernet/Serial I2C/SPI/UART/USB	有	表面贴装	微芯片技术	267	Tray	M2S090	活跃	BGA, BGA484,22X22,40	网格排列	3	PLASTIC/EPOXY	BGA484,22X22,40	1.2 V	30	1.14 V	85 °C	无	M2S090-FG484	BGA	SQUARE	活跃	ARMu00ae Cortexu00ae-M3 System On Chip (SOC) IC SmartFusionu00ae2 FPGA - 90K Logic Modules 512KB 64KB 166MHz 484-FPBGA (23x23)	MICROSEMI CORP	1.26 V	5.83	Commercial grade			This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	86316 LE	0 to 85 °C	Tray	SmartFusion2	e0			Tin/Lead (Sn/Pb)				8542.39.00.01	CMOS	BOTTOM	BALL	240	1 mm	not_compliant	484	S-PBGA-B484	267	不合格	0.95, 1.05, 2.375, 2.625 V	1.2 V	OTHER	CAN/Ethernet/Serial	166MHz	64 KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	32 Bit	267	2.44 mm	现场可编程门阵列	Commercial		FPGA - 90K Logic Modules	86316	1 Core	512KB	ARM Cortex-M3	23 mm	23 mm
M2S150TS-FCSG536	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	536-LFBGA, CSPBGA	536-CSPBGA (16x16)	ARM Cortex M3	微芯片技术	Tray	M2S150	活跃					This product may require additional documentation to export from the United States.	Details	166 MHz	-	-	64 kB	146124 LE	有	12177 LAB	90	293	0°C ~ 85°C (TJ)	Tray	SmartFusion2																							166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA						STD	FPGA - 150K Logic Modules		1 Core	512KB
M2S150TS-FC1152	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1152-BBGA, FCBGA	YES	1152-FCBGA (35x35)	1152	ARM Cortex M3	有	12177 LAB	24	146124	FCBGA	1.2 V	1.14 V	574	微芯片技术	1.26 V	表面贴装	574	Tray	M2S150	活跃	FBGA-1152	网格排列	PLASTIC/EPOXY	BGA1152,34X34,40	1.2 V	30	1.14 V	85 °C	无	M2S150TS-FC1152	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.87	Commercial grade			This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	146124 LE	0 to 85 °C	Tray	SmartFusion2	e0			Tin/Lead (Sn/Pb)				8542.39.00.01	CMOS	BOTTOM	BALL	240	1 mm	not_compliant	1152	S-PBGA-B1152	574	不合格		1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		574	2.9 mm	现场可编程门阵列	Commercial	STD	FPGA - 150K Logic Modules	146124	1 Core	512KB		35 mm	35 mm
M2S025T-FG484	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484	YES	484-FPBGA (23x23)	484	ARM Cortex M3	60	1.2000 V	1.14 V	1.26 V	267	微芯片技术	Tray	M2S025	活跃	BGA, BGA484,22X22,40	网格排列	3	PLASTIC/EPOXY	BGA484,22X22,40	1.2 V	30	1.14 V	85 °C	无	M2S025T-FG484	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.87			This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	27696 LE	有	2308 LAB	0 to 85 °C	Tray	SmartFusion2	e0			Tin/Lead (Sn/Pb)				8542.39.00.01	CMOS	BOTTOM	BALL	240	1 mm	not_compliant		S-PBGA-B484	267	不合格		1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		267	2.44 mm	现场可编程门阵列		STD	FPGA - 25K Logic Modules	23988	1 Core	256KB		23 mm	23 mm
M2S150TS-FCS536	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	536-LFBGA, CSPBGA	YES	536-CSPBGA (16x16)	536	ARM Cortex M3	微芯片技术	PLASTIC/EPOXY	1.2 V	30	1.14 V	85 °C	无	M2S150TS-FCS536	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.84			This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	146124 LE	有	12177 LAB	90	293	Tray	M2S150	活跃	FBGA-536	网格排列	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0	无		Tin/Lead (Sn/Pb)				8542.39.00.01		BOTTOM	BALL	240		not_compliant		S-PBGA-B536					OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA				现场可编程门阵列		STD	FPGA - 150K Logic Modules		1 Core	512KB
M2S005S-VFG400	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	400-LFBGA	YES	400-VFBGA (17x17)	400	ARM Cortex M3	LFBGA, BGA400,20X20,32	微芯片技术	GRID ARRAY, LOW PROFILE, FINE PITCH	3	PLASTIC/EPOXY	BGA400,20X20,32	1.2 V	40	1.14 V	85 °C	有	M2S005S-VFG400	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.82			This product may require additional documentation to export from the United States.	Details	166 MHz	-	-	64 kB	6060 LE	有	505 LAB	90	169	Tray	M2S005	活跃	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e1			Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01	CMOS	BOTTOM	BALL	250	0.8 mm	compliant		S-PBGA-B400	171	不合格		1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		171	1.51 mm	现场可编程门阵列			FPGA - 5K Logic Modules	6060	1 Core	128KB		17 mm	17 mm
M2S010TS-1FGG484M	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 1 month ago)	FPBGA-484	YES	484-FPBGA (23x23)	484	ARM Cortex M3	M2S010	活跃	微芯片技术	FBGA-484	网格排列	3	PLASTIC/EPOXY	BGA484,22X22,40	-55 °C	1.2 V	40	1.14 V	125 °C	有	M2S010TS-1FGG484M	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.82		This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	12084 LE	有	1007 LAB	60	233	Tray	-55°C ~ 125°C (TJ)	Tray	SmartFusion2	e1		3A001.A.2.C	Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01	CMOS	BOTTOM	BALL	250	1 mm	compliant		S-PBGA-B484	233	不合格		1.2 V	MILITARY		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		233	2.44 mm	现场可编程门阵列			FPGA - 10K Logic Modules	12084	1 Core	256KB		23 mm	23 mm
M2S090TS-1FCSG325I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FCBGA-325	YES	325-FCBGA (11x13.5)	325	ARM Cortex M3	活跃	微芯片技术	FBGA-325	GRID ARRAY, THIN PROFILE, FINE PITCH	3	PLASTIC/EPOXY	BGA325,21X21,20	1.2 V	40	1.14 V	有	M2S090TS-1FCSG325I	TFBGA	RECTANGULAR	活跃	MICROSEMI CORP	1.26 V	5.81			This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	86316 LE	有	7193 LAB	176	180	Tray	M2S090	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e1			Tin/Silver/Copper (Sn/Ag/Cu)			LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.5 mm	compliant		R-PBGA-B325	180	不合格		1.2 V			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		180	1.16 mm	现场可编程门阵列			FPGA - 90K Logic Modules	86316	1 Core	512KB		13.5 mm	11 mm
M2S005S-1VFG400I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	VFPBGA-400	400-VFBGA (17x17)	ARM Cortex M3	微芯片技术	505 LAB	90	169	Tray	M2S005	活跃					This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	6060 LE	有	-40°C ~ 100°C (TJ)	Tray	SmartFusion2																							166MHz	64KB	ARM® Cortex®-M3	DDR	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA							FPGA - 5K Logic Modules		1 Core	128KB
M2S060-FCS325I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	325-TFBGA, FCBGA	YES	325	325-FCBGA (11x11)	325	ARM Cortex M3	200	微芯片技术	Tray	M2S060	活跃	FBGA-325	GRID ARRAY, THIN PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA325,21X21,20	1.2 V	30	1.14 V	无	M2S060-FCS325I	TFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.84	This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	56520 LE	有	4710 LAB	176	SmartFusion2	1.2000 V	1.14 V	1.26 V	-40 to 100 °C	Tray	SmartFusion2	e0			Tin/Lead (Sn/Pb)	100 °C	-40 °C	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.5 mm	not_compliant		S-PBGA-B325	200	不合格	1.2 V	1.2 V			166MHz	164.3 kB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		200	1.01 mm	现场可编程门阵列		STD	FPGA - 60K Logic Modules	56520	1 Core	256KB		11 mm	11 mm
M2S050-FCS325I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	FCBGA-325	325-FCBGA (11x11)	ARM Cortex M3	微芯片技术	200	Tray	M2S050	活跃				This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	56340 LE	有	4695 LAB	176	-40°C ~ 100°C (TJ)	Tray	SmartFusion2																							166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA							FPGA - 50K Logic Modules		1 Core	256KB
M2S025TS-VF256I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	256-LFBGA	YES	256-FPBGA (14x14)	256	ARM Cortex M3	微芯片技术	30	1.14 V	无	M2S025TS-VF256I	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.87		This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	27696 LE	有	2308 LAB	119	138	Tray	M2S025	活跃	VFBGA-256	GRID ARRAY, LOW PROFILE, FINE PITCH	PLASTIC/EPOXY	1.2 V	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0	无		Tin/Lead (Sn/Pb)			LG-MIN, WD-MIN	8542.39.00.01		BOTTOM	BALL	240	0.8 mm	not_compliant		S-PBGA-B256							166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA			1.56 mm	现场可编程门阵列			FPGA - 25K Logic Modules		1 Core	256KB		14 mm	14 mm
M2S150T-FC1152	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1152-BBGA, FCBGA	1152-FCBGA (35x35)	ARM Cortex M3	微芯片技术	Tray	M2S150	活跃					This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	146124 LE	有	12177 LAB	24	574	0°C ~ 85°C (TJ)	Tray	SmartFusion2																							166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA						STD	FPGA - 150K Logic Modules		1 Core	512KB
M2S150T-FC1152I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FCBGA-1152	1152-FCBGA (35x35)	ARM Cortex M3	微芯片技术	12177 LAB	24	574	Tray	M2S150	活跃					This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	146124 LE	有	-40°C ~ 100°C (TJ)	Tray	SmartFusion2																							166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA							FPGA - 150K Logic Modules		1 Core	512KB
M2S010TS-1FGG484I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484	484-FPBGA (23x23)	ARM Cortex M3	微芯片技术	1007 LAB	60	233	Tray	M2S010	活跃					This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	12084 LE	有	-40°C ~ 100°C (TJ)	Tray	SmartFusion2																							166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA							FPGA - 10K Logic Modules		1 Core	256KB