category.集成电路IC_category.集成电路IC品牌厂家，型号_价格_规格

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产品型号	品牌	数据表	库存	价格(含增值税)	数量	生命周期状态	包装/外壳	表面安装	引脚数	供应商器件包装	终端数量			Core										厂商																														操作温度	包装	系列	JESD-609代码	端子表面处理	最高工作温度	最小工作温度	附加功能	HTS代码	技术	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	Reach合规守则	频率	时间@峰值回流温度-最大值(s)	JESD-30代码	输出的数量	资历状况	电源	温度等级	界面	速度	内存大小	核心处理器	周边设备	程序内存大小	连接方式	建筑学	输入数量	组织结构	座位高度-最大	可编程逻辑类型	核心架构	速度等级	主要属性
M2S050TS-FGG896	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	896-BGA	896-FBGA (31x31)	ARM Cortex M3	微芯片技术	56340 LE	有	4695 LAB	27	377	Tray	M2S050	活跃				This product may require additional documentation to export from the United States.	Details	166 MHz	-	-	64 kB	0°C ~ 85°C (TJ)	Tray	SmartFusion2																					166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA							FPGA - 50K Logic Modules			1 Core	256KB
M2S005S-FGG484I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484	484-FPBGA (23x23)	ARM Cortex M3	微芯片技术	SMD/SMT	166 MHz	-	-	64 kB	6060 LE	有	505 LAB	60	209	Tray	M2S005	活跃					This product may require additional documentation to export from the United States.	Details	-40°C ~ 100°C (TJ)	Tray	SmartFusion2																					166MHz	64KB	ARM® Cortex®-M3	DDR	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA							FPGA - 5K Logic Modules			1 Core	128KB
M2S050-FG896I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	FPBGA-896	YES	896-FBGA (31x31)	896	ARM Cortex M3	56340 LE	有	4695 LAB	27	微芯片技术	377	Tray	M2S050	活跃	FBGA-896	网格排列	3	PLASTIC/EPOXY	BGA896,30X30,40	1.2 V	30	1.14 V	无	M2S050-FG896I	50 MHz	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.26		This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)				8542.39.00.01	CMOS	BOTTOM	BALL	240	1 mm	not_compliant			S-PBGA-B896	377	不合格	1.2 V			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	377	48672 CLBS	2.44 mm	现场可编程门阵列			FPGA - 50K Logic Modules	48672	56340	1 Core	256KB	31 mm	31 mm
M2S060TS-1FCS325	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	325-TFBGA, FCBGA	YES	325-FCBGA (11x11)	325	ARM Cortex M3	4710 LAB	176	SmartFusion2	微芯片技术	200	Tray	M2S060	活跃	FBGA-325	GRID ARRAY, THIN PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA325,21X21,20	1.2 V	30	1.14 V	85 °C	无	M2S060TS-1FCS325	TFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.88		This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	56520 LE	有	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)			LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.5 mm	not_compliant			S-PBGA-B325	200	不合格	1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	200		1.01 mm	现场可编程门阵列			FPGA - 60K Logic Modules		56520	1 Core	256KB	11 mm	11 mm
M2S090TS-1FGG484	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484	484-FPBGA (23x23)	ARM Cortex M3	微芯片技术					This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	86316 LE	有	7193 LAB	60	1.2 V	1.14 V	1.26 V	267	Tray	M2S090	活跃	0 to 85 °C	Tray	SmartFusion2																					166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA						1	FPGA - 90K Logic Modules			1 Core	512KB
M2S150-1FCVG484I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-BFBGA	YES	484-FBGA (19x19)	484	ARM Cortex M3	12177 LAB	84	273	微芯片技术	Tray	M2S150	活跃	VFBGA-484	GRID ARRAY, FINE PITCH	4	PLASTIC/EPOXY	BGA484,22X22,32	1.2 V	40	1.14 V	有	M2S150-1FCVG484I	FBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.77			This product may require additional documentation to export from the United States.	Details	166 MHz	-	-	64 kB	146124 LE	有	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e1	Tin/Silver/Copper (Sn/Ag/Cu)			LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.8 mm	compliant			S-PBGA-B484	273	不合格	1.2 V			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	273		3.15 mm	现场可编程门阵列			FPGA - 150K Logic Modules		146124	1 Core	512KB	19 mm	19 mm
M2S090-1FGG676I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	BGA-676	676-FBGA (27x27)	ARM Cortex M3	微芯片技术	SMD/SMT	166 MHz	-	-	64 kB	86316 LE	有	7193 LAB	40	425	Tray	M2S090	活跃					This product may require additional documentation to export from the United States.	N	-40°C ~ 100°C (TJ)	Tray	SmartFusion2																					166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA							FPGA - 90K Logic Modules			1 Core	512KB
M2S050T-VF400	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	VFPBGA-400	YES	400-VFBGA (17x17)	400	ARM Cortex M3	56340 LE	有	4695 LAB	90	微芯片技术	207	Tray	M2S050	活跃	VFBGA-400	GRID ARRAY, LOW PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA400,20X20,32	1.2 V	30	1.14 V	85 °C	无	M2S050T-VF400	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.3			This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)				8542.39.00.01	CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant			S-PBGA-B400	160	不合格	1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	160		1.51 mm	现场可编程门阵列		STD	FPGA - 50K Logic Modules		48672	1 Core	256KB	17 mm	17 mm
M2S025TS-1FG484M	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	FPBGA-484	YES	484-FPBGA (23x23)	484	ARM Cortex M3	27696 LE	有	2308 LAB	60	微芯片技术	267	Tray	M2S025	活跃	BGA, BGA484,22X22,40	网格排列	3	PLASTIC/EPOXY	BGA484,22X22,40	1.2 V	30	1.14 V	85 °C	无	M2S025TS-1FG484M	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.84		This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	-55°C ~ 125°C (TJ)	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)				8542.39.00.01	CMOS	BOTTOM	BALL	240	1 mm	not_compliant			S-PBGA-B484	267	不合格	1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	267		2.44 mm	现场可编程门阵列			FPGA - 25K Logic Modules		27696	1 Core	256KB	23 mm	23 mm
M2S005-FG484I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484	484-FPBGA (23x23)	ARM Cortex M3	微芯片技术	SMD/SMT	166 MHz	-	-	64 kB	6060 LE	有	505 LAB	60	209	Tray	M2S005	活跃					This product may require additional documentation to export from the United States.	N	-40°C ~ 100°C (TJ)	Tray	SmartFusion2																					166MHz	64KB	ARM® Cortex®-M3	DDR	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA							FPGA - 5K Logic Modules			1 Core	128KB
M2S060TS-1FG484I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	484-BGA	484-FPBGA (23x23)	ARM Cortex M3	微芯片技术	This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	56520 LE	有	4710 LAB	60	SmartFusion2	0.710494 oz	8542390000, 8542390000/8542390000, 8542390000/8542390000/8542390000, 8542390000/8542390000/8542390000/8542390000	267	Tray	M2S060	活跃				-40°C ~ 100°C (TJ)	Tray	SmartFusion2																					166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA							FPGA - 60K Logic Modules			1 Core	256KB			含铅
M2S025TS-1FCSG325I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	FCBGA-325	YES	325-FCBGA (11x11)	325	ARM Cortex M3	有	2308 LAB	176	微芯片技术	180	Tray	M2S025	活跃	FBGA-325	GRID ARRAY, THIN PROFILE, FINE PITCH	3	PLASTIC/EPOXY	BGA325,21X21,20	1.2 V	40	1.14 V	有	M2S025TS-1FCSG325I	TFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.81		This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	27696 LE	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e1	Tin/Silver/Copper (Sn/Ag/Cu)			LG-MIN, WD-MIN		CMOS	BOTTOM	BALL	250	0.5 mm	compliant			S-PBGA-B325	180	不合格	1.2 V			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	180		1.01 mm	现场可编程门阵列			FPGA - 25K Logic Modules		27696	1 Core	256KB	11 mm	11 mm
M2S090TS-FG676	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	676-BGA	YES	676-FBGA (27x27)	676	ARM Cortex M3	有	7193 LAB	40	425	微芯片技术	Tray	M2S090	活跃	FBGA-676	网格排列	3	PLASTIC/EPOXY	BGA676,26X26,40	1.2 V	30	1.14 V	85 °C	无	M2S090TS-FG676	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.84			This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	86316 LE	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)				8542.39.00.01	CMOS	BOTTOM	BALL	240	1 mm	not_compliant			S-PBGA-B676	425	不合格	1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	425		2.44 mm	现场可编程门阵列			FPGA - 90K Logic Modules		86316	1 Core	512KB	27 mm	27 mm
M2S090TS-1FG676	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	BGA-676	YES	676-FBGA (27x27)	676	ARM Cortex M3	64 kB	86316 LE	有	7193 LAB	40	微芯片技术	425	Tray	M2S090	活跃	FBGA-676	网格排列	3	PLASTIC/EPOXY	BGA676,26X26,40	1.2 V	30	1.14 V	85 °C	无	M2S090TS-1FG676	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.84			This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)				8542.39.00.01	CMOS	BOTTOM	BALL	240	1 mm	not_compliant			S-PBGA-B676	425	不合格	1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	425		2.44 mm	现场可编程门阵列			FPGA - 90K Logic Modules		86316	1 Core	512KB	27 mm	27 mm
M2S050-1FGG896I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-896	YES	896-FBGA (31x31)	896	ARM Cortex M3	56340 LE	有	4695 LAB	27	微芯片技术	1.2000 V	377	Tray	M2S050	活跃	BGA, BGA896,30X30,40	网格排列	PLASTIC/EPOXY	BGA896,30X30,40	1.2 V	40	1.14 V	有	M2S050-1FGG896I	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.76			This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	-40 to 100 °C	Tray	SmartFusion2	e1	Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01	CMOS	BOTTOM	BALL	250	1 mm	compliant			S-PBGA-B896	377	不合格	1.2 V			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	377		2.44 mm	现场可编程门阵列		1	FPGA - 50K Logic Modules		56340	1 Core	256KB	31 mm	31 mm
M2S090-FGG676I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	BGA-676	YES	676-FBGA (27x27)	676	ARM Cortex M3	86316 LE	有	7193 LAB	40	微芯片技术	425	Tray	M2S090	活跃	BGA, BGA676,26X26,40	网格排列	3	PLASTIC/EPOXY	BGA676,26X26,40	1.2 V	40	1.14 V	有	M2S090-FGG676I	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.78			This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e1	Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01	CMOS	BOTTOM	BALL	250	1 mm	compliant			S-PBGA-B676	425	不合格	1.2 V			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	425		2.44 mm	现场可编程门阵列			FPGA - 90K Logic Modules		86316	1 Core	512KB	27 mm	27 mm
M2S010TS-1FG484I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484	YES	484-FPBGA (23x23)	484	ARM Cortex M3	-	64 kB	12084 LE	有	1007 LAB	60	微芯片技术	1.2000 V	1.14 V	1.26 V	233	Tray	M2S010	活跃	FBGA-484	网格排列	3	PLASTIC/EPOXY	1.2 V	30	1.14 V	无	M2S010TS-1FG484I	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.8			This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-40 to 100 °C	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)				8542.39.00.01		BOTTOM	BALL	240	1 mm	not_compliant			S-PBGA-B484						166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA			2.44 mm	现场可编程门阵列		1	FPGA - 10K Logic Modules			1 Core	256KB	23 mm	23 mm
M2S060T-1FCS325I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	325-TFBGA, FCBGA	YES	325-FCBGA (11x11)	325	ARM Cortex M3	176	SmartFusion2	微芯片技术	200	Tray	M2S060	活跃	FBGA-325	GRID ARRAY, THIN PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA325,21X21,20	1.2 V	30	1.14 V	无	M2S060T-1FCS325I	TFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.87		This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	56520 LE	有	4710 LAB	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)			LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.5 mm	not_compliant			S-PBGA-B325	200	不合格	1.2 V			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	200		1.01 mm	现场可编程门阵列			FPGA - 60K Logic Modules		56520	1 Core	256KB	11 mm	11 mm
A2F500M3G-1FGG256M	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	256-LBGA	256	256-FPBGA (17x17)	ARM Cortex M3	微芯片技术	1.425 V	500000	1.575 V	MCU - 25, FPGA - 66	Tray	A2F500	活跃	3	有	A2F500M3G-1FGG256M	活跃	MICROSEMI CORP	5.79				This product may require additional documentation to export from the United States.	Details	100 MHz	-	-	64 kB	6000 LE	有	-	90	SmartFusion	1.5000 V	0 to 85 °C	Tray	A2F500			125 °C	-55 °C		8542.39.00.01						compliant	100 MHz							EBI/EMI, Ethernet, I2C, SPI, UART, USART	100MHz	64KB	ARM® Cortex®-M3	DMA, POR, WDT	512 kB	EBI/EMI, Ethernet, I²C, SPI, UART/USART	MCU, FPGA					ARM	1	ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops			1 Core	512KB
M2S010T-1VFG256	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	VFPBGA-256	YES	256-FPBGA (17x17)	256	ARM Cortex M3	64 kB	12084 LE	有	1007 LAB	119	微芯片技术	138	Tray	M2S010	活跃	VFBGA-256	GRID ARRAY, LOW PROFILE, FINE PITCH	3	PLASTIC/EPOXY	BGA256,16X16,32	1.2 V	40	1.14 V	85 °C	有	M2S010T-1VFG256	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.77			This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e1	Tin/Silver/Copper (Sn/Ag/Cu)			LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.8 mm	compliant			S-PBGA-B256	138	不合格	1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	138		1.56 mm	现场可编程门阵列			FPGA - 10K Logic Modules		12084	1 Core	256KB	14 mm	14 mm
M2S150TS-FCG1152I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FCBGA-1152	YES	1152-FCBGA (35x35)	1152	ARM Cortex M3	有	12177 LAB	24	微芯片技术	574	Tray	M2S150	活跃	BGA, BGA1152,34X34,40	网格排列	4	PLASTIC/EPOXY	BGA1152,34X34,40	1.2 V	1.14 V	有	M2S150TS-FCG1152I	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.81			This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	146124 LE	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e1	Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01	CMOS	BOTTOM	BALL	250	1 mm	compliant		40	S-PBGA-B1152	574	不合格	1.2 V			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	574		2.9 mm	现场可编程门阵列			FPGA - 150K Logic Modules		146124	1 Core	512KB	35 mm	35 mm
M2S060T-VF400	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	400-LFBGA	YES	400-VFBGA (17x17)	400	ARM Cortex M3	4710 LAB	90	SmartFusion2	微芯片技术	207	Tray	M2S060	活跃	VFBGA-400	GRID ARRAY, LOW PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA400,20X20,32	1.2 V	30	1.14 V	85 °C	无	M2S060T-VF400	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.87		This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	56520 LE	有	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)				8542.39.00.01	CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant			S-PBGA-B400	207	不合格	1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	207		1.51 mm	现场可编程门阵列			FPGA - 60K Logic Modules		56520	1 Core	256KB	17 mm	17 mm
M2S010T-1VF400	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	VFPBGA-400	YES	400-VFBGA (17x17)	400	ARM Cortex M3	-	-	64 kB	12084 LE	有	1007 LAB	90	微芯片技术	1.2000 V	1.14 V	1.26 V	195	Tray	M2S010	活跃	VFBGA-400	GRID ARRAY, LOW PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA400,20X20,32	1.2 V	30	1.14 V	85 °C	无	M2S010T-1VF400	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.84			This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	0 to 85 °C	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)				8542.39.00.01	CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant			S-PBGA-B400	160	不合格	1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	160		1.51 mm	现场可编程门阵列		1	FPGA - 10K Logic Modules		9744	1 Core	256KB	17 mm	17 mm
M2S150-FCS536	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	536-LFBGA, CSPBGA	536-CSPBGA (16x16)	ARM Cortex M3	微芯片技术	-	64 kB	146124 LE	有	12177 LAB	90	293	Tray	M2S150	活跃					This product may require additional documentation to export from the United States.	N	166 MHz	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2																					166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA							FPGA - 150K Logic Modules			1 Core	512KB
M2S060-FGG484I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	484-BGA	484-FPBGA (23x23)	ARM Cortex M3	微芯片技术	166 MHz	-	-	64 kB	56520 LE	有	4710 LAB	60	SmartFusion2	1.2000 V	267	Tray	M2S060	活跃				This product may require additional documentation to export from the United States.	Details	-40 to 100 °C	Tray	SmartFusion2																					166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA						STD	FPGA - 60K Logic Modules			1 Core	256KB