Microchip Technology M2S090-1FGG676I

包装/外壳

BGA-676

供应商器件包装

676-FBGA (27x27)

Shipping Restrictions

This product may require additional documentation to export from the United States.

RoHS

N

Mounting Styles

SMD/SMT

Core

ARM Cortex M3

Maximum Clock Frequency

166 MHz

L1 Cache Instruction Memory

-

L1 Cache Data Memory

-

Data RAM Size

64 kB

Number of Logic Elements

86316 LE

Moisture Sensitive

有

Number of Logic Array Blocks - LABs

7193 LAB

Factory Pack QuantityFactory Pack Quantity

40

Number of I/Os

425

Package

Tray

Base Product Number

M2S090

厂商

微芯片技术

Product Status

活跃

包装

Tray

系列

SmartFusion2

操作温度

-40°C ~ 100°C (TJ)

速度

166MHz

内存大小

64KB

核心处理器

ARM® Cortex®-M3

周边设备

DDR, PCIe, SERDES

程序内存大小

512 kB

连接方式

CANbus, Ethernet, I²C, SPI, UART/USART, USB

建筑学

MCU, FPGA

主要属性

FPGA - 90K Logic Modules

核数量

1 Core

闪光大小

512KB