您好，欢迎来到优特美尔 登录 注册有礼
我的订单 会员中心
订单状态 询价历史 我的收藏 地址管理
QQ在线咨询 电话0755-83328606
DEGSON海康连接器端子储存器硬盘闪存卡
IC分立半导体传感器
询价列表
购物车
0
首页 产品目录表 品牌库 BOM配单 行业资讯 资质认证 关于我们 联系我们
首页 全部商品 category.集成电路IC category.片上系统（SoC）

类别是'category.片上系统（SoC）' (7695)

  • 所有品牌

对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

包装/外壳

供应商器件包装

Core

厂商

操作温度

包装

系列

类型

工作电源电压

界面

速度

内存大小

核心处理器

周边设备

程序存储器类型

程序内存大小

连接方式

建筑学

数据总线宽度

总 RAM 位数

收发器数量

主要属性

核数量

闪光大小

设备核心

高度

长度

宽度
XCVC1802-2HSIVIVA1596
XCVC1802-2HSIVIVA1596
 Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1596-BFBGA, FCBGA

1596-FCBGA (40x40)

AMD 赛灵思

- 40 C

+ 110 C

1

500

Tray

活跃

Details

-40°C ~ 100°C (TJ)

Versal™ AI Core

880 mV

800MHz, 1.65GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.5M Logic Cells

-

 XCVC1902-2LSEVSVD1760
XCVC1902-2LSEVSVD1760
 Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

AMD 赛灵思

0 C

+ 110 C

1

692

Tray

活跃

Details

0°C ~ 100°C (TJ)

Versal™ AI Core

700 mV

450MHz, 1.08GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.9M Logic Cells

-

 XCZU49DR-2FSVF1760I5149
XCZU49DR-2FSVF1760I5149
 Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

FBGA-1760

ARM Cortex A53, ARM Cortex R5F

SMD/SMT

2 x 32 kB, 2 x 32 kB

2 x 32 kB, 2 x 32 kB

256 kB

930300 LE

674 I/O

- 40 C

+ 100 C

13 Mb

53160 LAB

1

850 mV

16 Transceiver

6 Core

 XCVM1802-1LSEVFVC1760
XCVM1802-1LSEVFVC1760
 Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

AMD 赛灵思

1

500

活跃

Details

0 C

+ 100 C

0°C ~ 100°C (TJ)

700 mV

400MHz, 1GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1.9M Logic Cells

-

 XCVM1802-2MSEVFVC1760
XCVM1802-2MSEVFVC1760
 Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

AMD 赛灵思

0 C

+ 110 C

1

活跃

Tray

500

Details

0°C ~ 100°C (TJ)

Versal™ Prime

800 mV

600MHz, 1.4GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1.9M Logic Cells

-

 XCVC1902-2MLIVIVA1596
XCVC1902-2MLIVIVA1596
 Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1596-BFBGA, FCBGA

1596-FCBGA (40x40)

AMD 赛灵思

+ 110 C

- 40 C

Details

500

Tray

活跃

1

-40°C ~ 100°C (TJ)

Versal™ AI Core

800 mV

600MHz, 1.4GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.9M Logic Cells

-

 XCZU15EG-2FFVB1156E4498
XCZU15EG-2FFVB1156E4498
 Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

FBGA-1156

ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2

1

42660 LAB

11.3 Mb

+ 100 C

0 C

353 I/O

746550 LE

256 kB

2 x 32 kB, 4 x 32 kB

2 x 32 kB, 4 x 32 kB

SMD/SMT

850 mV

24 Transceiver

7 Core

 XCZU1EG-1SBVA484I
XCZU1EG-1SBVA484I
 Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

FBGA-484

484-FCBGA (19x19)

ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2

AMD 赛灵思

Tray

活跃

SMD/SMT

2 x 32 kB, 4 x 32 kB

2 x 32 kB, 4 x 32 kB

256 kB

81900 LE

82 I/O

- 40 C

+ 100 C

1 Mb

4680 LAB

1

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™

850 mV

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

-

MPU, FPGA

-

7 Core

-

 XCZU9CG-1FFVB1156I5228
XCZU9CG-1FFVB1156I5228
 Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

FBGA-1156

ARM Cortex A53, ARM Cortex R5F

SMD/SMT

2 x 32 kB, 2 x 32 kB

2 x 32 kB, 2 x 32 kB

256 kB

599550 LE

353 I/O

- 40 C

+ 100 C

8.8 Mb

34260 LAB

1

850 mV

24 Transceiver

4 Core

 ST4SI2M0007AKIFW
ST4SI2M0007AKIFW
 STMicroelectronics 数据表

N/A

-

最小起订量: 1

最小包装量: 1

VFDFPN-8

ARM

Microcontroller

STMicroelectronics

Bulk

ST4SI2

活跃

1.8 V, 3 V, 5 V

Details

1.8 V, 3 V, 5 V

- 40 C

+ 105 C

SPI

有

SMD/SMT

4000

RISC

MouseReel

ST4SIM-200M

LTE-M

SPI

Flash

32 bit

ARM SC300

0.85 mm

5 mm

6 mm

 XCZU1EG-1SBVA484E
XCZU1EG-1SBVA484E
 Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

FBGA-484

484-FCBGA (19x19)

ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2

AMD 赛灵思

Tray

活跃

1

4680 LAB

1 Mb

+ 100 C

0 C

82 I/O

81900 LE

256 kB

2 x 32 kB, 4 x 32 kB

2 x 32 kB, 4 x 32 kB

SMD/SMT

0°C ~ 100°C (TJ)

Zynq® UltraScale+™

850 mV

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

-

MPU, FPGA

-

7 Core

-

 XCZU1CG-L1SFVC784I
XCZU1CG-L1SFVC784I
 Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

FBGA-784

784-FCBGA (23x23)

ARM Cortex A53, ARM Cortex R5F

AMD 赛灵思

Tray

活跃

SMD/SMT

2 x 32 kB, 2 x 32 kB

2 x 32 kB, 2 x 32 kB

256 kB

81900 LE

180 I/O

- 40 C

+ 100 C

1 Mb

4680 LAB

1

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™

850 mV

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

-

MPU, FPGA

-

4 Core

-

 XCZU47DR-1FSVG1517E5149
XCZU47DR-1FSVG1517E5149
 Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

FBGA-1517

ARM Cortex A53, ARM Cortex R5F

SMD/SMT

2 x 32 kB, 2 x 32 kB

2 x 32 kB, 2 x 32 kB

256 kB

930300 LE

597 I/O

0 C

+ 100 C

13 Mb

53160 LAB

1

850 mV

16 Transceiver

6 Core

 XCZU1EG-2SBVA484I
XCZU1EG-2SBVA484I
 Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

FBGA-484

484-FCBGA (19x19)

ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2

AMD 赛灵思

SMD/SMT

2 x 32 kB, 4 x 32 kB

2 x 32 kB, 4 x 32 kB

256 kB

81900 LE

82 I/O

- 40 C

+ 100 C

1 Mb

4680 LAB

1

活跃

-40°C ~ 100°C (TJ)

850 mV

533MHz, 600MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

-

MPU, FPGA

-

7 Core

-

 XCZU2CG-L1UBVA530I
XCZU2CG-L1UBVA530I
 Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

FBGA-530

530-FCBGA (16x9.5)

ARM Cortex A53, ARM Cortex R5F

AMD 赛灵思

Tray

活跃

SMD/SMT

2 x 32 kB, 2 x 32 kB

2 x 32 kB, 2 x 32 kB

256 kB

103320 LE

82 I/O

- 40 C

+ 100 C

1.2 Mb

5904 LAB

1

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

850 mV

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Zynq®UltraScale+™ FPGA, 103K+ Logic Cells

4 Core

-

 XCZU2CG-2SFVC784I5230
XCZU2CG-2SFVC784I5230
 Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

FBGA-784

ARM Cortex A53, ARM Cortex R5F

SMD/SMT

2 x 32 kB, 2 x 32 kB

2 x 32 kB, 2 x 32 kB

256 kB

103320 LE

252 I/O

- 40 C

+ 100 C

1.2 Mb

5904 LAB

1

850 mV

4 Core

 XCZU3EG-1UBVA530I
XCZU3EG-1UBVA530I
 Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

FBGA-530

530-FCBGA (16x9.5)

ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2

AMD 赛灵思

Tray

活跃

82 I/O

- 40 C

+ 100 C

1.8 Mb

8820 LAB

1

SMD/SMT

2 x 32 kB, 4 x 32 kB

2 x 32 kB, 4 x 32 kB

256 kB

154350 LE

-40°C ~ 100°C (TJ)

-

850 mV

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

7 Core

-

 XCZU4CG-2SFVC784I5231
XCZU4CG-2SFVC784I5231
 Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

FBGA-784

ARM Cortex A53, ARM Cortex R5F

SMD/SMT

2 x 32 kB, 2 x 32 kB

2 x 32 kB, 2 x 32 kB

256 kB

192150 LE

252 I/O

- 40 C

+ 100 C

2.6 Mb

10980 LAB

1

850 mV

16 Transceiver

4 Core

 XCZU15EG-L2FFVB1156E4535
XCZU15EG-L2FFVB1156E4535
 Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

FBGA-1156

ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2

SMD/SMT

2 x 32 kB, 4 x 32 kB

2 x 32 kB, 4 x 32 kB

256 kB

746550 LE

353 I/O

0 C

+ 110 C

11.3 Mb

42660 LAB

1

850 mV

24 Transceiver

7 Core

 XCZU3EG-1UBVA530E
XCZU3EG-1UBVA530E
 Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

FBGA-530

530-FCBGA (16x9.5)

ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2

AMD 赛灵思

Tray

活跃

SMD/SMT

2 x 32 kB, 4 x 32 kB

2 x 32 kB, 4 x 32 kB

256 kB

154350 LE

82 I/O

0 C

+ 100 C

1.8 Mb

8820 LAB

1

0°C ~ 100°C (TJ)

-

850 mV

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

7 Core

-

 XCZU3CG-L2UBVA530E
XCZU3CG-L2UBVA530E
 Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

FBGA-530

530-FCBGA (16x9.5)

ARM Cortex A53, ARM Cortex R5F

AMD 赛灵思

Tray

活跃

SMD/SMT

2 x 32 kB, 2 x 32 kB

2 x 32 kB, 2 x 32 kB

256 kB

154350 LE

82 I/O

0 C

+ 110 C

1.8 Mb

8820 LAB

1

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

850 mV

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

4 Core

-

 XCZU3EG-2UBVA530E
XCZU3EG-2UBVA530E
 Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

FBGA-530

530-FCBGA (16x9.5)

ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2

AMD 赛灵思

Tray

活跃

SMD/SMT

2 x 32 kB, 4 x 32 kB

2 x 32 kB, 4 x 32 kB

256 kB

154350 LE

82 I/O

0 C

+ 100 C

1.8 Mb

8820 LAB

1

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

850 mV

533MHz, 600MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

7 Core

-

 MPFS025TLS-FCVG484I
MPFS025TLS-FCVG484I
 Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

484-BFBGA

484-FBGA (19x19)

RV64GC, RV64IMAC

微芯片技术

Tray

活跃

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

23000 LE

108 I/O

- 40 C

+ 100 C

1

-40°C ~ 100°C

Tray

-

1 V

-

230.4KB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 23K Logic Modules

5 Core

128KB

 MPFS025T-1FCVG484I
MPFS025T-1FCVG484I
 Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

FCVG-484

484-FCBGA (19x19)

RV64GC, RV64IMAC

微芯片技术

1

MSL 3 - 168 hours

Tray

活跃

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

23000 LE

108 I/O

- 40 C

+ 100 C

-40°C ~ 100°C

Tray

-

1 V

-

230.4KB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

1843.2Kbit

FPGA - 23K Logic Modules

5 Core

128KB

 MPFS025TL-FCVG484E
MPFS025TL-FCVG484E
 Microchip Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

484-BFBGA

484-FBGA (19x19)

RV64GC, RV64IMAC

微芯片技术

Tray

活跃

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

23000 LE

108 I/O

0 C

+ 100 C

1

0°C ~ 100°C

Tray

-

1 V

-

230.4KB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 23K Logic Modules

5 Core

128KB