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产品型号	品牌	数据表	库存	价格(含增值税)	数量	工厂交货时间	触点镀层	底架	包装/外壳	表面安装	引脚数	供应商器件包装	Core																			操作温度	包装	已出版	系列	JESD-609代码	无铅代码	零件状态	湿度敏感性等级(MSL)	终止次数	ECCN 代码	端子表面处理	最高工作温度	最小工作温度	附加功能	HTS代码	端子位置	终端形式	峰值回流焊温度（摄氏度）	电源电压	端子间距	Reach合规守则	频率	时间@峰值回流温度-最大值(s)	基本部件号	JESD-30代码	资历状况	工作电源电压	电源电压-最大值(Vsup)	电源	电源电压-最小值(Vsup)	界面	最大电源电压	最小电源电压	工作电源电流	速度	内存大小	uPs/uCs/外围ICs类型	核心处理器	周边设备	时钟频率	程序内存大小	传播延迟	连接方式	建筑学	数据总线宽度	逻辑元件/单元数	核心架构	内存(字)
XC7Z035-2FFG900I	Xilinx Inc.	数据表	970 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	表面贴装	900-BBGA, FCBGA			130			-40°C~100°C TJ	Tray	2010	Zynq®-7000	e1		活跃	4 (72 Hours)	900	3A991.D	Tin/Silver/Copper (Sn/Ag/Cu)			PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY		BOTTOM	BALL	245	1V	1mm		800MHz	30		S-PBGA-B900						CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	1.05V	950mV			256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA			100 ps	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			ARM			YES	2		Kintex™-7 FPGA, 275K Logic Cells	343800				3.35mm	31mm	31mm		ROHS3 Compliant
XC7Z045-3FFG900E	Xilinx Inc.	数据表	555 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	900-BBGA, FCBGA	YES	ROMless	130					0°C~100°C TJ	Tray	2009	Zynq®-7000	e1		活跃	4 (72 Hours)	900	3A991.D	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)				8542.39.00.01	BOTTOM	BALL	245	1V	1mm		1GHz	30	XC7Z045	S-PBGA-B900		1V	1.05V			CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB					256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA				CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b		ARM			YES	-3	256000	Kintex™-7 FPGA, 350K Logic Cells			CAN; ETHERNET; I2C; SPI; UART; USB		3.35mm	31mm		无	ROHS3 Compliant
XC7Z015-2CLG485I	Xilinx Inc.	数据表	4257 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	表面贴装	484-LFBGA, CSPBGA	485	485-CSBGA (19x19)	130			-40°C~100°C TJ	Tray	2010	Zynq®-7000			活跃	3 (168 Hours)				100°C	-40°C									766MHz									CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB				766MHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA				CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b		ARM		766MHz				Artix™-7 FPGA, 74K Logic Cells									ROHS3 Compliant
A2F500M3G-FGG484	Atmel (Microchip Technology)	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484				ARM Cortex M3	This product may require additional documentation to export from the United States.	Details	SMD/SMT	80 MHz	-	-	64 kB	6000 LE	204 I/O	0 C	+ 85 C	有	-	60	SmartFusion					Tray		A2F500																							1.5 V							16.5 mA							512 kB							500000			1 Core
XC7Z030-1FBG484I	Xilinx Inc.	数据表	990 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	484-BBGA, FCBGA	YES	484			130		-40°C~100°C TJ	Tray	2009	Zynq®-7000	e1		活跃	4 (72 Hours)	484	EAR99	Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01	BOTTOM	BALL	250	1V	1mm		667MHz	30	XC7Z030			1V	1.05V			CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB					256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA				CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b		ARM			YES	-1	256000	Kintex™-7 FPGA, 125K Logic Cells			CAN; ETHERNET; I2C; SPI; UART; USB		2.54mm	23mm		无	ROHS3 Compliant
XC7Z010-2CLG400E	Xilinx Inc.	数据表	495 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	400-LFBGA, CSPBGA	YES	400			130		0°C~100°C TJ	Tray	2010	Zynq®-7000	e1		活跃	3 (168 Hours)	400	EAR99	Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01	BOTTOM	BALL	260	1V	0.8mm		766MHz		XC7Z010			1V	1.05V			CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB					256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA				CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b		ARM			YES	-2	256000	Artix™-7 FPGA, 28K Logic Cells			CAN; ETHERNET; I2C; SPI; UART; USB		1.6mm	17mm		无	ROHS3 Compliant
A2F500M3G-FGG484I	Atmel (Microchip Technology)	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484				ARM Cortex M3	+ 100 C	- 40 C	204 I/O	6000 LE	64 kB	-	-	80 MHz	SMD/SMT	Details	有	-	60	SmartFusion	0.062696 oz					Tray		A2F500																							1.5 V							16.5 mA							512 kB							500000			1 Core
XC7Z010-1CLG225C	Xilinx Inc.	数据表	50 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	225-LFBGA, CSPBGA	YES	225			86		0°C~85°C TJ	Tray	2010	Zynq®-7000	e1		活跃	3 (168 Hours)	225	EAR99	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)				8542.39.00.01	BOTTOM	BALL	260	1V	0.8mm		667MHz	30	XC7Z010			1V	1.05V			CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB					256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA				CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b		ARM			YES	-1	256000	Artix™-7 FPGA, 28K Logic Cells			CAN; ETHERNET; I2C; SPI; UART; USB		1.5mm	13mm		无	ROHS3 Compliant
XC7Z035-1FFG676I	Xilinx Inc.	数据表	990 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	表面贴装	676-BBGA, FCBGA			130			-40°C~100°C TJ	Tray	2010	Zynq®-7000	e1		活跃	4 (72 Hours)	676		Tin/Silver/Copper (Sn/Ag/Cu)					BOTTOM	BALL	未说明	1V			667MHz	未说明		S-PBGA-B676						CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	1.05V	950mV			256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA			120 ps	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			ARM			YES	1	256000	Kintex™-7 FPGA, 275K Logic Cells	343800		CAN; ETHERNET; I2C; SPI; UART; USB		3.37mm	27mm	27mm		ROHS3 Compliant
XC7Z045-2FFG676E	Xilinx Inc.	数据表	873 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	676-BBGA, FCBGA	YES	ROMless	130					0°C~100°C TJ	Tray	2009	Zynq®-7000	e1		活跃	4 (72 Hours)	676	3A991.D	Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01	BOTTOM	BALL	245	1V	1mm		800MHz	30	XC7Z045	S-PBGA-B676		1V	1.05V			CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB					256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA				CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b		ARM			YES	-2	256000	Kintex™-7 FPGA, 350K Logic Cells			CAN; ETHERNET; I2C; SPI; UART; USB		3.37mm	27mm		无	ROHS3 Compliant
A2F200M3F-FGG256I	Atmel (Microchip Technology)	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-256				ARM Cortex M3	Details	SMD/SMT	80 MHz	-	-	64 kB	2000 LE	117 I/O	- 40 C	+ 100 C	有	-	90	SmartFusion	0.690329 oz					Tray		A2F200																							1.5 V							7 mA							256 kB							200000			1 Core
XC7Z007S-2CLG400E	Xilinx Inc.	数据表	990 In Stock	1: ¥201.262733 10: ¥189.870502 100: ¥179.123116 500: ¥168.984071 查看所有的价格 -	最小起订量: 1 最小包装量: 1	10 Weeks	400-LFBGA, CSPBGA	YES	100						0°C~100°C TJ	Tray	2016	Zynq®-7000	e3	yes	活跃	3 (168 Hours)	400		Matte Tin (Sn)				8542.31.00.01	BOTTOM	BALL	未说明	1V	0.8mm			未说明		S-PBGA-B400			1.05V		0.95V					766MHz	256KB		Single ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	800MHz			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						YES		256000	Artix™-7 FPGA, 23K Logic Cells			CAN; ETHERNET; I2C; SPI; UART; USB		1.6mm	17mm	17mm		ROHS3 Compliant
XC7Z045-2FFG900E	Xilinx Inc.	数据表	854 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	900-BBGA, FCBGA	YES	ROMless	130					0°C~100°C TJ	Tray	2009	Zynq®-7000	e1		活跃	4 (72 Hours)	900	3A991.D	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)				8542.39.00.01	BOTTOM	BALL	245	1V	1mm		800MHz	30	XC7Z045	S-PBGA-B900		1V	1.05V			CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB					256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA				CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b		ARM			YES	-2	256000	Kintex™-7 FPGA, 350K Logic Cells			CAN; ETHERNET; I2C; SPI; UART; USB		3.35mm	31mm		无	ROHS3 Compliant
XC7Z030-1SBG485C	Xilinx Inc.	数据表	990 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	484-FBGA, FCBGA	YES	485			130		0°C~85°C TJ	Tray	2009	Zynq®-7000	e1		活跃	4 (72 Hours)	485	EAR99	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)				8542.39.00.01	BOTTOM	BALL	未说明	1V	0.8mm		667MHz	未说明			不合格		1.05V	11.8V	0.95V	CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB					256KB	微处理器电路	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA				CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b		ARM			YES	-1	256000	Kintex™-7 FPGA, 125K Logic Cells			CAN; ETHERNET; I2C; SPI; UART; USB	N	2.44mm	19mm			ROHS3 Compliant
XC7Z007S-1CLG225C	Xilinx Inc.	数据表	500 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	225-LFBGA, CSPBGA	YES	54						0°C~85°C TJ	Tray	2016	Zynq®-7000	e1	yes	活跃	3 (168 Hours)	225		Tin/Silver/Copper (Sn/Ag/Cu)					BOTTOM	BALL	260	1V	0.8mm			30		S-PBGA-B225			1.05V		0.95V					667MHz	256KB		Single ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	667MHz			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			ARM			YES		256000	Artix™-7 FPGA, 23K Logic Cells			CAN; ETHERNET; I2C; PCI; SPI; UART; USB		1.5mm	13mm	13mm		ROHS3 Compliant
XC7Z045-1FBG676C	Xilinx Inc.	数据表	868 In Stock	1: ¥5,168.527540 10: ¥4,875.969381 100: ¥4,599.971112 500: ¥4,339.595391 查看所有的价格 -	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	676-BBGA, FCBGA	YES	676			130	ROMless		0°C~85°C TJ	Tray	2009	Zynq®-7000	e1		活跃	3 (168 Hours)	676	3A991.D	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)				8542.39.00.01	BOTTOM	BALL	245	1V	1mm		667MHz	30	XC7Z045							CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	3.3V	1.2V			256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA				CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b	190000	ARM			YES	-1	256000	Kintex™-7 FPGA, 350K Logic Cells			CAN; ETHERNET; I2C; SPI; UART; USB		2.54mm	27mm		无	ROHS3 Compliant
XC7Z030-2FBG484E	Xilinx Inc.	数据表	2545 In Stock	1: ¥2,406.481105 10: ¥2,270.265190 100: ¥2,141.759613 500: ¥2,020.527940 查看所有的价格 -	最小起订量: 1 最小包装量: 1	10 Weeks	484-BBGA, FCBGA	YES	484			130			0°C~100°C TJ	Tray	2009	Zynq®-7000	e1		活跃	4 (72 Hours)	484	EAR99	Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01	BOTTOM	BALL	250	1V	1mm		800MHz	30	XC7Z030				1.05V		0.95V	CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB					256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA				CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b		ARM			YES	-2	256000	Kintex™-7 FPGA, 125K Logic Cells			CAN; ETHERNET; I2C; SPI; UART; USB		2.54mm	23mm		无	ROHS3 Compliant
XC7Z030-2FFG676E	Xilinx Inc.	数据表	2693 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	676-BBGA, FCBGA	YES	676			130		0°C~100°C TJ	Tray	2009	Zynq®-7000	e1		活跃	4 (72 Hours)	676	3A991.D	Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01	BOTTOM	BALL	245	1V	1mm		800MHz	30	XC7Z030			1V	1.05V			CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB					256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA				CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b		ARM			YES	-2	256000	Kintex™-7 FPGA, 125K Logic Cells			CAN; ETHERNET; I2C; SPI; UART; USB		3.24mm	27mm		无	ROHS3 Compliant
M2S005-TQG144	Atmel (Microchip Technology)	数据表	N/A	-	最小起订量: 1 最小包装量: 1	TQFP-144				ARM Cortex M3	0.035380 oz	60	505 LAB	有	191 kbit	+ 85 C	0 C	84 I/O	6060 LE	64 kB	-	-	166 MHz	SMD/SMT	Details					Tray		SmartFusion2																							1.2 V														128 kB										1 Core
XC7Z045-2FBG676I	Xilinx Inc.	数据表	760 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	676-BBGA, FCBGA	YES	676			ROMless	130		-40°C~100°C TJ	Tray	2009	Zynq®-7000	e1		活跃	3 (168 Hours)	676	3A991.D	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)				8542.39.00.01	BOTTOM	BALL	245	1V	1mm		800MHz	30	XC7Z045			1V	1.05V			CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB					256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA				CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b		ARM			YES	-2	256000	Kintex™-7 FPGA, 350K Logic Cells			CAN; ETHERNET; I2C; SPI; UART; USB		2.54mm	27mm		无	ROHS3 Compliant
XC7Z020-2CLG484E	Xilinx Inc.	数据表	495 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	484-LFBGA, CSPBGA	YES	484			130		0°C~100°C TJ	Tray	2009	Zynq®-7000	e1		活跃	3 (168 Hours)	484	3A991.D	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)				8542.39.00.01	BOTTOM	BALL	260	1V	0.8mm		766MHz	30	XC7Z020			1V	1.05V			CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB					256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA				CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b		ARM			YES	-2	256000	Artix™-7 FPGA, 85K Logic Cells			CAN; ETHERNET; I2C; SPI; UART; USB		1.6mm	19mm		无	ROHS3 Compliant
XC7Z100-2FFG1156I	Xilinx Inc.	数据表	793 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	表面贴装	1156-BBGA, FCBGA			250			-40°C~100°C TJ	Tray	2010	Zynq®-7000	e1		活跃	4 (72 Hours)		3A991.D	Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01	BOTTOM	BALL	245	1V	1mm	not_compliant	800MHz	30		S-PBGA-B1156			1.05V		0.95V	CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB					256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA				CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b		ARM			YES		256000	Kintex™-7 FPGA, 444K Logic Cells			CAN; ETHERNET; I2C; SPI; UART; USB		3.1mm	35mm			ROHS3 Compliant
M2S005S-TQG144	Atmel (Microchip Technology)	数据表	N/A	-	最小起订量: 1 最小包装量: 1	ARM Cortex M3	Details	166 MHz	-	-	64 kB	6060 LE	有	505 LAB	60								This product may require additional documentation to export from the United States.		Tray		SmartFusion2																																					128 kB														1 Core
XC7Z015-3CLG485E	Xilinx Inc.	数据表	495 In Stock	1: ¥358.685571 10: ¥338.382614 100: ¥319.228882 500: ¥301.159322 查看所有的价格 -	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	表面贴装	484-LFBGA, CSPBGA	485			130		0°C~100°C TJ	Tray	2010	Zynq®-7000	e1		活跃	3 (168 Hours)	485	EAR99	Tin/Silver/Copper (Sn/Ag/Cu)			PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY	8542.39.00.01	BOTTOM	BALL	未说明	1V	0.8mm		866MHz	未说明			不合格		1.05V	11.8V	0.95V	CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB					256KB	微处理器电路	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA				CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b		ARM			YES		256000	Artix™-7 FPGA, 74K Logic Cells			CAN; ETHERNET; I2C; SPI; UART; USB	N	1.6mm	19mm			ROHS3 Compliant
XC7Z007S-1CLG400C	Xilinx Inc.	数据表	960 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	400-LFBGA, CSPBGA	YES	100						0°C~85°C TJ	Tray	2016	Zynq®-7000	e3	yes	活跃	3 (168 Hours)	400		Matte Tin (Sn)				8542.31.00.01	BOTTOM	BALL	未说明	1V	0.8mm			未说明		S-PBGA-B400			1.05V		0.95V					667MHz	256KB		Single ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	667MHz			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						YES		256000	Artix™-7 FPGA, 23K Logic Cells			CAN; ETHERNET; I2C; SPI; UART; USB		1.6mm	17mm	17mm		ROHS3 Compliant