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产品型号	品牌	数据表	库存	价格(含增值税)	数量	工厂交货时间	包装/外壳	表面安装	供应商器件包装		Core									厂商											操作温度	包装	已出版	系列	无铅代码	零件状态	湿度敏感性等级(MSL)	终止次数	端子表面处理	附加功能	HTS代码	端子位置	峰值回流焊温度（摄氏度）	电源电压	端子间距	时间@峰值回流温度-最大值(s)	JESD-30代码	输出的数量	工作电源电压	电源电压-最大值(Vsup)	电源	电源电压-最小值(Vsup)	速度	内存大小	核心处理器	周边设备	程序内存大小	连接方式	建筑学	速度等级	主要属性	核数量	闪光大小
XCZU6CG-2FFVB1156I	Xilinx Inc.	数据表	1 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA	YES	328				-40°C~100°C TJ	Bulk	2016	Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)				8542.31.00.01	BOTTOM	BALL	未说明	0.85V		未说明		R-PBGA-B1156			0.876V		0.825V	533MHz, 1.3GHz	256KB	微处理器电路	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 469K+ Logic Cells						ROHS3 Compliant
XCZU4EV-L2FBVB900E	Xilinx Inc.	数据表	280 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA	YES	204				0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EV			活跃	4 (72 Hours)	900		ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V		未说明		R-PBGA-B900			0.742V		0.698V	533MHz, 600MHz, 1.3GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 192K+ Logic Cells						ROHS3 Compliant
XCZU2EG-2SBVA484I	Xilinx Inc.	数据表	522 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	484-BFBGA, FCBGA	YES	82				-40°C~100°C TJ	Tray	2013	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)	484			8542.31.00.01	BOTTOM	BALL	未说明	0.85V		未说明		R-PBGA-B484			0.876V			533MHz, 600MHz, 1.3GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 103K+ Logic Cells						ROHS3 Compliant
XCZU3CG-2SBVA484I	Xilinx Inc.	数据表	814 In Stock	1: ¥5,188.309712 10: ¥4,894.631800 100: ¥4,617.577175 500: ¥4,356.204883 查看所有的价格 -	最小起订量: 1 最小包装量: 1	11 Weeks	484-BFBGA, FCBGA	YES	82				-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)	484			8542.31.00.01	BOTTOM	BALL	未说明	0.85V		未说明		R-PBGA-B484			0.876V			533MHz, 1.3GHz	256KB	微处理器电路	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 154K+ Logic Cells						ROHS3 Compliant
XCZU11EG-L1FFVF1517I	Xilinx Inc.	数据表	95 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1517-BBGA, FCBGA	YES	464				-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V		未说明		R-PBGA-B1517			0.742V		0.698V	500MHz, 600MHz, 1.2GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 653K+ Logic Cells						ROHS3 Compliant
XCZU19EG-1FFVE1924E	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	1924-BBGA, FCBGA			668			0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)				8542.31.00.01			未说明			未说明								500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells						ROHS3 Compliant
XCZU15EG-2FFVC900E	Xilinx Inc.	数据表	210 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA			204			0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		yes	活跃	4 (72 Hours)				8542.31.00.01			未说明			未说明								533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 747K+ Logic Cells						ROHS3 Compliant
5CSXFC5C6U23C6N	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	8 Weeks	672-FBGA	YES	MCU - 181, FPGA - 145				0°C~85°C TJ	Tray	2018	Cyclone® V SX			活跃	3 (168 Hours)	672				BOTTOM	BALL	未说明	1.1V	0.8mm	未说明	5CSXFC5	S-PBGA-B672	145	不合格	1.13V	1.11.2/3.32.5V	1.07V	925MHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	145	现场可编程门阵列	FPGA - 85K Logic Elements	85000		1.85mm	23mm	23mm	符合RoHS标准
XCZU11EG-2FFVC1760E	Xilinx Inc.	数据表	390 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1760-BBGA, FCBGA			512			0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		yes	活跃	4 (72 Hours)				8542.31.00.01			未说明			未说明								533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 653K+ Logic Cells						ROHS3 Compliant
XCZU17EG-2FFVB1517I	Xilinx Inc.	数据表	303 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1517-BBGA, FCBGA			644			-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)				8542.31.00.01			未说明			未说明								533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 926K+ Logic Cells						ROHS3 Compliant
XCZU11EG-1FFVF1517I	Xilinx Inc.	数据表	850 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1517-BBGA, FCBGA			464			-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)				8542.31.00.01			未说明			未说明								500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 653K+ Logic Cells						ROHS3 Compliant
M2S010S-1TQG144I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1		TQFP-144		144-TQFP (20x20)	This product may require additional documentation to export from the United States.	ARM Cortex M3	SMD/SMT	166 MHz	-	-	64 kB	12084 LE	84 I/O	- 40 C	微芯片技术	+ 100 C	400 kbit	60	1007 LAB	1.2000 V	1.14 V	1.26 V	Tray	M2S010	活跃	-40 to 100 °C	Tray		SmartFusion2															1.2 V				166MHz	64KB	ARM® Cortex®-M3	-	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	1	FPGA - 10K Logic Modules	1 Core	256KB
10AS032H3F34E2SG	Intel	数据表	308 In Stock	-	最小起订量: 1 最小包装量: 1	8 Weeks	1152-BBGA, FCBGA	YES	384				0°C~100°C TJ	Tray		Arria 10 SX			活跃	3 (168 Hours)				8542.39.00.01	BOTTOM	BALL	未说明	0.9V	1mm	未说明		S-PBGA-B1152	384	不合格	0.93V	0.9V	0.87V	1.5GHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	384	现场可编程门阵列	FPGA - 320K Logic Elements	320000		3.65mm	35mm	35mm	符合RoHS标准
XCZU6EG-1FFVC900E	Xilinx Inc.	数据表	537 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA			204			0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)				8542.31.00.01			未说明			未说明								500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 469K+ Logic Cells						ROHS3 Compliant
XCZU17EG-1FFVC1760E	Xilinx Inc.	数据表	60 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1760-BBGA, FCBGA			512			0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)				8542.31.00.01			未说明			未说明								500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 926K+ Logic Cells						ROHS3 Compliant
XCZU6CG-L2FFVC900E	Xilinx Inc.	数据表	1350 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA	YES	204				0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)	900		ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V		未说明		R-PBGA-B900			0.742V		0.698V	533MHz, 1.3GHz	256KB	微处理器电路	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 469K+ Logic Cells						ROHS3 Compliant
XCZU7CG-2FFVC1156I	Xilinx Inc.	数据表	12 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA	YES	360				-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)				8542.31.00.01	BOTTOM	BALL	未说明	0.85V		未说明		R-PBGA-B1156			0.876V		0.825V	533MHz, 1.3GHz	256KB	微处理器电路	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 504K+ Logic Cells						ROHS3 Compliant
XCZU9CG-L2FFVC900E	Xilinx Inc.	数据表	992 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA	YES	204				0°C~100°C TJ	Bulk	2016	Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)	900		ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V		未说明		R-PBGA-B900			0.742V		0.698V	533MHz, 1.3GHz	256KB	微处理器电路	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 599K+ Logic Cells						ROHS3 Compliant
XCZU4EG-1FBVB900I	Xilinx Inc.	数据表	677 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA			204			-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)				8542.31.00.01			未说明			未说明								500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 192K+ Logic Cells						ROHS3 Compliant
XCZU4EG-3FBVB900E	Xilinx Inc.	数据表	360 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA			204			0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)				8542.31.00.01			未说明			未说明								600MHz, 1.5GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 192K+ Logic Cells						ROHS3 Compliant
XCZU7CG-2FBVB900I	Xilinx Inc.	数据表	2 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA	YES	204				-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)	900			8542.31.00.01	BOTTOM	BALL	未说明	0.85V		未说明		R-PBGA-B900			0.876V		0.825V	533MHz, 1.3GHz	256KB	微处理器电路	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 504K+ Logic Cells						ROHS3 Compliant
XCZU11EG-L1FFVC1156I	Xilinx Inc.	数据表	899 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA	YES	360				-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V		未说明		R-PBGA-B1156			0.742V		0.698V	500MHz, 600MHz, 1.2GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 653K+ Logic Cells						ROHS3 Compliant
XCZU11EG-2FFVC1156E	Xilinx Inc.	数据表	2267 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA			360			0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		yes	活跃	4 (72 Hours)				8542.31.00.01			未说明			未说明								533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 653K+ Logic Cells						ROHS3 Compliant
5CSEMA6F31C6N	Intel	数据表	2562 In Stock	-	最小起订量: 1 最小包装量: 1	8 Weeks	896-BGA	YES	MCU - 181, FPGA - 288				0°C~85°C TJ	Tray	2018	Cyclone® V SE	e1		活跃	3 (168 Hours)	896	Tin/Silver/Copper (Sn/Ag/Cu)		8542.39.00.01	BOTTOM	BALL	未说明	1.1V	1mm	未说明	5CSEMA6	S-PBGA-B896	288	不合格	1.13V	1.11.2/3.32.5V	1.07V	925MHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	288	现场可编程门阵列	FPGA - 110K Logic Elements	110000		2mm	31mm	31mm	符合RoHS标准
10AS066K2F35I2LG	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	12 Weeks	1152-BBGA, FCBGA	YES	396				-40°C~100°C TJ	Tray		Arria 10 SX			活跃	3 (168 Hours)				8542.39.00.01	BOTTOM	BALL	未说明	0.9V	1mm	未说明		S-PBGA-B1152	396	不合格	0.93V	0.9V	0.87V	1.5GHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	396	现场可编程门阵列	FPGA - 660K Logic Elements	660000		3.5mm	35mm	35mm	符合RoHS标准