N/A

-

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

活跃

252

Tray

XCZU4

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

-

N/A

-

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

活跃

252

Tray

XCZU5

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 256K+ Logic Cells

-

N/A

-

1517-BBGA, FCBGA

1517-FCBGA (40x40)

AMD

活跃

644

Tray

XCZU17

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

600MHz, 667MHz, 1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 926K+ Logic Cells

-

N/A

-

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

活跃

252

Tray

XCZU4

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

-

N/A

-

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

AMD

ACH550-BCR-032A-6+B058

ABB

Panel, Wall

726

Tray

活跃

0°C ~ 100°C (TJ)

Versal™ Prime

450MHz, 1.08GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

60 Hz

Versal™ Prime FPGA, 1.9M Logic Cells

-

断路器

575 VAC

IP58

N/A

-

256-LFBGA

YES

256-FPBGA (14x14)

256

LFBGA, BGA256,16X16,32

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA256,16X16,32

1.2 V

微芯片技术

30

1.14 V

85 °C

无

M2S010-1VF256

LFBGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.26 V

2.49

138

Tray

M2S010

活跃

-

166 MHz

12084 LE

SMD/SMT

-

64 kB

0°C ~ 85°C (TJ)

SmartFusion®2

e0

Tin/Lead (Sn/Pb)

LG-MIN, WD-MIN

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B256

138

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

138

1.56 mm

现场可编程门阵列

400Kbit

FPGA - 10K Logic Modules

12084

1 Core

256KB

14 mm

14 mm

N/A

-

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

366

Tray

活跃

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

N/A

-

1517-BBGA, FCBGA

1517-FCBGA (40x40)

AMD

表面贴装

561

Tray

活跃

Industrial grade

RISC

1.8/2.5/3.3 V

FCBGA

6

有

-40 to 100 °C

Zynq® UltraScale+™ RFSoC

1517

3.3 V

CAN/Serial I2C/SPI/U

533MHz, 1.333GHz

256 KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

64 Bit

Industrial

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

ARM Cortex-A53/ARM Cortex-R5

N/A

-

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

366

Tray

活跃

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

N/A

-

N/A

-

Production (Last Updated: 2 months ago)

676-BGA

676-FBGA (27x27)

微芯片技术

活跃

Compliant

387

Tray

M2S060

0°C ~ 85°C (TJ)

SmartFusion®2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 60K Logic Modules

256KB

N/A

-

484-BFBGA

YES

484-FBGA (19x19)

484

1.2 V

30

1.14 V

微芯片技术

85 °C

无

M2S150TS-FCV484

FBGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.26 V

5.87

273

Tray

M2S150

活跃

-

166 MHz

146124 LE

-

64 kB

VFBGA-484

GRID ARRAY, FINE PITCH

PLASTIC/EPOXY

0°C ~ 85°C (TJ)

SmartFusion®2

e0

无

Tin/Lead (Sn/Pb)

LG-MIN, WD-MIN

8542.39.00.01

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B484

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

3.15 mm

现场可编程门阵列

FPGA - 150K Logic Modules

1 Core

512KB

19 mm

19 mm

N/A

-

Axial

Axial

192

Non-Compliant

有

2 x 32 kB

1.2 GHz

160000 LE

0.423288 oz

1

SMD/SMT

20000 LAB

964674

Intel

Intel / Altera

Arria 10 SoC

2 x 32 kB

-

-65°C ~ 175°C

Tape & Reel (TR)

Military, MIL-PRF-55182/07, RNC50

0.070 Dia x 0.150 L (1.78mm x 3.81mm)

±1%

活跃

2

±25ppm/°C

6.81 kOhms

Metal Film

0.1W, 1/10W

SOC - Systems on a Chip

S (0.001%)

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

SoC FPGA

FPGA - 160K Logic Elements

2 Core

--

Military, Moisture Resistant, Weldable

SoC FPGA

--

N/A

-

1760-BBGA, FCBGA

1760-FCBGA (42.5x42.5)

PEI-Genesis

Bulk

活跃

574

0°C ~ 100°C (TJ)

*

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

N/A

-

1517-BBGA, FCBGA

1517-FCBGA (40x40)

AMD

561

Tray

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

N/A

-

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

表面贴装

366

Tray

活跃

Industrial grade

RISC

1.8/2.5/3.3 V

6

CAN/Serial I2C/SPI/UART/USB

有

-40 to 100 °C

Zynq® UltraScale+™ RFSoC

1156

0.85 V

CAN/Serial I2C/SPI/U

533MHz, 1.333GHz

256 KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

64 Bit

Industrial

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

ARM Cortex-A53/ARM Cortex-R5

N/A

-

Production (Last Updated: 2 months ago)

Lead, Tin

通孔

896-BGA

YES

896-FBGA (31x31)

896

PLASTIC/EPOXY

BGA896,30X30,40

微芯片技术

1.2 V

40

1.14 V

有

M2S050TS-FGG896I

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.26 V

5.82

Compliant

377

Tray

M2S050

活跃

-

166 MHz

56340 LE

SMD/SMT

-

64 kB

FBGA-896

网格排列

-40°C ~ 100°C (TJ)

Tape & Reel (TR)

SmartFusion®2

1 %

e1

2

50 ppm/°C

1.62 MΩ

Tin/Silver/Copper (Sn/Ag/Cu)

175 °C

-65 °C

Metal Film

8542.39.00.01

现场可编程门阵列

250 mW

250 mW

CMOS

BOTTOM

BALL

250

1 mm

compliant

MIL-R-10509

S-PBGA-B896

377

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

377

2.44 mm

现场可编程门阵列

FPGA - 50K Logic Modules

56340

1 Core

256KB

Flame Retardant Coating, Military, Moisture Resistant

3.68 mm

8.7376 mm

3.68 mm

含铅

N/A

-

1517-BBGA, FCBGA

1517-FCBGA (40x40)

KYOCERA AVX

Tape & Reel (TR)

活跃

561

0°C ~ 100°C (TJ)

*

CAN/Serial I2C/SPI/U

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

N/A

-

400-LFBGA

400-VFBGA (17x17)

PEI-Genesis

M2S005

Bulk

活跃

169

-40°C ~ 100°C (TJ)

*

166MHz

64KB

ARM® Cortex®-M3

DDR

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 5K Logic Modules

128KB

N/A

-

Production (Last Updated: 2 months ago)

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

3

PLASTIC/EPOXY

BGA325,21X21,20

M2S050T-1FCSG325I

PEI-Genesis

TFBGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

活跃

Compliant

1.2 V

1.14 V

有

1.26 V

5.76

Bulk

200

M2S050

-

166 MHz

56340 LE

SMD/SMT

-

64 kB

FBGA-325

GRID ARRAY, THIN PROFILE, FINE PITCH

-40°C ~ 100°C (TJ)

*

e1

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

250

0.5 mm

compliant

40

S-PBGA-B325

200

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

200

1.01 mm

现场可编程门阵列

FPGA - 50K Logic Modules

56340

1 Core

256KB

11 mm

11 mm

N/A

-

1210 (3225 Metric)

1210

KOA Speer Electronics, Inc.

366

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

RN73H2E

活跃

-55°C ~ 155°C

RN73H

0.126 L x 0.098 W (3.20mm x 2.50mm)

±1%

2

±50ppm/°C

191 kOhms

Metal Film

0.25W, 1/4W

-

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

Automotive AEC-Q200, Moisture Resistant

0.028 (0.70mm)

AEC-Q200

N/A

-

1517-BBGA, FCBGA

1517-FCBGA (40x40)

ITT Cannon, LLC

561

Bulk

KPT06

活跃

-40°C ~ 100°C (TJ)

KPT

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

N/A

-

-

-

PEI-Genesis

Bulk

活跃

720

-40°C ~ 100°C (TJ)

*

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.7M Logic Elements

-

N/A

-

面板安装

1596-BFBGA, FCBGA

Flange

Circular

Composite

-

Amphenol Aerospace Operations

CTVPS00RF

22D (97), 8 Twinax (2)

活跃

478

Bulk

-65°C ~ 200°C

MIL-DTL-38999 Series III, Tri-Start™ TV

插座外壳

用于公引脚

99 (97 + 2 Twinax)

Threaded

Crimp

D

Shielded

抗环境干扰

化学镍

25-7

Silver

不包括触点

600MHz, 1.4GHz

256KB

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

-

Versal™ AI Core FPGA, 800k Logic Cells

-

-

-

N/A

-

1369-BFBGA

1369-BGA (35x35)

AMD

424

Tray

活跃

-40°C ~ 100°C (TJ)

Versal™ Prime

600MHz, 1.4GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1.2M Logic Cells

-