我的订单
会员中心 
在线咨询
0755-83328606
类别是'category.片上系统（SoC）' (7695)
- 所有品牌
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 安装类型 | 包装/外壳 | 供应商器件包装 | 材料类型 | 厂商 | 操作温度 | 系列 | 尺寸/尺寸 | 零件状态 | 类型 | 应用 | 电压 - 供电 | 频率 | 频率稳定性 | 输出量 | 引脚数量 | 功能 | 基本谐振器 | 最大电流源 | 界面 | 速度 | 内存大小 | 核心处理器 | 周边设备 | 扩频带宽 | 连接方式 | 建筑学 | 粘合剂 | 图例 | 绝对牵引范围 (APR) | 主要属性 | 数量 | 背景颜色 | VA 额定功率 | 闪光大小 | 文字颜色 | 语言 | 相位 | 座位高度(最大) | 评级结果 | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | XCZU2EG-L1UBVA530I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 530-WFBGA, FCBGA | 530-FCBGA (16x9.5) | AMD | 82 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||
| XCVC1902-2HSIVSVD1760 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 726 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Versal™ AI Core | 800MHz, 1.65GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||
| XCVM1302-2LSENSVF1369 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1369-BFBGA | 1369-BGA (35x35) | AMD | 316 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal™ Prime | 450MHz, 1.08GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | ||||||||||||||||||||||||||||||||||||
| XCZU1EG-L1SBVA484I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | AMD | - | Tray | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ | CAN/Serial I2C/SPI/U | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | MPU, FPGA | - | - | |||||||||||||||||||||||||||||||||||
| XCVM1802-2MLEVSVA2197 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD | 770 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||
| AGFA022R25A2I2V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 活跃 | Tray | 624 | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | ||||||||||||||||||||||||||||||||||||
| XC7Z030-1FBG676I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 676-BBGA, FCBGA | 676-FCBGA (27x27) | AMD | 130 | Tray | XC7Z030 | 活跃 | -40°C ~ 100°C (TJ) | Zynq®-7000 | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 125K Logic Cells | - | |||||||||||||||||||||||||||||||||||
| BCM3384GUIFSBGB0T | Broadcom | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Broadcom Limited | Tray | BCM3384 | 活跃 | * | |||||||||||||||||||||||||||||||||||||||||||||||
| AGFA014R24B1I1V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Tray | 活跃 | Intel | 101980 | Brady | 768 | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | - | ||||||||||||||||||||||||||||||||||
| SC1201UFH-266B | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 4-SMD, No Lead | 481-BGA (40x40) | 27 | SiTime | Strip | 活跃 | BGA | 表面贴装 | -40°C ~ 85°C | SiT1602B | 0.098 L x 0.079 W (2.50mm x 2.00mm) | XO (Standard) | 2.25V ~ 3.63V | 31.25 MHz | ±50ppm | HCMOS, LVCMOS | 481 | Enable/Disable | MEMS | 4.5mA | 266MHz | - | X86 | AC97/AMC97, DMA, PCI, SmartCard, WDT | - | Access.bus, GPIO, PC/AT, UART | MPU | - | - | - | 0.031 (0.80mm) | - | |||||||||||||||||||
| AGFA014R24C2E2V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 744 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | - | ||||||||||||||||||||||||||||||||||||
| MPFS460TS-1FCG1152IPP | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | 1152-FCBGA (35x35) | 微芯片技术 | MCU - 136, FPGA - 468 | Tray | 活跃 | -40°C ~ 100°C | * | 活跃 | - | 3.95MB | RISC-V | DMA, PCI, PWM | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 461K Logic Modules | 128kB | |||||||||||||||||||||||||||||||||||
| XCZU3CG-2SFVC784I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | AMD | 252 | Bulk | XCZU3 | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||
| XCZU4EG-1SFVC784E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | AMD | 252 | Tray | XCZU4 | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||
| AGFA014R24C2E3VAA | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 744 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | - | ||||||||||||||||||||||||||||||||||||
| AGFB006R24C2I2V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 576 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 573K Logic Elements | - | ||||||||||||||||||||||||||||||||||||
| XCZU7EV-1FBVB900E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | 204 | Tray | XCZU7 | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EV | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||
| AGFA019R25A2E4F | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Tray | 活跃 | Intel | 4627151 | Murrelektronik | 480 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | - | ||||||||||||||||||||||||||||||||||
| AGFA006R24C2E4X | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | C1F007WES | CSA, UL | H级 | Hammond Power Solutions | Wall | Intel | 576 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Agilex F | Distribution | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 573K Logic Elements | 7,500 VA | - | 1 | ||||||||||||||||||||||||||||
| AGFB008R24C3E3V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 576 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 764K Logic Elements | - | ||||||||||||||||||||||||||||||||||||
| XCVC1502-2MLINSVG1369 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | AMD | 478 | Tray | 活跃 | Versal™ AI Core | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 800k Logic Cells | - | |||||||||||||||||||||||||||||||||||||||
| XCVC1802-2LSEVSVA2197 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD | Miscellaneous | 活跃 | Tray | 770 | 0°C ~ 100°C (TJ) | Versal™ AI Core | 450MHz, 1.08GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - | |||||||||||||||||||||||||||||||||||
| XCZU5EG-L2FBVB900E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | Plastic | XCZU5 | Tray | AMD | 204 | 41700 | Brady | 不用于新设计 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | Pipe & Valve Marking | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 无 | Air | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | 0 | Green | - | White | English | |||||||||||||||||||||||||
| XCZU17EG-3FFVE1924E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1924-BBGA, FCBGA | 1924-FCBGA (45x45) | AMD | 668 | Tray | XCZU17 | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 600MHz, 667MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||
| XCVM1802-1MLIVSVD1760 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 726 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - |
-
XCZU2EG-L1UBVA530I
AMD
分类:Embedded - System On Chip (SoC)
-
XCVC1902-2HSIVSVD1760
AMD
分类:Embedded - System On Chip (SoC)
-
XCVM1302-2LSENSVF1369
AMD
分类:Embedded - System On Chip (SoC)
-
XCZU1EG-L1SBVA484I
AMD
分类:Embedded - System On Chip (SoC)
-
XCVM1802-2MLEVSVA2197
AMD
分类:Embedded - System On Chip (SoC)
-
AGFA022R25A2I2V
Intel
分类:Embedded - System On Chip (SoC)
-
XC7Z030-1FBG676I
AMD
分类:Embedded - System On Chip (SoC)
-
BCM3384GUIFSBGB0T
Broadcom
分类:Embedded - System On Chip (SoC)
-
AGFA014R24B1I1V
Intel
分类:Embedded - System On Chip (SoC)
-
SC1201UFH-266B
AMD
分类:Embedded - System On Chip (SoC)
-
AGFA014R24C2E2V
Intel
分类:Embedded - System On Chip (SoC)
-
MPFS460TS-1FCG1152IPP
Microchip
分类:Embedded - System On Chip (SoC)
-
XCZU3CG-2SFVC784I
AMD
分类:Embedded - System On Chip (SoC)
-
XCZU4EG-1SFVC784E
AMD
分类:Embedded - System On Chip (SoC)
-
AGFA014R24C2E3VAA
Intel
分类:Embedded - System On Chip (SoC)
-
AGFB006R24C2I2V
Intel
分类:Embedded - System On Chip (SoC)
-
XCZU7EV-1FBVB900E
AMD
分类:Embedded - System On Chip (SoC)
-
AGFA019R25A2E4F
Intel
分类:Embedded - System On Chip (SoC)
-
AGFA006R24C2E4X
Intel
分类:Embedded - System On Chip (SoC)
-
AGFB008R24C3E3V
Intel
分类:Embedded - System On Chip (SoC)
-
XCVC1502-2MLINSVG1369
AMD
分类:Embedded - System On Chip (SoC)
-
XCVC1802-2LSEVSVA2197
AMD
分类:Embedded - System On Chip (SoC)
-
XCZU5EG-L2FBVB900E
AMD
分类:Embedded - System On Chip (SoC)
-
XCZU17EG-3FFVE1924E
AMD
分类:Embedded - System On Chip (SoC)
-
XCVM1802-1MLIVSVD1760
AMD
分类:Embedded - System On Chip (SoC)