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类别是'category.片上系统（SoC）' (7695)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 包装/外壳 | 表面安装 | 供应商器件包装 | 终端数量 | 厂商 | 操作温度 | 系列 | JESD-609代码 | 无铅代码 | 端子表面处理 | HTS代码 | 子类别 | 技术 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 端子间距 | Reach合规守则 | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 电源 | 温度等级 | 界面 | 速度 | 内存大小 | 核心处理器 | 周边设备 | 连接方式 | 建筑学 | 输入数量 | 座位高度-最大 | 可编程逻辑类型 | 速度等级 | 主要属性 | 逻辑单元数 | 闪光大小 | 长度 | 宽度 | |||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | XCVM1302-1MSINBVB1024 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1024-BFBGA | 1024-BGA (31x31) | AMD | 316 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.3GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU57DR-L2FFVE1156I | AMD | 数据表 | 612 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | - | Tray | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC DR | 533MHz, 1.3GHz | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq® UltraScale+™ RFSoC | - | |||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU57DR-L2FSVE1156I | AMD | 数据表 | 550 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | - | Tray | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC DR | 533MHz, 1.3GHz | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq® UltraScale+™ RFSoC | - | |||||||||||||||||||||||||||||||||||||||||||||||||
| XCVM1302-1MSIVSVD1760 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 402 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.3GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||
| XCVE1752-1LLIVSVA2197 | AMD | 数据表 | 570 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD | 608 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Versal™ AI Core | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||
| XCVE1752-1LSEVSVA2197 | AMD | 数据表 | 967 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD | 608 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal™ AI Core | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||
| XCVM1402-2LSENSVF1369 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1369-BFBGA | 1369-BGA (35x35) | AMD | 424 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal™ Prime | 450MHz, 1.08GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||
| M2S050S-1VF400I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S100T-FC1152 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1152 | 1.2 V | 未说明 | 1.14 V | 85 °C | 无 | M2S100T-FC1152 | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.26 V | 5.86 | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1152 | 574 | 不合格 | 1.2 V | OTHER | 574 | 2.9 mm | 现场可编程门阵列 | 99512 | 35 mm | 35 mm | |||||||||||||||||||||||||
| M2S090S-1FG676I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 676 | 未说明 | 1.14 V | 无 | M2S090S-1FG676I | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.26 V | 5.83 | BGA | BGA, | 网格排列 | PLASTIC/EPOXY | 1.2 V | 无 | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1 mm | compliant | 676 | S-PBGA-B676 | 2.44 mm | 现场可编程门阵列 | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||||
| M2S090S-1FGG484I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S100T-FCG1152 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1152 | PLASTIC/EPOXY | BGA1152,34X34,40 | 1.2 V | 未说明 | 1.14 V | 85 °C | 有 | M2S100T-FCG1152 | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.26 V | 5.8 | 35 X 35 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-1152 | 网格排列 | 4 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1152 | 574 | 不合格 | 1.2 V | OTHER | 574 | 2.9 mm | 现场可编程门阵列 | 99512 | 35 mm | 35 mm | ||||||||||||||||||||||||||
| M2S010T-1FGG484M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 484-BGA | 484-FPBGA (23x23) | 微芯片技术 | 233 | Tray | M2S010 | 活跃 | -55°C ~ 125°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 10K Logic Modules | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||
| M2S100T-1FCG1152 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1152 | PLASTIC/EPOXY | BGA1152,34X34,40 | 1.2 V | 未说明 | 1.14 V | 85 °C | 有 | M2S100T-1FCG1152 | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.26 V | 5.8 | BGA, BGA1152,34X34,40 | 网格排列 | 4 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1152 | 574 | 不合格 | 1.2 V | OTHER | 574 | 2.9 mm | 现场可编程门阵列 | 99512 | 35 mm | 35 mm | ||||||||||||||||||||||||||
| A2F500M3G-FGG256I | Microchip | 数据表 | 2344 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 256-LBGA | 256-FPBGA (17x17) | 微芯片技术 | MCU - 25, FPGA - 66 | Tray | A2F500 | 活跃 | -40°C ~ 100°C (TJ) | SmartFusion® | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | STD | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||
| IMX8XMIPI4CAM | NXP | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| PIMX8UX6AVLFZAB | NXP | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU1CG-L2SFVA625E | AMD | 数据表 | 2374 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | AMD | - | Tray | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ | CAN/Serial I2C/SPI/U | 533MHz, 1.333GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | MPU, FPGA | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||
| XCVM1302-1LSINBVB1024 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1024-BFBGA | 1024-BGA (31x31) | AMD | 316 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Versal™ Prime | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||
| XCVM1802-1MSEVSVD1760 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 726 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU2CG-2UBVA530I | AMD | 数据表 | 2723 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 530-WFBGA, FCBGA | 530-FCBGA (16x9.5) | AMD | 82 | Tray | 活跃 | -40°C ~ 100°C (TJ) | - | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||
| XCVC1802-2HSIVSVA2197 | AMD | 数据表 | 932 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD | 770 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Versal™ AI Core | 800MHz, 1.65GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||
| XAZU1EG-L1SBVA484I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | AMD | 82 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq®UltraScale+™ FPGA, 82K Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||
| XCVM1802-2MSIVSVD1760 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 726 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||
| XCVM1402-2LSENBVB1024 | AMD | 数据表 | 930 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1024-BFBGA | 1024-BGA (31x31) | AMD | 424 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal™ Prime | 450MHz, 1.08GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - |
-
XCVM1302-1MSINBVB1024
AMD
分类:Embedded - System On Chip (SoC)
-
XCZU57DR-L2FFVE1156I
AMD
分类:Embedded - System On Chip (SoC)
180,998.304292
-
XCZU57DR-L2FSVE1156I
AMD
分类:Embedded - System On Chip (SoC)
182,145.924633
-
XCVM1302-1MSIVSVD1760
AMD
分类:Embedded - System On Chip (SoC)
-
XCVE1752-1LLIVSVA2197
AMD
分类:Embedded - System On Chip (SoC)
218,839.773745
-
XCVE1752-1LSEVSVA2197
AMD
分类:Embedded - System On Chip (SoC)
145,890.224286
-
XCVM1402-2LSENSVF1369
AMD
分类:Embedded - System On Chip (SoC)
-
M2S050S-1VF400I
Microchip
分类:Embedded - System On Chip (SoC)
-
M2S100T-FC1152
Microchip
分类:Embedded - System On Chip (SoC)
-
M2S090S-1FG676I
Microchip
分类:Embedded - System On Chip (SoC)
-
M2S090S-1FGG484I
Microchip
分类:Embedded - System On Chip (SoC)
-
M2S100T-FCG1152
Microchip
分类:Embedded - System On Chip (SoC)
-
M2S010T-1FGG484M
Microchip
分类:Embedded - System On Chip (SoC)
-
M2S100T-1FCG1152
Microchip
分类:Embedded - System On Chip (SoC)
-
A2F500M3G-FGG256I
Microchip
分类:Embedded - System On Chip (SoC)
957.716580
-
IMX8XMIPI4CAM
NXP
分类:Embedded - System On Chip (SoC)
-
PIMX8UX6AVLFZAB
NXP
分类:Embedded - System On Chip (SoC)
-
XCZU1CG-L2SFVA625E
AMD
分类:Embedded - System On Chip (SoC)
2,954.089073
-
XCVM1302-1LSINBVB1024
AMD
分类:Embedded - System On Chip (SoC)
-
XCVM1802-1MSEVSVD1760
AMD
分类:Embedded - System On Chip (SoC)
-
XCZU2CG-2UBVA530I
AMD
分类:Embedded - System On Chip (SoC)
3,341.464846
-
XCVC1802-2HSIVSVA2197
AMD
分类:Embedded - System On Chip (SoC)
255,492.622174
-
XAZU1EG-L1SBVA484I
AMD
分类:Embedded - System On Chip (SoC)
-
XCVM1802-2MSIVSVD1760
AMD
分类:Embedded - System On Chip (SoC)
-
XCVM1402-2LSENBVB1024
AMD
分类:Embedded - System On Chip (SoC)
56,407.218538