类别是'category.片上系统(SoC)' (7695)

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AGFB006R24C3E4X
AGFB006R24C3E4X
Intel 数据表

709 In Stock

-

最小起订量: 1

最小包装量: 1

-

-

Intel

Tray

活跃

576

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 573K Logic Elements

-

MPFS460TS-1FCG1152IPP
MPFS460TS-1FCG1152IPP
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1152-BBGA, FCBGA

1152-FCBGA (35x35)

微芯片技术

Tray

活跃

MCU - 136, FPGA - 468

-40°C ~ 100°C

*

活跃

-

3.95MB

RISC-V

DMA, PCI, PWM

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 461K Logic Modules

128kB

XC7Z045-3FFG676E
XC7Z045-3FFG676E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Surface Mount, MLCC

0603 (1608 Metric)

676-FCBGA (27x27)

AMD

Thumb-2

1.2, 3.3 V

FCBGA

2

表面贴装

130

Tray

XC7Z045

活跃

Lead free / RoHS Compliant

200V

-55°C ~ 150°C

Tape & Reel (TR)

GA

0.063 L x 0.032 W (1.60mm x 0.80mm)

±2%

1 (Unlimited)

C0G, NP0

汽车

270pF

676

1 V

-

-

1GHz

256KB

-

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

32 Bit

Kintex™-7 FPGA, 350K Logic Cells

-

-

-

0.038 (0.97mm)

AEC-Q200

XC7Z045-1FBG676I
XC7Z045-1FBG676I
AMD 数据表

782 In Stock

-

最小起订量: 1

最小包装量: 1

通孔

Radial, Disc

676-FCBGA (27x27)

AMD

2

130

Tray

XC7Z045

活跃

Lead free / RoHS Compliant

400VAC

Thumb-2

1.2, 3.3 V

FCBGA

-30°C ~ 125°C

Bulk

Cera-Mite 125L

0.563 Dia (14.30mm)

±20%

1 (Unlimited)

Y5V (F)

Safety

10000pF

676

1 V

-

0.374 (9.50mm)

667MHz

256KB

Straight

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

32 Bit

Kintex™-7 FPGA, 350K Logic Cells

-

-

0.689 (17.50mm)

-

X1, Y4

XC7Z020-L1CLG484I
XC7Z020-L1CLG484I
AMD 数据表

2240 In Stock

-

最小起订量: 1

最小包装量: 1

Surface Mount, MLCC

1812 (4532 Metric)

484-CSPBGA (19x19)

AMD

活跃

Lead free / RoHS Compliant

50V

1 V

0.95 V

1.05 V

130

Tray

XC7Z020

-55°C ~ 150°C

Tape & Reel (TR)

GA

0.177 L x 0.126 W (4.50mm x 3.20mm)

±20%

1 (Unlimited)

X7R

汽车

0.056µF

-

-

667MHz

256KB

-

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

1L

Artix™-7 FPGA, 85K Logic Cells

-

-

-

0.086 (2.18mm)

AEC-Q200

M2S005S-TQ144I
M2S005S-TQ144I
Microchip 数据表

2678 In Stock

-

最小起订量: 1

最小包装量: 1

144-LQFP

YES

144-TQFP (20x20)

4400g

144

微芯片技术

(W x H x D) 348 x 100 x 289 mm

Black

84

Tray

Obsolete

TQFP-144

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP144,.87SQ,20

1.2 V

30

1.14 V

M2S005S-TQ144I

LFQFP

SQUARE

Microsemi Corporation

Obsolete

MICROSEMI CORP

1.26 V

5.88

-40°C ~ 100°C (TJ)

SmartFusion®2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

现场可编程门阵列

CMOS

QUAD

鸥翼

240

0.5 mm

289mm

not_compliant

S-PQFP-G144

84

不合格

1.2 V

166MHz

64KB

ARM® Cortex®-M3

-

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

84

1.6 mm

现场可编程门阵列

FPGA - 5K Logic Modules

6060

128KB

100m

20 mm

348mm

XCZU3CG-2SFVC784I
XCZU3CG-2SFVC784I
AMD 数据表

689 In Stock

-

最小起订量: 1

最小包装量: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

252

Bulk

XCZU3

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

-

M2S050T-FGG896ES
M2S050T-FGG896ES
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1935297

Phoenix Contact

M2S025-1FGG484
M2S025-1FGG484
Microchip 数据表

2224 In Stock

-

最小起订量: 1

最小包装量: 1

484-BGA

YES

484-FPBGA (23x23)

484

微芯片技术

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.78

10250T436H621

Cutler Hammer, Div of Eaton Co

267

Tray

M2S025

活跃

-

166 MHz

27696 LE

SMD/SMT

-

64 kB

FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

40

1.14 V

85 °C

0°C ~ 85°C (TJ)

SmartFusion®2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

267

2.44 mm

现场可编程门阵列

1

FPGA - 25K Logic Modules

27696

1 Core

256KB

23 mm

23 mm

AGFA006R24C2E4X
AGFA006R24C2E4X
Intel 数据表

808 In Stock

-

最小起订量: 1

最小包装量: 1

-

-

Intel

C1F007WES

CSA, UL

H级

Hammond Power Solutions

Wall

576

Tray

活跃

0°C ~ 100°C (TJ)

Agilex F

Distribution

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 573K Logic Elements

7,500 VA

-

1

XCVC1802-2LSEVSVA2197
XCVC1802-2LSEVSVA2197
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

2197-BFBGA, FCBGA

2197-FCBGA (45x45)

AMD

Miscellaneous

活跃

Tray

770

0°C ~ 100°C (TJ)

Versal™ AI Core

450MHz, 1.08GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.5M Logic Cells

-

AGFA022R31C2E3V
AGFA022R31C2E3V
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

Aluminum

Intel

Tray

活跃

(2) Universal International Receptacles

P-P22#2R2-M3RUV0

Grace Technologies

720

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.2M Logic Elements

-

IP65

XCZU5EG-L2FBVB900E
XCZU5EG-L2FBVB900E
AMD 数据表

693 In Stock

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

Plastic

AMD

Tray

204

41700

Brady

不用于新设计

XCZU5

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

Pipe & Valve Marking

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Air

Zynq®UltraScale+™ FPGA, 256K+ Logic Cells

0

Green

-

White

English

XCVC1502-2MLINSVG1369
XCVC1502-2MLINSVG1369
AMD 数据表

609 In Stock

-

最小起订量: 1

最小包装量: 1

AMD

478

Tray

活跃

Versal™ AI Core

600MHz, 1.4GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 800k Logic Cells

-

XC7Z045-3FFV676E
XC7Z045-3FFV676E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

676-BBGA, FCBGA

676-FCBGA (27x27)

AMD

Bulk

Obsolete

130

0°C ~ 100°C (TJ)

Zynq®-7000

1GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Kintex™-7 FPGA, 350K Logic Cells

-

XCVC1502-1MSIVSVA2197
XCVC1502-1MSIVSVA2197
AMD 数据表

615 In Stock

-

最小起订量: 1

最小包装量: 1

2197-BFBGA, FCBGA

2197-FCBGA (45x45)

AMD

Tray

活跃

586

Versal™ AI Core

600MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 800k Logic Cells

-

AGFA008R16A2E4X
AGFA008R16A2E4X
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

Polyolefin

Intel

Tray

活跃

0.41

0.64

1.98

384

0°C ~ 100°C (TJ)

Agilex F

TUBING

Clear

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 764K Logic Elements

-

3:1

XCZU6EG-3FFVB1156E
XCZU6EG-3FFVB1156E
AMD 数据表

608 In Stock

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

Metal

AMD

Tray

XCZU6

活跃

328

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

600MHz, 1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 469K+ Logic Cells

-

XC7Z007S-1CLG225C
XC7Z007S-1CLG225C
AMD 数据表

73 In Stock

-

最小起订量: 1

最小包装量: 1

225-LFBGA, CSPBGA

225-CSPBGA (13x13)

AMD

54

Tray

XC7Z007

活跃

0°C ~ 85°C (TJ)

Zynq®-7000

667MHz

256KB

Single ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Artix™-7 FPGA, 23K Logic Cells

-

10AS016C4U19E3LG
10AS016C4U19E3LG
ALTERA 数据表

777 In Stock

-

最小起订量: 1

最小包装量: 1

484-BFBGA, FCBGA

YES

484-UBGA (19x19)

484

FBGA, BGA484,22X22,32

GRID ARRAY, FINE PITCH

PLASTIC/EPOXY

BGA484,22X22,32

0.9 V

未说明

0.87 V

100 °C

10AS016C4U19E3LG

FBGA

SQUARE

活跃

INTEL CORP

0.93 V

5.47

192

Non-Compliant

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

160000 LE

0.423288 oz

1

SMD/SMT

20000 LAB

964677

Intel

Intel / Altera

Arria 10 SoC

2 x 32 kB

-

0°C ~ 100°C (TJ)

Tray

Arria 10 SX

活跃

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

未说明

0.8 mm

compliant

S-PBGA-B484

192

不合格

0.9 V

OTHER

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

192

3.25 mm

现场可编程门阵列

SoC FPGA

FPGA - 160K Logic Elements

160000

2 Core

--

SoC FPGA

19 mm

19 mm

XCZU3EG-L1SFVA625I
XCZU3EG-L1SFVA625I
AMD 数据表

681 In Stock

-

最小起订量: 1

最小包装量: 1

625-BFBGA, FCBGA

625-FCBGA (21x21)

AMD

180

Tray

XCZU3

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

-

AGFA008R24C2E2V
AGFA008R24C2E2V
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

Intel

Tray

活跃

576

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 764K Logic Elements

-

AGIB027R31B2E3VR0
AGIB027R31B2E3VR0
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

Intel

Tray

活跃

720

0°C ~ 100°C (TJ)

Agilex I

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.7M Logic Elements

-

AGFA019R25A2I2V
AGFA019R25A2I2V
Intel 数据表

799 In Stock

-

最小起订量: 1

最小包装量: 1

-

-

Intel

Tray

活跃

480

-40°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.9M Logic Elements

-

AGFA019R25A3I3E
AGFA019R25A3I3E
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

Intel

Tray

活跃

480

-40°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.9M Logic Elements

-