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产品型号	品牌	数据表	库存	价格(含增值税)	数量	工厂交货时间	包装/外壳	表面安装			操作温度	包装	已出版	系列	JESD-609代码	无铅代码	零件状态	湿度敏感性等级(MSL)	终止次数	ECCN 代码	端子表面处理	附加功能	HTS代码	端子位置	终端形式	峰值回流焊温度（摄氏度）	电源电压	端子间距	时间@峰值回流温度-最大值(s)	基本部件号	JESD-30代码	输出的数量	资历状况	电源电压-最大值(Vsup)	电源	电源电压-最小值(Vsup)	速度	内存大小	uPs/uCs/外围ICs类型	核心处理器	周边设备	时钟频率	连接方式	建筑学	输入数量	可编程逻辑类型	主要属性	逻辑单元数	座位高度(最大)	长度	宽度	RoHS状态
XCZU11EG-1FFVC1760I	Xilinx Inc.	数据表	8 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1760-BBGA, FCBGA	512		-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)					8542.31.00.01			未说明			未说明								500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 653K+ Logic Cells					ROHS3 Compliant
10AS057N2F40I2LG	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	8 Weeks	1517-BBGA, FCBGA	YES	588	-40°C~100°C TJ	Tray		Arria 10 SX			活跃	3 (168 Hours)					8542.39.00.01	BOTTOM	BALL	未说明	0.9V	1mm	未说明		S-PBGA-B1517	588	不合格	0.93V	0.9V	0.87V	1.5GHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	588	现场可编程门阵列	FPGA - 570K Logic Elements	570000	3.5mm	40mm	40mm	符合RoHS标准
XCZU19EG-L2FFVB1517E	Xilinx Inc.	数据表	27 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1517-BBGA, FCBGA	YES	644	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)				ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V		未说明		R-PBGA-B1517			0.742V		0.698V	533MHz, 600MHz, 1.3GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells					ROHS3 Compliant
XCZU19EG-1FFVD1760I	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	1760-BBGA, FCBGA	308		-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)					8542.31.00.01			未说明			未说明								500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells					ROHS3 Compliant
5CSEBA5U23I7SN	Intel	数据表	1000 In Stock	-	最小起订量: 1 最小包装量: 1	8 Weeks	672-FBGA	YES	MCU - 181, FPGA - 145	-40°C~100°C TJ	Tray	2018	Cyclone® V SE			活跃	3 (168 Hours)	672				8542.39.00.01	BOTTOM	BALL	未说明	1.1V	0.8mm	未说明	5CSEBA5	S-PBGA-B672	145	不合格	1.13V	1.11.2/3.32.5V	1.07V	800MHz	64KB		Single ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	145	现场可编程门阵列	FPGA - 85K Logic Elements	85000	1.85mm	23mm	23mm	符合RoHS标准
10AS066H4F34E3SG	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	8 Weeks	1152-BBGA, FCBGA	YES	492	0°C~100°C TJ	Tray		Arria 10 SX			活跃	3 (168 Hours)					8542.39.00.01	BOTTOM	BALL	未说明	0.9V	1mm	未说明		S-PBGA-B1152	492	不合格	0.93V	0.9V	0.87V	1.5GHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	492	现场可编程门阵列	FPGA - 660K Logic Elements	660000	3.65mm	35mm	35mm	符合RoHS标准
XCZU3CG-1SFVA625I	Xilinx Inc.	数据表	2000 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	625-BFBGA, FCBGA	180		-40°C~100°C TJ	Bulk	2016	Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)					8542.31.00.01			未说明			未说明								500MHz, 1.2GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 154K+ Logic Cells					ROHS3 Compliant
XCZU6EG-L2FFVC900E	Xilinx Inc.	数据表	896 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA	YES	204	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)	900			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V		未说明		R-PBGA-B900			0.742V		0.698V	533MHz, 600MHz, 1.3GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 469K+ Logic Cells					ROHS3 Compliant
XCZU6EG-3FFVC900E	Xilinx Inc.	数据表	995 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA	204		0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)					8542.31.00.01			未说明			未说明								600MHz, 1.5GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 469K+ Logic Cells					ROHS3 Compliant
XCZU7CG-L1FFVC1156I	Xilinx Inc.	数据表	659 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA	YES	360	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)				ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V		未说明		R-PBGA-B1156			0.742V		0.698V	500MHz, 1.2GHz	256KB	微处理器电路	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 504K+ Logic Cells					ROHS3 Compliant
XCZU3CG-L1SFVA625I	Xilinx Inc.	数据表	60 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	625-BFBGA, FCBGA	YES	180	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)	625			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V		未说明		R-PBGA-B625			0.742V		0.698V	500MHz, 1.2GHz	256KB	微处理器电路	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 154K+ Logic Cells					ROHS3 Compliant
XCZU19EG-2FFVB1517E	Xilinx Inc.	数据表	85 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1517-BBGA, FCBGA	644		0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		yes	活跃	4 (72 Hours)					8542.31.00.01			未说明			未说明								533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells					ROHS3 Compliant
XCZU9CG-L1FFVC900I	Xilinx Inc.	数据表	59 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA	YES	204	-40°C~100°C TJ	Bulk	2016	Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)	900			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V		未说明		R-PBGA-B900			0.742V		0.698V	500MHz, 1.2GHz	256KB	微处理器电路	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 599K+ Logic Cells					ROHS3 Compliant
XCZU15EG-L1FFVC900I	Xilinx Inc.	数据表	300 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA	YES	204	-40°C~100°C TJ	Tray		Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)	900			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V		未说明		R-PBGA-B900			0.742V		0.698V	500MHz, 600MHz, 1.2GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 747K+ Logic Cells					ROHS3 Compliant
5CSEBA5U19C8SN	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	8 Weeks	484-FBGA	YES	MCU - 151, FPGA - 66	0°C~85°C TJ	Tray	2018	Cyclone® V SE			活跃	3 (168 Hours)	484					BOTTOM	BALL	未说明	1.1V	0.8mm	未说明	5CSEBA5	S-PBGA-B484	66	不合格	1.13V	1.11.2/3.32.5V	1.07V	600MHz	64KB		Single ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	66	现场可编程门阵列	FPGA - 85K Logic Elements	85000	1.9mm	19mm	19mm	符合RoHS标准
XA7Z030-1FBV484Q	Xilinx Inc.	数据表	2343 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	484-BBGA, FCBGA	YES	130	Automotive grade	-40°C~125°C TJ	Tray	2010	Automotive, AEC-Q100, Zynq®-7000 XA			活跃	4 (72 Hours)	484	EAR99			8542.39.00.01	BOTTOM	BALL						S-PBGA-B484						667MHz	256KB	微处理器电路	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Kintex™-7 FPGA, 125K Logic Cells					ROHS3 Compliant
XCZU3CG-L2SFVA625E	Xilinx Inc.	数据表	68 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	625-BFBGA, FCBGA	YES	180	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)	625			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V		未说明		R-PBGA-B625			0.742V		0.698V	533MHz, 1.3GHz	256KB	微处理器电路	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 154K+ Logic Cells					ROHS3 Compliant
XCZU6CG-L1FFVB1156I	Xilinx Inc.	数据表	787 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA	YES	328	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)				ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V		未说明		R-PBGA-B1156			0.742V		0.698V	500MHz, 1.2GHz	256KB	微处理器电路	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 469K+ Logic Cells					ROHS3 Compliant
5CSEMA5F31C8N	Intel	数据表	15 In Stock	-	最小起订量: 1 最小包装量: 1	8 Weeks	896-BGA	YES	MCU - 181, FPGA - 288	0°C~85°C TJ	Tray	2018	Cyclone® V SE	e1		活跃	3 (168 Hours)	896		Tin/Silver/Copper (Sn/Ag/Cu)		8542.39.00.01	BOTTOM	BALL	未说明	1.1V	1mm	未说明	5CSEMA5	S-PBGA-B896	288	不合格	1.13V	1.11.2/3.32.5V	1.07V	600MHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	288	现场可编程门阵列	FPGA - 85K Logic Elements	85000	2mm	31mm	31mm	符合RoHS标准
10AS066K2F35I1HG	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	8 Weeks	1152-BBGA, FCBGA	396		-40°C~100°C TJ	Tray		Arria 10 SX			活跃	3 (168 Hours)																			1.5GHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			FPGA - 660K Logic Elements					符合RoHS标准
5ASTFD5G3F35I3N	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	8 Weeks	1152-BBGA, FCBGA	YES	MCU - 208, FPGA - 385	-40°C~100°C TJ	Tray		Arria V ST	e1		活跃	3 (168 Hours)			锡银铜		8542.39.00.01	BOTTOM	BALL	未说明	1.15V	1mm	未说明	5ASTFD5	S-PBGA-B1152			1.18V		1.12V	1.05GHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	670MHz	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		现场可编程门阵列	FPGA - 462K Logic Elements		2.7mm	35mm	35mm	符合RoHS标准
XCZU2EG-2SBVA484E	Xilinx Inc.	数据表	523 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	484-BFBGA, FCBGA	82		0°C~100°C TJ	Tray	2013	Zynq® UltraScale+™ MPSoC EG		yes	活跃	4 (72 Hours)					8542.31.00.01			未说明			未说明								533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 103K+ Logic Cells					ROHS3 Compliant
XCZU2EG-L2SFVA625E	Xilinx Inc.	数据表	478 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	625-BFBGA, FCBGA	YES	180	0°C~100°C TJ	Tray	2013	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)	625			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V		未说明		R-PBGA-B625			0.742V		0.698V	533MHz, 600MHz, 1.3GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 103K+ Logic Cells					ROHS3 Compliant
XCZU2EG-2SFVA625E	Xilinx Inc.	数据表	519 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	625-BFBGA, FCBGA	180		0°C~100°C TJ	Tray	2013	Zynq® UltraScale+™ MPSoC EG		yes	活跃	4 (72 Hours)					8542.31.00.01			未说明			未说明								533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 103K+ Logic Cells					ROHS3 Compliant
XCZU5CG-L1SFVC784I	Xilinx Inc.	数据表	332 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	784-BFBGA, FCBGA	YES	252	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)	784			IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)	8542.31.00.01	BOTTOM	BALL	未说明	0.72V		未说明		S-PBGA-B784						500MHz, 1.2GHz	256KB	微处理器电路	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			Zynq®UltraScale+™ FPGA, 256K+ Logic Cells					ROHS3 Compliant