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产品型号	品牌	数据表	库存	价格(含增值税)	数量	底架	安装类型	包装/外壳	表面安装	引脚数	供应商器件包装	终端数量	表面贴装的焊盘尺寸																			厂商																																	操作温度	包装	系列	尺寸/尺寸	容差	零件状态	终止次数	终端	温度系数	连接器类型	类型	电阻	定位的数量	最高工作温度	最小工作温度	组成	应用	行数	功率(瓦特)	HTS代码	电容量	子类别	额定电流	螺距	技术	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	样式	已加载定位数量	Reach合规守则	基本部件号	触点表面处理	终端样式	JESD-30代码	输出的数量	资历状况	工作电源电压	ESR（等效串联电阻）	失败率	引线间距	电源	温度等级	内存大小	振荡器类型	极化	阻抗	连接器样式	速度	内存大小	引线样式	电压 - 供电 (Vcc/Vdd)	核心处理器	纹波电流@高频	周边设备	程序存储器类型	芯尺寸	程序内存大小	连接方式	建筑学	输入数量	座位高度-最大	可编程逻辑类型	逻辑元件/单元数	产品类别	增益	EEPROM 大小	连接器用途
XCVC1902-2MSEVSVD1760	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BFBGA, FCBGA	1760-FCBGA (40x40)	AMD					692	Tray	活跃			0°C ~ 100°C (TJ)		Versal™ AI Core																																														600MHz, 1.4GHz	256KB			Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™		DDR, DMA, PCIe				CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA												Versal™ AI Core FPGA, 1.9M Logic Cells				-
XCVC1902-1MSEVSVD1760	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BFBGA, FCBGA	1760-FCBGA (40x40)	AMD					692	Tray	活跃			0°C ~ 100°C (TJ)		Versal™ AI Core																																														600MHz, 1.3GHz	256KB			Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™		DDR, DMA, PCIe				CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA												Versal™ AI Core FPGA, 1.9M Logic Cells				-
XC7Z015-1CLG485C	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	通孔	Radial, Can	485-CSPBGA (19x19)	-	EPCOS - TDK Electronics	Bulk	Obsolete	25 V	5000 Hrs @ 105°C	130	XC7Z015					-55°C ~ 105°C		B41858	0.492 Dia (12.50mm)	±20%												汽车				2200 µF																			30mOhm @ 10kHz		0.197 (5.00mm)				Polar	25 mOhms		667MHz	256KB			Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	2.858 A @ 100 kHz	DMA				CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA												Artix™-7 FPGA, 74K Logic Cells				-				1.654 (42.00mm)						-
XC7Z020-2CLG484I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-LFBGA, CSPBGA	484-CSPBGA (19x19)	Molex	Bulk	093338	活跃	130							-40°C ~ 100°C (TJ)		*																																														766MHz	256KB			Dual ARM® Cortex®-A9 MPCore™ with CoreSight™		DMA				CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA												Artix™-7 FPGA, 85K Logic Cells				-
XC7Z045-1FFG900C	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	900-BBGA, FCBGA	900-FCBGA (31x31)	TE Connectivity Deutsch 连接器	Bag	DIV40E15	活跃	130							0°C ~ 85°C (TJ)		*																																														667MHz	256KB			Dual ARM® Cortex®-A9 MPCore™ with CoreSight™		DMA				CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA												Kintex™-7 FPGA, 350K Logic Cells				-
XCZU7EV-1FBVB900I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	900-BBGA, FCBGA	900-FCBGA (31x31)	KEMET	Obsolete	Bulk	204	XCZU7							-40°C ~ 100°C (TJ)		-																																														500MHz, 600MHz, 1.2GHz	256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2		DMA, WDT				CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA												Zynq®UltraScale+™ FPGA, 504K+ Logic Cells				-
AGFA023R25A3I3E	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Molex	Bulk	120122	活跃	480							-40°C ~ 100°C (TJ)		*																																														1.4GHz	256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point		DMA, WDT				EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA												FPGA - 2.3M Logic Elements				-
AGFA019R25A2E3E	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	通孔	Radial, Disc	-	Vishay Beyschlag/Draloric/BC Components					Bulk	活跃	440VAC	480		-40°C ~ 125°C		WYO	0.256 Dia (6.50mm)	±20%				Y5U (E)								Safety				1000 pF																				-	0.197 (5.00mm)							1.4GHz	256KB	Straight		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point		DMA, WDT				EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA												FPGA - 1.9M Logic Elements				-		-		0.374 (9.50mm)			-			X1, Y2
AGFB027R31C2E1V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	TE Connectivity Deutsch 连接器	Bag	DL66G12	活跃	720							0°C ~ 100°C (TJ)		*																																														1.4GHz	256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point		DMA, WDT				EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA												FPGA - 2.7M Logic Elements				-
AGFA008R16A2I2V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Molex	Bulk	173114	活跃	384							-40°C ~ 100°C (TJ)		*																																														1.4GHz	256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point		DMA, WDT				EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA												FPGA - 764K Logic Elements				-
AGFA027R31C3E3E	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1206 (3216 Metric)	1206	KOA Speer Electronics, Inc.	Tape & Reel (TR)	RN732B	Obsolete	720							-55°C ~ 155°C		RN73	0.126 L x 0.063 W (3.20mm x 1.60mm)	±1%		2		±50ppm/°C			111 Ohms				Thin Film			0.125W, 1/8W																														1.4GHz	256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point		DMA, WDT				EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA												FPGA - 2.7M Logic Elements				-		Moisture Resistant		0.028 (0.70mm)
5CSEBA6U23C7N	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	672-FBGA	YES	672	672-UBGA (23x23)	672	Molex			Bulk	121064	活跃	MCU - 181, FPGA - 145	Compliant	FBGA, BGA672,28X28,32	GRID ARRAY, FINE PITCH	PLASTIC/EPOXY	BGA672,28X28,32	1.1 V	未说明	1.07 V	85 °C	有	5CSEBA6U23C7N	FBGA	SQUARE	Intel Corporation	活跃	FPGA - Field Programmable Gate Array Cyclone V SE dual -core ARM Cortex-A9	INTEL CORP	1.13 V	2.01		0°C ~ 85°C (TJ)	Tray	*			活跃								85 °C	0 °C					8542.39.00.01		现场可编程门阵列			CMOS	BOTTOM	BALL	未说明	0.8 mm			compliant	5CSEBA6			S-PBGA-B672	145	不合格	1.13 V				1.1,1.2/3.3,2.5 V	OTHER	773.9 kB					800MHz	64KB			Dual ARM® Cortex®-A9 MPCore™ with CoreSight™		DMA, POR, WDT				CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	145	1.85 mm	现场可编程门阵列	110000				800 MHz	41509	7		FPGA - 110K Logic Elements		110000		--					23 mm	23 mm			无铅
10AS048H2F34E1SG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	0603 (1608 Metric)	YES	0603	1152	KOA Speer Electronics, Inc.	Tape & Reel (TR)	RN731J	Obsolete	492	35 X 35 MM, ROHS COMPLIANT, FBGA-1152	网格排列	PLASTIC/EPOXY	BGA1152,34X34,40	0.9 V	未说明	0.87 V	100 °C	有	10AS048H2F34E1SG	BGA	SQUARE	Intel Corporation	Obsolete	INTEL CORP	0.93 V	5.68					-55°C ~ 155°C	Tray	RN73	0.063 L x 0.031 W (1.60mm x 0.80mm)	±1%	Discontinued at Digi-Key	2		±50ppm/°C			16.4 kOhms				Thin Film			0.063W, 1/16W	8542.39.00.01		现场可编程门阵列			CMOS	BOTTOM	BALL	未说明	1 mm			compliant				S-PBGA-B1152	492	不合格					0.9 V	OTHER					1.5GHz	256KB			Dual ARM® Cortex®-A9 MPCore™ with CoreSight™		DMA, POR, WDT				EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	492	3.65 mm	现场可编程门阵列									FPGA - 480K Logic Elements		480000		--		Moisture Resistant		0.022 (0.55mm)	35 mm	35 mm
10AS066N4F40I3SGES	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	1517-BBGA, FCBGA	YES	1517-FCBGA (40x40)	1517	KYOCERA AVX	PLASTIC/EPOXY	-40 °C	0.9 V	0.87 V	100 °C	10AS066N4F40I3SGES	BGA	SQUARE	Intel Corporation	Obsolete	INTEL CORP	0.93 V	5.66				250VAC/DC	Bag	活跃	588	BGA,	网格排列	-55°C ~ 125°C	Tray	8071, Kyocera			Discontinued at Digi-Key		-		Receptacle, Female Sockets			55					-		8542.39.00.01			1 A	0.079 (2.00mm)		BOTTOM	BALL		1 mm		All	compliant		-		S-PBGA-B1517								INDUSTRIAL				-	1.5GHz	256KB			Dual ARM® Cortex®-A9 MPCore™ with CoreSight™		DMA, POR, WDT				EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		3.5 mm	现场可编程门阵列								-	FPGA - 660K Logic Elements				--		-			40 mm	40 mm		-
10AS057K3F40E2SG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	2512 (6432 Metric)	YES	2512	1517	Arria 10 SoC	Details	2 x 32 kB	-	Stackpole Electronics Inc	BGA,	网格排列	PLASTIC/EPOXY	0.9 V	0.87 V	100 °C	有	10AS057K3F40E2SG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.45					Tape & Reel (TR)	活跃	696	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	570000 LE	21	SMD/SMT	71250 LAB	965069	Intel	Intel / Altera	-55°C ~ 155°C	Tray	RMCF	0.248 L x 0.126 W (6.30mm x 3.20mm)	±1%	活跃	2		±400ppm/°C			7.32 Ohms				厚膜			1W	8542.39.00.01		SOC - Systems on a Chip				BOTTOM	BALL		1 mm			compliant				S-PBGA-B1517					-			OTHER					1.5GHz	256KB			Dual ARM® Cortex®-A9 MPCore™ with CoreSight™		DMA, POR, WDT			-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		3.5 mm	现场可编程门阵列		SoC FPGA							FPGA - 570K Logic Elements			2 Core	--		Automotive AEC-Q200	SoC FPGA	0.028 (0.70mm)	40 mm	40 mm				AEC-Q200
10AS066K1F35E1SG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1152-BBGA, FCBGA	YES	1152-FBGA (35x35)	1152	Broadcom Limited	35 X 35 MM, ROHS COMPLIANT, FBGA-1152	网格排列	PLASTIC/EPOXY	0.9 V	0.87 V	100 °C	有	10AS066K1F35E1SG	BGA	SQUARE	Intel Corporation	Obsolete	INTEL CORP	0.93 V	5.66					Bulk	QL3P41	Obsolete	396	0°C ~ 100°C (TJ)	Tray	-			Discontinued at Digi-Key														8542.39.00.01						BOTTOM	BALL		1 mm			compliant				S-PBGA-B1152								OTHER					1.5GHz	256KB			Dual ARM® Cortex®-A9 MPCore™ with CoreSight™		DMA, POR, WDT				EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		3.5 mm	现场可编程门阵列									FPGA - 660K Logic Elements				--					35 mm	35 mm
1SX250LU2F50I2LG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	表面贴装	52-TQFP	52-TQFP (10x10)	Rohm Semiconductor	34	Bulk	ML620Q156	A/D 12x10b SAR	最后一次购买						-40°C ~ 105°C (TA)	Tray	-			活跃																																							External, Internal				8.4MHz	2K x 8		1.8V ~ 5.5V	nX-U16/100		POR, PWM, WDT	FLASH	16-Bit	64KB (32K x 16)	I²C, SSP, UART/USART	MCU, FPGA							2K x 8					FPGA - 2500K Logic Elements				--
10AS048H3F34I2LG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	0603 (1608 Metric)	YES	0603	1152	SMD/SMT	60000 LAB	965303	Intel	Intel / Altera	Arria 10 SoC	Details	2 x 32 kB	KOA Speer Electronics, Inc.	-	BGA, BGA1152,34X34,40	网格排列	PLASTIC/EPOXY	BGA1152,34X34,40	-40 °C	0.9 V	未说明	0.87 V	100 °C	有	10AS048H3F34I2LG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.47					Tape & Reel (TR)	SG731J	活跃	492	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	480000 LE	1	-55°C ~ 155°C	Tray	SG73	0.063 L x 0.031 W (1.60mm x 0.80mm)	±20%	活跃	2		±200ppm/°C			18 Ohms				厚膜			0.1W, 1/10W	8542.39.00.01		SOC - Systems on a Chip			CMOS	BOTTOM	BALL	未说明	1 mm			compliant				S-PBGA-B1152	492	不合格			-		0.9 V	INDUSTRIAL					1.5GHz	256KB			Dual ARM® Cortex®-A9 MPCore™ with CoreSight™		DMA, POR, WDT			-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	492	3.65 mm	现场可编程门阵列		SoC FPGA							FPGA - 480K Logic Elements		480000	2 Core	--		Automotive AEC-Q200, Moisture Resistant, Pulse Withstanding	SoC FPGA	0.022 (0.55mm)	35 mm	35 mm	AEC-Q200
XCVC1702-2LLEVSVA2197	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	2197-BFBGA, FCBGA	2197-FCBGA (45x45)	AMD	有	608	Tray	活跃							0°C ~ 100°C (TJ)		Versal™ AI Core																																														450MHz, 1.08GHz	-			Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™		DDR, DMA, PCIe				CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA												Versal™ AI Core FPGA, 1M Logic Cells				-
XCVM1802-2LLIVSVA2197	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	2197-BFBGA, FCBGA	2197-FCBGA (45x45)	AMD	有	648	Tray	活跃							-40°C ~ 100°C (TJ)		Versal™ Prime																																														450MHz, 1.08GHz	256KB			Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™		DDR, DMA, PCIe				CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA												Versal™ Prime FPGA, 1.9M Logic Cells				-
XC7Z007S-2CLG225E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	225-LFBGA, CSPBGA	225-CSPBGA (13x13)	AMD	54	Tray	XC7Z007	活跃							-	-	Whip	1	磁性安装	460 MHz	TE Connectivity	TE Connectivity / Laird External Antennas	UHF	-	0°C ~ 100°C (TJ)		QW								无源天线						Mobile Antennas					Antennas								带底座的直线型					-														766MHz	256KB			Single ARM® Cortex®-A9 MPCore™ with CoreSight™		DMA				CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					GPS Antennas - GNSS, GLONASS, Galileo, Beidou	Unity						Artix™-7 FPGA, 23K Logic Cells	1 Band			-	室外天线		Antennas		6 in
AGFB008R24C3E4X	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	ITT Cannon	576	Tray	活跃							1	ITT Cannon	0°C ~ 100°C (TJ)		KPT																			D-Sub Connectors																											1.4GHz	256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point		DMA, WDT				EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA					D-Sub Connectors - Standard Density							FPGA - 764K Logic Elements				-			D-Sub Standard Connectors
AGFB006R24C2E1V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	0.001429 oz	1800	PCB 安装	TT Electronics	Welwyn Components / TT Electronics	576	Tray	活跃							2512	6432	0°C ~ 100°C (TJ)	Reel	PWC																			Resistors			厚膜																								1.4GHz	256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point		DMA, WDT				EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA					厚膜电阻器							FPGA - 573K Logic Elements				-		-	Thick Film Resistors - SMD
AGFA019R25A2E2V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel							3000	KYOCERA AVX	KYOCERA AVX	Accu-L	Details	480	Tray	活跃	0°C ~ 100°C (TJ)	Reel	0603, 0805																			Inductors, Chokes & Coils													SMD/SMT														1.4GHz	256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point		DMA, WDT				EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA					固定电感器							FPGA - 1.9M Logic Elements				-	射频电感器		RF Inductors - SMD
AGFB012R24B2E2V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Cable	-	-	Intel	Tray	活跃	3	Intel	Intel						Non-Compliant	768	0°C ~ 100°C (TJ)	Tray	Agilex F																																														1.4GHz	256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point		DMA, WDT				EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA											FPGA - 1.2M Logic Elements				-			Intel