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类别是'category.片上系统（SoC）' (7695)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 包装/外壳 | 表面安装 | 供应商器件包装 | 终端数量 | 端子材料 | 厂商 | 操作温度 | 系列 | JESD-609代码 | 无铅代码 | 类型 | 端子表面处理 | HTS代码 | 子类别 | 技术 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 端子间距 | Reach合规守则 | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 电源 | 温度等级 | 速度 | 内存大小 | 核心处理器 | 周边设备 | 连接方式 | 建筑学 | 输入数量 | 座位高度-最大 | 可编程逻辑类型 | 端子类型 | 剥线长度 | 线缆规格（AWG） | 主要属性 | 逻辑单元数 | 闪光大小 | 绝缘的 | 长度 | 宽度 | |||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | XCVM1802-2LLEVSVD1760 | AMD | 数据表 | 645 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | Tray | 活跃 | 726 | 0°C ~ 100°C (TJ) | Versal™ Prime | 450MHz, 1.08GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU42DR-1FSVE1156I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | Tray | 活跃 | 366 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 489K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVM1402-2MLEVSVD1760 | AMD | 数据表 | 647 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | Tray | 活跃 | 726 | 0°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.4GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVM1302-2MLEVSVD1760 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | Tray | 活跃 | 402 | 0°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.4GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU1EG-L1UBVA494I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 494-WFBGA, FCBGA | 494-FCBGA (14x14) | AMD | Tray | 活跃 | 82 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | MPU, FPGA | Zynq®UltraScale+™ FPGA, 81K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVE1752-1LSIVSVA2197 | AMD | 数据表 | 710 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD | Tray | 活跃 | 608 | -40°C ~ 100°C (TJ) | Versal™ AI Core | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVC1502-1LSIVSVA1596 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1596-BFBGA | 1596-BGA (37.5x37.5) | AMD | Tray | 活跃 | 478 | -40°C ~ 100°C (TJ) | Versal™ AI Core | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 80k Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVC1502-1LSINSVG1369 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1369-BFBGA | 1369-BGA (35x35) | AMD | Tray | 活跃 | 478 | -40°C ~ 100°C (TJ) | Versal™ AI Core | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 80k Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVM1802-1MLIVFVC1760 | AMD | 数据表 | 859 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | Tray | 活跃 | 500 | -40°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU2EG-1UBVA530I | AMD | 数据表 | 2455 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 530-WFBGA, FCBGA | 530-FCBGA (16x9.5) | AMD | Tray | 活跃 | 82 | -40°C ~ 100°C (TJ) | - | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVM1302-2MLIVSVD1760 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | Tray | 活跃 | 402 | -40°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.4GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU65DR-1FFVE1156I | AMD | 数据表 | 713 In Stock |
- | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVM1802-1LLIVFVC1760 | AMD | 数据表 | 930 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | Tray | 活跃 | 500 | -40°C ~ 100°C (TJ) | Versal™ Prime | 400MHz, 1GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVC1902-1MLIVIVA1596 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1596-BFBGA, FCBGA | 1596-FCBGA (40x40) | AMD | Tray | 活跃 | 500 | -40°C ~ 100°C (TJ) | Versal™ AI Core | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVM1402-2MSINSVF1369 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1369-BFBGA | 1369-BGA (35x35) | AMD | Tray | 活跃 | 424 | -40°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.4GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVC1902-1MSEVSVA2197 | AMD | 数据表 | 997 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD | Tray | 活跃 | 770 | 0°C ~ 100°C (TJ) | Versal™ AI Core | Adaptive Compute Acc | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVC1902-2MSEVIVA1596 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1596-BFBGA, FCBGA | 1596-FCBGA (40x40) | AMD | Tray | 活跃 | 500 | 0°C ~ 100°C (TJ) | Versal™ AI Core | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| BCM47622A1KFEBG | Broadcom | 数据表 | 10000 In Stock |
- | 最小起订量: 1 最小包装量: 1 | - | - | Aluminum | Broadcom Limited | ES4W8W | Side A 4 AWG, Side B 8 AWG | Burndy | Nylon | - | Tray | 活跃 | - | - | 1.5GHz | - | ARM® Cortex®-A7 | DDR3, DDR4, LED | Ethernet, I²C, PCIe, SPI, UART/USART, USB, Wifi | MPU | Splice Reducer | 0.88 | 4 AWG, 8 AWG | - | - | Insulated | ||||||||||||||||||||||||||||||||||||||||||||||
| M2S050S-1VF400I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S100T-FC1152 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1152 | 未说明 | 1.14 V | 85 °C | 无 | M2S100T-FC1152 | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.26 V | 5.86 | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | 1.2 V | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1152 | 574 | 不合格 | 1.2 V | OTHER | 574 | 2.9 mm | 现场可编程门阵列 | 99512 | 35 mm | 35 mm | |||||||||||||||||||||||||||||||
| M2S090S-1FG676I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 676 | 1.14 V | 无 | M2S090S-1FG676I | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.26 V | 5.83 | BGA | BGA, | 网格排列 | PLASTIC/EPOXY | 1.2 V | 未说明 | 无 | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1 mm | compliant | 676 | S-PBGA-B676 | 2.44 mm | 现场可编程门阵列 | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||||||||||
| M2S090S-1FGG484I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S100T-FCG1152 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1152 | BGA1152,34X34,40 | 1.2 V | 未说明 | 1.14 V | 85 °C | 有 | M2S100T-FCG1152 | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.26 V | 5.8 | 35 X 35 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-1152 | 网格排列 | 4 | PLASTIC/EPOXY | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1152 | 574 | 不合格 | 1.2 V | OTHER | 574 | 2.9 mm | 现场可编程门阵列 | 99512 | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||
| M2S010T-1FGG484M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 484-BGA | 484-FPBGA (23x23) | 微芯片技术 | 233 | Tray | M2S010 | 活跃 | -55°C ~ 125°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 10K Logic Modules | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M2S100T-1FCG1152 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1152 | BGA1152,34X34,40 | 1.2 V | 未说明 | 1.14 V | 85 °C | 有 | M2S100T-1FCG1152 | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.26 V | 5.8 | BGA, BGA1152,34X34,40 | 网格排列 | 4 | PLASTIC/EPOXY | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1152 | 574 | 不合格 | 1.2 V | OTHER | 574 | 2.9 mm | 现场可编程门阵列 | 99512 | 35 mm | 35 mm |
-
XCVM1802-2LLEVSVD1760
AMD
分类:Embedded - System On Chip (SoC)
100,646.556388
-
XCZU42DR-1FSVE1156I
AMD
分类:Embedded - System On Chip (SoC)
-
XCVM1402-2MLEVSVD1760
AMD
分类:Embedded - System On Chip (SoC)
56,117.984364
-
XCVM1302-2MLEVSVD1760
AMD
分类:Embedded - System On Chip (SoC)
-
XCZU1EG-L1UBVA494I
AMD
分类:Embedded - System On Chip (SoC)
-
XCVE1752-1LSIVSVA2197
AMD
分类:Embedded - System On Chip (SoC)
162,007.370138
-
XCVC1502-1LSIVSVA1596
AMD
分类:Embedded - System On Chip (SoC)
-
XCVC1502-1LSINSVG1369
AMD
分类:Embedded - System On Chip (SoC)
-
XCVM1802-1MLIVFVC1760
AMD
分类:Embedded - System On Chip (SoC)
80,873.599827
-
XCZU2EG-1UBVA530I
AMD
分类:Embedded - System On Chip (SoC)
3,115.897185
-
XCVM1302-2MLIVSVD1760
AMD
分类:Embedded - System On Chip (SoC)
-
XCZU65DR-1FFVE1156I
AMD
分类:Embedded - System On Chip (SoC)
108,215.152197
-
XCVM1802-1LLIVFVC1760
AMD
分类:Embedded - System On Chip (SoC)
97,051.473374
-
XCVC1902-1MLIVIVA1596
AMD
分类:Embedded - System On Chip (SoC)
-
XCVM1402-2MSINSVF1369
AMD
分类:Embedded - System On Chip (SoC)
-
XCVC1902-1MSEVSVA2197
AMD
分类:Embedded - System On Chip (SoC)
150,102.599645
-
XCVC1902-2MSEVIVA1596
AMD
分类:Embedded - System On Chip (SoC)
-
BCM47622A1KFEBG
Broadcom
分类:Embedded - System On Chip (SoC)
259.650638
-
M2S050S-1VF400I
Microchip
分类:Embedded - System On Chip (SoC)
-
M2S100T-FC1152
Microchip
分类:Embedded - System On Chip (SoC)
-
M2S090S-1FG676I
Microchip
分类:Embedded - System On Chip (SoC)
-
M2S090S-1FGG484I
Microchip
分类:Embedded - System On Chip (SoC)
-
M2S100T-FCG1152
Microchip
分类:Embedded - System On Chip (SoC)
-
M2S010T-1FGG484M
Microchip
分类:Embedded - System On Chip (SoC)
-
M2S100T-1FCG1152
Microchip
分类:Embedded - System On Chip (SoC)