类别是'category.片上系统(SoC)' (7695)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 终端数量 | 厂商 | Voltage-Input | 操作温度 | 包装 | 系列 | 尺寸/尺寸 | 容差 | 零件状态 | 终止次数 | 温度系数 | 电阻 | 最高工作温度 | 最小工作温度 | 组成 | 应用 | 功率(瓦特) | HTS代码 | 电容量 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 频率 | 基本部件号 | JESD-30代码 | 功能 | 输出的数量 | 资历状况 | 审批机构 | 效率 | 工作电源电压 | 失败率 | 引线间距 | 电源 | 温度等级 | 界面 | 内存大小 | 极化 | 最大输出电流 | 速度 | 内存大小 | 引线样式 | 核心处理器 | 周边设备 | 程序内存大小 | 连接方式 | 输入类型 | 电压 - 输出 | 建筑学 | 输入数量 | 座位高度-最大 | 可编程逻辑类型 | 逻辑元件/单元数 | 产品类别 | 核心架构 | 表格 | 使用地区 | 线长 | 输入连接器 | 输出连接器 | 收发器数量 | 无负载功耗 | 主要属性 | 逻辑单元数 | 核数量 | 闪光大小 | 抽头/步数 | 独立延误次数 | 第一拍延迟 | 可用总延误 | 特征 | 触点增量 | 产品类别 | 座位高度(最大) | 长度 | 宽度 | 厚度(最大) | 评级结果 | ||||||||||||||||||||||||||||||||||||||||
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![]() | XCZU25DR-1FFVE1156I | Xilinx | 数据表 | 752 In Stock | - | 最小起订量: 1 最小包装量: 1 | Tray | * | 活跃 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU27DR-L2FSVG1517I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Tray | * | 活跃 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA023R25A1I1V | Intel | 数据表 | 569 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | 8-uMAX/uSOP | Analog Devices Inc./Maxim Integrated | Tube | DS1100 | Obsolete | 480 | -40°C ~ 85°C | - | 4.75V ~ 5.25V | Nonprogrammable | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | - | 5 | 1 | 100ns | 500ns | 100 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFC019R25A2I3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 0402 (1005 Metric) | 0402 | KOA Speer Electronics, Inc. | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | RN73H1E | 活跃 | 480 | -55°C ~ 155°C | RN73H | 0.039 L x 0.020 W (1.00mm x 0.50mm) | ±0.5% | 2 | ±50ppm/°C | 10.1 Ohms | Metal Film | 0.063W, 1/16W | - | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | - | Automotive AEC-Q200, Moisture Resistant | 0.016 (0.40mm) | AEC-Q200 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS022E3F29E1HG | ALTERA | 数据表 | 730 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 780-BBGA, FCBGA | 780-FBGA (29x29) | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | - | 有 | 10AS022E3F29E1HG | 活跃 | INTEL CORP | 5.67 | 288 | 有 | 2 x 32 kB | 1.2 GHz | 220000 LE | + 100 C | 0 C | 36 | SMD/SMT | 27500 LAB | 973472 | Intel | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | 活跃 | SOC - Systems on a Chip | unknown | 950 mV | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | 12 Transceiver | FPGA - 220K Logic Elements | 2 Core | -- | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS057H2F34I2SG | ALTERA | 数据表 | 850 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 1152 | 121024 | 活跃 | 492 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 570000 LE | 24 | SMD/SMT | Molex | 71250 LAB | 965012 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | - | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | -40 °C | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS057H2F34I2SG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.45 | Bulk | -40°C ~ 100°C (TJ) | Tray | * | 活跃 | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1152 | 492 | 不合格 | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 492 | 3.65 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 570K Logic Elements | 570000 | 2 Core | -- | SoC FPGA | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS048K4F35I3LG | ALTERA | 数据表 | 972 In Stock |
- | 最小起订量: 1 最小包装量: 1 | YES | - | 1152 | Advantech Corp | SQUARE | Intel Corporation | 活跃 | INTEL CORP | 0.93 V | 5.47 | Bulk | Obsolete | 396 | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | -40 °C | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS048K4F35I3LG | BGA | 230VAC | - | Tray | - | 2.39 L x 2.01 W x 1.55 H (60.7mm x 51.1mm x 39.4mm) | 活跃 | ITE (Commercial) | 6 W | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1152 | 396 | 不合格 | CE, TUVgs | - | 0.9 V | INDUSTRIAL | Positive Tip, Negative Sleeve | 500mA | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 固定刀片 | 12V | MCU, FPGA | 396 | 3.5 mm | 现场可编程门阵列 | Wall Mount (Class II) | Europe | 72 (1.83m) | CEE 7/16 | Phono Plug, 2.5mm O.D. x 11.5mm | - | FPGA - 480K Logic Elements | 480000 | -- | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS048K3F35I2SG | ALTERA | 数据表 | 644 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Axial | YES | Axial | 1152 | RNC60 | 活跃 | 396 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 480000 LE | 1 | SMD/SMT | Vishay Dale | 60000 LAB | 965306 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | - | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | -40 °C | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS048K3F35I2SG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.47 | Tape & Reel (TR) | -65°C ~ 175°C | Tray | Military, MIL-PRF-55182/03, RNC60 | 0.097 Dia x 0.280 L (2.46mm x 7.11mm) | ±0.1% | 活跃 | 2 | ±50ppm/°C | 124 Ohms | Metal Film | 0.25W, 1/4W | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1152 | 396 | 不合格 | M (1%) | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 396 | 3.5 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 480K Logic Elements | 480000 | 2 Core | -- | Military, Moisture Resistant, Weldable | SoC FPGA | - | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS066K3F35E2LG | ALTERA | 数据表 | 746 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 0805 (2012 Metric) | YES | 0805 | 1152 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 660000 LE | 24 | SMD/SMT | 82500 LAB | Stackpole Electronics Inc | 965076 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | - | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS066K3F35E2LG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.46 | 活跃 | Tape & Reel (TR) | 396 | -55°C ~ 155°C | Tray | RNCS | 0.079 L x 0.049 W (2.00mm x 1.25mm) | ±0.1% | 活跃 | 2 | ±50ppm/°C | 15.4 kOhms | Thin Film | 0.1W, 1/10W | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1152 | 396 | 不合格 | - | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 396 | 3.5 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 660K Logic Elements | 660000 | 2 Core | -- | Anti-Corrosive, Automotive AEC-Q200, Moisture Resistant | SoC FPGA | 0.026 (0.65mm) | 35 mm | 35 mm | AEC-Q200 | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVP1202-2MLEVSVA2785 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Surface Mount, MLCC | 0805 (2012 Metric) | Vishay Vitramon | Tape & Reel (TR) | Obsolete | 50V | -55°C ~ 150°C | GA | 0.079 L x 0.049 W (2.00mm x 1.25mm) | ±0.1pF | C0G, NP0 | 汽车 | 3.3 pF | - | - | - | Epoxy Mountable, High Temperature | - | 0.057 (1.45mm) | AEC-Q200 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS027H4F34E3SG | ALTERA | 数据表 | 729 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FBGA-1152 | 384 | 有 | 2 x 32 kB | 1.2 GHz | 270000 LE | 1.784333 oz | 1 | SMD/SMT | 33750 LAB | 965051 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | - | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | 活跃 | SOC - Systems on a Chip | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | FPGA - 270K Logic Elements | 2 Core | -- | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5CSEMA4U23C6N | ALTERA | 数据表 | 2422 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 672-FBGA | 484 | 672-UBGA (23x23) | MCU - 181, FPGA - 145 | Compliant | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SE | 活跃 | 85 °C | 0 °C | 925 MHz | 5CSEMA4 | 1.1 V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 2.9 MB | 925MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 40000 | ARM | FPGA - 40K Logic Elements | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS066N3F40I2SGES | ALTERA | 数据表 | 24 In Stock | - | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | YES | 1517-FCBGA (40x40) | 1517 | BGA, | 网格排列 | PLASTIC/EPOXY | -40 °C | 0.9 V | 0.87 V | 100 °C | 10AS066N3F40I2SGES | BGA | SQUARE | Intel Corporation | Obsolete | INTEL CORP | 0.93 V | 5.66 | 588 | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | Discontinued at Digi-Key | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1517 | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3.5 mm | 现场可编程门阵列 | FPGA - 660K Logic Elements | -- | 40 mm | 40 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1502-2MSINSVG1369 | AMD | 数据表 | 659 In Stock |
- | 最小起订量: 1 最小包装量: 1 | AMD | 478 | Tray | 活跃 | Versal™ AI Core | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 800k Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGIB022R31B2E3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 720 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Agilex I | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS460TS-FC1152M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | 1152-FCBGA (35x35) | 微芯片技术 | 1 | Microchip | 微芯片技术 | MCU - 136, FPGA - 468 | Tray | 活跃 | Tray | PolarFire™ | SOC - Systems on a Chip | - | 3.95MB | RISC-V | DMA, PCI, PWM | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 461K Logic Modules | 128kB | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 1SX040HH3F35E3XG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | Intel | 374 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Stratix® 10 SX | 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 400K Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVE1752-2MLINSVG1369 | AMD | 数据表 | 870 In Stock |
- | 最小起订量: 1 最小包装量: 1 | AMD | 500 | Tray | 活跃 | Versal™ AI Core | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7Z045-2FFG676E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 676-BBGA, FCBGA | 676-FCBGA (27x27) | AMD | 130 | Tray | XC7Z045 | 活跃 | 0°C ~ 100°C (TJ) | Zynq®-7000 | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 350K Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS250T-1FCG1152E | Microchip | 数据表 | 2413 In Stock |
- | 最小起订量: 1 最小包装量: 1 | BGA-1152 | 1152-FCBGA (35x35) | 微芯片技术 | 有 | This product may require additional documentation to export from the United States. | 16 kB, 4 x 32 kB | 667 MHz, 667 MHz | 254000 LE | 372 I/O | + 100 C | 0 C | 1 | SMD/SMT | Microchip | Microchip Technology / Atmel | 4 x 32 kB | - | Tray | 活跃 | 0°C ~ 100°C | Tray | PolarFire™ | SOC - Systems on a Chip | 1 V | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 254K Logic Modules | 5 Core | 128kB | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS250T-FCVG784E | Microchip | 数据表 | 2518 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FCVG-784 | 784-FCBGA (23x23) | 微芯片技术 | This product may require additional documentation to export from the United States. | 16 kB, 4 x 32 kB | 667 MHz, 667 MHz | 254000 LE | 372 I/O | + 100 C | 0 C | 1 | SMD/SMT | Microchip | Microchip Technology / Atmel | 4 x 32 kB | - | Tray | 活跃 | 0°C ~ 100°C | Tray | PolarFire™ | SOC - Systems on a Chip | 1 V | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 254K Logic Modules | 5 Core | 128kB | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS250T-FCG1152E | Microchip | 数据表 | 2415 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FCG-1152 | 1152-FCBGA (35x35) | 微芯片技术 | 有 | This product may require additional documentation to export from the United States. | 16 kB, 4 x 32 kB | 667 MHz, 667 MHz | 254000 LE | 372 I/O | + 100 C | 0 C | 1 | SMD/SMT | Microchip | Microchip Technology / Atmel | 4 x 32 kB | - | Tray | 活跃 | 0°C ~ 100°C | Tray | PolarFire™ | SOC - Systems on a Chip | 1 V | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 254K Logic Modules | 5 Core | 128kB | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS460T-FCG1152E | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | 4 x 32 kB | Microchip Technology / Atmel | Microchip | SMD/SMT | 1 | 0 C | + 100 C | 468 I/O | 461000 LE | 667 MHz, 667 MHz | 16 kB, 4 x 32 kB | This product may require additional documentation to export from the United States. | Tray | SOC - Systems on a Chip | - | 5 Core | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS250T-FCG1152I | Microchip | 数据表 | 2972 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FCG-1152 | 1152-FCBGA (35x35) | 微芯片技术 | 有 | This product may require additional documentation to export from the United States. | 16 kB, 4 x 32 kB | 667 MHz, 667 MHz | 254000 LE | 372 I/O | + 100 C | 0 C | 1 | SMD/SMT | Microchip | Microchip Technology / Atmel | 4 x 32 kB | - | Tray | 活跃 | -40°C ~ 100°C | Tray | PolarFire™ | SOC - Systems on a Chip | 1 V | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 254K Logic Modules | 5 Core | 128kB | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7Z007S-1CLG400I | AMD | 数据表 | 70 In Stock | - | 最小起订量: 1 最小包装量: 1 | 400-LFBGA, CSPBGA | 400-CSPBGA (17x17) | AMD | 100 | Tray | XC7Z007 | 活跃 | -40°C ~ 100°C (TJ) | Zynq®-7000 | 667MHz | 256KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Artix™-7 FPGA, 23K Logic Cells | - |
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