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产品型号	品牌	数据表	库存	价格(含增值税)	数量	生命周期状态	触点镀层	底架	包装/外壳	表面安装	引脚数	供应商器件包装	材料	房屋材料	质量	终端数量																			厂商																																					操作温度	包装	系列	JESD-609代码	零件状态	终端	ECCN 代码	连接器类型	类型	定位的数量	端子表面处理	最高工作温度	最小工作温度	颜色	性别	HTS代码	紧固类型	子类别	额定功率	技术	端子位置	方向	终端形式	屏蔽/屏蔽	峰值回流焊温度（摄氏度）	端子间距	深度	Reach合规守则	时间@峰值回流温度-最大值(s)	基本部件号	终端样式	JESD-30代码	输出的数量	资历状况	执行器类型	效率	输出电压	房屋颜色	工作电源电压	电源	温度等级	配置	端口的数量	速度	内存大小	输出电流	核心处理器	极数	视角	周边设备	程序内存大小	连接方式	输出功率	电压 - 输出 2	输入数量	组织结构	电流-输出1	工作温度范围	照明颜色
XCZU46DR-2FFVH1760I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BBGA, FCBGA	1760-FCBGA (42.5x42.5)	AMD 赛灵思						5	Positronic	Amphenol Positronic	574	Tray	活跃					-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ RFSoC															D-Sub Connectors																									533MHz, 1.333GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™			DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MCU, FPGA							Mixed Contact D-Sub Connectors								Zynq®UltraScale+™ FPGA, 930K+ Logic Cells							-							D-Sub Mixed Contact Connectors
AGFA008R24C2I3V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel						1	Advanced Energy	Advanced Energy	576	Tray	活跃					-40°C ~ 100°C (TJ)		Agilex F															DC-DC Converter																									1.4GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point			DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MPU, FPGA							Non-Isolated DC-DC Converters								FPGA - 764K Logic Elements							-							Non-Isolated DC/DC Converters
AGFB006R16A2E3V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Gold	-	-	Thermoplastic polyester	Intel	450	0 C	+ 70 C	384	Tray	活跃								Amphenol Commercial Products	Amphenol	磷青铜	8P8C	0°C ~ 100°C (TJ)	Tray	Agilex F						磁性千斤顶					Black	Jack (Female)			Modular Connectors / Ethernet Connectors						Shielded						焊针											1x1	1 Port	1.4GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point			DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MPU, FPGA							Modular Connectors / Ethernet Connectors		0 C to + 70 C						FPGA - 573K Logic Elements							-		Connectors	直角			RJ45	Modular Connectors / Ethernet Connectors					UL 94V-0
10AS016E4F27E3LG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	672-BBGA, FCBGA	YES	672-FBGA (27x27)	672	网格排列	PLASTIC/EPOXY		BGA672,26X26,40	0.9 V	未说明	0.87 V	100 °C	有	10AS016E4F27E3LG	BGA	SQUARE	活跃	FPGA - Field Programmable Gate Array Arria 10 SX 160 SoC FPGA	INTEL CORP	0.93 V	1.96								Non-Compliant	240	有	2 x 32 kB	1.2 GHz	160000 LE	1	SMD/SMT	20000 LAB	964735	Intel	Intel / Altera	Arria 10 SoC	2 x 32 kB	-	BGA, BGA672,26X26,40	0°C ~ 100°C (TJ)	Tray	Arria 10 SX		活跃										8542.39.00.01		SOC - Systems on a Chip		CMOS	BOTTOM		BALL		未说明	1 mm		compliant				S-PBGA-B672	240	不合格						0.9 V	OTHER			1.5GHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™			DMA, POR, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MCU, FPGA	240			3.25 mm	现场可编程门阵列		SoC FPGA								FPGA - 160K Logic Elements					160000	2 Core	--			SoC FPGA	27 mm	27 mm
XCZU2CG-2SFVA625I	AMD	数据表	625 In Stock	-	最小起订量: 1 最小包装量: 1	Gold	Flanges, Panel, Through Hole	625-BFBGA, FCBGA	23	625-FCBGA (21x21)	AMD	Compliant	180	Tray	XCZU2	活跃							-40°C ~ 100°C (TJ)	Bulk	Zynq® UltraScale+™ MPSoC CG			Solder		Receptacle		19		175 °C	-65 °C				Threaded																										533MHz, 1.3GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™			DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MCU, FPGA															Zynq®UltraScale+™ FPGA, 103K+ Logic Cells							-				Shielded									抗环境干扰
AGIB027R29A1E2VR3	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Metal	Intel						Non-Compliant	720	Tray	活跃	1	Intel	Intel				0°C ~ 100°C (TJ)	Tray	Agilex I																			Straight																					1.4GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point			DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MPU, FPGA														FPGA - 2.7M Logic Elements							-							Intel
XCZU3EG-1SFVA625I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Panel	625-BFBGA, FCBGA	625-FCBGA (21x21)	230 g	AMD	Tray	XCZU3	活跃								5 V	Compliant	180	-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG									50 °C	0 °C						55 W								76.2 mm					3			70 %	12 V							500MHz, 600MHz, 1.2GHz	256KB	6 A	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2			DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	55 W	12 V	MCU, FPGA						6 A		-12 V							Zynq®UltraScale+™ FPGA, 154K+ Logic Cells		500 mA					-	500 mA								28.956 mm	127 mm	76.2 mm
M2S060TS-1VFG784I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	784-FBGA	784-VFBGA (23x23)	微芯片技术	Tray	活跃										-40°C ~ 100°C (TJ)		SmartFusion®2																																								166MHz			ARM® Cortex®-M3			DDR, PCIe, SERDES		CANbus, Ethernet, I²C, SPI, UART/USART, USB			MCU, FPGA															FPGA - 60K Logic Modules
AGIB019R18A2E3V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel						480	Tray	活跃					0°C ~ 100°C (TJ)		Agilex I																																								1.4GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point			DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MPU, FPGA															FPGA - 1.9M Logic Elements							-
A2F200M3F-1PQ208I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	208-BFQFP	208-PQFP (28x28)	微芯片技术	MCU - 22, FPGA - 66	Tray	A2F200	Obsolete										3-1191563-0	TE Connectivity	TE Connectivity	Details	-40°C ~ 100°C (TJ)		SmartFusion®																																								100MHz	64KB		ARM® Cortex®-M3			DMA, POR, WDT		EBI/EMI, Ethernet, I²C, SPI, UART/USART			MCU, FPGA							Hook-up Wire								ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops							256KB							Hook-up Wire
M2S150TS-1FCG1152M	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1152-BBGA, FCBGA	YES	1152-FCBGA (35x35)	1152	微芯片技术								1	Glenair	Glenair	574	Tray	M2S150	活跃	FBGA-1152	网格排列	4	PLASTIC/EPOXY	BGA1152,34X34,40	-55 °C	1.2 V	1.14 V	125 °C	有	M2S150TS-1FCG1152M	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.8	-55°C ~ 125°C (TJ)		SmartFusion®2	e1			3A001.A.2.C				Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01		D-Sub Connectors		CMOS	BOTTOM		BALL		250	1 mm		compliant	40			S-PBGA-B1152	574	不合格						1.2 V	MILITARY			166MHz	64KB		ARM® Cortex®-M3			DDR, PCIe, SERDES		CANbus, Ethernet, I²C, SPI, UART/USART, USB			MCU, FPGA	574			2.9 mm	现场可编程门阵列		Mixed Contact D-Sub Connectors								FPGA - 150K Logic Modules					146124		512KB							D-Sub Mixed Contact Connectors		35 mm	35 mm
M2S005-1TQ144	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Obsolete (Last Updated: 2 months ago)	144-LQFP	YES	144-TQFP (20x20)	144	微芯片技术						7-1617785-8	TE Connectivity	TE Connectivity	N	84	Tray	Obsolete	TQFP-144	FLATPACK, LOW PROFILE, FINE PITCH	3	PLASTIC/EPOXY	QFP144,.87SQ,20	1.2 V	30	1.14 V	85 °C	无	M2S005-1TQ144	LFQFP	SQUARE	Obsolete	MICROSEMI CORP	1.26 V	5.88		0°C ~ 85°C (TJ)		SmartFusion®2	e0							Tin/Lead (Sn/Pb)				8542.39.00.01		Relays		CMOS	QUAD		鸥翼		240	0.5 mm		not_compliant				S-PQFP-G144	84	不合格						1.2 V	OTHER			166MHz	64KB		ARM® Cortex®-M3			-		CANbus, Ethernet, I²C, SPI, UART/USART, USB			MCU, FPGA	84			1.6 mm	现场可编程门阵列		工业继电器								FPGA - 5K Logic Modules					6060		128KB		Military/Aerospace Relays					工业继电器		20 mm	20 mm
MPFS095TL-FCVG484E	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-BFBGA, FCBGA	484-FCBGA (19x19)	酚醛塑料，带铝嵌件	微芯片技术	0.248011 oz	25	5-1437624-3	TE Connectivity	TE Connectivity / P&B	Line on Top, Side and Skirt	Details	MCU - 136, FPGA - 276	Tray	活跃	16 kB, 4 x 32 kB	667 MHz, 667 MHz	93000 LE	+ 100 C	0 C	SMD/SMT	4 x 32 kB	-									White	0°C ~ 100°C		PKES						带裙边圆柱形旋钮					Black, Silver				Knobs & Dials																				1 V					-	857.6kB		RISC-V			DMA, PCI, PWM	-	CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG			MPU, FPGA							Knobs & Dials						Fluted		FPGA - 93K Logic Modules	26 mm					5 Core	128kB		Knobs		Top spun aluminum inlay, with skirt			Knobs & Dials	1/4 in	15 mm
MPFS095TL-FCVG484I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-BFBGA, FCBGA	484-FCBGA (19x19)	微芯片技术	4 x 32 kB	-										TE Connectivity	TE Connectivity	MCU - 136, FPGA - 276	Tray	活跃	16 kB, 4 x 32 kB	667 MHz, 667 MHz	93000 LE	+ 100 C	- 40 C	SMD/SMT	-40°C ~ 100°C		PolarFire®															Relays																				1 V					-	857.6kB		RISC-V			DMA, PCI, PWM	-	CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG			MPU, FPGA							工业继电器								FPGA - 93K Logic Modules						5 Core	128kB							工业继电器
MPFS160T-FCVG784I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	784-BFBGA, FCBGA	784-FCBGA (23x23)	Aluminum	微芯片技术	Details	MCU - 136, FPGA - 312	Tray	活跃	16 kB, 4 x 32 kB	667 MHz, 667 MHz	161000 LE	+ 100 C	0 C	SMD/SMT	4 x 32 kB	-									1	BIVAR	Bivar	-	630 nm	-40°C ~ 100°C	Tube	Coastline C5500 Linear															LED照明	10 W																		Black	1 V					-	1.4125MB		RISC-V		35 deg	DMA, PCI, PWM	-	CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG			MPU, FPGA							LED照明灯具			Red		390 lm		-	FPGA - 161K Logic Modules						5 Core	128kB		LED照明灯具			24 V		LED照明灯具		15.2 mm	609.6 mm	21.1 mm
MPFS250T-FCSG536E	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FCSG-536	536-LFBGA	微芯片技术	16 kB, 4 x 32 kB	667 MHz, 667 MHz	254000 LE	372 I/O	+ 100 C	0 C	SMD/SMT	4 x 32 kB	-	Tray	活跃										1	FCB-405-0628M	TE Connectivity	TE Connectivity	This product may require additional documentation to export from the United States.	0°C ~ 100°C	Tray	PolarFire™															Relays																				1 V					-	2.2MB		RISC-V			DMA, PCI, PWM	-	CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG			MPU, FPGA							通用继电器								FPGA - 254K Logic Modules						5 Core	128kB							通用继电器
MPFS025T-1FCSG325E	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	325-TFBGA	325-BGA (11x11)	微芯片技术	16 kB, 4 x 32 kB	667 MHz, 667 MHz	23000 LE	+ 100 C	0 C	SMD/SMT	4 x 32 kB	-										15	Amphenol	Amphenol Commercial Products	MCU - 136, FPGA - 108	Tray	活跃	MSL 3 - 168 hours	0°C ~ 100°C	Tray	-															I/O Connectors																				1 V					-	230.4KB		RISC-V			DMA, PCI, PWM	-	CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG			MPU, FPGA							I/O Connectors				1843.2Kbit				FPGA - 23K Logic Modules						5 Core	128KB							I/O Connectors
AGFB027R24C3I3V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	SOT-23-3	-	Intel	0.000176 oz	- 55 C	3000	SMD/SMT	Panjit	Panjit	2.4 V	Details	744	Tray	活跃										50 uA	100 Ohms	50 uA	200 mW	+ 150 C	-40°C ~ 100°C (TJ)	Reel	ZSM-02TA															Diodes & Rectifiers																							Single		1.4GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point			DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MPU, FPGA			5 mA				齐纳二极管								FPGA - 2.7M Logic Elements			50 uA				-							齐纳二极管		1 mm	2.2 mm	1.35 mm
5ASTMD3E3F31I3N	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	896-BBGA, FCBGA	YES	896-FBGA (31x31)	896	Non-Compliant	MCU - 208, FPGA - 250	BGA, BGA896,30X30,40	网格排列	PLASTIC/EPOXY	BGA896,30X30,40	-40 °C	1.15 V	未说明	1.12 V	100 °C	有	5ASTMD3E3F31I3N	BGA	SQUARE	Intel Corporation	生命周期结束	INTEL CORP		1.18 V	5.29								-40°C ~ 100°C (TJ)	Tray	Arria V ST	e1	活跃						Tin/Silver/Copper (Sn/Ag/Cu)					8542.39.00.01				BOTTOM		BALL		未说明	1 mm		compliant		5ASTMD3		S-PBGA-B896	540								INDUSTRIAL			1.05GHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™			DMA, POR, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MCU, FPGA	540	13207 CLBS		2.7 mm	现场可编程门阵列										FPGA - 350K Logic Elements				13207	350000		--										31 mm	31 mm
5CSEBA5U23C6N	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	672-FBGA	YES	672-UBGA (23x23)	672	GRID ARRAY, FINE PITCH	PLASTIC/EPOXY	BGA672,28X28,32	1.1 V	未说明	1.07 V	85 °C	有	5CSEBA5U23C6N	FBGA	SQUARE	Intel Corporation	活跃	FPGA - Field Programmable Gate Array Cyclone V SE dual -core ARM Cortex-A9	INTEL CORP	1.13 V		5.55								MCU - 181, FPGA - 145	FBGA, BGA672,28X28,32	0°C ~ 85°C (TJ)	Tray	Cyclone® V SE		活跃													现场可编程门阵列	CMOS	BOTTOM		BALL		未说明	0.8 mm		compliant		5CSEBA5		S-PBGA-B672	145	不合格						1.1,1.2/3.3,2.5 V	OTHER			925MHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™			DMA, POR, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MCU, FPGA	145			1.85 mm	现场可编程门阵列										FPGA - 85K Logic Elements					85000		--										23 mm	23 mm
XQZU1CG-2SFQC784I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Amphenol	Amphenol Aerospace	38999	Details												This product may require additional documentation to export from the United States.		1			D38999 III															Circular Connectors																																											军规圆形连接器																						军规圆形连接器
XQZU1EG-1SBQA484I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1												1	Amphenol		Amphenol Aerospace	38999	Details			D38999 III															Circular Connectors																																											军规圆形连接器																						军规圆形连接器
AGID023R18A2E3V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel						1	Advanced Energy	Advanced Energy	480	Tray	活跃					0°C ~ 100°C (TJ)		Agilex I															DC-DC Converter																									1.4GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point			DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MPU, FPGA							Non-Isolated DC-DC Converters								FPGA - 2.3M Logic Elements							-							Non-Isolated DC/DC Converters
XCVM1502-2MLINFVB1369	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	AMD						3	面板安装	Sensata	不发光	AIRPAX	N	478	Tray	活跃									Versal™ Prime															断路器												Hook Terminal				Toggle									600MHz, 1.4GHz	256KB		Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	2 Pole		DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MPU, FPGA														Versal™ Prime FPGA, 1M Logic Cells							-		电路保护器					断路器		32.53 mm	45.21 mm	39.67 mm
AGID019R18A2E3E	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	Tray										Non-Compliant	活跃	480	0°C ~ 100°C (TJ)		Agilex I																																								1.4GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point			DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MPU, FPGA															FPGA - 1.9M Logic Elements							-