我的订单
会员中心 
在线咨询
0755-83328606
类别是'category.片上系统（SoC）' (7695)
- 所有品牌
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 底架 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 端子表面处理 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 工作电源电流 | 速度 | 内存大小 | uPs/uCs/外围ICs类型 | 核心处理器 | 周边设备 | 连接方式 | 数据率 | 建筑学 | 输入数量 | 可编程逻辑类型 | 逻辑元件/单元数 | 核心架构 | 阀门数量 | 主要属性 | 逻辑单元数 | 闪光大小 | 座位高度(最大) | 长度 | 宽度 | RoHS状态 | 无铅 | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | AGIB027R31A2E2VB | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | 720 | 0°C ~ 100°C (TJ) | Tray | Agilex I | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | ||||||||||||||||||||||||||||||||||||||||||||||||
| AGFA023R31C3E3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | 480 | 0°C ~ 100°C (TJ) | Tray | Agilex F | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | ||||||||||||||||||||||||||||||||||||||||||||||||
| UPD63702AGF-3B9-A | Renesas Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Bulk | * | 活跃 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AGID019R18A2I1V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1805-BBGA Exposed Pad | 1805-BGA (42.5x42.5) | 480 | -40°C ~ 100°C (TJ) | Tray | Agilex I | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | ||||||||||||||||||||||||||||||||||||||||||||||||
| AGIB022R31A1E2VB | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | 720 | 0°C ~ 100°C (TJ) | Tray | Agilex I | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | ||||||||||||||||||||||||||||||||||||||||||||||||
| AGIB019R31B2E3V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | 480 | 0°C ~ 100°C (TJ) | Tray | Agilex I | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | ||||||||||||||||||||||||||||||||||||||||||||||||
| BCM11350KFEBG | Broadcom Limited | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Bulk | Obsolete | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AMA4B2KL-KXR | Ambiq Micro, Inc. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 131-VFBGA | 131-BGA (4.7x4.7) | 75 | AMA4B2KL | -20°C ~ 60°C | Tape & Reel (TR) | Apollo4 Blue Lite | 活跃 | 192MHz | 1.375MB | ARM® Cortex®-M4F | AES, Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | GPIO, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART | MCU | 2MB | |||||||||||||||||||||||||||||||||||||||||||||||
| AGIB019R31B2I3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | 480 | -40°C ~ 100°C (TJ) | Tray | Agilex I | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | ||||||||||||||||||||||||||||||||||||||||||||||||
| AGFB014R24D2E2V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2340-BFBGA Exposed Pad | 2340-BGA (45x42) | 0°C ~ 100°C (TJ) | Tray | Agilex F | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | |||||||||||||||||||||||||||||||||||||||||||||||||
 | 5CSEBA4U19I7LN | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 15 Weeks | 484-FBGA | MCU - 151, FPGA - 66 | -40°C~100°C TJ | Tray | 2018 | Cyclone® V SE | 活跃 | compliant | 925MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 现场可编程门阵列 | FPGA - 40K Logic Elements | |||||||||||||||||||||||||||||||||||||||||||||
| 5ASXFB5H4F40I3NES | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FBGA, FC (40x40) | MCU - 208, FPGA - 540 | -40°C~100°C TJ | Tray | Arria V SX | Obsolete | 3 (168 Hours) | 5ASXFB5 | 1.05GHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 462K Logic Elements | ||||||||||||||||||||||||||||||||||||||||||||||
| 1SX280LU3F50I2VG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 2397-BBGA, FCBGA | 704 | -40°C~100°C TJ | Tray | Stratix® 10 SX | 活跃 | 3 (168 Hours) | 1.5GHz | 256KB | 微处理器电路 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 2800K Logic Elements | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||
 | 10AS066H2F34E1HG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 1152-BBGA, FCBGA | 492 | 0°C~100°C TJ | Tray | Arria 10 SX | 活跃 | 3 (168 Hours) | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 660K Logic Elements | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||
| 10AS032H2F35E1HG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | 384 | 0°C~100°C TJ | Tray | Arria 10 SX | 活跃 | 3 (168 Hours) | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 320K Logic Elements | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||
| 10AS032H2F34E1HG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 1152-BBGA, FCBGA | 384 | 0°C~100°C TJ | Tray | Arria 10 SX | 活跃 | 3 (168 Hours) | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 320K Logic Elements | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||
| 10AS032H2F35I1HG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | 384 | -40°C~100°C TJ | Tray | Arria 10 SX | 活跃 | 3 (168 Hours) | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 320K Logic Elements | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||
 | 10AS048E2F29I1HG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 780-BBGA, FCBGA | 360 | -40°C~100°C TJ | Tray | Arria 10 SX | 活跃 | 3 (168 Hours) | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 480K Logic Elements | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||
 | 5CSEBA5U23C7SN | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 672-FBGA | YES | MCU - 181, FPGA - 145 | 0°C~85°C TJ | Tray | 2018 | Cyclone® V SE | 活跃 | 3 (168 Hours) | 672 | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.1V | 0.8mm | 未说明 | 5CSEBA5 | S-PBGA-B672 | 145 | 不合格 | 1.13V | 1.11.2/3.32.5V | 1.07V | 800MHz | 64KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | 现场可编程门阵列 | FPGA - 85K Logic Elements | 85000 | 1.85mm | 23mm | 23mm | 符合RoHS标准 | |||||||||||||||||||||||
| 5CSXFC6C6U23I7LN | Intel | 数据表 | 2596 In Stock | - | 最小起订量: 1 最小包装量: 1 | 15 Weeks | 672-FBGA | MCU - 181, FPGA - 145 | -40°C~100°C TJ | Tray | 2018 | Cyclone® V SX | 活跃 | compliant | 925MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 现场可编程门阵列 | FPGA - 110K Logic Elements | |||||||||||||||||||||||||||||||||||||||||||||
| BCM3383DUKFEBG | Broadcom Limited | 数据表 | 420 In Stock | - | 最小起订量: 1 最小包装量: 1 | 活跃 | 1 (Unlimited) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | A2F200M3F-FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2 Weeks | 484-BGA | YES | 484 | MCU - 41, FPGA - 94 | 0°C~85°C TJ | Tray | 2011 | SmartFusion® | e1 | 活跃 | 3 (168 Hours) | 484 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 250 | 1.5V | 1mm | 80MHz | 40 | A2F200 | 94 | 不合格 | 1.5V | 1.51.82.53.3V | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 1.575V | 1.425V | 4.5kB | 7mA | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | 400 kbps | MCU, FPGA | 现场可编程门阵列 | 2500 | ARM | 200000 | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 256KB | 2.44mm | 23mm | 23mm | 符合RoHS标准 | 无铅 | |||||||||||||
| BCM1125HA2K600 | Broadcom Limited | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | BGA | Obsolete | 1 (Unlimited) | 600MHz | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 1SX280LU3F50E2LG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2397-BBGA, FCBGA | 704 | 0°C~100°C TJ | Tray | Stratix® 10 SX | 活跃 | 3 (168 Hours) | 1.5GHz | 256KB | 微处理器电路 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 2800K Logic Elements | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||
| 1SX280LU2F50I2VG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 2397-BBGA, FCBGA | 704 | -40°C~100°C TJ | Tray | Stratix® 10 SX | 活跃 | 3 (168 Hours) | 1.5GHz | 256KB | 微处理器电路 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 2800K Logic Elements | 符合RoHS标准 |
-
AGIB027R31A2E2VB
Intel
分类:Embedded - System On Chip (SoC)
-
AGFA023R31C3E3E
Intel
分类:Embedded - System On Chip (SoC)
-
UPD63702AGF-3B9-A
Renesas Electronics Corporation
分类:Embedded - System On Chip (SoC)
-
AGID019R18A2I1V
Intel
分类:Embedded - System On Chip (SoC)
-
AGIB022R31A1E2VB
Intel
分类:Embedded - System On Chip (SoC)
-
AGIB019R31B2E3V
Intel
分类:Embedded - System On Chip (SoC)
-
BCM11350KFEBG
Broadcom Limited
分类:Embedded - System On Chip (SoC)
-
AMA4B2KL-KXR
Ambiq Micro, Inc.
分类:Embedded - System On Chip (SoC)
-
AGIB019R31B2I3E
Intel
分类:Embedded - System On Chip (SoC)
-
AGFB014R24D2E2V
Intel
分类:Embedded - System On Chip (SoC)
-
5CSEBA4U19I7LN
Intel
分类:Embedded - System On Chip (SoC)
-
5ASXFB5H4F40I3NES
Intel
分类:Embedded - System On Chip (SoC)
-
1SX280LU3F50I2VG
Intel
分类:Embedded - System On Chip (SoC)
-
10AS066H2F34E1HG
Intel
分类:Embedded - System On Chip (SoC)
-
10AS032H2F35E1HG
Intel
分类:Embedded - System On Chip (SoC)
-
10AS032H2F34E1HG
Intel
分类:Embedded - System On Chip (SoC)
-
10AS032H2F35I1HG
Intel
分类:Embedded - System On Chip (SoC)
-
10AS048E2F29I1HG
Intel
分类:Embedded - System On Chip (SoC)
-
5CSEBA5U23C7SN
Intel
分类:Embedded - System On Chip (SoC)
-
5CSXFC6C6U23I7LN
Intel
分类:Embedded - System On Chip (SoC)
-
BCM3383DUKFEBG
Broadcom Limited
分类:Embedded - System On Chip (SoC)
-
A2F200M3F-FGG484
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
-
BCM1125HA2K600
Broadcom Limited
分类:Embedded - System On Chip (SoC)
-
1SX280LU3F50E2LG
Intel
分类:Embedded - System On Chip (SoC)
-
1SX280LU2F50I2VG
Intel
分类:Embedded - System On Chip (SoC)