类别是'category.片上系统(SoC)' (7695)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 底架 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 工作电源电流 | 速度 | 内存大小 | 核心处理器 | 周边设备 | 连接方式 | 数据率 | 建筑学 | 输入数量 | 组织结构 | 可编程逻辑类型 | 逻辑元件/单元数 | 核心架构 | 阀门数量 | 逻辑块数(LABs) | 主要属性 | 逻辑单元数 | 等效门数 | 闪光大小 | 座位高度(最大) | 长度 | 宽度 | RoHS状态 | 无铅 | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | M2S050-1FCSG325I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 325-TFBGA, CSPBGA | YES | 200 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e3 | 活跃 | 3 (168 Hours) | 325 | 3A991.D | 哑光锡 | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 0.5mm | 未说明 | S-PBGA-B325 | 200 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 200 | 现场可编程门阵列 | FPGA - 50K Logic Modules | 56340 | 256KB | 1.01mm | 11mm | 11mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||
![]() | M2S025TS-1VF400I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 400-LFBGA | 400 | 400-VFBGA (17x17) | 207 | -40°C~100°C TJ | Tray | 2016 | SmartFusion®2 | 活跃 | 3 (168 Hours) | 100°C | -40°C | 166MHz | M2S025TS | CAN, Ethernet, I2C, SPI, UART, USART, USB | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | ARM | FPGA - 25K Logic Modules | 256KB | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||
![]() | M2S050T-FCSG325I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 325-TFBGA, CSPBGA | YES | 200 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e3 | 活跃 | 3 (168 Hours) | 325 | 哑光锡 | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 0.5mm | 未说明 | S-PBGA-B325 | 200 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 200 | 现场可编程门阵列 | FPGA - 50K Logic Modules | 56340 | 256KB | 1.01mm | 11mm | 11mm | 符合RoHS标准 | |||||||||||||||||||||||||
![]() | M2S060-FGG676 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 11 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 676-BGA | YES | 387 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e3 | 活跃 | 3 (168 Hours) | 676 | 哑光锡 | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 1mm | 未说明 | S-PBGA-B676 | 387 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 387 | 现场可编程门阵列 | FPGA - 60K Logic Modules | 56520 | 256KB | 2.44mm | 27mm | 27mm | 符合RoHS标准 | ||||||||||||||||||||||||||
![]() | M2S060TS-1FCS325 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 325-TFBGA, CSPBGA | YES | 200 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | 活跃 | 3 (168 Hours) | 325 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 0.5mm | not_compliant | 未说明 | S-PBGA-B325 | 200 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 200 | 现场可编程门阵列 | FPGA - 60K Logic Modules | 56520 | 256KB | 1.01mm | 11mm | 11mm | Non-RoHS Compliant | ||||||||||||||||||||||||
![]() | M2S025TS-FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 484-BGA | YES | 267 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | 活跃 | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 1mm | not_compliant | 未说明 | S-PBGA-B484 | 267 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 267 | 现场可编程门阵列 | FPGA - 25K Logic Modules | 27696 | 256KB | 2.44mm | 23mm | 23mm | Non-RoHS Compliant | |||||||||||||||||||||||||
![]() | M2S060TS-FCSG325I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 325-TFBGA, CSPBGA | YES | 200 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e3 | 活跃 | 3 (168 Hours) | 325 | 哑光锡 | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 0.5mm | 未说明 | S-PBGA-B325 | 200 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 200 | 现场可编程门阵列 | FPGA - 60K Logic Modules | 56520 | 256KB | 1.01mm | 11mm | 11mm | 符合RoHS标准 | |||||||||||||||||||||||||
![]() | M2S025T-1FGG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-BGA | 484-FPBGA (23x23) | 267 | -40°C~100°C TJ | Tray | 2009 | SmartFusion®2 | 活跃 | 3 (168 Hours) | 100°C | -40°C | 166MHz | M2S025T | CAN, Ethernet, I2C, SPI, UART, USART, USB | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | ARM | FPGA - 25K Logic Modules | 256KB | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||
![]() | M2S050T-VFG400 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 400-LFBGA | 400 | 400-VFBGA (17x17) | 207 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | 活跃 | 3 (168 Hours) | 85°C | 0°C | 166MHz | M2S050T | CAN, Ethernet, I2C, SPI, UART, USART, USB | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | ARM | FPGA - 50K Logic Modules | 256KB | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||
![]() | M2S025T-VF256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 256-LFBGA | YES | 138 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | 活跃 | 3 (168 Hours) | 256 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 0.8mm | not_compliant | 未说明 | S-PBGA-B256 | 138 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 138 | 现场可编程门阵列 | FPGA - 25K Logic Modules | 27696 | 256KB | 1.56mm | 14mm | 14mm | Non-RoHS Compliant | ||||||||||||||||||||||||
![]() | M2S025T-1FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-BGA | 484-FPBGA (23x23) | 267 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | 活跃 | 3 (168 Hours) | 85°C | 0°C | 166MHz | M2S025T | CAN, Ethernet, I2C, SPI, UART, USART, USB | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | ARM | FPGA - 25K Logic Modules | 256KB | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||
![]() | M2S025TS-1FG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 484-BGA | 484-FPBGA (23x23) | 267 | 0°C~85°C TJ | Tray | SmartFusion®2 | 活跃 | 3 (168 Hours) | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 256KB | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S025TS-VF400 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 400-LFBGA | YES | 207 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | 活跃 | 3 (168 Hours) | 400 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 0.8mm | not_compliant | 未说明 | S-PBGA-B400 | 207 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 207 | 现场可编程门阵列 | FPGA - 25K Logic Modules | 27696 | 256KB | 1.51mm | 17mm | 17mm | Non-RoHS Compliant | |||||||||||||||||||||||||
![]() | M2S025TS-FCS325I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 325-TFBGA, CSPBGA | YES | 180 | -40°C~100°C TJ | Tray | SmartFusion®2 | e0 | 活跃 | 3 (168 Hours) | 325 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 0.5mm | not_compliant | 未说明 | S-PBGA-B325 | 180 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 180 | 现场可编程门阵列 | FPGA - 25K Logic Modules | 27696 | 256KB | 1.01mm | 11mm | 11mm | Non-RoHS Compliant | |||||||||||||||||||||||||
![]() | A2F500M3G-PQ208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 208-BFQFP | YES | 208 | MCU - 22, FPGA - 66 | -40°C~100°C TJ | Tray | 2013 | SmartFusion® | e0 | Obsolete | 3 (168 Hours) | 208 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | 鸥翼 | 225 | 1.5V | 0.5mm | 80MHz | 20 | A2F500M3G | 66 | 不合格 | 1.575V | 1.51.82.53.3V | 1.425V | Ethernet, I2C, SPI, UART, USART | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | Ethernet, I2C, SPI, UART/USART | MCU, FPGA | 11520 CLBS, 500000 GATES | 现场可编程门阵列 | ARM | 24 | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 500000 | 512KB | 4.1mm | 28mm | 28mm | Non-RoHS Compliant | |||||||||||||||||||||||
![]() | A2F060M3E-FGG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2 Weeks | 表面贴装 | 256-LBGA | 256 | MCU - 26, FPGA - 66 | 0°C~85°C TJ | Tray | 2015 | SmartFusion® | e1 | Obsolete | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 250 | 1.5V | 1mm | 80MHz | 30 | A2F060M3E | 1.5V | EBI/EMI, I2C, SPI, UART, USART | 1.575V | 1.425V | 4.5kB | 3mA | 16KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, I2C, SPI, UART/USART | 400 kbps | MCU, FPGA | 现场可编程门阵列 | 660 | ARM | 60000 | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 128KB | 1.7mm | 17mm | 17mm | 符合RoHS标准 | |||||||||||||||||||||||
![]() | M2S050T-VFG400I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 400-LFBGA | YES | 207 | -40°C~100°C TJ | Tray | 2014 | SmartFusion®2 | e3 | 活跃 | 3 (168 Hours) | 400 | 哑光锡 | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 0.8mm | 未说明 | S-PBGA-B400 | 207 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 207 | 现场可编程门阵列 | FPGA - 50K Logic Modules | 56340 | 256KB | 1.51mm | 17mm | 17mm | 符合RoHS标准 | ||||||||||||||||||||||||||
![]() | M2S050TS-FG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 484-BGA | YES | 267 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | 活跃 | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 1mm | not_compliant | 未说明 | S-PBGA-B484 | 267 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 267 | 现场可编程门阵列 | FPGA - 50K Logic Modules | 56340 | 256KB | 2.44mm | 23mm | 23mm | Non-RoHS Compliant | |||||||||||||||||||||||||
![]() | M2S060-1FGG676 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 676-BGA | YES | 387 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e3 | 活跃 | 3 (168 Hours) | 676 | 哑光锡 | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 1mm | 未说明 | S-PBGA-B676 | 387 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 387 | 现场可编程门阵列 | FPGA - 60K Logic Modules | 56520 | 256KB | 2.44mm | 27mm | 27mm | 符合RoHS标准 | ||||||||||||||||||||||||||
![]() | M2S050TS-VF400I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 400-LFBGA | YES | 207 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | 活跃 | 3 (168 Hours) | 400 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 0.8mm | not_compliant | 未说明 | S-PBGA-B400 | 207 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 207 | 现场可编程门阵列 | FPGA - 50K Logic Modules | 56340 | 256KB | 1.51mm | 17mm | 17mm | Non-RoHS Compliant | |||||||||||||||||||||||||
![]() | M2S060TS-FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 484-BGA | YES | 267 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e3 | 活跃 | 3 (168 Hours) | 484 | 哑光锡 | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 1mm | 未说明 | S-PBGA-B484 | 267 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 267 | 现场可编程门阵列 | FPGA - 60K Logic Modules | 56520 | 256KB | 2.44mm | 23mm | 23mm | 符合RoHS标准 | ||||||||||||||||||||||||||
![]() | M2S060T-1FG676 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 676-BGA | YES | 387 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | 活跃 | 3 (168 Hours) | 676 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 1mm | not_compliant | 未说明 | S-PBGA-B676 | 387 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 387 | 现场可编程门阵列 | FPGA - 60K Logic Modules | 56520 | 256KB | 2.44mm | 27mm | 27mm | Non-RoHS Compliant | |||||||||||||||||||||||||
![]() | M2S050TS-1VF400 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 400-LFBGA | 400-VFBGA (17x17) | 207 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | 活跃 | 3 (168 Hours) | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 50K Logic Modules | 256KB | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S060TS-1VFG400 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 400-LFBGA | YES | 207 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e3 | 活跃 | 3 (168 Hours) | 400 | 哑光锡 | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 0.8mm | 未说明 | S-PBGA-B400 | 207 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 207 | 现场可编程门阵列 | FPGA - 60K Logic Modules | 56520 | 256KB | 1.51mm | 17mm | 17mm | 符合RoHS标准 | ||||||||||||||||||||||||||
![]() | M2S060TS-VF400I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 400-LFBGA | YES | 207 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | 活跃 | 3 (168 Hours) | 400 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1.2V | 0.8mm | not_compliant | 未说明 | S-PBGA-B400 | 207 | 不合格 | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 207 | 现场可编程门阵列 | FPGA - 60K Logic Modules | 56520 | 256KB | 1.51mm | 17mm | 17mm | Non-RoHS Compliant |
M2S050-1FCSG325I
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
M2S025TS-1VF400I
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
M2S050T-FCSG325I
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
M2S060-FGG676
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
M2S060TS-1FCS325
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
M2S025TS-FG484I
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
M2S060TS-FCSG325I
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
M2S025T-1FGG484I
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
M2S050T-VFG400
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
M2S025T-VF256I
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
M2S025T-1FGG484
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
M2S025TS-1FG484
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
M2S025TS-VF400
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
M2S025TS-FCS325I
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
A2F500M3G-PQ208I
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
A2F060M3E-FGG256
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
M2S050T-VFG400I
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
M2S050TS-FG484
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
M2S060-1FGG676
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
M2S050TS-VF400I
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
M2S060TS-FGG484
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
M2S060T-1FG676
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
M2S050TS-1VF400
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
M2S060TS-1VFG400
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
M2S060TS-VF400I
Microsemi Corporation
分类:Embedded - System On Chip (SoC)
