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产品型号	品牌	数据表	库存	价格(含增值税)	数量	工厂交货时间	触点镀层	底架	包装/外壳	表面安装	引脚数	供应商器件包装		Core										厂商															操作温度	包装	已出版	系列	JESD-609代码	无铅代码	零件状态	湿度敏感性等级(MSL)	终止次数	ECCN 代码	端子表面处理	最高工作温度	最小工作温度	附加功能	HTS代码	端子位置	终端形式	电源电压	端子间距	频率	时间@峰值回流温度-最大值(s)	基本部件号	JESD-30代码	资历状况	工作电源电压	电源电压-最大值(Vsup)	电源	电源电压-最小值(Vsup)	界面	最大电源电压	最小电源电压	工作电源电流	速度	内存大小	uPs/uCs/外围ICs类型	核心处理器	周边设备	时钟频率	程序内存大小	传播延迟	连接方式	数据总线宽度	输入数量	逻辑元件/单元数	阀门数量	速度等级	寄存器数量	核数量
XC7Z045-1FFG900C	Xilinx Inc.	数据表	990 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	900-BBGA, FCBGA	YES	900			ROMless			130	0°C~85°C TJ	Tray	2009	Zynq®-7000	e1		活跃	4 (72 Hours)	900	3A991.D	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)				8542.39.00.01	BOTTOM	BALL	245	1V	1mm	667MHz	30	XC7Z045								CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	3.3V	1.2V			256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b		190000	ARM		YES	-1	256000	Kintex™-7 FPGA, 350K Logic Cells				CAN; ETHERNET; I2C; SPI; UART; USB			3.35mm	31mm		无	ROHS3 Compliant
XC7Z035-3FFG676E	Xilinx Inc.	数据表	957 In Stock	1: ¥17,617.154850 10: ¥17,037.867363 25: ¥16,919.431340 50: ¥16,801.818610 查看所有的价格 -	最小起订量: 1 最小包装量: 1	10 Weeks	676-BBGA, FCBGA	YES		130						0°C~100°C TJ	Tray	2010	Zynq®-7000	e1		活跃	4 (72 Hours)	676	3A991.D	Tin/Silver/Copper (Sn/Ag/Cu)			PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY	8542.39.00.01	BOTTOM	BALL	未说明	1V	1mm	800MHz	未说明		S-PBGA-B676				1.05V		0.95V	CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB					256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				ARM		YES		256000	Kintex™-7 FPGA, 275K Logic Cells				CAN; ETHERNET; I2C; SPI; UART; USB			3.37mm	27mm	27mm		ROHS3 Compliant
XC7Z030-1FFG676C	Xilinx Inc.	数据表	490 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	676-BBGA, FCBGA	YES	676			130			0°C~85°C TJ	Tray	2009	Zynq®-7000	e1		活跃	4 (72 Hours)	676	3A991.D	Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01	BOTTOM	BALL	245	1V	1mm	667MHz	30	XC7Z030				1V	1.05V			CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB					256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b			ARM		YES	-1	256000	Kintex™-7 FPGA, 125K Logic Cells				CAN; ETHERNET; I2C; SPI; UART; USB			3.24mm	27mm		无	ROHS3 Compliant
XC7Z015-2CLG485E	Xilinx Inc.	数据表	495 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	表面贴装	484-LFBGA, CSPBGA	485			130			0°C~100°C TJ	Tray	2010	Zynq®-7000	e1		活跃	3 (168 Hours)	485	EAR99	Tin/Silver/Copper (Sn/Ag/Cu)			PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY	8542.39.00.01	BOTTOM	BALL	未说明	1V	0.8mm	766MHz	未说明				不合格		1.05V	11.8V	0.95V	CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB					256KB	微处理器电路	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b			ARM		YES		256000	Artix™-7 FPGA, 74K Logic Cells				CAN; ETHERNET; I2C; SPI; UART; USB		N	1.6mm	19mm			ROHS3 Compliant
XC7Z045-1FBG676I	Xilinx Inc.	数据表	625 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	676-BBGA, FCBGA	YES		ROMless		130				-40°C~100°C TJ	Tray	2009	Zynq®-7000	e1		活跃	3 (168 Hours)	676	3A991.D	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)				8542.39.00.01	BOTTOM	BALL	245	1V	1mm	667MHz	30	XC7Z045	S-PBGA-B676			1V	1.05V			CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB					256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b			ARM		YES	-1	256000	Kintex™-7 FPGA, 350K Logic Cells				CAN; ETHERNET; I2C; SPI; UART; USB			2.54mm	27mm		无	ROHS3 Compliant
A2F500M3G-FG484	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1		FPBGA-484			484-FPBGA (23x23)	This product may require additional documentation to export from the United States.	ARM Cortex M3	N	SMD/SMT	80 MHz	-	-	64 kB	6000 LE	204 I/O	0 C	微芯片技术	+ 85 C	有	-	60	SmartFusion	1.5000 V	1.425 V	500000	1.575 V	Tray	A2F500	活跃			0 to 85 °C	Tray		A2F500																												2 mA	80MHz	64KB		ARM® Cortex®-M3	DMA, POR, WDT		512 kB		EBI/EMI, Ethernet, I²C, SPI, UART/USART	MCU, FPGA				500000	STD	ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops	1 Core	512KB
XC7Z045-3FFG676E	Xilinx Inc.	数据表	937 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	676-BBGA, FCBGA	YES		ROMless		130				0°C~100°C TJ	Tray	2009	Zynq®-7000	e1		活跃	4 (72 Hours)	676	3A991.D	Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01	BOTTOM	BALL	245	1V	1mm	1GHz	30	XC7Z045	S-PBGA-B676			1V	1.05V			CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB					256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b			ARM		YES	-3	256000	Kintex™-7 FPGA, 350K Logic Cells				CAN; ETHERNET; I2C; SPI; UART; USB			3.37mm	27mm		无	ROHS3 Compliant
XC7Z007S-1CLG400I	Xilinx Inc.	数据表	2970 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	400-LFBGA, CSPBGA	YES		100						-40°C~100°C TJ	Tray	2016	Zynq®-7000	e3	yes	活跃	3 (168 Hours)	400		Matte Tin (Sn)				8542.31.00.01	BOTTOM	BALL	未说明	1V	0.8mm		未说明		S-PBGA-B400				1.05V		0.95V					667MHz	256KB		Single ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	667MHz		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						YES		256000	Artix™-7 FPGA, 23K Logic Cells				CAN; ETHERNET; I2C; SPI; UART; USB			1.6mm	17mm	17mm		ROHS3 Compliant
XC7Z012S-2CLG485E	Xilinx Inc.	数据表	980 In Stock	1: ¥1,110.356756 10: ¥1,047.506374 100: ¥988.213560 500: ¥932.276943 查看所有的价格 -	最小起订量: 1 最小包装量: 1	10 Weeks	484-LFBGA, CSPBGA	YES		150						0°C~100°C TJ	Tray	2016	Zynq®-7000	e3	yes	活跃	3 (168 Hours)	485		Matte Tin (Sn)				8542.31.00.01	BOTTOM	BALL	未说明	1V	0.8mm		未说明		S-PBGA-B485				1.05V		0.95V					766MHz	256KB		Single ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	800MHz		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						YES		256000	Artix™-7 FPGA, 55K Logic Cells				CAN; ETHERNET; I2C; SPI; UART; USB			1.6mm	19mm	19mm		ROHS3 Compliant
XC7Z007S-1CLG225I	Xilinx Inc.	数据表	1980 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	225-LFBGA, CSPBGA	YES		54						-40°C~100°C TJ	Tray	2016	Zynq®-7000	e1	yes	活跃	3 (168 Hours)	225		Tin/Silver/Copper (Sn/Ag/Cu)					BOTTOM	BALL	260	1V	0.8mm		30		S-PBGA-B225				1.05V		0.95V					667MHz	256KB		Single ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	667MHz		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						YES		256000	Artix™-7 FPGA, 23K Logic Cells				CAN; ETHERNET; I2C; SPI; UART; USB			1.5mm	13mm	13mm		ROHS3 Compliant
A2F500M3G-FG256	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1		FPBGA-256			256-FPBGA (17x17)	This product may require additional documentation to export from the United States.	ARM Cortex M3	N	SMD/SMT	80 MHz	-	-	64 kB	6000 LE	117 I/O	0 C	微芯片技术	+ 85 C	有	-	90	SmartFusion	1.5000 V	1.425 V	500000	1.575 V	Tray	A2F500	活跃			0 to 85 °C	Tray		A2F500																												2 mA	80MHz	64KB		ARM® Cortex®-M3	DMA, POR, WDT		512 kB		EBI/EMI, Ethernet, I²C, SPI, UART/USART	MCU, FPGA				500000	STD	ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops	1 Core	512KB
5CSXFC6D6F31I7N	Intel	数据表	2903 In Stock	-	最小起订量: 1 最小包装量: 1	8 Weeks	896-BGA	YES		MCU - 181, FPGA - 288						-40°C~100°C TJ	Tray	2018	Cyclone® V SX			活跃	3 (168 Hours)	896						8542.39.00.01	BOTTOM	BALL	未说明	1.1V	1mm		未说明	5CSXFC6	S-PBGA-B896	288	不合格		1.13V	1.11.2/3.32.5V	1.07V					800MHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		288	现场可编程门阵列						FPGA - 110K Logic Elements		110000					2mm	31mm	31mm		符合RoHS标准
5CSXFC6C6U23C8N	Intel	数据表	2982 In Stock	-	最小起订量: 1 最小包装量: 1	8 Weeks	672-FBGA	YES		MCU - 181, FPGA - 145						0°C~85°C TJ	Tray	2018	Cyclone® V SX			活跃	3 (168 Hours)	672							BOTTOM	BALL	未说明	1.1V	0.8mm		未说明	5CSXFC6	S-PBGA-B672	145	不合格		1.13V	1.11.2/3.32.5V	1.07V					600MHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		145	现场可编程门阵列						FPGA - 110K Logic Elements		110000					1.85mm	23mm	23mm		符合RoHS标准
XC7Z015-1CLG485I	Xilinx Inc.	数据表	990 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	表面贴装	484-LFBGA, CSPBGA	485			130			-40°C~100°C TJ	Tray	2010	Zynq®-7000	e1		活跃	3 (168 Hours)	485	EAR99	Tin/Silver/Copper (Sn/Ag/Cu)			PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY	8542.39.00.01	BOTTOM	BALL	未说明	1V	0.8mm	667MHz	未说明				不合格		1.05V	11.8V	0.95V	CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB					256KB	微处理器电路	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b			ARM		YES		256000	Artix™-7 FPGA, 74K Logic Cells				CAN; ETHERNET; I2C; SPI; UART; USB		N	1.6mm	19mm			ROHS3 Compliant
M2S010-VFG400I	Atmel (Microchip Technology)	数据表	N/A	-	最小起订量: 1 最小包装量: 1	VFPBGA-400	ARM Cortex M3	64 kB	12084 LE	有	1007 LAB		90	0.236569 oz							This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-		Tray		SmartFusion2																																			256 kB															1 Core
5CSXFC6C6U23I7N	Intel	数据表	17628 In Stock	-	最小起订量: 1 最小包装量: 1	8 Weeks	672-FBGA	YES		MCU - 181, FPGA - 145						-40°C~100°C TJ	Tray	2018	Cyclone® V SX			活跃	3 (168 Hours)	672						8542.39.00.01	BOTTOM	BALL	未说明	1.1V	0.8mm		未说明	5CSXFC6	S-PBGA-B672	145	不合格		1.13V	1.11.2/3.32.5V	1.07V					800MHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		145	现场可编程门阵列						FPGA - 110K Logic Elements		110000					1.85mm	23mm	23mm		符合RoHS标准
XC7Z030-L2FBG676I	Xilinx Inc.	数据表	2627 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	表面贴装	676-BBGA, FCBGA			130				-40°C~100°C TJ	Tray	2010	Zynq®-7000	e1		活跃	3 (168 Hours)	676	3A991.D	Tin/Silver/Copper (Sn/Ag/Cu)			PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY	8542.39.00.01	BOTTOM	BALL	未说明	1V	1mm	800MHz	未说明		S-PBGA-B676							CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	1.05V	950mV			256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				ARM		YES		256000	Kintex™-7 FPGA, 125K Logic Cells	157200			CAN; ETHERNET; I2C; SPI; UART; USB			2.54mm	27mm	27mm		ROHS3 Compliant
XC7Z035-3FBG676E	Xilinx Inc.	数据表	990 In Stock	1: ¥5,629.188718 10: ¥5,444.089669 25: ¥5,406.245948 50: ¥5,368.665290 查看所有的价格 -	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	表面贴装	676-BBGA, FCBGA			130				0°C~100°C TJ	Tray	2010	Zynq®-7000	e1		活跃	3 (168 Hours)	676							BOTTOM	BALL	未说明	1V	1mm	800MHz	未说明		S-PBGA-B676							CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	1.05V	950mV			256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA		110 ps	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				ARM		YES	3	256000	Kintex™-7 FPGA, 275K Logic Cells	343800			CAN; ETHERNET; I2C; SPI; UART; USB			2.54mm	27mm	27mm		ROHS3 Compliant
XC7Z035-1FFG900C	Xilinx Inc.	数据表	990 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	表面贴装	900-BBGA, FCBGA	900-FCBGA (31x31)			130			0°C~85°C TJ	Tray	2010	Zynq®-7000			活跃	4 (72 Hours)				85°C	0°C								667MHz										CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	1.05V	950mV		667MHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA		120 ps	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				ARM			1		Kintex™-7 FPGA, 275K Logic Cells	343800										ROHS3 Compliant
XC7Z035-L2FFG900I	Xilinx Inc.	数据表	66 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	900-BBGA, FCBGA	YES		130						-40°C~100°C TJ	Tray	2010	Zynq®-7000	e1		活跃	4 (72 Hours)	900	3A991.D	Tin/Silver/Copper (Sn/Ag/Cu)			PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY	8542.39.00.01	BOTTOM	BALL	245	1V	1mm	800MHz	30		S-PBGA-B900				1.05V		0.95V	CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB					256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				ARM		YES		256000	Kintex™-7 FPGA, 275K Logic Cells				CAN; ETHERNET; I2C; SPI; UART; USB			3.35mm	31mm	31mm		ROHS3 Compliant
XC7Z030-3FBG676E	Xilinx Inc.	数据表	495 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	676-BBGA, FCBGA	YES	676			130			0°C~100°C TJ	Tray	2009	Zynq®-7000	e1		活跃	4 (72 Hours)	676	3A991.D	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)				8542.39.00.01	BOTTOM	BALL	245	1V	1mm	1GHz	30	XC7Z030				1V	1.05V			CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB					256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b			ARM		YES	-3	256000	Kintex™-7 FPGA, 125K Logic Cells				CAN; ETHERNET; I2C; SPI; UART; USB			2.54mm	27mm		无	ROHS3 Compliant
XC7Z045-1FFG676C	Xilinx Inc.	数据表	638 In Stock	1: ¥13,023.216303 10: ¥12,594.986751 25: ¥12,507.434709 50: ¥12,420.491275 查看所有的价格 -	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	676-BBGA, FCBGA	YES		ROMless		130				0°C~85°C TJ	Tray	2009	Zynq®-7000	e1		活跃	4 (72 Hours)	676	3A991.D	Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01	BOTTOM	BALL	245	1V	1mm	667MHz	30	XC7Z045	S-PBGA-B676			1V	1.05V			CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB					256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b			ARM		YES	-1	256000	Kintex™-7 FPGA, 350K Logic Cells				CAN; ETHERNET; I2C; SPI; UART; USB			3.37mm	27mm		无	ROHS3 Compliant
M2S025T-FGG484	Atmel (Microchip Technology)	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484	ARM Cortex M3	64 kB	27696 LE	273 I/O	0 C	+ 85 C		有	2308 LAB	60							Details	SMD/SMT	166 MHz	-	-		Tray		SmartFusion2																							1.2 V												256 kB															1 Core
XCZU4EV-1SFVC784E	Xilinx Inc.	数据表	561 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	784-BFBGA, FCBGA						252			0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EV			活跃	4 (72 Hours)							8542.31.00.01			未说明				未说明													500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA									Zynq®UltraScale+™ FPGA, 192K+ Logic Cells											ROHS3 Compliant
5CSXFC5D6F31I7N	Intel	数据表	20293 In Stock	-	最小起订量: 1 最小包装量: 1	8 Weeks	896-BGA	YES		MCU - 181, FPGA - 288						-40°C~100°C TJ	Tray	2018	Cyclone® V SX			活跃	3 (168 Hours)	896						8542.39.00.01	BOTTOM	BALL	未说明	1.1V	1mm		未说明	5CSXFC5	S-PBGA-B896	288	不合格		1.13V	1.11.2/3.32.5V	1.07V					800MHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		288	现场可编程门阵列						FPGA - 85K Logic Elements		85000					2mm	31mm	31mm		符合RoHS标准