category.集成电路IC_category.集成电路IC品牌厂家，型号_价格_规格

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产品型号	品牌	数据表	库存	价格(含增值税)	数量	生命周期状态	包装/外壳	表面安装	供应商器件包装	终端数量		Core																	厂商																																				操作温度	包装	系列	JESD-609代码	无铅代码	ECCN 代码	端子表面处理	最高工作温度	最小工作温度	附加功能	HTS代码	技术	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	Reach合规守则	频率	引脚数量	JESD-30代码	输出的数量	资历状况	工作电源电压	电源	温度等级	界面	最大电源电压	最小电源电压	内存大小	速度	内存大小	核心处理器	周边设备	程序内存大小	连接方式	建筑学	数据总线宽度	输入数量	座位高度-最大	可编程逻辑类型
M2S060T-1FGG484M	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	BGA-484	YES	484-FPBGA (23x23)	484	ARM Cortex M3	M2S060	微芯片技术	活跃	FBGA-484	网格排列	3	PLASTIC/EPOXY	-55 °C	1.2 V	40	1.14 V	125 °C	有	M2S060T-1FGG484M	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.8		This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	56520 LE	267 I/O	- 55 C	+ 125 C	1314 kbit	4710 LAB	60	SmartFusion2	Tray	-55°C ~ 125°C (TJ)	Tray	SmartFusion2	e1	有	3A001.A.2.C	Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01		BOTTOM	BALL	250	1 mm	compliant			S-PBGA-B484			1.2 V		MILITARY				166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA			2.44 mm	现场可编程门阵列					FPGA - 60K Logic Modules			1 Core	256KB			23 mm	23 mm
M2S060TS-1FGG484M	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	BGA-484	YES	484-FPBGA (23x23)	484	ARM Cortex M3	M2S060	微芯片技术	活跃	FBGA-484	网格排列	3	PLASTIC/EPOXY	-55 °C	1.2 V	40	1.14 V	125 °C	有	M2S060TS-1FGG484M	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.81		This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	56520 LE	267 I/O	- 55 C	+ 125 C	1314 kbit	4710 LAB	60	SmartFusion2	Tray	-55°C ~ 125°C (TJ)	Tray	SmartFusion2	e1	有	3A001.A.2.C	Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01		BOTTOM	BALL	250	1 mm	compliant			S-PBGA-B484			1.2 V		MILITARY				166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA			2.44 mm	现场可编程门阵列					FPGA - 60K Logic Modules			1 Core	256KB			23 mm	23 mm
M2S010TS-1FG484M	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 1 month ago)	FPBGA-484	YES	484-FPBGA (23x23)	484	ARM Cortex M3	微芯片技术	BGA484,22X22,40	-55 °C	1.2 V	30	1.14 V	125 °C	无	M2S010TS-1FG484M	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.86	This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	12084 LE	有	1007 LAB	60	233	Tray	M2S010	活跃	FBGA-484	网格排列	3	PLASTIC/EPOXY	-55°C ~ 125°C (TJ)	Tray	SmartFusion2	e0		3A001.A.2.C	Tin/Lead (Sn/Pb)				8542.39.00.01	CMOS	BOTTOM	BALL	240	1 mm	not_compliant			S-PBGA-B484	233	不合格		1.2 V	MILITARY				166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		233	2.44 mm	现场可编程门阵列					FPGA - 10K Logic Modules		12084	1 Core	256KB			23 mm	23 mm
M2S150T-1FCS536	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	536-LFBGA, CSPBGA	YES	536-CSPBGA (16x16)	536	ARM Cortex M3	微芯片技术	85 °C	无	M2S150T-1FCS536	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.81		This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	146124 LE	有	12177 LAB	90	293	Tray	M2S150	活跃	BGA, BGA536,30X30,20	网格排列	PLASTIC/EPOXY	BGA536,30X30,20	1.2 V	30	1.14 V	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0			Tin/Lead (Sn/Pb)				8542.39.00.01	CMOS	BOTTOM	BALL	240		not_compliant			S-PBGA-B536	293	不合格		1.2 V	OTHER				166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		293		现场可编程门阵列					FPGA - 150K Logic Modules		146124	1 Core	512KB
M2S060T-FG484	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	484-BGA	YES	484-FPBGA (23x23)	484	ARM Cortex M3	微芯片技术	1.2 V	30	1.14 V	85 °C	无	M2S060T-FG484	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.88	This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	56520 LE	有	4710 LAB	60	SmartFusion2	267	Tray	M2S060	活跃	FBGA-484	网格排列	3	PLASTIC/EPOXY	BGA484,22X22,40	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0			Tin/Lead (Sn/Pb)				8542.39.00.01	CMOS	BOTTOM	BALL	240	1 mm	not_compliant			S-PBGA-B484	267	不合格		1.2 V	OTHER				166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		267	2.44 mm	现场可编程门阵列					FPGA - 60K Logic Modules		56520	1 Core	256KB			23 mm	23 mm
M2S010T-FGG484I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484	YES	484-FPBGA (23x23)	484	ARM Cortex M3	微芯片技术	活跃	FBGA-484	网格排列	3	PLASTIC/EPOXY	BGA484,22X22,40	1.2 V	40	1.14 V	有	M2S010T-FGG484I	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	2.32		This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	12084 LE	有	1007 LAB	60	1.2000 V	1.14 V	1.26 V	233	Tray	M2S010	-40 to 100 °C	Tray	SmartFusion2	e1			Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01	CMOS	BOTTOM	BALL	250	1 mm	compliant			S-PBGA-B484	233	不合格		1.2 V					166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		233	2.44 mm	现场可编程门阵列				STD	FPGA - 10K Logic Modules		12084	1 Core	256KB			23 mm	23 mm
M2S005S-1VFG400	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	VFPBGA-400	YES	400-VFBGA (17x17)	400	ARM Cortex M3	微芯片技术	BGA400,20X20,32	1.2 V	40	1.14 V	85 °C	有	M2S005S-1VFG400	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.81		This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	6060 LE	有	505 LAB	90	171	Tray	M2S005	活跃	LFBGA, BGA400,20X20,32	GRID ARRAY, LOW PROFILE, FINE PITCH	3	PLASTIC/EPOXY	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e1			Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01	CMOS	BOTTOM	BALL	250	0.8 mm	compliant			S-PBGA-B400	171	不合格		1.2 V	OTHER				166MHz	64KB	ARM® Cortex®-M3	DDR	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		171	1.51 mm	现场可编程门阵列					FPGA - 5K Logic Modules		6060	1 Core	128KB			17 mm	17 mm
M2S010T-VF256	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 1 month ago)	256-LFBGA	256-FPBGA (14x14)	ARM Cortex M3	微芯片技术	-	64 kB	12084 LE	有	1007 LAB	119	138	Tray	M2S010	活跃			This product may require additional documentation to export from the United States.	N	166 MHz	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2																										166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA									FPGA - 10K Logic Modules			1 Core	256KB
M2S050TS-FGG484	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	484-BGA	484-FPBGA (23x23)	ARM Cortex M3	微芯片技术	-	64 kB	56340 LE	有	4695 LAB	60	267	Tray	M2S050	活跃			This product may require additional documentation to export from the United States.	Details	166 MHz	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2																										166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA									FPGA - 50K Logic Modules			1 Core	256KB
M2S005S-FG484	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-BGA	484-FPBGA (23x23)	ARM Cortex M3	微芯片技术	N	166 MHz	-	-	64 kB	6060 LE	有	505 LAB	60	209	Tray	M2S005	活跃				This product may require additional documentation to export from the United States.	0°C ~ 85°C (TJ)	Tray	SmartFusion2																										166MHz	64KB	ARM® Cortex®-M3	DDR	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA									FPGA - 5K Logic Modules			1 Core	128KB
M2S005S-1FGG484I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484	484-FPBGA (23x23)	ARM Cortex M3	微芯片技术			This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	6060 LE	有	505 LAB	60	209	Tray	M2S005	活跃		-40°C ~ 100°C (TJ)	Tray	SmartFusion2																										166MHz	64KB	ARM® Cortex®-M3	DDR	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA									FPGA - 5K Logic Modules			1 Core	128KB
M2S050-FGG896I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	FPBGA-896	YES	896-FBGA (31x31)	896	ARM Cortex M3	微芯片技术	40	1.14 V	有	M2S050-FGG896I	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.26	This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	56340 LE	有	4695 LAB	27	1.2000 V	377	Tray	M2S050	活跃	FBGA-896	网格排列	PLASTIC/EPOXY	BGA896,30X30,40	1.2 V	-40 to 100 °C	Tray	SmartFusion2	e1			Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01	CMOS	BOTTOM	BALL	250	1 mm	compliant			S-PBGA-B896	377	不合格		1.2 V					166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		377	2.44 mm	现场可编程门阵列				STD	FPGA - 50K Logic Modules		56340	1 Core	256KB			31 mm	31 mm
M2S005S-VF256	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	256-LFBGA	256-FPBGA (14x14)	ARM Cortex M3	微芯片技术	N	166 MHz	-	-	64 kB	6060 LE	有	505 LAB	119	161	Tray	M2S005	活跃				This product may require additional documentation to export from the United States.	0°C ~ 85°C (TJ)	Tray	SmartFusion2																										166MHz	64KB	ARM® Cortex®-M3	-	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA									FPGA - 5K Logic Modules			1 Core	128KB
M2S090-1FCSG325	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FCBGA-325	YES	325-FCBGA (11x13.5)	325	ARM Cortex M3	微芯片技术	BGA325,21X21,20	1.2 V	40	1.14 V	85 °C	有	M2S090-1FCSG325	TFBGA	RECTANGULAR	活跃	MICROSEMI CORP	1.26 V	5.78		This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	86316 LE	有	7193 LAB	176	180	Tray	M2S090	活跃	FBGA-325	GRID ARRAY, THIN PROFILE, FINE PITCH	3	PLASTIC/EPOXY	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e1			Tin/Silver/Copper (Sn/Ag/Cu)			LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.5 mm	compliant			R-PBGA-B325	180	不合格		1.2 V	OTHER				166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		180	1.16 mm	现场可编程门阵列					FPGA - 90K Logic Modules		86316	1 Core	512KB			13.5 mm	11 mm
M2S050TS-1FG896I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-896	YES	896-FBGA (31x31)	896	ARM Cortex M3	微芯片技术	1.2 V	30	1.14 V	无	M2S050TS-1FG896I	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.84		This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	56340 LE	有	4695 LAB	27	1.2000 V	377	Tray	M2S050	活跃	FBGA-896	网格排列	3	PLASTIC/EPOXY	-40 to 100 °C	Tray	SmartFusion2	e0			Tin/Lead (Sn/Pb)				8542.39.00.01		BOTTOM	BALL	240	1 mm	not_compliant		896	S-PBGA-B896									166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA			2.44 mm	现场可编程门阵列				1	FPGA - 50K Logic Modules			1 Core	256KB			31 mm	31 mm
M2S090-FCS325I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	FCBGA-325	YES	325-FCBGA (11x13.5)	325	ARM Cortex M3	微芯片技术	BGA325,21X21,20	1.2 V	30	1.14 V	无	M2S090-FCS325I	TFBGA	RECTANGULAR	活跃	MICROSEMI CORP	1.26 V	5.83	This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	86316 LE	有	7193 LAB	176	1.14 V	1.26 V	180	Tray	M2S090	活跃	TFBGA, BGA325,21X21,20	GRID ARRAY, THIN PROFILE, FINE PITCH	PLASTIC/EPOXY	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0			Tin/Lead (Sn/Pb)			LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.5 mm	not_compliant			R-PBGA-B325	180	不合格		1.2 V					166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		180	1.16 mm	现场可编程门阵列					FPGA - 90K Logic Modules		86316	1 Core	512KB			13.5 mm	11 mm
M2S050TS-FCS325I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	FCBGA-325	YES	325-FCBGA (11x11)	325	ARM Cortex M3	微芯片技术	TFBGA	M2S050TS-FCS325I	无	1.14 V	30	1.2 V	BGA325,21X21,20	PLASTIC/EPOXY	GRID ARRAY, THIN PROFILE, FINE PITCH	FBGA-325	This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	56340 LE	有	4695 LAB	176	200	FLASH	Tray	M2S050	活跃	1.26 V	5.88	MICROSEMI CORP	活跃	SQUARE	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0			Tin/Lead (Sn/Pb)	100 °C	-40 °C	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.5 mm	not_compliant	166 MHz		S-PBGA-B325	200	不合格		1.2 V			3.45 V	1.14 V	256 kB	166MHz	64 kB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		200	1.01 mm	现场可编程门阵列	56340				FPGA - 50K Logic Modules	100 °C	56340	1 Core	256KB		1.01 mm	11 mm	11 mm
M2S090-FG676I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	BGA-676	YES	676-FBGA (27x27)	676	ARM Cortex M3	微芯片技术	1.2 V	30	1.14 V	无	M2S090-FG676I	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.83		This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	86316 LE	有	7193 LAB	40	425	Tray	M2S090	活跃	BGA, BGA676,26X26,40	网格排列	3	PLASTIC/EPOXY	BGA676,26X26,40	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0			Tin/Lead (Sn/Pb)				8542.39.00.01	CMOS	BOTTOM	BALL	240	1 mm	not_compliant			S-PBGA-B676	425	不合格		1.2 V					166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		425	2.44 mm	现场可编程门阵列					FPGA - 90K Logic Modules		86316	1 Core	512KB			27 mm	27 mm
M2S150-FCVG484I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-BFBGA	YES	484-FBGA (19x19)	484	ARM Cortex M3	12177 LAB	84	RISC	1.2, 1.5, 1.8, 2.5, 3.3 V	VFBGA	1	微芯片技术	CAN/Ethernet/Serial I2C/SPI/UART/USB	有	表面贴装	Tray	M2S150	活跃	VFBGA-484	GRID ARRAY, FINE PITCH	4	PLASTIC/EPOXY	BGA484,22X22,32	1.2 V	40	1.14 V	有	M2S150-FCVG484I	FBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.76	Industrial grade		Details	SMD/SMT	166 MHz	-	-	64 kB	146124 LE	273 I/O	- 40 C	+ 100 C	有	-40 to 100 °C	Tray	SmartFusion2	e1			Tin/Silver/Copper (Sn/Ag/Cu)			LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.8 mm	compliant		484	S-PBGA-B484	273	不合格	1.2 V	1.2 V		CAN/Ethernet/Serial			166MHz	64 KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	32 Bit	273	3.15 mm	现场可编程门阵列			Industrial		FPGA - 150K Logic Modules		146124	1 Core	512KB	ARM Cortex-M3		19 mm	19 mm
M2S010-FGG484I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	BGA-484	YES	484-FPBGA (23x23)	484	ARM Cortex M3	1007 LAB	60	0.404535 oz	1.2000 V	微芯片技术	1.14 V	1.26 V	Tray	M2S010	活跃	FBGA-484	网格排列	3	PLASTIC/EPOXY	BGA484,22X22,40	1.2 V	40	1.14 V	有	M2S010-FGG484I	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.76		Details	SMD/SMT	166 MHz	-	-	64 kB	12084 LE	233 I/O	- 40 C	+ 100 C	400 kbit	64 kB	有	-40 to 100 °C	Tray	SmartFusion2	e1			Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01	CMOS	BOTTOM	BALL	250	1 mm	compliant			S-PBGA-B484	233	不合格	1.2 V	1.2 V					166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		233	2.44 mm	现场可编程门阵列				STD	FPGA - 10K Logic Modules		12084	1 Core	256KB			23 mm	23 mm
M2S060-FG676	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	676-BGA	676-FBGA (27x27)	ARM Cortex M3	微芯片技术	N	166 MHz	-	-	64 kB	56520 LE	有	4710 LAB	40	SmartFusion2	387	Tray	M2S060	活跃			This product may require additional documentation to export from the United States.	0°C ~ 85°C (TJ)	Tray	SmartFusion2																										166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA									FPGA - 60K Logic Modules			1 Core	256KB
M2S150-1FCSG536I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	536-LFBGA, CSPBGA	YES	536-CSPBGA (16x16)	536	ARM Cortex M3	微芯片技术	1.14 V	有	M2S150-1FCSG536I	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.77		This product may require additional documentation to export from the United States.	Details	166 MHz	-	-	64 kB	146124 LE	有	12177 LAB	90	293	Tray	M2S150	活跃	FBGA-536	网格排列	3	PLASTIC/EPOXY	BGA536,30X30,20	1.2 V	40	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e1			Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01	CMOS	BOTTOM	BALL	250		compliant			S-PBGA-B536	293	不合格		1.2 V					166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		293		现场可编程门阵列					FPGA - 150K Logic Modules		146124	1 Core	512KB
M2S010-FG484I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484	YES	484-FPBGA (23x23)	484	ARM Cortex M3	微芯片技术	1.2 V	30	1.14 V	无	M2S010-FG484I	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.81		This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	12084 LE	有	1007 LAB	60	233	Tray	M2S010	活跃	BGA, BGA484,22X22,40	网格排列	3	PLASTIC/EPOXY	BGA484,22X22,40	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0			Tin/Lead (Sn/Pb)				8542.39.00.01	CMOS	BOTTOM	BALL	240	1 mm	not_compliant			S-PBGA-B484	233	不合格		1.2 V					166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		233	2.44 mm	现场可编程门阵列					FPGA - 10K Logic Modules		12084	1 Core	256KB			23 mm	23 mm
M2S025T-FCSG325I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	FCBGA-325	YES	325-FCBGA (11x11)	325	ARM Cortex M3	微芯片技术	BGA325,21X21,20	1.2 V	40	1.14 V	有	M2S025T-FCSG325I	TFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.78	This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	27696 LE	有	2308 LAB	176	-	180	Tray	M2S025	活跃	FBGA-325	GRID ARRAY, THIN PROFILE, FINE PITCH	3	PLASTIC/EPOXY	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e1			Tin/Silver/Copper (Sn/Ag/Cu)			LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.5 mm	compliant			S-PBGA-B325	180	不合格		1.2 V					166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		180	1.01 mm	现场可编程门阵列		592Kbit			FPGA - 25K Logic Modules		27696	1 Core	256KB			11 mm	11 mm
M2S025T-1FCSG325	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	FCBGA-325	325-FCBGA (11x11)	ARM Cortex M3	微芯片技术	Details	SMD/SMT	166 MHz	-	-	64 kB	27696 LE	有	2308 LAB	176	180	Tray	M2S025	活跃			This product may require additional documentation to export from the United States.	0°C ~ 85°C (TJ)	Tray	SmartFusion2																										166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA									FPGA - 25K Logic Modules			1 Core	256KB