category.集成电路IC_category.集成电路IC品牌厂家，型号_价格_规格

类别是'category.片上系统（SoC）' (7695)

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产品型号	品牌	数据表	库存	价格(含增值税)	数量	生命周期状态	包装/外壳	表面安装	供应商器件包装	终端数量				Core																				厂商																																															操作温度	包装	系列	JESD-609代码	无铅代码	温度系数	电阻	端子表面处理	最高工作温度	最小工作温度	附加功能	HTS代码	子类别	额定功率	技术	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	电阻器类型	Reach合规守则	频率	时间@峰值回流温度-最大值(s)	引脚数量	JESD-30代码	输出的数量	资历状况	工作电源电压
XCVM1502-2HSIVFVC1760	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	+ 110 C		- 40 C	1		Xilinx	Xilinx											30.0000 ppm/°C	20 kOhm						SOC - Systems on a Chip	10.0000 W						Power								880 mV																			System-On-Modules - SOM			5						SoC FPGA	47.62
XCVC1502-2MSEVBVA1024	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	+ 110 C		0 C	1		Xilinx	Xilinx											200 ppm/K	2.15 Ohm						SOC - Systems on a Chip	0.0625 W						通用型								800 mV																			System-On-Modules - SOM			1						SoC FPGA	1	0.5
XCVM1402-1LLIVFVB1369	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	AEC-Q200		+ 110 C	- 40 C		Xilinx	Xilinx											100 ppm/K	15 Ohm						SOC - Systems on a Chip	0.75 W						通用型								700 mV																			System-On-Modules - SOM			1						SoC FPGA	5 mm	2.5 mm
M2S150TS-1FCSG536I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	536-LFBGA, CSPBGA	536-CSPBGA (16x16)	ARM Cortex M3	微芯片技术	166 MHz	-	-	64 kB	146124 LE	有	12177 LAB	90	RISC	1.2, 1.5, 1.8, 2.5, 3.3 V	1	有	293	Tray	M2S150	活跃	Industrial grade				This product may require additional documentation to export from the United States.	Details	-40 to 100 °C	Tray	SmartFusion2																					536				1.2 V			CAN/Ethernet/Serial			166MHz	64 KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	32 Bit						Industrial			FPGA - 150K Logic Modules			1 Core	512KB				ARM Cortex-M3
M2S090-1FGG676	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	BGA-676	YES	676-FBGA (27x27)	676	ARM Cortex M3	微芯片技术	SMD/SMT	166 MHz	-	-	64 kB	86316 LE	有	7193 LAB	40	425	Tray	M2S090	活跃	FBGA-676	网格排列	3	PLASTIC/EPOXY	BGA676,26X26,40	1.2 V	40	1.14 V	85 °C	有	M2S090-1FGG676	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.27		This product may require additional documentation to export from the United States.	Details	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e1				Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01			CMOS	BOTTOM	BALL	250	1 mm		compliant				S-PBGA-B676	425	不合格		1.2 V	OTHER				166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		425	2.44 mm	现场可编程门阵列						FPGA - 90K Logic Modules		86316	1 Core	512KB						27 mm	27 mm
M2S050T-FG484	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484	YES	484-FPBGA (23x23)	484	ARM Cortex M3	微芯片技术	MICROSEMI CORP	1.26 V	5.84		This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	56340 LE	有	4695 LAB	60	1.2000 V	1.14 V	1.26 V	267	Tray	M2S050	活跃	FBGA-484	网格排列	3	PLASTIC/EPOXY	BGA484,22X22,40	1.2 V	30	1.14 V	85 °C	无	M2S050T-FG484	BGA	SQUARE	活跃	0 to 85 °C	Tray	SmartFusion2	e0				Tin/Lead (Sn/Pb)				8542.39.00.01			CMOS	BOTTOM	BALL	240	1 mm		not_compliant				S-PBGA-B484	267	不合格		1.2 V	OTHER				166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		267	2.44 mm	现场可编程门阵列				STD		FPGA - 50K Logic Modules		48672	1 Core	256KB						23 mm	23 mm
M2S010-1FG484I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484	YES	484-FPBGA (23x23)	484	ARM Cortex M3	微芯片技术	-	-	64 kB	12084 LE	有	1007 LAB	60	233	Tray	M2S010	活跃	BGA, BGA484,22X22,40	网格排列	3	PLASTIC/EPOXY	BGA484,22X22,40	1.2 V	30	1.14 V	无	M2S010-1FG484I	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.3		This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0				Tin/Lead (Sn/Pb)				8542.39.00.01			CMOS	BOTTOM	BALL	240	1 mm		not_compliant				S-PBGA-B484	233	不合格		1.2 V					166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		233	2.44 mm	现场可编程门阵列				1		FPGA - 10K Logic Modules		9744	1 Core	256KB						23 mm	23 mm
M2S090T-FCS325I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FCBGA-325	325-FCBGA (11x13.5)	ARM Cortex M3	微芯片技术	This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	86316 LE	有	7193 LAB	176	SMARTFUSION2	100C	Industrial	FCBGA	-40C to 100C	180	86316	65nm	1.26(V)	1.2(V)	无	1.14(V)	-40C	有	86316	表面贴装	180	Tray	活跃	M2S090				-40°C ~ 100°C (TJ)	Tray	SmartFusion2																					325										166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA										FPGA - 90K Logic Modules			1 Core	512KB
M2S090T-FGG484I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484	YES	484-FPBGA (23x23)	484	ARM Cortex M3	微芯片技术	SMD/SMT	166 MHz	-	-	64 kB	86316 LE	有	7193 LAB	60	1.2000 V	267	Tray	M2S090	活跃	BGA, BGA484,22X22,40	网格排列	3	PLASTIC/EPOXY	BGA484,22X22,40	1.2 V	40	1.14 V	有	M2S090T-FGG484I	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.78		This product may require additional documentation to export from the United States.	Details	-40 to 100 °C	Tray	SmartFusion2	e1				Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01			CMOS	BOTTOM	BALL	250	1 mm		compliant				S-PBGA-B484	267	不合格		1.2 V					166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		267	2.44 mm	现场可编程门阵列				STD		FPGA - 90K Logic Modules		86316	1 Core	512KB						23 mm	23 mm
M2S050T-FGG896I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	FPBGA-896	YES	896-FBGA (31x31)	896	ARM Cortex M3	微芯片技术	64 kB	56340 LE	有	4695 LAB	27	1.2000 V	377	Tray	M2S050	活跃	BGA, BGA896,30X30,40	网格排列	PLASTIC/EPOXY	BGA896,30X30,40	1.2 V	40	1.14 V	有	M2S050T-FGG896I	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.76	This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	-40 to 100 °C	Tray	SmartFusion2	e1				Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01			CMOS	BOTTOM	BALL	250	1 mm		compliant				S-PBGA-B896	377	不合格		1.2 V					166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		377	2.44 mm	现场可编程门阵列				STD		FPGA - 50K Logic Modules		56340	1 Core	256KB						31 mm	31 mm
M2S090T-FCSG325	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	325-TFBGA, FCBGA	YES	325-FCBGA (11x13.5)	325	ARM Cortex M3	微芯片技术	86316 LE	有	7193 LAB	176	180	Tray	M2S090	活跃	FBGA-325	GRID ARRAY, THIN PROFILE, FINE PITCH	3	PLASTIC/EPOXY	BGA325,21X21,20	1.2 V	1.14 V	85 °C	有	M2S090T-FCSG325	TFBGA	RECTANGULAR	活跃	MICROSEMI CORP	1.26 V	5.78		This product may require additional documentation to export from the United States.	Details	166 MHz	-	-	64 kB	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e1				Tin/Silver/Copper (Sn/Ag/Cu)			LG-MIN, WD-MIN	8542.39.00.01			CMOS	BOTTOM	BALL	250	0.5 mm		compliant		40		R-PBGA-B325	180	不合格		1.2 V	OTHER				166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		180	1.16 mm	现场可编程门阵列						FPGA - 90K Logic Modules		86316	1 Core	512KB						13.5 mm	11 mm
M2S150TS-FCV484I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-BFBGA	YES	484-FBGA (19x19)	484	ARM Cortex M3	微芯片技术	273	Tray	M2S150	活跃	FBGA,	GRID ARRAY, FINE PITCH	PLASTIC/EPOXY	1.2 V	30	1.14 V	无	M2S150TS-FCV484I	FBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.87		This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	146124 LE	有	12177 LAB	84	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0	无			Tin/Lead (Sn/Pb)			LG-MIN,WD-MIN	8542.39.00.01				BOTTOM	BALL	240	0.8 mm		compliant				S-PBGA-B484									166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA			3.15 mm	现场可编程门阵列						FPGA - 150K Logic Modules			1 Core	512KB						19 mm	19 mm
M2S050TS-FG896I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	FPBGA-896	896-FBGA (31x31)	ARM Cortex M3	微芯片技术	This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	56340 LE	有	4695 LAB	27	377	Tray	M2S050	活跃			-40°C ~ 100°C (TJ)	Tray	SmartFusion2																															166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA										FPGA - 50K Logic Modules			1 Core	256KB
M2S005-FGG484I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FPBGA-484	484-FPBGA (23x23)	ARM Cortex M3	微芯片技术	1.26 V	表面贴装	209	活跃	M2S005	Tray	Industrial grade				Details	SMD/SMT	166 MHz	-	-	64 kB	6060 LE	有	505 LAB	60	0.377729 oz	6,060	FPBGA	1.2000 V	1.14 V	209	-40 to 100 °C	Tray	SmartFusion2																					484										166MHz	64KB	ARM® Cortex®-M3	DDR	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA							Industrial	STD		FPGA - 5K Logic Modules			1 Core	128KB
M2S010TS-FGG484	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 1 month ago)	484-BGA	YES	484-FPBGA (23x23)	484	ARM Cortex M3	微芯片技术	-	64 kB	12084 LE	有	1007 LAB	60	233	FLASH	Tray	M2S010	活跃	FBGA-484	网格排列	3	PLASTIC/EPOXY	BGA484,22X22,40	1.2 V	40	1.14 V	85 °C	有	M2S010TS-FGG484	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.82	This product may require additional documentation to export from the United States.	Details	166 MHz	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e1				Tin/Silver/Copper (Sn/Ag/Cu)	85 °C	0 °C		8542.39.00.01			CMOS	BOTTOM	BALL	250	1 mm		compliant	166 MHz			S-PBGA-B484	233	不合格		1.2 V	OTHER		3.6 V	1.4 V	256 kB	166MHz	64 kB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		233	2.44 mm	现场可编程门阵列						FPGA - 10K Logic Modules	85 °C	12084	1 Core	256KB					2.44 mm	23 mm	23 mm
M2S005-1TQG144I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	TQFP-144	144-TQFP (20x20)	ARM Cortex M3	微芯片技术	SMD/SMT	166 MHz	-	-	64 kB	6060 LE	84 I/O	- 40 C	+ 100 C	191 kbit	有	505 LAB	60	0.046530 oz	Tray	M2S005	活跃				This product may require additional documentation to export from the United States.	Details	-40°C ~ 100°C (TJ)	Tray	SmartFusion2																									1.2 V						166MHz	64KB	ARM® Cortex®-M3	-	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA										FPGA - 5K Logic Modules			1 Core	128KB
M2S090TS-1FGG676	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	BGA-676	YES	676-FBGA (27x27)	676	ARM Cortex M3	微芯片技术	SMD/SMT	166 MHz	-	-	64 kB	86316 LE	有	7193 LAB	40	425	Tray	M2S090	活跃	FBGA-676	网格排列	3	PLASTIC/EPOXY	BGA676,26X26,40	1.2 V	40	1.14 V	85 °C	有	M2S090TS-1FGG676	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.81		This product may require additional documentation to export from the United States.	Details	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e1				Tin/Silver/Copper (Sn/Ag/Cu)							CMOS	BOTTOM	BALL	250	1 mm		compliant				S-PBGA-B676	425	不合格		1.2 V	OTHER				166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		425	2.44 mm	现场可编程门阵列						FPGA - 90K Logic Modules		86316	1 Core	512KB						27 mm	27 mm
M2S005-VF256	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	256-LFBGA	256-FPBGA (14x14)	ARM Cortex M3	微芯片技术	This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	6060 LE	有	505 LAB	119	161	Tray	M2S005	活跃				0°C ~ 85°C (TJ)	Tray	SmartFusion2																															166MHz	64KB	ARM® Cortex®-M3	-	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA										FPGA - 5K Logic Modules			1 Core	128KB
M2S150TS-1FCG1152	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FCBGA-1152	1152-FCBGA (35x35)	ARM Cortex M3	微芯片技术	活跃				This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	-	-	64 kB	146124 LE	有	12177 LAB	24	574	Tray	M2S150	0°C ~ 85°C (TJ)	Tray	SmartFusion2																															166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA										FPGA - 150K Logic Modules			1 Core	512KB
M2S060TS-FCS325I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	325-TFBGA, FCBGA	YES	325-FCBGA (11x11)	325	ARM Cortex M3	微芯片技术	56520 LE	有	4710 LAB	176	SmartFusion2	200	Tray	M2S060	活跃	FBGA-325	GRID ARRAY, THIN PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA325,21X21,20	1.2 V	30	1.14 V	无	M2S060TS-FCS325I	TFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.88		This product may require additional documentation to export from the United States.	N	166 MHz	-	-	64 kB	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0				Tin/Lead (Sn/Pb)			LG-MIN, WD-MIN	8542.39.00.01			CMOS	BOTTOM	BALL	240	0.5 mm		not_compliant				S-PBGA-B325	200	不合格		1.2 V					166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		200	1.01 mm	现场可编程门阵列						FPGA - 60K Logic Modules		56520	1 Core	256KB						11 mm	11 mm
M2S025TS-1VFG256	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	VFPBGA-256	YES	256-FPBGA (17x17)	256	ARM Cortex M3	微芯片技术	-	-	64 kB	27696 LE	有	2308 LAB	119	138	Tray	M2S025	活跃	LFBGA, BGA256,16X16,32	GRID ARRAY, LOW PROFILE, FINE PITCH	3	PLASTIC/EPOXY	BGA256,16X16,32	1.2 V	40	1.14 V	85 °C	有	M2S025TS-1VFG256	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.81	This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e1				Tin/Silver/Copper (Sn/Ag/Cu)			LG-MIN, WD-MIN	8542.39.00.01			CMOS	BOTTOM	BALL	250	0.8 mm		compliant				S-PBGA-B256	138	不合格		1.2 V	OTHER				166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		138	1.56 mm	现场可编程门阵列						FPGA - 25K Logic Modules		27696	1 Core	256KB						14 mm	14 mm
M2S010T-1VF256I	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	VFPBGA-256	YES	256-FPBGA (14x14)	256	ARM Cortex M3	微芯片技术	64 kB	12084 LE	有	1007 LAB	119	138	Tray	M2S010	活跃	VFBGA-256	GRID ARRAY, LOW PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA256,16X16,32	1.2 V	30	1.14 V	无	M2S010T-1VF256I	LFBGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.81		This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0				Tin/Lead (Sn/Pb)			LG-MIN, WD-MIN	8542.39.00.01			CMOS	BOTTOM	BALL	240	0.8 mm		not_compliant				S-PBGA-B256	138	不合格		1.2 V					166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		138	1.56 mm	现场可编程门阵列						FPGA - 10K Logic Modules		12084	1 Core	256KB						14 mm	14 mm
M2S090TS-1FCSG325	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FCBGA-325	YES	325-FCBGA (11x13.5)	325	ARM Cortex M3	微芯片技术	-	-	64 kB	86316 LE	有	7193 LAB	176	180	Tray	M2S090	活跃	FBGA-325	GRID ARRAY, THIN PROFILE, FINE PITCH	3	PLASTIC/EPOXY	BGA325,21X21,20	1.2 V	1.14 V	85 °C	有	M2S090TS-1FCSG325	TFBGA	RECTANGULAR	活跃	MICROSEMI CORP	1.26 V	5.81		This product may require additional documentation to export from the United States.	Details	SMD/SMT	166 MHz	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e1				Tin/Silver/Copper (Sn/Ag/Cu)			LG-MIN, WD-MIN	8542.39.00.01			CMOS	BOTTOM	BALL	250	0.5 mm		compliant		40		R-PBGA-B325	180	不合格		1.2 V	OTHER				166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		180	1.16 mm	现场可编程门阵列						FPGA - 90K Logic Modules		86316	1 Core	512KB						13.5 mm	11 mm
M2S060-1VFG400	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	400-LFBGA	400-VFBGA (17x17)	ARM Cortex M3	微芯片技术	This product may require additional documentation to export from the United States.	Details	166 MHz	-	-	64 kB	56520 LE	有	4710 LAB	90	SmartFusion2	207	Tray	M2S060	活跃			0°C ~ 85°C (TJ)	Tray	SmartFusion2																															166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA										FPGA - 60K Logic Modules			1 Core	256KB
M2S025TS-1FG484	Microchip Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	FPBGA-484	484-FPBGA (23x23)	ARM Cortex M3	微芯片技术	M2S025	活跃			This product may require additional documentation to export from the United States.	N	SMD/SMT	166 MHz	-	-	64 kB	27696 LE	有	2308 LAB	60	267	FLASH	Tray	0°C ~ 85°C (TJ)	Tray	SmartFusion2						85 °C	0 °C												166 MHz										3.45 V	1.14 V	256 kB	166MHz	64 kB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA					27696					FPGA - 25K Logic Modules	125 °C		1 Core	256KB					2.44 mm