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产品型号	品牌	数据表	库存	价格(含增值税)	数量	安装类型	包装/外壳	表面安装	供应商器件包装	终端数量															厂商																												操作温度	包装	系列	尺寸/尺寸	容差	零件状态	终止次数	温度系数	类型	电阻	组成	颜色	功率(瓦特)	HTS代码	子类别	技术	电压 - 供电	端子位置	终端形式	峰值回流焊温度（摄氏度）	入口保护	端子间距	样式	Reach合规守则	频率	频率稳定性	输出量	JESD-30代码	功能	基本谐振器	最大电流源	输出的数量	资历状况	失败率	电源	温度等级	电流 - 电源（禁用）（最大值）	速度	内存大小	核心处理器	周边设备	程序内存大小	扩频带宽	连接方式	建筑学	输入数量	座位高度-最大	可编程逻辑类型	产品类别	第一个连接器	第二个连接器	绝对牵引范围 (APR)	主要属性	嵌入式	次要属性	逻辑单元数	核数量	闪光大小
XCZU19EG-3FFVC1760E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BBGA, FCBGA	1760-FCBGA (42.5x42.5)	AMD		512	Tray	XCZU19	活跃			0°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG																																			600MHz, 667MHz, 1.5GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA										Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells					-
AGFA027R24C3E3E	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel		744	Tray	活跃			0°C ~ 100°C (TJ)		Agilex F																																			1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT			EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA										FPGA - 2.7M Logic Elements					-
10AS027H4F35I3LG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FBGA-1152	YES	1152	1	SMD/SMT	33750 LAB	973480	Intel	Intel / Altera	Arria 10 SoC	Details		2 x 32 kB	-	BGA, BGA1152,34X34,40	网格排列	PLASTIC/EPOXY	BGA1152,34X34,40	-40 °C	0.9 V	未说明	0.87 V	100 °C	有	10AS027H4F35I3LG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.43			384	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	270000 LE	-40°C ~ 100°C (TJ)	Tray	Arria 10 SX			活跃								8542.39.00.01	SOC - Systems on a Chip	CMOS		BOTTOM	BALL	未说明		1 mm		compliant				S-PBGA-B1152				384	不合格		0.9 V	INDUSTRIAL		1.5GHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	384	3.5 mm			现场可编程门阵列	SoC FPGA				FPGA - 270K Logic Elements	270000	2 Core	--		SoC FPGA		35 mm	35 mm
AGFA022R25A2I3V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel		624	Tray	活跃			-40°C ~ 100°C (TJ)		Agilex F																																			1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT			EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA										FPGA - 2.2M Logic Elements					-
MPFS250T-1FCSG536T2	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	536-LFBGA	536-BGA (16x16)	微芯片技术		MCU - 136, FPGA - 168	Tray	活跃			-40°C ~ 125°C (TJ)		-																																			-	2.2MB	RISC-V	DMA, PCI, PWM			CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG	MPU, FPGA										FPGA - 254K Logic Modules					128KB
AGIB023R18A2E1V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel		480	Tray	活跃			0°C ~ 100°C (TJ)		Agilex I																																			1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT			EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA										FPGA - 2.3M Logic Elements					-
XC7Z030-2FFG676I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	676-BBGA, FCBGA	676-FCBGA (27x27)	AMD		130	Tray	XC7Z030	活跃			-40°C ~ 100°C (TJ)		Zynq®-7000																																			800MHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA			CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA										Kintex™-7 FPGA, 125K Logic Cells					-
XCZU43DR-1FSVE1156E	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	AMD 赛灵思	活跃				366	0°C ~ 100°C (TJ)																																					500MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe			CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA										Zynq®UltraScale+™ FPGA, 930K+ Logic Cells					-
XCZU43DR-1FFVE1156E	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	AMD 赛灵思	活跃				366	0°C ~ 100°C (TJ)																																					500MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe			CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA										Zynq®UltraScale+™ FPGA, 930K+ Logic Cells					-
AGFA006R16A2E2V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel		384	Tray	活跃			0°C ~ 100°C (TJ)		Agilex F																																			1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT			EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA										FPGA - 573K Logic Elements					-
AGFC023R25A2E2V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel		480	Tray	活跃			0°C ~ 100°C (TJ)		Agilex F																																			1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT			EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA										FPGA - 2.3M Logic Elements					-
XCVM1802-2LLIVFVC1760	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BFBGA, FCBGA	1760-FCBGA (40x40)	AMD		378	Tray	活跃			-40°C ~ 100°C (TJ)		Versal™ Prime																																			450MHz, 1.08GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe			CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA										Versal™ Prime FPGA, 1.9M Logic Cells					-
XCZU5EV-2SFVC784E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	784-BFBGA, FCBGA	784-FCBGA (23x23)	AMD		252	Tray	XCZU5	活跃			0°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EV																																			533MHz, 600MHz, 1.3GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA										Zynq®UltraScale+™ FPGA, 256K+ Logic Cells					-
XCZU5EG-1SFVC784E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	784-BFBGA, FCBGA	784-FCBGA (23x23)	AMD		252	Tray	XCZU5	活跃			0°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG																																			500MHz, 600MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA										Zynq®UltraScale+™ FPGA, 256K+ Logic Cells					-
XCVC1802-2LLIVSVD1760	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	AMD		726	Tray	活跃			-40°C ~ 100°C (TJ)		Versal™ AI Core																																			450MHz, 1.08GHz	256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe			CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA										Versal™ AI Core FPGA, 1.5M Logic Cells					-
XCZU49DR-2FSVF1760I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BBGA, FCBGA	1760-FCBGA (42.5x42.5)	AMD 赛灵思		622	Tray	活跃			-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ RFSoC																																			533MHz, 1.333GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe			CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA										Zynq®UltraScale+™ FPGA, 930K+ Logic Cells					-
XCZU46DR-L2FSVH1760I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BBGA, FCBGA	1760-FCBGA (42.5x42.5)	AMD 赛灵思		574	Tray	活跃			-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ RFSoC																																			533MHz, 1.333GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe			CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA										Zynq®UltraScale+™ FPGA, 930K+ Logic Cells					-
XCZU47DR-1FSVE1156I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	AMD 赛灵思		366	Tray	活跃			-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ RFSoC																																			500MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT			CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA										Zynq®UltraScale+™ FPGA, 930K+ Logic Cells					-
AGFB022R31C2I3V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Amphenol Custom Cable	Male	6 GHz	RG-316	720				Male	Bag	50 Ohms	Q-2I01A0	活跃	-		-									Copper									-		MCX to N-Type															1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT			EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA							MCX Plug, Right Angle	N-Type Plug		FPGA - 2.2M Logic Elements					-	Shielded			39.4 (1.0m) 3.3
AGFA023R25A2E4X	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	表面贴装	4-SMD, No Lead	-	Skyworks Solutions Inc.		Strip	510KBA	活跃	480		-40°C ~ 85°C		Si510	0.197 L x 0.126 W (5.00mm x 3.20mm)					XO (Standard)								1.8V								100 MHz	±25ppm	CMOS		Enable/Disable	Crystal	26mA						18mA	1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA									-	FPGA - 2.3M Logic Elements					-			0.050 (1.28mm)			-
AGFB023R25A2I2V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	TE Connectivity Deutsch 连接器		Bag	DIV46E19	活跃	480			-40°C ~ 100°C (TJ)		*																																			1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT			EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA										FPGA - 2.3M Logic Elements					-
10AS032E1F29E1SG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	780-BBGA, FCBGA	YES	780-FBGA (29x29)	780	Fox Electronics	活跃	360	Non-Compliant	29 X 29 MM, ROHS COMPLIANT, FBGA-780	网格排列	PLASTIC/EPOXY	0.9 V	0.87 V	100 °C	有	10AS032E1F29E1SG	BGA	SQUARE	Intel Corporation	Obsolete	INTEL CORP	0.93 V	5.66		Tape & Reel (TR)	0°C ~ 100°C (TJ)	Tray	*			Discontinued at Digi-Key								8542.39.00.01				BOTTOM	BALL			1 mm		compliant				S-PBGA-B780								OTHER		1.5GHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT			EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		3.35 mm			现场可编程门阵列					FPGA - 320K Logic Elements					--				29 mm	29 mm
10AS027E3F27I2SG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FBGA-672	YES	672	240	Non-Compliant	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	270000 LE	1	SMD/SMT	33750 LAB	964925	Amphenol ICC (Commercial Products)	Intel	Intel / Altera	Arria 10 SoC	2 x 32 kB	-	BGA, BGA672,26X26,40	网格排列	PLASTIC/EPOXY	BGA672,26X26,40	-40 °C	0.9 V	未说明	0.87 V	100 °C	有	10AS027E3F27I2SG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.43			Tray	RJMG2	Obsolete	-40°C ~ 100°C (TJ)	Tray	-			活跃								8542.39.00.01	SOC - Systems on a Chip	CMOS		BOTTOM	BALL	未说明		1 mm		compliant				S-PBGA-B672				240	不合格		0.9 V	INDUSTRIAL		1.5GHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	240	3.25 mm			现场可编程门阵列	SoC FPGA		FPGA - 270K Logic Elements			270000	2 Core	--		SoC FPGA		27 mm	27 mm
10AS032H4F34I3LG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FBGA-1152	YES	1152	384	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	320000 LE	1	SMD/SMT	40000 LAB	965347	Intel	Analog Devices Inc./Maxim Integrated	Intel / Altera	Arria 10 SoC	Details	2 x 32 kB	-	BGA, BGA1152,34X34,40	网格排列	PLASTIC/EPOXY	BGA1152,34X34,40	-40 °C	0.9 V	未说明	0.87 V	100 °C	有	10AS032H4F34I3LG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.45			Box	MAX147	Obsolete	-40°C ~ 100°C (TJ)	Tray	-			活跃			电源管理					8542.39.00.01	SOC - Systems on a Chip	CMOS		BOTTOM	BALL	未说明		1 mm		compliant				S-PBGA-B1152	电池充电器			384	不合格		0.9 V	INDUSTRIAL		1.5GHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	384	3.65 mm	MAX14750	Board(s)	现场可编程门阵列	SoC FPGA		-	-	-	320000	2 Core	--		SoC FPGA		35 mm	35 mm
10AS032E3F27I2SG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Axial	YES	Axial	672	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	320000 LE	1	SMD/SMT	40000 LAB	965290	Intel	Vishay Dale	Intel / Altera	Arria 10 SoC	Details	2 x 32 kB	-	BGA, BGA672,26X26,40	网格排列	PLASTIC/EPOXY	BGA672,26X26,40	-40 °C	0.9 V	未说明	0.87 V	100 °C	有	10AS032E3F27I2SG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.45		Tape & Reel (TR)	ERC55	活跃	240	-65°C ~ 175°C	Tray	ERC	0.097 Dia x 0.280 L (2.46mm x 7.11mm)	±1%	活跃	2	±50ppm/°C		127 kOhms	Metal Film		0.25W, 1/4W	8542.39.00.01	SOC - Systems on a Chip	CMOS		BOTTOM	BALL	未说明		1 mm		compliant				S-PBGA-B672				240	不合格	-	0.9 V	INDUSTRIAL		1.5GHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	240	3.25 mm			现场可编程门阵列	SoC FPGA		FPGA - 320K Logic Elements			320000	2 Core	--	Moisture Resistant	SoC FPGA	-	27 mm	27 mm