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类别是'category.片上系统（SoC）' (7695)

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产品型号	品牌	数据表	库存	价格(含增值税)	数量	安装类型	包装/外壳	表面安装	越来越多的功能	外壳材料	供应商器件包装	插入材料	终端数量	后壳材料，电镀	第一种连接器安装类型	第二个连接器安装类型																				厂商																																	操作温度	包装	系列	尺寸/尺寸	容差	零件状态	终止次数	终端	温度系数	连接器类型	电阻	定位的数量	组成	颜色	应用	功率(瓦特)	HTS代码	紧固类型	子类别	额定电流	技术	端子位置	方向	终端形式	屏蔽/屏蔽	峰值回流焊温度（摄氏度）	入口保护	端子间距	样式	Reach合规守则	外壳完成	外壳尺寸-插入	JESD-30代码	功能	输出的数量	资历状况	电压 - 输入（最大值）	输出类型	工作电源电压	电压 - 输入（最小值）	失败率	电源	温度等级	速度	输出配置	内存大小	外壳尺寸，MIL	输出电流	核心处理器	周边设备	程序内存大小	连接方式	电缆开口	电压 - 输出（最小值/固定）	拓扑	建筑学	频率开关	输入数量	座位高度-最大	可编程逻辑类型	同步整流器	产品类别	第一个连接器	第二个连接器	收发器数量	主要属性
10AS057K4F40I3SG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	0805 (2012 Metric)	YES	0805	1517	1.2 GHz	570000 LE	2.081634 oz	1	SMD/SMT	71250 LAB	965313	Intel	Intel / Altera	Arria 10 SoC	Details	2 x 32 kB	KOA Speer Electronics, Inc.	-	BGA, BGA1517,39X39,40	网格排列	PLASTIC/EPOXY	BGA1517,39X39,40	-40 °C	0.9 V	未说明	0.87 V	100 °C	有	10AS057K4F40I3SG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.47								Tape & Reel (TR)	RN732A	Obsolete	696	有	This product may require additional documentation to export from the United States.	2 x 32 kB	-55°C ~ 155°C	Tray	RN73	0.079 L x 0.049 W (2.00mm x 1.25mm)	±0.1%	活跃	2		±10ppm/°C		448 Ohms		Thin Film			0.1W, 1/10W	8542.39.00.01		SOC - Systems on a Chip		CMOS	BOTTOM		BALL		未说明		1 mm		compliant			S-PBGA-B1517		696	不合格						0.9 V	INDUSTRIAL	1.5GHz		256KB			Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA		696	3.5 mm	现场可编程门阵列		SoC FPGA					FPGA - 570K Logic Elements	570000	2 Core	--	Moisture Resistant	SoC FPGA	0.024 (0.60mm)	40 mm	40 mm
10AS032H2F34I2LG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	FBGA-1152	YES	1152	面板安装	Free Hanging (In-Line)	50 Ohms	Q-260270	Bulkhead - Front Side Nut	活跃	Female	6 GHz	-	LMR 240	384	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	320000 LE	1	SMD/SMT	40000 LAB	Amphenol Custom Cable	965294	Intel	Intel / Altera	Arria 10 SoC	Details	2 x 32 kB	-	BGA, BGA1152,34X34,40	网格排列	PLASTIC/EPOXY	BGA1152,34X34,40	-40 °C	0.9 V	未说明	0.87 V	100 °C	有	10AS032H2F34I2LG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.45							Female	Bag	-	Tray	-			活跃								Black			8542.39.00.01		SOC - Systems on a Chip		CMOS	BOTTOM		BALL		未说明	-	1 mm	N-Type to N-Type	compliant			S-PBGA-B1152		384	不合格						0.9 V	INDUSTRIAL	1.5GHz		256KB			Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA		384	3.65 mm	现场可编程门阵列		SoC FPGA	N-Type Jack	N-Type Jack			FPGA - 320K Logic Elements	320000	2 Core	--	Shielded	SoC FPGA	98.4 (2.5m) 8.2	35 mm
10AS022C3U19E2SG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1206 (3216 Metric)	YES	1206	484	1.2 GHz	220000 LE	0.423288 oz	1	SMD/SMT	27500 LAB	964699	Intel	Intel / Altera	Arria 10 SoC	2 x 32 kB	Vishay Dale	-	FBGA, BGA484,22X22,32	GRID ARRAY, FINE PITCH	PLASTIC/EPOXY	BGA484,22X22,32	0.9 V	未说明	0.87 V	100 °C	有	10AS022C3U19E2SG	FBGA	SQUARE	活跃	INTEL CORP	0.93 V	5.47								Tape & Reel (TR)	TNPW1206	活跃	192	Non-Compliant	有	This product may require additional documentation to export from the United States.	2 x 32 kB	-55°C ~ 155°C	Tray	TNPW e3	0.126 L x 0.063 W (3.20mm x 1.60mm)	±0.5%	活跃	2		±25ppm/°C		5.36 kOhms		Thin Film			0.25W, 1/4W	8542.39.00.01		SOC - Systems on a Chip		CMOS	BOTTOM		BALL		未说明		0.8 mm		compliant			S-PBGA-B484		192	不合格					-	0.9 V	OTHER	1.5GHz		256KB			Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA		192	3.25 mm	现场可编程门阵列		SoC FPGA					FPGA - 220K Logic Elements	220000	2 Core	--	Anti-Sulfur, Automotive AEC-Q200, Moisture Resistant	SoC FPGA	0.026 (0.65mm)	19 mm	19 mm			AEC-Q200
10AS048K2F35E1SG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Free Hanging (In-Line)	1152-BBGA, FCBGA	YES	-	Aluminum Die Cast, Brass	1152-FBGA (35x35)	Synthetic Resin	1152	-	Hirose Electric Co Ltd		300VAC, 420VDC	Bag	Metal	最后一次购买	Brass	Silver	396	35 X 35 MM, ROHS COMPLIANT, FBGA-1152	网格排列	PLASTIC/EPOXY	BGA1152,34X34,40	0.9 V	未说明	0.87 V	100 °C	有	10AS048K2F35E1SG	BGA	SQUARE	Intel Corporation	Obsolete	INTEL CORP	0.93 V	5.68		-40°C ~ 75°C	Tray	MF25			Discontinued at Digi-Key		焊杯		Plug, Female Sockets		5 (3 + 2 Fiber Optic)		Black	Transportation		8542.39.00.01	Threaded	现场可编程门阵列	30A	CMOS	BOTTOM	Keyed	BALL	Unshielded	未说明	IP67 - Dust Tight, Waterproof	1 mm		compliant	黑铬	-	S-PBGA-B1152		396	不合格						0.9 V	OTHER	1.5GHz		256KB	-		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	-			MCU, FPGA		396	3.5 mm	现场可编程门阵列							FPGA - 480K Logic Elements	480000		--	Backshell, Cable Clamp, Coupling Nut			35 mm	35 mm	-	UL94 V-0
10AS057N2F40I2LG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	YES	1517-FCBGA (40x40)	1517	570000 LE	21	SMD/SMT	71250 LAB	965071	Intel	Intel / Altera	Arria 10 SoC	Details	2 x 32 kB	-	Molex	BGA, BGA1517,39X39,40	网格排列	PLASTIC/EPOXY	BGA1517,39X39,40	-40 °C	0.9 V	未说明	0.87 V	100 °C	有	10AS057N2F40I2LG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.45								Bulk	120069	活跃	588	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	-40°C ~ 100°C (TJ)	Tray	*			活跃											8542.39.00.01		SOC - Systems on a Chip		CMOS	BOTTOM		BALL		未说明		1 mm		compliant			S-PBGA-B1517		588	不合格						0.9 V	INDUSTRIAL	1.5GHz		256KB			Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA		588	3.5 mm	现场可编程门阵列		SoC FPGA					FPGA - 570K Logic Elements	570000	2 Core	--		SoC FPGA		40 mm	40 mm
10AS057K1F40I1SG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	YES	1517-FCBGA (40x40)	1517	Ohmite		Tape & Reel (TR)	Obsolete	696	40 X 40 MM, ROHS COMPLIANT, FBGA-1517	网格排列	PLASTIC/EPOXY	-40 °C	0.9 V	0.87 V	100 °C	有	10AS057K1F40I1SG	BGA	SQUARE	Intel Corporation	Obsolete	INTEL CORP	0.93 V	5.66							-40°C ~ 100°C (TJ)	Tray	-			Discontinued at Digi-Key											8542.39.00.01					BOTTOM		BALL				1 mm		compliant			S-PBGA-B1517										INDUSTRIAL	1.5GHz		256KB			Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA			3.5 mm	现场可编程门阵列							FPGA - 570K Logic Elements			--				40 mm	40 mm
10AS066K2F40I2LG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	表面贴装	8-SOIC (0.154, 3.90mm Width)	YES	8-SOIC	1517	21	SMD/SMT	82500 LAB	973539	Intel	Intel / Altera	Arria 10 SoC	Details	2 x 32 kB	-	Analog Devices Inc./Maxim Integrated	BGA, BGA1517,39X39,40	网格排列	PLASTIC/EPOXY	BGA1517,39X39,40	-40 °C	0.9 V	未说明	0.87 V	100 °C	有	10AS066K2F40I2LG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.44							Tape & Reel (TR)	MAX858	活跃	696	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	660000 LE	-40°C ~ 85°C (TA)	Tray	-			活跃											8542.39.00.01		SOC - Systems on a Chip		CMOS	BOTTOM		BALL		未说明		1 mm		compliant			S-PBGA-B1517	Step-Up	1	不合格	6V	可编程		0.8V		0.9 V	INDUSTRIAL	1.5GHz	Positive	256KB		125mA (Switch)	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		3.3V, 5V	提升	MCU, FPGA	500kHz	696	3.5 mm	现场可编程门阵列	无	SoC FPGA			-		FPGA - 660K Logic Elements	660000	2 Core	--		SoC FPGA		40 mm	40 mm
10AS057K3F40I2SG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	YES	1517-FCBGA (40x40)	1517	71250 LAB	SMD/SMT	21	570000 LE	1.2 GHz	2 x 32 kB	This product may require additional documentation to export from the United States.	有	BGA,	Souriau-Sunbank by Eaton	网格排列	PLASTIC/EPOXY	-40 °C	0.9 V	0.87 V	100 °C	有	10AS057K3F40I2SG	BGA	SQUARE	活跃	IC SOC CORTEX-A9 1.5GHZ 1517FBGA	INTEL CORP	0.93 V	5.45								Bag	活跃	696	-	2 x 32 kB	Details	Arria 10 SoC	Intel / Altera	Intel	964985	-40°C ~ 100°C (TJ)	Tray	*			活跃											8542.39.00.01		SOC - Systems on a Chip			BOTTOM		BALL				1 mm		compliant			S-PBGA-B1517										INDUSTRIAL	1.5GHz		256KB			Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA			3.5 mm	现场可编程门阵列		SoC FPGA					FPGA - 570K Logic Elements		2 Core	--		SoC FPGA		40 mm	40 mm
10AS066K2F40I2SG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	YES	1517-FBGA (40x40)	1517	SMD/SMT	82500 LAB	967193	Intel	Intel / Altera	Arria 10 SoC	Details	2 x 32 kB	-	Molex	BGA,	网格排列	PLASTIC/EPOXY	-40 °C	0.9 V	0.87 V	100 °C	有	10AS066K2F40I2SG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.46								Bulk	085639	活跃	696	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	660000 LE	1	-40°C ~ 100°C (TJ)	Tray	*			活跃											8542.39.00.01		SOC - Systems on a Chip			BOTTOM		BALL				1 mm		compliant			S-PBGA-B1517										INDUSTRIAL	1.5GHz		256KB			Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA			3.5 mm	现场可编程门阵列		SoC FPGA					FPGA - 660K Logic Elements		2 Core	--		SoC FPGA		40 mm	40 mm
10AS066H3F34E2SG	ALTERA	数据表	188 In Stock	-	最小起订量: 1 最小包装量: 1	1152-BBGA, FCBGA	YES	1152-FCBGA (35x35)	1152	+ 100 C	0 C	24	SMD/SMT	82500 LAB	964989	Intel	Intel / Altera	Arria 10 SoC	Details	2 x 32 kB	Panduit Corp	-	BGA, BGA1152,34X34,40	网格排列	PLASTIC/EPOXY	BGA1152,34X34,40	0.9 V	未说明	0.87 V	100 °C	有	10AS066H3F34E2SG	BGA	SQUARE	活跃	INTEL CORP	0.93 V	5.45								Obsolete	Bulk	492	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	660000 LE	0°C ~ 100°C (TJ)	Tray	-			活跃											8542.39.00.01		SOC - Systems on a Chip		CMOS	BOTTOM		BALL		未说明		1 mm		compliant			S-PBGA-B1152		492	不合格			900 mV			0.9 V	OTHER	1.5GHz		256KB			Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA		492	3.65 mm	现场可编程门阵列		SoC FPGA				24 Transceiver	FPGA - 660K Logic Elements	660000	2 Core	--		SoC FPGA		35 mm	35 mm
10AS057K4F35E3SG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1152-BBGA, FCBGA	YES	1152-FCBGA (35x35)	1152	Molex						Bulk	015266	活跃	396	BGA, BGA1152,34X34,40	网格排列	PLASTIC/EPOXY	BGA1152,34X34,40	0.9 V	未说明	0.87 V	100 °C	有	10AS057K4F35E3SG	BGA	SQUARE	Intel Corporation	活跃	INTEL CORP	0.93 V	5.45			0°C ~ 100°C (TJ)	Tray	Premo-Flex 15266			活跃											8542.39.00.01		现场可编程门阵列		CMOS	BOTTOM		BALL		未说明		1 mm		compliant			S-PBGA-B1152		396	不合格						0.9 V	OTHER	1.5GHz		256KB			Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA		396	3.5 mm	现场可编程门阵列							FPGA - 570K Logic Elements	570000		--				35 mm	35 mm
XCVH1582-2LLELSVA4737	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1		Xilinx	Xilinx												+ 110 C	0 C																			SOC - Systems on a Chip																				700 mV																							System-On-Modules - SOM										SoC FPGA
XCZU57DR-2FSVE1156I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	AMD 赛灵思										1	Xilinx	Xilinx	-	Tray	活跃	-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ RFSoC DR																SOC - Systems on a Chip																									533MHz, 1.3GHz		-			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MPU, FPGA										Zynq® UltraScale+™ RFSoC			-		SoC FPGA
XC7Z010-3CLG400E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	400-LFBGA, CSPBGA	400-CSPBGA (17x17)	AMD		130	Tray	XC7Z010	活跃									0°C ~ 100°C (TJ)		Zynq®-7000																																									866MHz		256KB			Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA											Artix™-7 FPGA, 28K Logic Cells			-
AGFB022R24C3I3E	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel										744	Tray	活跃	-40°C ~ 100°C (TJ)		Agilex F																																									1.4GHz		256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MPU, FPGA											FPGA - 2.2M Logic Elements			-
AGFA008R16A2E3E	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel										384	Tray	活跃	0°C ~ 100°C (TJ)		Agilex F																																									1.4GHz		256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MPU, FPGA											FPGA - 764K Logic Elements			-
XCVM1802-2MSIVFVC1760-5189	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1		Xilinx	Xilinx												+ 110 C	- 40 C																			SOC - Systems on a Chip																				800 mV																							System-On-Modules - SOM										SoC FPGA
XCZU5EG-3SFVC784E	AMD	数据表	328 In Stock	-	最小起订量: 1 最小包装量: 1	784-BFBGA, FCBGA	784-FCBGA (23x23)	AMD		252	Tray	XCZU5	活跃									0°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG																																									600MHz, 1.5GHz		256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA											Zynq®UltraScale+™ FPGA, 256K+ Logic Cells			-
XC7Z010-1CLG400C	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	400-LFBGA, CSPBGA	400-CSPBGA (17x17)	AMD		130	Tray	XC7Z010	活跃									0°C ~ 85°C (TJ)		Zynq®-7000																																									667MHz		256KB			Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA											Artix™-7 FPGA, 28K Logic Cells			-
XCVC1802-1LSIVSVA2197	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	2197-BFBGA, FCBGA	2197-FCBGA (45x45)	AMD 赛灵思					770	活跃						-40°C ~ 100°C (TJ)																																											400MHz, 1GHz		256KB			Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MPU, FPGA											Versal™ AI Core FPGA, 1.5M Logic Cells			-
XC7Z030-1SBG485C	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-FBGA, FCBGA	484-FCBGA (19x19)	AMD		130	Tray	XC7Z030	活跃									0°C ~ 85°C (TJ)		Zynq®-7000																																									667MHz		256KB			Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA											Kintex™-7 FPGA, 125K Logic Cells			-
XCZU7EG-1FBVB900E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	900-BBGA, FCBGA	900-FCBGA (31x31)	AMD		204	Tray	XCZU7	活跃									0°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG																																									500MHz, 600MHz, 1.2GHz		256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA											Zynq®UltraScale+™ FPGA, 504K+ Logic Cells			-
AGFA022R31C2I2V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel										720	Tray	活跃	-40°C ~ 100°C (TJ)		Agilex F																																									1.4GHz		256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MPU, FPGA											FPGA - 2.2M Logic Elements			-
XCZU15EG-2FFVB1156E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	AMD		328	Tray	XCZU15	活跃									0°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG																																									533MHz, 600MHz, 1.3GHz		256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA											Zynq®UltraScale+™ FPGA, 747K+ Logic Cells			-
XCZU2EG-3SFVC784E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	784-BFBGA, FCBGA	784-FCBGA (23x23)	AMD										252	Tray	Obsolete	0°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG																																									600MHz, 667MHz, 1.5GHz		256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA											Zynq®UltraScale+™ FPGA, 103K+ Logic Cells			-