类别是'category.片上系统(SoC)' (7695)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 安装类型 | 包装/外壳 | 表面安装 | 越来越多的功能 | 外壳材料 | 供应商器件包装 | 插入材料 | 终端数量 | 后壳材料,电镀 | 第一种连接器安装类型 | 第二个连接器安装类型 | 厂商 | 操作温度 | 包装 | 系列 | 尺寸/尺寸 | 容差 | 零件状态 | 终止次数 | 终端 | 温度系数 | 连接器类型 | 电阻 | 定位的数量 | 组成 | 颜色 | 应用 | 功率(瓦特) | HTS代码 | 紧固类型 | 子类别 | 额定电流 | 技术 | 端子位置 | 方向 | 终端形式 | 屏蔽/屏蔽 | 峰值回流焊温度(摄氏度) | 入口保护 | 端子间距 | 样式 | Reach合规守则 | 外壳完成 | 外壳尺寸-插入 | JESD-30代码 | 功能 | 输出的数量 | 资历状况 | 电压 - 输入(最大值) | 输出类型 | 工作电源电压 | 电压 - 输入(最小值) | 失败率 | 电源 | 温度等级 | 速度 | 输出配置 | 内存大小 | 外壳尺寸,MIL | 输出电流 | 核心处理器 | 周边设备 | 程序内存大小 | 连接方式 | 电缆开口 | 电压 - 输出(最小值/固定) | 拓扑 | 建筑学 | 频率开关 | 输入数量 | 座位高度-最大 | 可编程逻辑类型 | 同步整流器 | 产品类别 | 第一个连接器 | 第二个连接器 | 电压 - 输出(最大值) | 收发器数量 | 主要属性 | 逻辑单元数 | 核数量 | 闪光大小 | 特征 | 产品类别 | 座位高度(最大) | 长度 | 宽度 | 触点表面处理厚度 - 配套 | 材料可燃性等级 | 评级结果 | |||||||||||||||||||||||||||||||||||||||||||||||||||
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![]() | 10AS057K4F40I3SG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 0805 (2012 Metric) | YES | 0805 | 1517 | 1.2 GHz | 570000 LE | 2.081634 oz | 1 | SMD/SMT | 71250 LAB | 965313 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | KOA Speer Electronics, Inc. | - | BGA, BGA1517,39X39,40 | 网格排列 | PLASTIC/EPOXY | BGA1517,39X39,40 | -40 °C | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS057K4F40I3SG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.47 | Tape & Reel (TR) | RN732A | Obsolete | 696 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | -55°C ~ 155°C | Tray | RN73 | 0.079 L x 0.049 W (2.00mm x 1.25mm) | ±0.1% | 活跃 | 2 | ±10ppm/°C | 448 Ohms | Thin Film | 0.1W, 1/10W | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1517 | 696 | 不合格 | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 696 | 3.5 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 570K Logic Elements | 570000 | 2 Core | -- | Moisture Resistant | SoC FPGA | 0.024 (0.60mm) | 40 mm | 40 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS032H2F34I2LG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FBGA-1152 | YES | 1152 | 面板安装 | Free Hanging (In-Line) | 50 Ohms | Q-260270 | Bulkhead - Front Side Nut | 活跃 | Female | 6 GHz | - | LMR 240 | 384 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 320000 LE | 1 | SMD/SMT | 40000 LAB | Amphenol Custom Cable | 965294 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | - | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | -40 °C | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS032H2F34I2LG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.45 | Female | Bag | - | Tray | - | 活跃 | Black | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | - | 1 mm | N-Type to N-Type | compliant | S-PBGA-B1152 | 384 | 不合格 | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 384 | 3.65 mm | 现场可编程门阵列 | SoC FPGA | N-Type Jack | N-Type Jack | FPGA - 320K Logic Elements | 320000 | 2 Core | -- | Shielded | SoC FPGA | 98.4 (2.5m) 8.2 | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS022C3U19E2SG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1206 (3216 Metric) | YES | 1206 | 484 | 1.2 GHz | 220000 LE | 0.423288 oz | 1 | SMD/SMT | 27500 LAB | 964699 | Intel | Intel / Altera | Arria 10 SoC | 2 x 32 kB | Vishay Dale | - | FBGA, BGA484,22X22,32 | GRID ARRAY, FINE PITCH | PLASTIC/EPOXY | BGA484,22X22,32 | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS022C3U19E2SG | FBGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.47 | Tape & Reel (TR) | TNPW1206 | 活跃 | 192 | Non-Compliant | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | -55°C ~ 155°C | Tray | TNPW e3 | 0.126 L x 0.063 W (3.20mm x 1.60mm) | ±0.5% | 活跃 | 2 | ±25ppm/°C | 5.36 kOhms | Thin Film | 0.25W, 1/4W | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 0.8 mm | compliant | S-PBGA-B484 | 192 | 不合格 | - | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 192 | 3.25 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 220K Logic Elements | 220000 | 2 Core | -- | Anti-Sulfur, Automotive AEC-Q200, Moisture Resistant | SoC FPGA | 0.026 (0.65mm) | 19 mm | 19 mm | AEC-Q200 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS048K2F35E1SG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Free Hanging (In-Line) | 1152-BBGA, FCBGA | YES | - | Aluminum Die Cast, Brass | 1152-FBGA (35x35) | Synthetic Resin | 1152 | - | Hirose Electric Co Ltd | 300VAC, 420VDC | Bag | Metal | 最后一次购买 | Brass | Silver | 396 | 35 X 35 MM, ROHS COMPLIANT, FBGA-1152 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS048K2F35E1SG | BGA | SQUARE | Intel Corporation | Obsolete | INTEL CORP | 0.93 V | 5.68 | -40°C ~ 75°C | Tray | MF25 | Discontinued at Digi-Key | 焊杯 | Plug, Female Sockets | 5 (3 + 2 Fiber Optic) | Black | Transportation | 8542.39.00.01 | Threaded | 现场可编程门阵列 | 30A | CMOS | BOTTOM | Keyed | BALL | Unshielded | 未说明 | IP67 - Dust Tight, Waterproof | 1 mm | compliant | 黑铬 | - | S-PBGA-B1152 | 396 | 不合格 | 0.9 V | OTHER | 1.5GHz | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MCU, FPGA | 396 | 3.5 mm | 现场可编程门阵列 | FPGA - 480K Logic Elements | 480000 | -- | Backshell, Cable Clamp, Coupling Nut | 35 mm | 35 mm | - | UL94 V-0 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS057N2F40I2LG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | YES | 1517-FCBGA (40x40) | 1517 | 570000 LE | 21 | SMD/SMT | 71250 LAB | 965071 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | - | Molex | BGA, BGA1517,39X39,40 | 网格排列 | PLASTIC/EPOXY | BGA1517,39X39,40 | -40 °C | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS057N2F40I2LG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.45 | Bulk | 120069 | 活跃 | 588 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | -40°C ~ 100°C (TJ) | Tray | * | 活跃 | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1517 | 588 | 不合格 | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 588 | 3.5 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 570K Logic Elements | 570000 | 2 Core | -- | SoC FPGA | 40 mm | 40 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS057K1F40I1SG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | YES | 1517-FCBGA (40x40) | 1517 | Ohmite | Tape & Reel (TR) | Obsolete | 696 | 40 X 40 MM, ROHS COMPLIANT, FBGA-1517 | 网格排列 | PLASTIC/EPOXY | -40 °C | 0.9 V | 0.87 V | 100 °C | 有 | 10AS057K1F40I1SG | BGA | SQUARE | Intel Corporation | Obsolete | INTEL CORP | 0.93 V | 5.66 | -40°C ~ 100°C (TJ) | Tray | - | Discontinued at Digi-Key | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1517 | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3.5 mm | 现场可编程门阵列 | FPGA - 570K Logic Elements | -- | 40 mm | 40 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS066K2F40I2LG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | 8-SOIC | 1517 | 21 | SMD/SMT | 82500 LAB | 973539 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | - | Analog Devices Inc./Maxim Integrated | BGA, BGA1517,39X39,40 | 网格排列 | PLASTIC/EPOXY | BGA1517,39X39,40 | -40 °C | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS066K2F40I2LG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.44 | Tape & Reel (TR) | MAX858 | 活跃 | 696 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 660000 LE | -40°C ~ 85°C (TA) | Tray | - | 活跃 | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1517 | Step-Up | 1 | 不合格 | 6V | 可编程 | 0.8V | 0.9 V | INDUSTRIAL | 1.5GHz | Positive | 256KB | 125mA (Switch) | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 3.3V, 5V | 提升 | MCU, FPGA | 500kHz | 696 | 3.5 mm | 现场可编程门阵列 | 无 | SoC FPGA | - | FPGA - 660K Logic Elements | 660000 | 2 Core | -- | SoC FPGA | 40 mm | 40 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS057K3F40I2SG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | YES | 1517-FCBGA (40x40) | 1517 | 71250 LAB | SMD/SMT | 21 | 570000 LE | 1.2 GHz | 2 x 32 kB | This product may require additional documentation to export from the United States. | 有 | BGA, | Souriau-Sunbank by Eaton | 网格排列 | PLASTIC/EPOXY | -40 °C | 0.9 V | 0.87 V | 100 °C | 有 | 10AS057K3F40I2SG | BGA | SQUARE | 活跃 | IC SOC CORTEX-A9 1.5GHZ 1517FBGA | INTEL CORP | 0.93 V | 5.45 | Bag | 活跃 | 696 | - | 2 x 32 kB | Details | Arria 10 SoC | Intel / Altera | Intel | 964985 | -40°C ~ 100°C (TJ) | Tray | * | 活跃 | 8542.39.00.01 | SOC - Systems on a Chip | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1517 | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3.5 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 570K Logic Elements | 2 Core | -- | SoC FPGA | 40 mm | 40 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS066K2F40I2SG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | YES | 1517-FBGA (40x40) | 1517 | SMD/SMT | 82500 LAB | 967193 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | - | Molex | BGA, | 网格排列 | PLASTIC/EPOXY | -40 °C | 0.9 V | 0.87 V | 100 °C | 有 | 10AS066K2F40I2SG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.46 | Bulk | 085639 | 活跃 | 696 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 660000 LE | 1 | -40°C ~ 100°C (TJ) | Tray | * | 活跃 | 8542.39.00.01 | SOC - Systems on a Chip | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1517 | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3.5 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 660K Logic Elements | 2 Core | -- | SoC FPGA | 40 mm | 40 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS066H3F34E2SG | ALTERA | 数据表 | 188 In Stock | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 1152 | + 100 C | 0 C | 24 | SMD/SMT | 82500 LAB | 964989 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | Panduit Corp | - | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS066H3F34E2SG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.45 | Obsolete | Bulk | 492 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 660000 LE | 0°C ~ 100°C (TJ) | Tray | - | 活跃 | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1152 | 492 | 不合格 | 900 mV | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 492 | 3.65 mm | 现场可编程门阵列 | SoC FPGA | 24 Transceiver | FPGA - 660K Logic Elements | 660000 | 2 Core | -- | SoC FPGA | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS057K4F35E3SG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 1152 | Molex | Bulk | 015266 | 活跃 | 396 | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS057K4F35E3SG | BGA | SQUARE | Intel Corporation | 活跃 | INTEL CORP | 0.93 V | 5.45 | 0°C ~ 100°C (TJ) | Tray | Premo-Flex 15266 | 活跃 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1152 | 396 | 不合格 | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 396 | 3.5 mm | 现场可编程门阵列 | FPGA - 570K Logic Elements | 570000 | -- | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVH1582-2LLELSVA4737 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1 | Xilinx | Xilinx | + 110 C | 0 C | SOC - Systems on a Chip | 700 mV | System-On-Modules - SOM | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU57DR-2FSVE1156I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD 赛灵思 | 1 | Xilinx | Xilinx | - | Tray | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC DR | SOC - Systems on a Chip | 533MHz, 1.3GHz | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq® UltraScale+™ RFSoC | - | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7Z010-3CLG400E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 400-LFBGA, CSPBGA | 400-CSPBGA (17x17) | AMD | 130 | Tray | XC7Z010 | 活跃 | 0°C ~ 100°C (TJ) | Zynq®-7000 | 866MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Artix™-7 FPGA, 28K Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFB022R24C3I3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 744 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA008R16A2E3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 384 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 764K Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1802-2MSIVFVC1760-5189 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1 | Xilinx | Xilinx | + 110 C | - 40 C | SOC - Systems on a Chip | 800 mV | System-On-Modules - SOM | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU5EG-3SFVC784E | AMD | 数据表 | 328 In Stock | - | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | AMD | 252 | Tray | XCZU5 | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 600MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7Z010-1CLG400C | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 400-LFBGA, CSPBGA | 400-CSPBGA (17x17) | AMD | 130 | Tray | XC7Z010 | 活跃 | 0°C ~ 85°C (TJ) | Zynq®-7000 | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Artix™-7 FPGA, 28K Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1802-1LSIVSVA2197 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD 赛灵思 | 770 | 活跃 | -40°C ~ 100°C (TJ) | 400MHz, 1GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7Z030-1SBG485C | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 484-FBGA, FCBGA | 484-FCBGA (19x19) | AMD | 130 | Tray | XC7Z030 | 活跃 | 0°C ~ 85°C (TJ) | Zynq®-7000 | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 125K Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU7EG-1FBVB900E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | 204 | Tray | XCZU7 | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA022R31C2I2V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 720 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU15EG-2FFVB1156E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | 328 | Tray | XCZU15 | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 747K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU2EG-3SFVC784E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | AMD | 252 | Tray | Obsolete | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 600MHz, 667MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - |
10AS057K4F40I3SG
ALTERA
分类:Embedded - System On Chip (SoC)
10AS032H2F34I2LG
ALTERA
分类:Embedded - System On Chip (SoC)
10AS022C3U19E2SG
ALTERA
分类:Embedded - System On Chip (SoC)
10AS048K2F35E1SG
ALTERA
分类:Embedded - System On Chip (SoC)
10AS057N2F40I2LG
ALTERA
分类:Embedded - System On Chip (SoC)
10AS057K1F40I1SG
ALTERA
分类:Embedded - System On Chip (SoC)
10AS066K2F40I2LG
ALTERA
分类:Embedded - System On Chip (SoC)
10AS057K3F40I2SG
ALTERA
分类:Embedded - System On Chip (SoC)
10AS066K2F40I2SG
ALTERA
分类:Embedded - System On Chip (SoC)
10AS066H3F34E2SG
ALTERA
分类:Embedded - System On Chip (SoC)
10AS057K4F35E3SG
ALTERA
分类:Embedded - System On Chip (SoC)
XCVH1582-2LLELSVA4737
Xilinx
分类:Embedded - System On Chip (SoC)
XCZU57DR-2FSVE1156I
Xilinx
分类:Embedded - System On Chip (SoC)
XC7Z010-3CLG400E
AMD
分类:Embedded - System On Chip (SoC)
AGFB022R24C3I3E
Intel
分类:Embedded - System On Chip (SoC)
AGFA008R16A2E3E
Intel
分类:Embedded - System On Chip (SoC)
XCVM1802-2MSIVFVC1760-5189
Xilinx
分类:Embedded - System On Chip (SoC)
XCZU5EG-3SFVC784E
AMD
分类:Embedded - System On Chip (SoC)
XC7Z010-1CLG400C
AMD
分类:Embedded - System On Chip (SoC)
XCVC1802-1LSIVSVA2197
Xilinx
分类:Embedded - System On Chip (SoC)
XC7Z030-1SBG485C
AMD
分类:Embedded - System On Chip (SoC)
XCZU7EG-1FBVB900E
AMD
分类:Embedded - System On Chip (SoC)
AGFA022R31C2I2V
Intel
分类:Embedded - System On Chip (SoC)
XCZU15EG-2FFVB1156E
AMD
分类:Embedded - System On Chip (SoC)
XCZU2EG-3SFVC784E
AMD
分类:Embedded - System On Chip (SoC)
