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类别是'category.片上系统（SoC）' (7695)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 包装/外壳 | 表面安装 | 供应商器件包装 | 终端数量 | 厂商 | 操作温度 | 包装 | 系列 | JESD-609代码 | 零件状态 | 端子表面处理 | HTS代码 | 子类别 | 技术 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 端子间距 | Reach合规守则 | 基本部件号 | JESD-30代码 | 输出的数量 | 资历状况 | 电源 | 温度等级 | 速度 | 内存大小 | uPs/uCs/外围ICs类型 | 核心处理器 | 周边设备 | 连接方式 | 建筑学 | 输入数量 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | 边界扫描 | 低功率模式 | 格式 | 集成缓存 | 主要属性 | 逻辑块数量 | 逻辑单元数 | 闪光大小 | 长度 | 宽度 | ||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | XCVM1502-2MLEVFVC1760 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | AMD | Tray | 活跃 | * | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AGIB027R31B2E2VAA | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 活跃 | 720 | Tray | 0°C ~ 100°C (TJ) | Agilex I | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU17EG-2FFVD1760I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | AMD | 308 | Tray | XCZU17 | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVC1902-1LSIVSVA2197-ES9748 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU5EV-1FBVB900E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | 204 | Tray | XCZU5 | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EV | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU7EV-2FFVC1156E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | 360 | Tray | XCZU7 | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EV | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| AGFA027R25A2I3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 活跃 | 624 | Tray | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AGIB019R18A1E2V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 活跃 | 480 | Tray | 0°C ~ 100°C (TJ) | Agilex I | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z020-3CLG400E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 400-LFBGA, CSPBGA | 400-CSPBGA (17x17) | AMD | 130 | Tray | XC7Z020 | 活跃 | 0°C ~ 100°C (TJ) | Zynq®-7000 | 866MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Artix™-7 FPGA, 85K Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU6EG-1FFVB1156E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | 328 | Tray | XCZU6 | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| AGFB022R24C2I3V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 活跃 | 744 | Tray | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU1CG-1SFVA625E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | AMD | 活跃 | - | Tray | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | MPU, FPGA | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU7EV-2FFVF1517E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD | 464 | Tray | XCZU7 | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EV | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| AGFB006R24C2E3V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 576 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 573K Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AGFB012R24C2E3V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 744 | 活跃 | Tray | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.2M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVE1752-1MSINSVG1369 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | AMD | Tray | 活跃 | * | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AGFB006R16A2E4X | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 活跃 | 384 | Tray | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 573K Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 5CSEBA4U19C6N | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 484-FBGA | YES | 484-UBGA (19x19) | 484 | BGA484,22X22,32 | 1.1 V | 未说明 | 1.07 V | 85 °C | 有 | 5CSEBA4U19C6N | FBGA | SQUARE | Intel Corporation | 活跃 | INTEL CORP | 1.13 V | 5.58 | MCU - 151, FPGA - 66 | FBGA, BGA484,22X22,32 | GRID ARRAY, FINE PITCH | PLASTIC/EPOXY | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SE | 活跃 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 未说明 | 0.8 mm | compliant | S-PBGA-B484 | 66 | 不合格 | 1.1,1.2/3.3,2.5 V | OTHER | 925MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 66 | 1.9 mm | 现场可编程门阵列 | FPGA - 40K Logic Elements | 40000 | -- | 19 mm | 19 mm | ||||||||||||||||||
| 5CSEMA6U23I7N | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 672-FBGA | 672-UBGA (23x23) | MCU - 181, FPGA - 145 | -40°C ~ 100°C (TJ) | Tray | Cyclone® V SE | 活跃 | 5CSEMA6 | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 110K Logic Elements | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 5ASXFB5G6F35C6N | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | MCU - 208, FPGA - 385 | 0°C ~ 85°C (TJ) | Tray | Arria V SX | 活跃 | 5ASXFB5 | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 462K Logic Elements | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 5ASXBB3D4F40C5N | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | YES | 1517-FBGA (40x40) | 1517 | BGA1517,39X39,40 | 1.1 V | 未说明 | 1.07 V | 85 °C | 有 | 5ASXBB3D4F40C5N | BGA | SQUARE | Intel Corporation | 生命周期结束 | INTEL CORP | 1.13 V | 5.28 | MCU - 208, FPGA - 540 | FBGA-1517 | 网格排列 | PLASTIC/EPOXY | 0°C ~ 85°C (TJ) | Tray | Arria V SX | e1 | 活跃 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 未说明 | 1 mm | compliant | 5ASXBB3 | S-PBGA-B1517 | 540 | 商业扩展 | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 540 | 13207 CLBS | 2.7 mm | 现场可编程门阵列 | FPGA - 350K Logic Elements | 13207 | 350000 | -- | 40 mm | 40 mm | |||||||||||||||||
| 5ASXBB5D6F40C6N | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | YES | 1517-FBGA (40x40) | 1517 | 1.1 V | 1.07 V | 85 °C | 5ASXBB5D6F40C6N | BGA | SQUARE | Intel Corporation | 生命周期结束 | INTEL CORP | 1.13 V | 5.28 | MCU - 208, FPGA - 540 | FBGA-1517 | 网格排列 | PLASTIC/EPOXY | BGA1517,39X39,40 | 0°C ~ 85°C (TJ) | Tray | Arria V SX | 活跃 | BOTTOM | BALL | 1 mm | compliant | 5ASXBB5 | S-PBGA-B1517 | 540 | 商业扩展 | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 540 | 17434 CLBS | 2.7 mm | 现场可编程门阵列 | FPGA - 462K Logic Elements | 17434 | 462000 | -- | 40 mm | 40 mm | ||||||||||||||||||||||
| MSCMMX6QZDK08AB | NXP | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 500 | 85 °C | 有 | MSCMMX6QZDK08AB | FBGA | RECTANGULAR | 恩智浦半导体 | Obsolete | NXP SEMICONDUCTORS | 5.83 | FBGA, | GRID ARRAY, FINE PITCH | 3 | PLASTIC/EPOXY | 未说明 | 8542.31.00.01 | CMOS | BOTTOM | BALL | 260 | 0.65 mm | compliant | R-PBGA-B500 | OTHER | 800 MHz | MICROPROCESSOR, RISC | 1.8 mm | YES | YES | 固定点 | YES | 17 mm | 14 mm | ||||||||||||||||||||||||||||||||||||
| AGFC023R25A2I2V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 活跃 | 480 | Tray | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AGFA006R24C2E2V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 活跃 | 576 | Tray | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 573K Logic Elements | - |
-
XCVM1502-2MLEVFVC1760
AMD
分类:Embedded - System On Chip (SoC)
-
AGIB027R31B2E2VAA
Intel
分类:Embedded - System On Chip (SoC)
-
XCZU17EG-2FFVD1760I
AMD
分类:Embedded - System On Chip (SoC)
-
XCVC1902-1LSIVSVA2197-ES9748
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCZU5EV-1FBVB900E
AMD
分类:Embedded - System On Chip (SoC)
-
XCZU7EV-2FFVC1156E
AMD
分类:Embedded - System On Chip (SoC)
-
AGFA027R25A2I3E
Intel
分类:Embedded - System On Chip (SoC)
-
AGIB019R18A1E2V
Intel
分类:Embedded - System On Chip (SoC)
-
XC7Z020-3CLG400E
AMD
分类:Embedded - System On Chip (SoC)
-
XCZU6EG-1FFVB1156E
AMD
分类:Embedded - System On Chip (SoC)
-
AGFB022R24C2I3V
Intel
分类:Embedded - System On Chip (SoC)
-
XCZU1CG-1SFVA625E
AMD
分类:Embedded - System On Chip (SoC)
-
XCZU7EV-2FFVF1517E
AMD
分类:Embedded - System On Chip (SoC)
-
AGFB006R24C2E3V
Intel
分类:Embedded - System On Chip (SoC)
-
AGFB012R24C2E3V
Intel
分类:Embedded - System On Chip (SoC)
-
XCVE1752-1MSINSVG1369
AMD
分类:Embedded - System On Chip (SoC)
-
AGFB006R16A2E4X
Intel
分类:Embedded - System On Chip (SoC)
-
5CSEBA4U19C6N
ALTERA
分类:Embedded - System On Chip (SoC)
-
5CSEMA6U23I7N
ALTERA
分类:Embedded - System On Chip (SoC)
-
5ASXFB5G6F35C6N
ALTERA
分类:Embedded - System On Chip (SoC)
-
5ASXBB3D4F40C5N
ALTERA
分类:Embedded - System On Chip (SoC)
-
5ASXBB5D6F40C6N
ALTERA
分类:Embedded - System On Chip (SoC)
-
MSCMMX6QZDK08AB
NXP
分类:Embedded - System On Chip (SoC)
-
AGFC023R25A2I2V
Intel
分类:Embedded - System On Chip (SoC)
-
AGFA006R24C2E2V
Intel
分类:Embedded - System On Chip (SoC)