类别是'category.片上系统(SoC)' (7695)
- 所有品牌
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 生命周期状态 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 终端数量 | Maximum Voltage | 厂商 | 操作温度 | 包装 | 系列 | JESD-609代码 | 零件状态 | 类型 | 端子表面处理 | 附加功能 | HTS代码 | 子类别 | 技术 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 额定电流 | JESD-30代码 | 输出的数量 | 资历状况 | 效率 | 输出电压 | 电源 | 温度等级 | 界面 | 速度 | 内存大小 | 输出电流 | 核心处理器 | 周边设备 | 程序内存大小 | 连接方式 | 输出功率 | 家人 | 建筑学 | 数据总线宽度 | 输入数量 | 座位高度-最大 | 可编程逻辑类型 | 产品类别 | 筛选水平 | 速度等级 | 主要属性 | 寄存器数量 | 逻辑单元数 | 核数量 | 闪光大小 | 输入电压 | 产品类别 | 设备核心 | 知识产权评级 | 产品长度(mm) | 长度 | 宽度 | 产品高度(mm) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | XCZU2EG-L2SFVC784E | AMD | 数据表 | 538 In Stock | - | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | AMD | 252 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S025T-1FG484 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 484-BGA | 484-FPBGA (23x23) | 微芯片技术 | 活跃 | 1.2000 V | 1.14 V | 1.26 V | 267 | Tray | M2S025 | 0 to 85 °C | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 25K Logic Modules | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU7CG-2FBVB900E | AMD | 数据表 | 793 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | 活跃 | 0.8500 V | 0.808 V | 0.892 V | 204 | Tray | XCZU7 | 0 to 100 °C | Zynq® UltraScale+™ MPSoC CG | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2 | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU9EG-1FFVB1156E | AMD | 数据表 | 975 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | 599,550 | 0.9500 V | 0.922 V | 328 | 0.979 V | 328 | Tray | XCZU9 | 活跃 | 0 to 100 °C | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | XCZU9EG | MCU, FPGA | 扩展工业 | 1 | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | 548,160 | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S060TS-FGG676I | Microchip | 数据表 | 2706 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 676-BGA | YES | 676-FBGA (27x27) | 676 | 微芯片技术 | PLASTIC/EPOXY | BGA676,26X26,40 | 1.2 V | 40 | 1.14 V | 有 | M2S060TS-FGG676I | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.26 V | 5.81 | 387 | Tray | M2S060 | 活跃 | FBGA-676 | 网格排列 | 3 | -40°C ~ 100°C (TJ) | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B676 | 387 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 387 | 2.44 mm | 现场可编程门阵列 | FPGA - 60K Logic Modules | 56520 | 256KB | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S010-1VFG256I | Microchip | 数据表 | 25 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | 微芯片技术 | PLASTIC/EPOXY | BGA256,16X16,32 | 1.2 V | 40 | 1.14 V | 有 | M2S010-1VFG256I | LFBGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.26 V | 5.77 | 138 | Tray | M2S010 | 活跃 | VFBGA-256 | GRID ARRAY, LOW PROFILE, FINE PITCH | 3 | -40°C ~ 100°C (TJ) | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B256 | 138 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 138 | 1.56 mm | 现场可编程门阵列 | FPGA - 10K Logic Modules | 12084 | 256KB | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S060-1FG676I | Microchip | 数据表 | 2562 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 676-BGA | 676-FBGA (27x27) | 微芯片技术 | Non-Compliant | 387 | Tray | M2S060 | 活跃 | -40°C ~ 100°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S005S-1VF256I | Microchip | 数据表 | 25 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 256-LFBGA | 256-FPBGA (14x14) | 微芯片技术 | 64 kB | 161 | Tray | M2S005 | 活跃 | - | 166 MHz | 6060 LE | SMD/SMT | - | -40°C ~ 100°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | - | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 5K Logic Modules | 1 Core | 128KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S025-1VF256 | Microchip | 数据表 | 2360 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 256-LFBGA | 256-FPBGA (14x14) | 微芯片技术 | - | 64 kB | Non-Compliant | 138 | Tray | M2S025 | 活跃 | - | 166 MHz | 27696 LE | SMD/SMT | 0°C ~ 85°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU1EG-L2SFVA625E | AMD | 数据表 | 2914 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | AMD | - | Tray | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ | CAN/Serial I2C/SPI/U | 533MHz, 600MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | MPU, FPGA | - | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU67DR-L1FFVE1156I | AMD | 数据表 | 989 In Stock |
- | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU42DR-1FSVE1156E | AMD | 数据表 | 866 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | 366 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 489K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU42DR-2FFVE1156E | AMD | 数据表 | 533 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | CAN/Serial I2C/SPI/UART/USB | 有 | FPGA/Microcontroller | 366 | Tray | 活跃 | RISC | 1.8/2.5/3.3 V | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | CAN/Serial I2C/SPI/U | 533MHz, 1.333GHz | 256 KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 64 Bit | Zynq®UltraScale+™ FPGA, 489K+ Logic Cells | - | ARM Cortex-A53/ARM Cortex-R5F | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5CSXFC6C6U23I7LN | ALTERA | 数据表 | 2902 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 5.8 | 5CSXFC6C6U23I7LN | Intel Corporation | 活跃 | INTEL CORP | Tray | * | 活跃 | compliant | 现场可编程门阵列 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS027E4F29I3SG | ALTERA | 数据表 | 946 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FBGA-780 | 16 | Intel / Altera | Arria 10 SoC | 2 x 32 kB | - | Non-Compliant | 360 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 270000 LE | 1 | SMD/SMT | 33750 LAB | 965265 | Intel | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | 活跃 | SOC - Systems on a Chip | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | FPGA - 270K Logic Elements | 2 Core | -- | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1402-1LSEVSVD1760 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 726 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal™ Prime | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVE1752-2LSENSVG1369 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1369-BFBGA | 1369-BGA (35x35) | AMD | 500 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal™ AI Core | 450MHz, 1.08GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU57DR-2FFVE1156I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | - | Tray | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC DR | 533MHz, 1.3GHz | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq® UltraScale+™ RFSoC | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1502-2LLEVSVA1596 | AMD | 数据表 | 993 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1596-BFBGA | 1596-BGA (37.5x37.5) | AMD | 500 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal™ AI Core | 450MHz, 1.08GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 800k Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1302-2MSENBVB1024 | AMD | 数据表 | 500 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1024-BFBGA | 1024-BGA (31x31) | AMD | 316 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.4GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1802-2MLEVIVA1596 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1596-BFBGA, FCBGA | 1596-FCBGA (40x40) | AMD | 500 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal™ AI Core | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5CSXFC5C6U23I7LN | ALTERA | 数据表 | 2192 In Stock |
- | 最小起订量: 1 最小包装量: 1 | MP3-42L10F8 | ABB | Tray | * | 活跃 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS027E4F29I3LG | ALTERA | 数据表 | 719 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Back Mount | FBGA-780 | YES | 5 | 780 | 300 VAC, 300 VDC | PLASTIC/EPOXY | BGA780,28X28,40 | -40 °C | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.43 | U-31412 | CSA, UL | Turck | 360 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 270000 LE | 1 | SMD/SMT | 33750 LAB | 964969 | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | - | BGA, BGA780,28X28,40 | 网格排列 | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | 活跃 | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | 5 A | S-PBGA-B780 | 360 | 不合格 | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 360 | 3.35 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 270K Logic Elements | 270000 | 2 Core | -- | SoC FPGA | IP67 | 0.5 m | 29 mm | |||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S050S-1FGG484I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | -10C | 无 | 3 | 30 | 有 | M2S050S-1FGG484I | Microsemi Corporation | 活跃 | MICROSEMI CORP | 5.26 | Commercial grade | 60C | 97(mm) | Desktop | 120 W | 3000VAC(V) | 47 to 63(Hz) | e1 | Regulated | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 250 | compliant | 1 | 85(%) | 24(V) | 5(A) | 120(W) | 现场可编程门阵列 | Commercial | 85 to 132/170 to 265(V) | 110(mm) | 60(mm) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S090-1FG676IX417 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Non-Compliant |
XCZU2EG-L2SFVC784E
AMD
分类:Embedded - System On Chip (SoC)
M2S025T-1FG484
Microchip
分类:Embedded - System On Chip (SoC)
XCZU7CG-2FBVB900E
AMD
分类:Embedded - System On Chip (SoC)
23,075.796264
XCZU9EG-1FFVB1156E
AMD
分类:Embedded - System On Chip (SoC)
22,694.246756
M2S060TS-FGG676I
Microchip
分类:Embedded - System On Chip (SoC)
2,078.690409
M2S010-1VFG256I
Microchip
分类:Embedded - System On Chip (SoC)
550.922096
M2S060-1FG676I
Microchip
分类:Embedded - System On Chip (SoC)
1,933.287468
M2S005S-1VF256I
Microchip
分类:Embedded - System On Chip (SoC)
334.819232
M2S025-1VF256
Microchip
分类:Embedded - System On Chip (SoC)
982.178221
XCZU1EG-L2SFVA625E
AMD
分类:Embedded - System On Chip (SoC)
3,148.721262
XCZU67DR-L1FFVE1156I
AMD
分类:Embedded - System On Chip (SoC)
146,519.282035
XCZU42DR-1FSVE1156E
AMD
分类:Embedded - System On Chip (SoC)
75,330.632149
XCZU42DR-2FFVE1156E
AMD
分类:Embedded - System On Chip (SoC)
93,587.345635
5CSXFC6C6U23I7LN
ALTERA
分类:Embedded - System On Chip (SoC)
3,440.040949
10AS027E4F29I3SG
ALTERA
分类:Embedded - System On Chip (SoC)
8,605.615797
XCVM1402-1LSEVSVD1760
AMD
分类:Embedded - System On Chip (SoC)
XCVE1752-2LSENSVG1369
AMD
分类:Embedded - System On Chip (SoC)
XCZU57DR-2FFVE1156I
AMD
分类:Embedded - System On Chip (SoC)
XCVC1502-2LLEVSVA1596
AMD
分类:Embedded - System On Chip (SoC)
194,058.549361
XCVM1302-2MSENBVB1024
AMD
分类:Embedded - System On Chip (SoC)
25,873.078997
XCVC1802-2MLEVIVA1596
AMD
分类:Embedded - System On Chip (SoC)
5CSXFC5C6U23I7LN
ALTERA
分类:Embedded - System On Chip (SoC)
2,559.366621
10AS027E4F29I3LG
ALTERA
分类:Embedded - System On Chip (SoC)
10,671.062740
M2S050S-1FGG484I
Microchip
分类:Embedded - System On Chip (SoC)
M2S090-1FG676IX417
Microchip
分类:Embedded - System On Chip (SoC)
