类别是'category.片上系统(SoC)' (7695)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 安装类型 | 包装/外壳 | 表面安装 | 供应商器件包装 | 终端数量 | Core | 厂商 | 操作温度 | 包装 | 系列 | JESD-609代码 | 类型 | 端子表面处理 | HTS代码 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 频率 | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 工作频率 | 工作电源电压 | 电源 | 温度等级 | 界面 | 内存大小 | 速度 | 内存大小 | 核心处理器 | 周边设备 | 程序存储器类型 | 程序内存大小 | 连接方式 | 输出功率 | 数据率 | 建筑学 | 数据总线宽度 | 输入数量 | 座位高度-最大 | 使用的 IC/零件 | 可编程逻辑类型 | 议定书 | 频率范围 | 筛选水平 | 功率 - 输出 | 速度等级 | 无线电频率系列/标准 | 收发器数量 | 天线类型 | 敏感度 | ADC通道数量 | 主要属性 | 串行接口 | 接收电流 | 传输电流 | 逻辑单元数 | 定时器数量 | 调制 | 核数量 | 闪光大小 | ADC Resolution | 设备核心 | 高度 | 长度 | 宽度 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
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![]() | EFR32MG1B231F256GM32-C0 | Silicon Labs | 数据表 | 26 In Stock |
- | 最小起订量: 1 最小包装量: 1 | QFN-32 | ARM Cortex M4 | I2C, I2S, SMBus, SPI, UART, USART | 40 MHz | 有 | SMD/SMT | EFR32MG1 | 490 | EFR32 | 3.3 V | Details | 1 Mbps | 3.3 V | 8.7 mA, 9.8 mA | 8.2 mA | - 40 C | + 85 C | 32 kB | RAM | SLWRB4154A | Tray | EFR32MG1 | Bluetooth, Zigbee | 2.4 GHz | Flash | 256 kB | 19.5 dBm | 32 bit | - 94 dBm | 2 Timer | 12 bit | 0.85 mm | 5 mm | 5 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | BCM85652IFSBG | MaxLinear | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | Details | - 40 C | + 110 C | 24 | Bulk | BCM85652 | Radar | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EG21GGB-MINIPCIE-S | Quectel | 数据表 | 208 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 卡边缘 | Module | Quectel | Details | 100 | 无线通信模块 | 0.368613 oz | Mini PCIe | Socket Mount | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | EG21 | 活跃 | Industrial grade | -40 to 80 °C | Reel | - | LTE Cat 1 Module | 3V ~ 3.6V | - | 3.8 V | - | 42Mbps | - | BeiDou, EDGE, Galileo, GLONASS, GPS, GNSS, GPRS, GSM, HSPA+, LTE, UMTS, WCDMA | 700/800/850/900/1700/1800/1900/2100/2600 MHz | Industrial | 33dBm | Cellular, Navigation | 不包括天线 | -110.5dBm | I²C, PCM, UART, USB | - | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S150TS-1FCSG536I | Microchip Technology | 数据表 | 603 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 536-LFBGA, CSPBGA | 536-CSPBGA (16x16) | ARM Cortex M3 | 微芯片技术 | 1.2, 1.5, 1.8, 2.5, 3.3 V | 1 | 有 | 293 | Tray | M2S150 | 活跃 | Industrial grade | This product may require additional documentation to export from the United States. | Details | 166 MHz | - | - | 64 kB | 146124 LE | 有 | 12177 LAB | 90 | RISC | -40 to 100 °C | Tray | SmartFusion2 | 536 | 1.2 V | CAN/Ethernet/Serial | 166MHz | 64 KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 32 Bit | Industrial | FPGA - 150K Logic Modules | 1 Core | 512KB | ARM Cortex-M3 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S090-1FGG676 | Microchip Technology | 数据表 | 2395 In Stock |
- | 最小起订量: 1 最小包装量: 1 | BGA-676 | YES | 676-FBGA (27x27) | 676 | ARM Cortex M3 | 微芯片技术 | 1.14 V | 85 °C | 有 | M2S090-1FGG676 | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.27 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 166 MHz | - | - | 64 kB | 86316 LE | 有 | 7193 LAB | 40 | 425 | Tray | M2S090 | 活跃 | FBGA-676 | 网格排列 | 3 | PLASTIC/EPOXY | BGA676,26X26,40 | 1.2 V | 40 | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B676 | 425 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 425 | 2.44 mm | 现场可编程门阵列 | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S050T-FG484 | Microchip Technology | 数据表 | 2615 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | ARM Cortex M3 | 微芯片技术 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 30 | 1.14 V | 85 °C | 无 | M2S050T-FG484 | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.84 | This product may require additional documentation to export from the United States. | N | SMD/SMT | 166 MHz | - | - | 64 kB | 56340 LE | 有 | 4695 LAB | 60 | 1.2000 V | 1.14 V | 1.26 V | 267 | Tray | M2S050 | 活跃 | FBGA-484 | 0 to 85 °C | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B484 | 267 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | 2.44 mm | 现场可编程门阵列 | STD | FPGA - 50K Logic Modules | 48672 | 1 Core | 256KB | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU7EG-L1FBVB900I4560 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FCBGA-900 | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | This product may require additional documentation to export from the United States. | SMD/SMT | 600 MHz, 667 MHz, 1.5 GHz | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | - | 504000 LE | 204 I/O | - 40 C | + 100 C | 6.2 Mbit | 11 Mbit | 28800 LAB | 1 | Zynq UltraScale+ | XCZU7EG | 720 mV/850 mV | - | 16 Transceiver | 7 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU6EG-L1FFVB1156I4560 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FCBGA-1156 | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | This product may require additional documentation to export from the United States. | Zynq UltraScale+ | 1 | 26825.5 LAB | 25.1 Mbit | 6.9 Mbit | + 100 C | - 40 C | 328 I/O | 469446 LE | - | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | 600 MHz, 667 MHz, 1.5 GHz | SMD/SMT | XCZU6EG | 720 mV/850 mV | - | 24 Transceiver | 7 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU4EG-L1FBVB900I4560 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FCBGA-900 | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | - | 192150 LE | 204 I/O | - 40 C | + 100 C | 2.6 Mbit | 4.5 Mbit | 10980 LAB | 1 | Zynq UltraScale+ | This product may require additional documentation to export from the United States. | SMD/SMT | 600 MHz, 667 MHz, 1.5 GHz | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | XCZU4EG | 720 mV/850 mV | - | 16 Transceiver | 7 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU7CG-L1FBVB900I4560 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FCBGA-900 | ARM Cortex A53, ARM Cortex R5 | This product may require additional documentation to export from the United States. | SMD/SMT | 600 MHz, 1.5 GHz | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | - | 504000 LE | 204 I/O | - 40 C | + 100 C | 6.2 Mbit | 11 Mbit | 28800 LAB | 1 | Zynq UltraScale+ | XCZU7CG | 720 mV/850 mV | - | 16 Transceiver | 4 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7Z035-2FFG676E4860 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ARM Cortex A9 | 2 x 32 kB | 2 x 32 kB | - | 275000 LE | 21487.5 LAB | 1 | Zynq | 766 MHz | XC7Z045 | - | 2 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU19EG-1FFVC1760I4870 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FCBGA-1760 | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | This product may require additional documentation to export from the United States. | SMD/SMT | 600 MHz, 667 MHz, 1.5 GHz | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | - | 1143450 LE | 512 I/O | - 40 C | + 100 C | 9.8 Mbit | 34.6 Mbit | 65340 LAB | 1 | Zynq UltraScale+ | XCZU19EG | 0.85 V | - | 48 Transceiver | 7 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7Z020-3CLG400E4893 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ARM Cortex A9 | 2 x 32 kB | 2 x 32 kB | - | 85000 LE | 6650 LAB | 1 | Zynq | 866 MHz | XC7Z045 | - | 2 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU5EV-1SFVC784E4887 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FCBGA-784 | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | This product may require additional documentation to export from the United States. | SMD/SMT | 600 MHz, 667 MHz, 1.5 GHz | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | - | 256200 LE | 252 I/O | 0 C | + 100 C | 3.5 Mbit | 5.1 Mbit | 14640 LAB | 1 | Zynq UltraScale+ | XCZU5EV | 0.85 V | - | 4 Transceiver | 7 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU19EG-2FFVC1760I4498 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FCBGA-1760 | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | This product may require additional documentation to export from the United States. | SMD/SMT | 600 MHz, 667 MHz, 1.5 GHz | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | - | 1143450 LE | 512 I/O | - 40 C | + 100 C | 9.8 Mbit | 34.6 Mbit | 65340 LAB | 1 | Zynq UltraScale+ | XCZU19EG | 0.85 V | - | 48 Transceiver | 7 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7Z007S-1CLG400I4873 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ARM Cortex A9 | SMD/SMT | 667 MHz | 32 kB | 32 kB | - | 23000 LE | 1800 LAB | 1 | Zynq | XC7Z045 | - | 1 Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU9CG-2FFVC900I4895 | Xilinx | 数据表 | 695 In Stock | - | 最小起订量: 1 最小包装量: 1 | FCBGA-900 | ARM Cortex A53, ARM Cortex R5 | This product may require additional documentation to export from the United States. | SMD/SMT | 600 MHz, 1.5 GHz | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | - | 599550 LE | 204 I/O | - 40 C | + 100 C | 8.8 Mbit | 32.1 Mbit | 34260 LAB | 1 | Zynq UltraScale+ | XCZU9CG | 0.85 V | - | 16 Transceiver | 4 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU11EG-L1FFVC1156I4524 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FCBGA-1156 | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | SMD/SMT | 600 MHz, 667 MHz, 1.5 GHz | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | - | 653100 LE | 360 I/O | - 40 C | + 100 C | 9.1 Mbit | 21.1 Mbit | 37320 LAB | 1 | Zynq UltraScale+ | XCZU11EG | 720 mV/850 mV | - | 20 Transceiver | 7 Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7Z030-2SB485I4872 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ARM Cortex A9 | 2 x 32 kB | 2 x 32 kB | - | 125000 LE | 9825 LAB | 1 | Zynq | 766 MHz | XC7Z045 | - | 2 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7Z007S-2CLG225I4539 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ARM Cortex A9 | SMD/SMT | 766 MHz | 32 kB | 32 kB | - | 23000 LE | 1800 LAB | 1 | Zynq | XC7Z045 | - | 1 Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU19EG-2FFVC1760I4951 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | SMD/SMT | 600 MHz, 667 MHz, 1.5 GHz | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | - | 1143450 LE | 65340 LAB | 1 | Zynq UltraScale+ MPSoC | XCZU19EG | - | 7 Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XQZU21DR-L1FFQD1156I5265 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | BGA-1156 | ARM Cortex A53, ARM Cortex R5F | SMD/SMT | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | 256 kB | 930300 LE | - 40 C | + 100 C | 13 Mb | 53160 LAB | 1 | 850 mV | 16 Transceiver | 6 Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | ESP32-C3FN4 | Espressif Systems | 数据表 | 3933 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | QFN-32 | RISC-V | Espressif Systems | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | 活跃 | Details | 150 Mbps | 3 V | 87 mA | 325 mA | - 40 C | + 85 C | 400 kB | SRAM | GPIO, I2C, I2S, SPI, UART | 160 MHz | 有 | SMD/SMT | 5000 | 3.6 V | -40°C ~ 85°C (TA) | MouseReel | ESP32 | Bluetooth, Wi-Fi | 3V ~ 3.6V | 2.402GHz ~ 2.48GHz | 2.4 GHz | 4MB Flash, 400kB SRAM, 384kB ROM | Flash | 4 MB | 18 dBm | 54Mbps | 32 bit | - | 802.11b/g/n, Bluetooth v5.0 | 21dBm | Bluetooth, WiFi | 不包括天线 | - 105 dBm | 6 Channel | GPIO, I²C, I²S, SPI, JTAG, UART, USB | 84mA ~ 87mA | 276mA ~ 335mA | - | 12 bit | 0.85 mm | 5 mm | 5 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS025TS-FCSG325I | Microchip Technology | 数据表 | 34 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 325-TFBGA | 325-BGA (11x11) | RV64GC, RV64IMAC | 微芯片技术 | 108 I/O | - 40 C | + 100 C | 1 | Tray | 活跃 | This product may require additional documentation to export from the United States. | SMD/SMT | 667 MHz, 667 MHz | 16 kB, 4 x 32 kB | 4 x 32 kB | - | 23000 LE | -40°C ~ 100°C | Tray | - | 1 V | - | 230.4KB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 23K Logic Modules | 5 Core | 128KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS025TL-FCSG325E | Microchip Technology | 数据表 | 35 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 325-TFBGA | 325-BGA (11x11) | RV64GC, RV64IMAC | 微芯片技术 | 108 I/O | 0 C | + 100 C | 1 | Tray | 活跃 | This product may require additional documentation to export from the United States. | SMD/SMT | 667 MHz, 667 MHz | 16 kB, 4 x 32 kB | 4 x 32 kB | - | 23000 LE | 0°C ~ 100°C | Tray | - | 1 V | - | 230.4KB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 23K Logic Modules | 5 Core | 128KB |
EFR32MG1B231F256GM32-C0
Silicon Labs
分类:Embedded - System On Chip (SoC)
61.109455
BCM85652IFSBG
MaxLinear
分类:Embedded - System On Chip (SoC)
EG21GGB-MINIPCIE-S
Quectel
分类:Embedded - System On Chip (SoC)
476.191442
M2S150TS-1FCSG536I
Microchip Technology
分类:Embedded - System On Chip (SoC)
4,908.139827
M2S090-1FGG676
Microchip Technology
分类:Embedded - System On Chip (SoC)
2,946.047653
M2S050T-FG484
Microchip Technology
分类:Embedded - System On Chip (SoC)
1,551.033292
XCZU7EG-L1FBVB900I4560
Xilinx
分类:Embedded - System On Chip (SoC)
XCZU6EG-L1FFVB1156I4560
Xilinx
分类:Embedded - System On Chip (SoC)
XCZU4EG-L1FBVB900I4560
Xilinx
分类:Embedded - System On Chip (SoC)
XCZU7CG-L1FBVB900I4560
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分类:Embedded - System On Chip (SoC)
XC7Z035-2FFG676E4860
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分类:Embedded - System On Chip (SoC)
XCZU19EG-1FFVC1760I4870
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分类:Embedded - System On Chip (SoC)
XC7Z020-3CLG400E4893
Xilinx
分类:Embedded - System On Chip (SoC)
XCZU5EV-1SFVC784E4887
Xilinx
分类:Embedded - System On Chip (SoC)
XCZU19EG-2FFVC1760I4498
Xilinx
分类:Embedded - System On Chip (SoC)
XC7Z007S-1CLG400I4873
Xilinx
分类:Embedded - System On Chip (SoC)
XCZU9CG-2FFVC900I4895
Xilinx
分类:Embedded - System On Chip (SoC)
XCZU11EG-L1FFVC1156I4524
Xilinx
分类:Embedded - System On Chip (SoC)
XC7Z030-2SB485I4872
Xilinx
分类:Embedded - System On Chip (SoC)
XC7Z007S-2CLG225I4539
Xilinx
分类:Embedded - System On Chip (SoC)
XCZU19EG-2FFVC1760I4951
Xilinx
分类:Embedded - System On Chip (SoC)
XQZU21DR-L1FFQD1156I5265
Xilinx
分类:Embedded - System On Chip (SoC)
ESP32-C3FN4
Espressif Systems
分类:Embedded - System On Chip (SoC)
MPFS025TS-FCSG325I
Microchip Technology
分类:Embedded - System On Chip (SoC)
450.372170
MPFS025TL-FCSG325E
Microchip Technology
分类:Embedded - System On Chip (SoC)
415.698894
