类别是'category.模拟开关和多路复用器ICs' (10000)

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产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

工厂交货时间

安装类型

包装/外壳

表面安装

供应商器件包装

材料

终端数量

Capacitance tolerance

Capacitors series

Case - inch

Case - mm

Date Of Intro

Diameter after shrinkage

Diameter After Shrinking

Diameter before shrinkage

Diameter Before Shrinking

Diameter of the protected wire (cable)

Dielectric strength

Gross weight

Gross Weight

Kind of capacitor

Number of switchable circuits

Protected Wire (Cable) Diameter

Transport package size/quantity

Transport packaging size/quantity

Transport Packaging Size/Quantity

Type of capacitor

Wall thickness after shrinkage

Wall Thickness After Shrinking

Wall thickness before shrinkage

Wall Thickness Before Shrinking

Operating temperature

操作温度

包装

容差

JESD-609代码

无铅代码

零件状态

ECCN 代码

类型

端子表面处理

颜色

附加功能

HTS代码

电容量

端子位置

终端形式

峰值回流焊温度(摄氏度)

功能数量

端子间距

深度

Reach合规守则

时间@峰值回流温度-最大值(s)

输出量

引脚数量

JESD-30代码

资历状况

电介质

Working voltage

电源电压-最大值(Vsup)

电源

Contact resistance

温度等级

电源电压-最小值(Vsup)

Insulation resistance

通道数量

电路数量

模拟 IC - 其他类型

座位高度-最大

供应电流-最大值(Isup)

负电源电压(Vsup)

Operating temperature range

工作温度范围

Rated current

-3db 带宽

通态电阻(最大值)

筛选水平

多路复用器/解复用器电路

断态隔离-标称

最大负电源电压(Vsup)

最大漏电流(IS(off))

通道电容(CS和CD:开关在断开时的源极和漏极电容)

通态电阻匹配标称

开关电路

开关时间(Ton, Toff)(最大)

Shrink temperature

收缩温度

通道间匹配度 (ΔRon)

串扰

开关量

开启时间-最大值

关机时间-最大值

电压 - 电源,单路(V±)

正常位置

信号电流-最大值

最小负电源电压(Vsup)

饱和电流

特征

正极输入电压-最大值

Operating voltage

工作电压

Accuracy class

Shrink ratio

收缩率

直径

高度

长度

宽度

DG211BDJ-E3
DG211BDJ-E3
Vishay Intertechnologies 数据表

N/A

-

最小起订量: 1

最小包装量: 1

8 Weeks

NO

16

活跃

VISHAY INTERTECHNOLOGY INC

ROHS COMPLIANT, PLASTIC, DIP-16

85 Ω

85 °C

-40 °C

PLASTIC/EPOXY

DIP

DIP16,.3

RECTANGULAR

IN-LINE

15 V

e3

哑光锡

DUAL

THROUGH-HOLE

4

2.54 mm

compliant

独立输出

R-PDIP-T16

不合格

22 V

INDUSTRIAL

4.5 V

1

SPST

5.08 mm

-15 V

90 dB

-22 V

2 Ω

BREAK-BEFORE-MAKE

300 ns

200 ns

NC

-4.5 V

1

20.13 mm

7.62 mm

DG409DY-T1-E3
DG409DY-T1-E3
Vishay Intertechnologies 数据表

12500 In Stock

-

最小起订量: 1

最小包装量: 1

8 Weeks

YES

16

±0.5pF

GCQ

0201

0603

0.03 g

活跃

MLCC

VISHAY INTERTECHNOLOGY INC

SOIC-16

100 Ω

85 °C

-40 °C

PLASTIC/EPOXY

SOP

SOP16,.25

RECTANGULAR

小概要

15 V

SMD

ceramic

-55...125°C

e3

Matte Tin (Sn)

7.8pF

DUAL

鸥翼

260

2

1.27 mm

compliant

30

R-PDSO-G16

不合格

C0G (NP0)

20 V

INDUSTRIAL

5 V

4

差分复用器

1.75 mm

2 mA

-15 V

75 dB

-20 V

15 Ω

BREAK-BEFORE-MAKE

150 ns

150 ns

0.02 A

-5 V

1

50V

9.9 mm

3.9 mm

DG333ALDW-T1-E3
DG333ALDW-T1-E3
Vishay Intertechnologies 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

20

±0.05pF

GCQ

0201

0603

0.03 g

活跃

MLCC

VISHAY INTERTECHNOLOGY INC

45 Ω

85 °C

-40 °C

PLASTIC/EPOXY

SOP

SOP20,.4

RECTANGULAR

小概要

15 V

SMD

ceramic

-55...125°C

9.1pF

DUAL

鸥翼

4

1.27 mm

compliant

独立输出

R-PDSO-G20

不合格

C0G (NP0)

22 V

INDUSTRIAL

4 V

1

单刀双掷

2.54 mm

-15 V

72 dB

-22 V

2 Ω

BREAK-BEFORE-MAKE

175 ns

145 ns

-4 V

50V

12.8 mm

7.5 mm

74HCT4052PW
74HCT4052PW
Nexperia 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

16

GCQ

0201

0603

1995-11-01

0.03 g

活跃

MLCC

NEXPERIA

SOP-16

180 Ω

125 °C

-40 °C

PLASTIC/EPOXY

SOP

RECTANGULAR

小概要

5 V

SMD

ceramic

-55...125°C

±5%

e4

镍钯金

8542.39.00.01

18pF

DUAL

鸥翼

260

2

0.65 mm

compliant

30

R-PDSO-G16

C0G (NP0)

5.5 V

AUTOMOTIVE

4.5 V

4

SP4T

50 dB

9 Ω

BREAK-BEFORE-MAKE

70 ns

50 ns

NO

1

50V

TDA1029
TDA1029
Philips Semiconductors 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

16

±0.1pF

GCM

0402

1005

0.03 g

Transferred

MLCC

飞利浦半导体

DIP, DIP16,.3

80 °C

-30 °C

PLASTIC/EPOXY

DIP

DIP16,.3

RECTANGULAR

IN-LINE

20 V

SMD

ceramic

-55...125°C

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

0.47pF

DUAL

THROUGH-HOLE

2.54 mm

unknown

R-PDIP-T16

不合格

C0G (NP0)

商业扩展

100V

DG9424EDQ-T1-GE3
DG9424EDQ-T1-GE3
Vishay Intertechnologies 数据表

N/A

-

最小起订量: 1

最小包装量: 1

16 Weeks, 4 Days

YES

16

±0.25pF

GCQ

0201

0603

0.03 g

VISHAY INTERTECHNOLOGY INC

MLCC

,

3.3 Ω

85 °C

-40 °C

PLASTIC/EPOXY

TSSOP

TSSOP16,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

5 V

SMD

活跃

42*23*23/500

ceramic

-55...125°C

8542.39.00.01

5.1pF

DUAL

鸥翼

未说明

4

0.65 mm

compliant

未说明

独立输出

R-PDSO-G16

C0G (NP0)

8 V

INDUSTRIAL

3 V

4

SPST

1.2 mm

5 mA

-5 V

56 dB

-8 V

BREAK-BEFORE-MAKE

81 ns

67 ns

NC

0.2 A

-3 V

50V

5 mm

4.4 mm

74HC4052PW
74HC4052PW
NXP Semiconductors 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

16

GCM

0402

1005

Transferred

0.03 g

NXP SEMICONDUCTORS

MLCC

TSSOP

4.40 MM, PLASTIC, MO-153, SOT-403-1, TSSOP-16

195 Ω

125 °C

-40 °C

PLASTIC/EPOXY

TSSOP

TSSOP16,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

5 V

SMD

ceramic

-55...125°C

±2%

e4

Nickel/Palladium/Gold (Ni/Pd/Au)

8542.39.00.01

1nF

DUAL

鸥翼

260

1

0.65 mm

compliant

30

16

R-PDSO-G16

不合格

C0G (NP0)

10 V

AUTOMOTIVE

2 V

4

差分复用器

1.1 mm

0.32 mA

-4.5 V

50 dB

-5 V

6 Ω

BREAK-BEFORE-MAKE

69 ns

57 ns

0.025 A

-1 V

1

100V

5 mm

4.4 mm

PI5V331QEX
PI5V331QEX
Pericom Semiconductor Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

brass

16

Transferred

1.40

PERICOM SEMICONDUCTOR CORP

SOIC

0.150 INCH, PLASTIC, QSOP-16

10 Ω

85 °C

-40 °C

PLASTIC/EPOXY

SSOP

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

5 V

hexagonal mounting standoff for PCB

M3x0.5 mm

screw - nut

28*15.5*14.5/10000

e3

EAR99

哑光锡

8542.39.00.01

DUAL

鸥翼

2

0.635 mm

overall - 13; standoffs - 8 mm

compliant

16

R-PDSO-G16

不合格

5.25 V

INDUSTRIAL

4.75 V

4

VIDEO MULTIPLEXER

1.75 mm

38 dB

5 ns

5 ns

1

nickel-plated

~5 mm

threaded shaft/hole ~ 5/5 mm

3.9116 mm

SA576D
SA576D
YAGEO Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

Synthetic Polyolefin

14

3.0 mm

6.5 mm

895.00

SOIC

,

0.02 MHz

85 °C

-40 °C

PLASTIC/EPOXY

RECTANGULAR

小概要

3.6 V

Obsolete

3.1…5.4 mm

飞利浦组件

46*46*50/10

0.55 mm

0.28 mm

In batches of 1 m segments

EAR99

Non-adhesive Heat Shrink Tubing

Red

8542.39.00.01

DUAL

鸥翼

1

unknown

14

R-PDSO-G14

不合格

7 V

INDUSTRIAL

2 V

COMPANDER

3 mA

-55…+125 °C

+70…+120 °C

7 V

600 V

2 : 1

1594/BEAJC
1594/BEAJC
Freescale Semiconductor 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

synthetic polyolefin

16

10.0 mm

22.0 mm

10.4…19.0 mm

2620.00

MOTOROLA SEMICONDUCTOR PRODUCTS

DIP, DIP16,.3

125 °C

-55 °C

CERAMIC

DIP

DIP16,.3

RECTANGULAR

IN-LINE

15 V

Obsolete

46*46*53/10

0.8 mm

0.4 mm

coil 100 m

e0

Adhesive-free heat shrink tube

Tin/Lead (Sn/Pb)

red

DUAL

THROUGH-HOLE

2.54 mm

unknown

R-XDIP-T16

不合格

600 V

+-15 V

MILITARY

相机开发工具

18 mA

-15 V

-55…+125 °C

38535Q/M;38534H;883B

+70…+120 °C

2 : 1

74LV4053D
74LV4053D
Nexperia 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

housing - nickel-plated metal; insulator - GF-PBT UL94V-0; contacts - brass

16

1993-08-01

1000 (50 Hz, 1 min.) V

8.90

NEXPERIA

435 Ω

125 °C

-40 °C

15

PLASTIC/EPOXY

SOP

RECTANGULAR

小概要

2 V

活跃

36*24*21/1000

e4

D-SUB M-M adapter

镍钯金

8542.39.00.01

DUAL

鸥翼

260

3

1.27 mm

17.6 mm

compliant

30

R-PDSO-G16

6 V

≤20 mΩ

AUTOMOTIVE

1 V

≥1000 (at Uinsp.dc=500 V) MΩ

2

SINGLE-ENDED MULTIPLEXER

1.75 mm

-55…+105 °C

3 A

50 dB

5 Ω

97 ns

70 ns

1

12.85 mm

9.9 mm

3.9 mm

MC14051BCP
MC14051BCP
Freescale Semiconductor 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

Copper + Manganin

16

20900.00

DIP16,.3

DIP

PLASTIC/EPOXY

-55 °C

125 °C

135 Ω

DIP, DIP16,.3

MOTOROLA SEMICONDUCTOR PRODUCTS

Obsolete

IN-LINE

RECTANGULAR

35*29*16/1

-40…+60 °C

e0

Tin/Lead (Sn/Pb)

DUAL

THROUGH-HOLE

1

2.54 mm

unknown

R-PDIP-T16

不合格

5/15 V

MILITARY

8

SINGLE-ENDED MULTIPLEXER

BREAK-BEFORE-MAKE

0.025 A

0.5

TPW4054-VR
TPW4054-VR
3PEAK 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

10-TFSOP, 10-MSOP (0.118", 3.00mm Width)

10-MSOP

-40°C ~ 125°C

Tape & Reel (TR)

活跃

1

200MHz

150Ohm

4:1

2μA

12pF

SP4T - Open/Closed

60ns, 50ns

35Ohm

-70dB @ 1MHz

3V ~ 12V

WAS4735Q-16/TR
WAS4735Q-16/TR
Will Semiconductor Ltd 数据表

N/A

-

最小起订量: 1

最小包装量: 1

接触制造商

WILL SEMICONDUCTOR LTD

8542.39.00.01

unknown

差分复用器

74HC4051PW
74HC4051PW
NXP Semiconductors 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

16

Transferred

NXP SEMICONDUCTORS

TSSOP

4.40 MM, PLASTIC, MO-153, SOT-403-1, TSSOP-16

1

180 Ω

125 °C

-40 °C

PLASTIC/EPOXY

TSSOP

TSSOP16,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

5 V

e4

Nickel/Palladium/Gold (Ni/Pd/Au)

ALSO OPERATES ON VCC-VEE 2 V TO 10 V SUPPLY

8542.39.00.01

DUAL

鸥翼

260

1

0.65 mm

unknown

30

16

R-PDSO-G16

不合格

10 V

AUTOMOTIVE

2 V

8

SINGLE-ENDED MULTIPLEXER

1.1 mm

0.32 mA

50 dB

9 Ω

BREAK-BEFORE-MAKE

104 ns

87 ns

0.025 A

5 mm

4.4 mm

74HC4052D
74HC4052D
NXP Semiconductors 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

16

Transferred

NXP SEMICONDUCTORS

SOIC

3.90 MM, 1.47 MM THICKNESS, MS-012AC, SOT-109-3, PLASTIC, SO-16

1

195 Ω

125 °C

-40 °C

PLASTIC/EPOXY

SOP

SOP16,.25

RECTANGULAR

小概要

5 V

e4

EAR99

Nickel/Palladium/Gold (Ni/Pd/Au)

8542.39.00.01

DUAL

鸥翼

260

1

1.27 mm

unknown

30

16

R-PDSO-G16

不合格

10 V

AUTOMOTIVE

2 V

4

差分复用器

1.75 mm

-4.5 V

50 dB

-5 V

6 Ω

BREAK-BEFORE-MAKE

69 ns

57 ns

0.025 A

-1 V

9.9 mm

3.9 mm

BL1555MM
BL1555MM
BL(Shanghai Belling) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

true

Tape & Reel (TR)

74HC4066DB
74HC4066DB
NXP Semiconductors 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

14

Transferred

NXP SEMICONDUCTORS

SSOP

SSOP, SSOP14,.3

1

142 Ω

125 °C

-40 °C

PLASTIC/EPOXY

SSOP

SSOP14,.3

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

4.5 V

e4

Nickel/Palladium/Gold (Ni/Pd/Au)

8542.39.00.01

DUAL

鸥翼

260

4

0.65 mm

unknown

30

独立输出

14

R-PDSO-G14

不合格

10 V

AUTOMOTIVE

2 V

1

SPST

2 mm

50 dB

5 Ω

MAKE-BEFORE-BREAK

30 ns

45 ns

NO

6.2 mm

5.3 mm

74HC4066DB
74HC4066DB
Nexperia 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

14

Obsolete

2017-02-01

NEXPERIA

SSOP,

1

142 Ω

125 °C

-40 °C

PLASTIC/EPOXY

SSOP

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

4.5 V

e4

镍钯金

8542.39.00.01

DUAL

鸥翼

260

4

0.65 mm

compliant

30

R-PDSO-G14

10 V

AUTOMOTIVE

2 V

1

SPST

2 mm

50 dB

5 Ω

30 ns

45 ns

6.2 mm

5.3 mm

DG409DY-T1
DG409DY-T1
Temic Semiconductors 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

16

100 Ω

85 °C

-40 °C

PLASTIC/EPOXY

RECTANGULAR

小概要

15 V

Transferred

TEMIC SEMICONDUCTORS

DUAL

鸥翼

1

unknown

R-PDSO-G16

不合格

INDUSTRIAL

4

差分复用器

2 mA

-15 V

75 dB

250 ns

250 ns

HEF4052BT
HEF4052BT
Philips Semiconductors 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

16

飞利浦半导体

2500 Ω

85 °C

-40 °C

PLASTIC/EPOXY

SOP

SOP16,.25

RECTANGULAR

小概要

Transferred

e4

Nickel/Palladium/Gold (Ni/Pd/Au)

8542.39.00.01

DUAL

鸥翼

1

1.27 mm

unknown

R-PDSO-G16

不合格

INDUSTRIAL

4

差分复用器

0.6 mA

BREAK-BEFORE-MAKE

0.01 A

DG309BDY
DG309BDY
Temic Semiconductors 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

16

85 Ω

85 °C

-40 °C

PLASTIC/EPOXY

SOP

RECTANGULAR

小概要

15 V

Transferred

TEMIC SEMICONDUCTORS

DUAL

鸥翼

4

unknown

R-PDSO-G16

不合格

INDUSTRIAL

1

SPST

0.005 mA

-15 V

90 dB

0.9 Ω

200 ns

150 ns

HI1-5051-8
HI1-5051-8
Intersil Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

16

Obsolete

INTERSIL CORP

DIP, DIP16,.3

50 Ω

125 °C

-55 °C

CERAMIC

DIP

DIP16,.3

RECTANGULAR

IN-LINE

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

DUAL

THROUGH-HOLE

2

2.54 mm

not_compliant

独立输出

R-XDIP-T16

不合格

MILITARY

1

单刀双掷

38535Q/M;38534H;883B

BREAK-BEFORE-MAKE

1000 ns

LF13331D
LF13331D
National Semiconductor Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

16

Obsolete

NATIONAL SEMICONDUCTOR CORP

DIP, DIP16,.3

250 Ω

70 °C

CERAMIC, METAL-SEALED COFIRED

DIP

DIP16,.3

RECTANGULAR

IN-LINE

15 V

e0

锡铅

8542.39.00.01

DUAL

THROUGH-HOLE

4

2.54 mm

unknown

独立输出

R-CDIP-T16

不合格

COMMERCIAL

1

SPST

4.572 mm

13.5 mA

-15 V

50 dB

10 Ω

BREAK-BEFORE-MAKE

NO

7.62 mm

DG509AAK/883
DG509AAK/883
Temic Semiconductors 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

16

400 Ω

125 °C

-55 °C

CERAMIC, GLASS-SEALED

RECTANGULAR

IN-LINE

15 V

Transferred

TEMIC SEMICONDUCTORS

DUAL

THROUGH-HOLE

1

unknown

R-GDIP-T16

不合格

MILITARY

4

差分复用器

2.4 mA

-15 V

68 dB

14.4 Ω

1000 ns