类别是'category.模拟开关和多路复用器ICs' (10000)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 安装类型 | 包装/外壳 | 表面安装 | 供应商器件包装 | 材料 | 终端数量 | Capacitance tolerance | Capacitors series | Case - inch | Case - mm | Date Of Intro | Diameter after shrinkage | Diameter After Shrinking | Diameter before shrinkage | Diameter Before Shrinking | Diameter of the protected wire (cable) | Dielectric strength | Gross weight | Gross Weight | Kind of capacitor | Number of switchable circuits | Protected Wire (Cable) Diameter | Transport package size/quantity | Transport packaging size/quantity | Transport Packaging Size/Quantity | Type of capacitor | Wall thickness after shrinkage | Wall Thickness After Shrinking | Wall thickness before shrinkage | Wall Thickness Before Shrinking | Operating temperature | 操作温度 | 包装 | 容差 | JESD-609代码 | 无铅代码 | 零件状态 | ECCN 代码 | 类型 | 端子表面处理 | 颜色 | 附加功能 | HTS代码 | 电容量 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | 深度 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 输出量 | 引脚数量 | JESD-30代码 | 资历状况 | 电介质 | Working voltage | 电源电压-最大值(Vsup) | 电源 | Contact resistance | 温度等级 | 电源电压-最小值(Vsup) | Insulation resistance | 通道数量 | 电路数量 | 模拟 IC - 其他类型 | 座位高度-最大 | 供应电流-最大值(Isup) | 负电源电压(Vsup) | Operating temperature range | 工作温度范围 | Rated current | -3db 带宽 | 通态电阻(最大值) | 筛选水平 | 多路复用器/解复用器电路 | 断态隔离-标称 | 最大负电源电压(Vsup) | 最大漏电流(IS(off)) | 通道电容(CS和CD:开关在断开时的源极和漏极电容) | 通态电阻匹配标称 | 开关电路 | 开关时间(Ton, Toff)(最大) | Shrink temperature | 收缩温度 | 通道间匹配度 (ΔRon) | 串扰 | 开关量 | 开启时间-最大值 | 关机时间-最大值 | 电压 - 电源,单路(V±) | 正常位置 | 信号电流-最大值 | 最小负电源电压(Vsup) | 饱和电流 | 特征 | 正极输入电压-最大值 | Operating voltage | 工作电压 | Accuracy class | Shrink ratio | 收缩率 | 直径 | 高度 | 长度 | 宽度 | ||||||||||||||||||||||
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![]() | DG211BDJ-E3 | Vishay Intertechnologies | 数据表 | N/A |
- | 最小起订量: 1 最小包装量: 1 | 8 Weeks | NO | 16 | 活跃 | VISHAY INTERTECHNOLOGY INC | ROHS COMPLIANT, PLASTIC, DIP-16 | 85 Ω | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | 15 V | 有 | e3 | 哑光锡 | DUAL | THROUGH-HOLE | 4 | 2.54 mm | compliant | 独立输出 | R-PDIP-T16 | 不合格 | 22 V | INDUSTRIAL | 4.5 V | 1 | SPST | 5.08 mm | -15 V | 90 dB | -22 V | 2 Ω | BREAK-BEFORE-MAKE | 300 ns | 200 ns | NC | -4.5 V | 1 | 20.13 mm | 7.62 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | DG409DY-T1-E3 | Vishay Intertechnologies | 数据表 | 12500 In Stock | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | YES | 16 | ±0.5pF | GCQ | 0201 | 0603 | 0.03 g | 活跃 | MLCC | VISHAY INTERTECHNOLOGY INC | SOIC-16 | 100 Ω | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP16,.25 | RECTANGULAR | 小概要 | 15 V | SMD | 有 | ceramic | -55...125°C | e3 | Matte Tin (Sn) | 7.8pF | DUAL | 鸥翼 | 260 | 2 | 1.27 mm | compliant | 30 | R-PDSO-G16 | 不合格 | C0G (NP0) | 20 V | INDUSTRIAL | 5 V | 4 | 差分复用器 | 1.75 mm | 2 mA | -15 V | 75 dB | -20 V | 15 Ω | BREAK-BEFORE-MAKE | 150 ns | 150 ns | 0.02 A | -5 V | 1 | 50V | 9.9 mm | 3.9 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | DG333ALDW-T1-E3 | Vishay Intertechnologies | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 20 | ±0.05pF | GCQ | 0201 | 0603 | 0.03 g | 活跃 | MLCC | VISHAY INTERTECHNOLOGY INC | 45 Ω | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP20,.4 | RECTANGULAR | 小概要 | 15 V | SMD | 有 | ceramic | -55...125°C | 9.1pF | DUAL | 鸥翼 | 4 | 1.27 mm | compliant | 独立输出 | R-PDSO-G20 | 不合格 | C0G (NP0) | 22 V | INDUSTRIAL | 4 V | 1 | 单刀双掷 | 2.54 mm | -15 V | 72 dB | -22 V | 2 Ω | BREAK-BEFORE-MAKE | 175 ns | 145 ns | -4 V | 50V | 12.8 mm | 7.5 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 74HCT4052PW | Nexperia | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 16 | GCQ | 0201 | 0603 | 1995-11-01 | 0.03 g | 活跃 | MLCC | NEXPERIA | SOP-16 | 180 Ω | 125 °C | -40 °C | PLASTIC/EPOXY | SOP | RECTANGULAR | 小概要 | 5 V | SMD | 有 | ceramic | -55...125°C | ±5% | e4 | 镍钯金 | 8542.39.00.01 | 18pF | DUAL | 鸥翼 | 260 | 2 | 0.65 mm | compliant | 30 | R-PDSO-G16 | C0G (NP0) | 5.5 V | AUTOMOTIVE | 4.5 V | 4 | SP4T | 50 dB | 9 Ω | BREAK-BEFORE-MAKE | 70 ns | 50 ns | NO | 1 | 50V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TDA1029 | Philips Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 16 | ±0.1pF | GCM | 0402 | 1005 | 0.03 g | Transferred | MLCC | 飞利浦半导体 | DIP, DIP16,.3 | 80 °C | -30 °C | PLASTIC/EPOXY | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | 20 V | SMD | 无 | ceramic | -55...125°C | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 0.47pF | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T16 | 不合格 | C0G (NP0) | 商业扩展 | 100V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | DG9424EDQ-T1-GE3 | Vishay Intertechnologies | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks, 4 Days | YES | 16 | ±0.25pF | GCQ | 0201 | 0603 | 0.03 g | VISHAY INTERTECHNOLOGY INC | MLCC | , | 3.3 Ω | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP16,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 5 V | SMD | 有 | 活跃 | 42*23*23/500 | ceramic | -55...125°C | 8542.39.00.01 | 5.1pF | DUAL | 鸥翼 | 未说明 | 4 | 0.65 mm | compliant | 未说明 | 独立输出 | R-PDSO-G16 | C0G (NP0) | 8 V | INDUSTRIAL | 3 V | 4 | SPST | 1.2 mm | 5 mA | -5 V | 56 dB | -8 V | BREAK-BEFORE-MAKE | 81 ns | 67 ns | NC | 0.2 A | -3 V | 50V | 5 mm | 4.4 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 74HC4052PW | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 16 | GCM | 0402 | 1005 | Transferred | 0.03 g | NXP SEMICONDUCTORS | MLCC | TSSOP | 4.40 MM, PLASTIC, MO-153, SOT-403-1, TSSOP-16 | 195 Ω | 125 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP16,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 5 V | SMD | 有 | ceramic | -55...125°C | ±2% | e4 | 有 | Nickel/Palladium/Gold (Ni/Pd/Au) | 8542.39.00.01 | 1nF | DUAL | 鸥翼 | 260 | 1 | 0.65 mm | compliant | 30 | 16 | R-PDSO-G16 | 不合格 | C0G (NP0) | 10 V | AUTOMOTIVE | 2 V | 4 | 差分复用器 | 1.1 mm | 0.32 mA | -4.5 V | 50 dB | -5 V | 6 Ω | BREAK-BEFORE-MAKE | 69 ns | 57 ns | 0.025 A | -1 V | 1 | 100V | 5 mm | 4.4 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | PI5V331QEX | Pericom Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | brass | 16 | Transferred | 1.40 | PERICOM SEMICONDUCTOR CORP | SOIC | 0.150 INCH, PLASTIC, QSOP-16 | 10 Ω | 85 °C | -40 °C | PLASTIC/EPOXY | SSOP | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | 5 V | hexagonal mounting standoff for PCB | M3x0.5 mm | screw - nut | 有 | 28*15.5*14.5/10000 | e3 | 有 | EAR99 | 哑光锡 | 8542.39.00.01 | DUAL | 鸥翼 | 2 | 0.635 mm | overall - 13; standoffs - 8 mm | compliant | 16 | R-PDSO-G16 | 不合格 | 5.25 V | INDUSTRIAL | 4.75 V | 4 | VIDEO MULTIPLEXER | 1.75 mm | 38 dB | 5 ns | 5 ns | 1 | nickel-plated | ~5 mm | threaded shaft/hole ~ 5/5 mm | 3.9116 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SA576D | YAGEO Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | Synthetic Polyolefin | 14 | 3.0 mm | 6.5 mm | 895.00 | SOIC | , | 0.02 MHz | 85 °C | -40 °C | PLASTIC/EPOXY | RECTANGULAR | 小概要 | 3.6 V | Obsolete | 3.1…5.4 mm | 飞利浦组件 | 46*46*50/10 | 0.55 mm | 0.28 mm | In batches of 1 m segments | EAR99 | Non-adhesive Heat Shrink Tubing | Red | 8542.39.00.01 | DUAL | 鸥翼 | 1 | unknown | 14 | R-PDSO-G14 | 不合格 | 7 V | INDUSTRIAL | 2 V | COMPANDER | 3 mA | -55…+125 °C | +70…+120 °C | 7 V | 600 V | 2 : 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 1594/BEAJC | Freescale Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | synthetic polyolefin | 16 | 10.0 mm | 22.0 mm | 10.4…19.0 mm | 2620.00 | MOTOROLA SEMICONDUCTOR PRODUCTS | DIP, DIP16,.3 | 125 °C | -55 °C | CERAMIC | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | 15 V | 无 | Obsolete | 46*46*53/10 | 0.8 mm | 0.4 mm | coil 100 m | e0 | Adhesive-free heat shrink tube | Tin/Lead (Sn/Pb) | red | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-XDIP-T16 | 不合格 | 600 V | +-15 V | MILITARY | 相机开发工具 | 18 mA | -15 V | -55…+125 °C | 38535Q/M;38534H;883B | +70…+120 °C | 2 : 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 74LV4053D | Nexperia | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | housing - nickel-plated metal; insulator - GF-PBT UL94V-0; contacts - brass | 16 | 1993-08-01 | 1000 (50 Hz, 1 min.) V | 8.90 | NEXPERIA | 435 Ω | 125 °C | -40 °C | 15 | PLASTIC/EPOXY | SOP | RECTANGULAR | 小概要 | 2 V | 有 | 活跃 | 36*24*21/1000 | e4 | D-SUB M-M adapter | 镍钯金 | 8542.39.00.01 | DUAL | 鸥翼 | 260 | 3 | 1.27 mm | 17.6 mm | compliant | 30 | R-PDSO-G16 | 6 V | ≤20 mΩ | AUTOMOTIVE | 1 V | ≥1000 (at Uinsp.dc=500 V) MΩ | 2 | SINGLE-ENDED MULTIPLEXER | 1.75 mm | -55…+105 °C | 3 A | 50 dB | 5 Ω | 97 ns | 70 ns | 1 | 12.85 mm | 9.9 mm | 3.9 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MC14051BCP | Freescale Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | Copper + Manganin | 16 | 20900.00 | DIP16,.3 | DIP | PLASTIC/EPOXY | -55 °C | 125 °C | 135 Ω | DIP, DIP16,.3 | MOTOROLA SEMICONDUCTOR PRODUCTS | Obsolete | 无 | IN-LINE | RECTANGULAR | 35*29*16/1 | -40…+60 °C | e0 | Tin/Lead (Sn/Pb) | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-PDIP-T16 | 不合格 | 5/15 V | MILITARY | 8 | SINGLE-ENDED MULTIPLEXER | BREAK-BEFORE-MAKE | 0.025 A | 0.5 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TPW4054-VR | 3PEAK | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) | 10-MSOP | -40°C ~ 125°C | Tape & Reel (TR) | 活跃 | 1 | 200MHz | 150Ohm | 4:1 | 2μA | 12pF | SP4T - Open/Closed | 60ns, 50ns | 35Ohm | -70dB @ 1MHz | 3V ~ 12V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | WAS4735Q-16/TR | Will Semiconductor Ltd | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 接触制造商 | WILL SEMICONDUCTOR LTD | 8542.39.00.01 | unknown | 差分复用器 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 74HC4051PW | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 16 | Transferred | NXP SEMICONDUCTORS | TSSOP | 4.40 MM, PLASTIC, MO-153, SOT-403-1, TSSOP-16 | 1 | 180 Ω | 125 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP16,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 5 V | 有 | e4 | 有 | Nickel/Palladium/Gold (Ni/Pd/Au) | ALSO OPERATES ON VCC-VEE 2 V TO 10 V SUPPLY | 8542.39.00.01 | DUAL | 鸥翼 | 260 | 1 | 0.65 mm | unknown | 30 | 16 | R-PDSO-G16 | 不合格 | 10 V | AUTOMOTIVE | 2 V | 8 | SINGLE-ENDED MULTIPLEXER | 1.1 mm | 0.32 mA | 50 dB | 9 Ω | BREAK-BEFORE-MAKE | 104 ns | 87 ns | 0.025 A | 5 mm | 4.4 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 74HC4052D | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 16 | Transferred | NXP SEMICONDUCTORS | SOIC | 3.90 MM, 1.47 MM THICKNESS, MS-012AC, SOT-109-3, PLASTIC, SO-16 | 1 | 195 Ω | 125 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP16,.25 | RECTANGULAR | 小概要 | 5 V | 有 | e4 | 有 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 8542.39.00.01 | DUAL | 鸥翼 | 260 | 1 | 1.27 mm | unknown | 30 | 16 | R-PDSO-G16 | 不合格 | 10 V | AUTOMOTIVE | 2 V | 4 | 差分复用器 | 1.75 mm | -4.5 V | 50 dB | -5 V | 6 Ω | BREAK-BEFORE-MAKE | 69 ns | 57 ns | 0.025 A | -1 V | 9.9 mm | 3.9 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | BL1555MM | BL(Shanghai Belling) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | true | Tape & Reel (TR) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 74HC4066DB | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 14 | Transferred | NXP SEMICONDUCTORS | SSOP | SSOP, SSOP14,.3 | 1 | 142 Ω | 125 °C | -40 °C | PLASTIC/EPOXY | SSOP | SSOP14,.3 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | 4.5 V | 有 | e4 | 有 | Nickel/Palladium/Gold (Ni/Pd/Au) | 8542.39.00.01 | DUAL | 鸥翼 | 260 | 4 | 0.65 mm | unknown | 30 | 独立输出 | 14 | R-PDSO-G14 | 不合格 | 10 V | AUTOMOTIVE | 2 V | 1 | SPST | 2 mm | 50 dB | 5 Ω | MAKE-BEFORE-BREAK | 30 ns | 45 ns | NO | 6.2 mm | 5.3 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 74HC4066DB | Nexperia | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 14 | Obsolete | 2017-02-01 | NEXPERIA | SSOP, | 1 | 142 Ω | 125 °C | -40 °C | PLASTIC/EPOXY | SSOP | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | 4.5 V | 有 | e4 | 镍钯金 | 8542.39.00.01 | DUAL | 鸥翼 | 260 | 4 | 0.65 mm | compliant | 30 | R-PDSO-G14 | 10 V | AUTOMOTIVE | 2 V | 1 | SPST | 2 mm | 50 dB | 5 Ω | 30 ns | 45 ns | 6.2 mm | 5.3 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | DG409DY-T1 | Temic Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 16 | 100 Ω | 85 °C | -40 °C | PLASTIC/EPOXY | RECTANGULAR | 小概要 | 15 V | Transferred | TEMIC SEMICONDUCTORS | DUAL | 鸥翼 | 1 | unknown | R-PDSO-G16 | 不合格 | INDUSTRIAL | 4 | 差分复用器 | 2 mA | -15 V | 75 dB | 250 ns | 250 ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | HEF4052BT | Philips Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 16 | 飞利浦半导体 | 2500 Ω | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP16,.25 | RECTANGULAR | 小概要 | 有 | Transferred | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | 8542.39.00.01 | DUAL | 鸥翼 | 1 | 1.27 mm | unknown | R-PDSO-G16 | 不合格 | INDUSTRIAL | 4 | 差分复用器 | 0.6 mA | BREAK-BEFORE-MAKE | 0.01 A | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | DG309BDY | Temic Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 16 | 85 Ω | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | RECTANGULAR | 小概要 | 15 V | Transferred | TEMIC SEMICONDUCTORS | DUAL | 鸥翼 | 4 | unknown | R-PDSO-G16 | 不合格 | INDUSTRIAL | 1 | SPST | 0.005 mA | -15 V | 90 dB | 0.9 Ω | 200 ns | 150 ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | HI1-5051-8 | Intersil Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 16 | Obsolete | INTERSIL CORP | DIP, DIP16,.3 | 50 Ω | 125 °C | -55 °C | CERAMIC | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | 无 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2 | 2.54 mm | not_compliant | 独立输出 | R-XDIP-T16 | 不合格 | MILITARY | 1 | 单刀双掷 | 38535Q/M;38534H;883B | BREAK-BEFORE-MAKE | 1000 ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | LF13331D | National Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 16 | Obsolete | NATIONAL SEMICONDUCTOR CORP | DIP, DIP16,.3 | 250 Ω | 70 °C | CERAMIC, METAL-SEALED COFIRED | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | 15 V | 无 | e0 | 锡铅 | 8542.39.00.01 | DUAL | THROUGH-HOLE | 4 | 2.54 mm | unknown | 独立输出 | R-CDIP-T16 | 不合格 | COMMERCIAL | 1 | SPST | 4.572 mm | 13.5 mA | -15 V | 50 dB | 10 Ω | BREAK-BEFORE-MAKE | NO | 7.62 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | DG509AAK/883 | Temic Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 16 | 400 Ω | 125 °C | -55 °C | CERAMIC, GLASS-SEALED | RECTANGULAR | IN-LINE | 15 V | Transferred | TEMIC SEMICONDUCTORS | DUAL | THROUGH-HOLE | 1 | unknown | R-GDIP-T16 | 不合格 | MILITARY | 4 | 差分复用器 | 2.4 mA | -15 V | 68 dB | 14.4 Ω | 1000 ns |
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分类:Interface - Analog Switches, Multiplexers, Demultiplexers
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分类:Interface - Analog Switches, Multiplexers, Demultiplexers
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分类:Interface - Analog Switches, Multiplexers, Demultiplexers
