Philips Semiconductors 74HCT4066N

表面安装

NO

材料

polyolefin

终端数量

14

Rohs Code

有

Part Life Cycle Code

Transferred

Ihs Manufacturer

飞利浦半导体

Package Description

DIP-14

On-state Resistance-Max (Ron)

118 Ω

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

DIP

Package Equivalence Code

DIP14,.3

Package Shape

RECTANGULAR

Package Style

IN-LINE

Supply Voltage-Nom (Vsup)

5 V

Weight gross

1226.87

Transport package size/quantity

46.5*46*58/8

Diameter before shrink

3 mm

Diameter after shrink

1 mm

Nominal diameter

3 mm

Wall thickness before shrink

0.42 mm

包装

roll 100 m

类型

Heat shrink tube with adhesive layer

颜色

black

HTS代码

8542.39.00.01

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

4

端子间距

2.54 mm

Reach合规守则

not_compliant

输出量

独立输出

JESD-30代码

R-PDIP-T14

资历状况

不合格

温度等级

INDUSTRIAL

注意

Possible deviation of the diameter to shrink up to +1.5 mm

模拟 IC - 其他类型

SPST

Operating temperature range

-55…+125 deg. C

Shrinkage ratio

3 : 1

Shrink temperature

100 deg. C

开关量

MAKE-BEFORE-BREAK

开启时间-最大值

24 ns

正常位置

NO

Operating voltage

≤1500 V

长度

100000 mm