类别是'category.存储器' (10000)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 终端数量 | 制造商包装标识符 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 终端 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 电压 | 界面 | 最大电源电压 | 最小电源电压 | 内存大小 | 工作电源电流 | 端口的数量 | 电源电流 | 操作模式 | 最大电源电流 | 时钟频率 | 电源电流-最大值 | 访问时间 | 内存格式 | 内存接口 | 数据总线宽度 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 密度 | 待机电流-最大值 | 记忆密度 | 最高频率 | 访问时间(最大) | 并行/串行 | I/O类型 | 同步/异步 | 字长 | 内存IC类型 | 编程电压 | 串行总线类型 | 耐力 | 写入周期时间 - 最大值 | 数据保持时间 | 写入保护 | 待机电压-最小值 | 备用内存宽度 | 数据轮询 | 拨动位 | 命令用户界面 | 输出启用 | 扇区/尺寸数 | 行业规模 | 准备就绪/忙碌 | 引导模块 | 环境温度范围高 | 通用闪存接口 | I2C控制字节 | 反向引脚排列 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | 无铅 | |||||||||||||||||||||||
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MX25L3206EM2I-12G | Macronix | 数据表 | 2283 In Stock | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | 表面贴装 | 8-SOIC (0.209, 5.30mm Width) | YES | Non-Volatile | -40°C~85°C TA | Tube | 2009 | MX25xxx05/06 | e3 | yes | 不用于新设计 | 3 (168 Hours) | 8 | 3A991.B.1.A | Matte Tin (Sn) | 8542.32.00.51 | 2.7V~3.6V | DUAL | 260 | 1 | 3.3V | 1.27mm | 40 | 8 | R-PDSO-G8 | 不合格 | 3.6V | 3/3.3V | 2.7V | SPI, Serial | 32Mb 4M x 8 | SYNCHRONOUS | 86MHz | FLASH | SPI | 16MX2 | 图腾柱 | 2 | 50μs, 3ms | 32 Mb | 0.00004A | 3.3V | 3-WIRE | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 1 | 2.16mm | 5.28mm | 5.23mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 93LC46T/SN | Microchip Technology | 数据表 | 1837 In Stock | - | 最小起订量: 1 最小包装量: 1 | 14 Weeks | Tin | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | 8 | Non-Volatile | 0°C~70°C TA | Tape & Reel (TR) | 2004 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 100K ERASE/WRITE CYCLES MIN; DATA RETENTION > 40 YEARS | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | 40 | 93LC46 | 8 | 6V | 3/5V | 2V | 2-Wire, Serial | 1Kb 128 x 8 64 x 16 | 3mA | 2MHz | 10 ms | EEPROM | SPI | 3-STATE | 8 | 1 kb | 0.00003A | MICROWIRE | 1000000 Write/Erase Cycles | 200 | SOFTWARE | 16 | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
BR24L02FVM-WTR | ROHM Semiconductor | 数据表 | 6000 In Stock | - | 最小起订量: 1 最小包装量: 1 | 11 Weeks | Copper, Tin | 表面贴装 | 表面贴装 | 8-VSSOP, 8-MSOP (0.110, 2.80mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2009 | e2 | yes | 活跃 | 1 (Unlimited) | 8 | SMD/SMT | EAR99 | Tin/Copper (Sn97.5Cu2.5) | 1.8V~5.5V | DUAL | 260 | 1 | 2.5V | 0.65mm | 10 | BR24L02 | 8 | 5.5V | 2/5V | 1.7V | 2-Wire, I2C, Serial | 2Kb 256 x 8 | 2mA | 400kHz | 900 ns | EEPROM | I2C | 8 | 5ms | 2 kb | 0.000002A | I2C | 1000000 Write/Erase Cycles | 5ms | 40 | HARDWARE | 1010DDDR | 1.095mm | 2.9mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 24LC04B-E/P | Microchip Technology | 数据表 | 683 In Stock | - | 最小起订量: 1 最小包装量: 1 | 7 Weeks | Tin | 通孔 | 通孔 | 8-DIP (0.300, 7.62mm) | 8 | Non-Volatile | -40°C~125°C TA | Tube | 2005 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 1 | 2.54mm | 24LC04B | 8 | 5.5V | 3/5V | 2.5V | I2C, Serial | 4Kb 256 x 8 x 2 | 3mA | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 4 kb | 0.000005A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010XXMR | NO | 5.33mm | 9.27mm | 7.62mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
CY7C1339G-133AXC | Cypress Semiconductor Corp | 数据表 | 18 In Stock | - | 最小起订量: 1 最小包装量: 1 | 7 Weeks | 表面贴装 | 表面贴装 | 100-LQFP | 100 | 657.000198mg | Volatile | 0°C~70°C TA | Tray | 2003 | e3 | yes | Obsolete | 3 (168 Hours) | 100 | 3A991.B.2.A | Matte Tin (Sn) | 流水线结构 | 3.15V~3.6V | QUAD | 260 | 1 | 3.3V | 0.65mm | 20 | CY7C1339 | 100 | 3.3V | 3.6V | 3.135V | 4Mb 128K x 32 | 4 | 225mA | 225mA | 133MHz | 4ns | SRAM | Parallel | 128KX32 | 3-STATE | 17b | 4 Mb | COMMON | Synchronous | 32b | 1.6mm | 20mm | 14mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 23A1024-I/P | Microchip Technology | 数据表 | 33000 In Stock | - | 最小起订量: 1 最小包装量: 1 | 7 Weeks | 通孔 | 8-DIP (0.300, 7.62mm) | NO | 8 | Volatile | -40°C~85°C TA | Tube | 2006 | e3 | 活跃 | 1 (Unlimited) | 8 | Matte Tin (Sn) - annealed | 1.7V~2.2V | DUAL | NOT APPLICABLE | 1 | NOT APPLICABLE | 23A1024 | 不合格 | 1.8V | 1.7V | SPI, Serial | 1Mb 128K x 8 | 2 | 10mA | 20MHz | 25 ns | SRAM | SPI - Quad I/O | 8b | 3-STATE | 24b | 1 Mb | COMMON/SEPARATE | Synchronous | 8b | 1.7V | NO | NO | 4.953mm | 10.16mm | 7.112mm | 无SVHC | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 25LC160AT-I/SNG | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 | 小概要 | 1 | 2000 | PLASTIC/EPOXY | SOP8,.25 | -40 °C | 40 | 85 °C | 有 | 25LC160AT-I/SNG | 10 MHz | 2048 words | 5 V | SOP | RECTANGULAR | Microchip Technology Inc | 不推荐 | MICROCHIP TECHNOLOGY INC | 5.25 | SOIC | e3 | 有 | EAR99 | Matte Tin (Sn) | 8542.32.00.51 | EEPROMs | CMOS | DUAL | 鸥翼 | 260 | 1 | 1.27 mm | compliant | 8 | R-PDSO-G8 | 不合格 | 5.5 V | 3/5 V | INDUSTRIAL | 2.5 V | SYNCHRONOUS | 0.006 mA | 2KX8 | 1.75 mm | 8 | 0.000005 A | 16384 bit | SERIAL | EEPROM | SPI | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE/SOFTWARE | 4.9 mm | 3.9 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M34E02-FMC6TG | STMicroelectronics | 数据表 | 2369 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 14 Weeks | ACTIVE (Last Updated: 7 months ago) | 表面贴装 | 表面贴装 | 8-UFDFN Exposed Pad | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | e4 | 活跃 | 1 (Unlimited) | 8 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 1.7V~5.5V | DUAL | 1 | 1.8V | 0.5mm | M34E02 | 5.5V | 2/5V | 1.7V | 2-Wire, I2C, Serial | 2Kb 256 x 8 | 3mA | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 2 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 40 | HARDWARE/SOFTWARE | 1010DDDR | 0.6mm | 3mm | 2mm | 无 | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
S29GL064S70TFI010 | Cypress Semiconductor Corp | 数据表 | 3 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 56-TFSOP (0.724, 18.40mm Width) | YES | 56 | Non-Volatile | -40°C~85°C TA | Tray | 2013 | GL-S | 活跃 | 3 (168 Hours) | 56 | 8542.32.00.51 | 2.7V~3.6V | DUAL | 1 | 3V | 0.5mm | 3V | 3.6V | 2.7V | 64Mb 4M x 16 | ASYNCHRONOUS | 70ns | FLASH | Parallel | 8MX8 | 8 | 60ns | 64 Mb | 3V | 1.2mm | 18.4mm | 14mm | 无SVHC | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 25C320/SN | Microchip Technology | 数据表 | 2900 In Stock | - | 最小起订量: 1 最小包装量: 1 | 3 Weeks | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | 8-SOIC | Non-Volatile | 0°C~70°C TA | Tube | 2004 | 活跃 | 1 (Unlimited) | 70°C | 0°C | 4.5V~5.5V | 3MHz | 25C320 | 5V | SPI, Serial | 5.5V | 4.5V | 32Kb 4K x 8 | 5mA | 3MHz | 150 ns | EEPROM | SPI | 5ms | 32 kb | 3MHz | 1.5mm | 4.9mm | 3.9mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MR2A16ACYS35 | Everspin Technologies Inc. | 数据表 | 444 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 44-TSOP (0.400, 10.16mm Width) | 44 | MR2A16ACYS35 | Non-Volatile | -40°C~85°C TA | Tray | 2003 | yes | 活跃 | 3 (168 Hours) | 44 | SMD/SMT | EAR99 | 8542.32.00.71 | 3V~3.6V | DUAL | 1 | 3.3V | 0.8mm | 44 | 3.3V | 3.6V | 3V | 4Mb 256K x 16 | 105mA | 165mA | RAM | Parallel | 16b | 256KX16 | 16 | 35ns | 4 Mb | 0.028A | 35 ns | 16b | 85°C | 1.2mm | 18.41mm | 无 | 无SVHC | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M95512-DRMF3TG/K | STMicroelectronics | 数据表 | 5000 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 14 Weeks | ACTIVE (Last Updated: 7 months ago) | Gold | 表面贴装 | 表面贴装 | 8-WFDFN Exposed Pad | 8 | Non-Volatile | Automotive grade | -40°C~125°C TA | Cut Tape (CT) | Automotive, AEC-Q100 | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.8V~5.5V | DUAL | 未说明 | 1 | 2.5V | 0.5mm | 未说明 | M95512 | 5.5V | 1.7V | SPI, Serial | 512Kb 64K x 8 | SYNCHRONOUS | 16MHz | 25 ns | EEPROM | SPI | 8 | 4ms | 512 kb | SPI | 4ms | 3mm | 2mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
BR24T01FV-WE2 | ROHM Semiconductor | 数据表 | 95 In Stock | - | 最小起订量: 1 最小包装量: 1 | 6 Weeks | Copper, Tin | 表面贴装 | 表面贴装 | 8-LSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2013 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | Matte Tin (Sn) | 1.6V~5.5V | DUAL | 225 | 1 | 2.5V | 0.65mm | 未说明 | 不合格 | 5.5V | 1.6V | 2-Wire, I2C, Serial | 1Kb 128 x 8 | SYNCHRONOUS | 400kHz | 900 ns | EEPROM | I2C | 8 | 5ms | 1 kb | 0.000002A | I2C | 1000000 Write/Erase Cycles | 5ms | 40 | HARDWARE | 1010DDDR | 1.35mm | 4.4mm | 3mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 24LC08BHT-I/OT | Microchip Technology | 数据表 | 5200 In Stock | - | 最小起订量: 1 最小包装量: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | SC-74A, SOT-753 | 5 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2008 | e3 | yes | 活跃 | 1 (Unlimited) | 5 | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 40 | 24LC08BH | 5 | 5V | I2C, Serial | 8Kb 256 x 8 x 4 | 3mA | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 8 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 200 | HARDWARE | 1010XMMR | 2.9mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 24LC08BH-E/SN | Microchip Technology | 数据表 | 800 In Stock | - | 最小起订量: 1 最小包装量: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~125°C TA | Tube | 2007 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 1.27mm | 40 | 24LC08BH | 8 | 5V | I2C, Serial | 8Kb 256 x 8 x 4 | 3mA | 400kHz | 900ns | EEPROM | I2C | 8 | 5ms | 8 kb | 0.000005A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010XMMR | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 93LC66BX-I/SNG | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
IS43TR16256AL-125KBL | ISSI, Integrated Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 6 Weeks | 表面贴装 | 96-TFBGA | YES | 96 | Volatile | 0°C~95°C TC | Tray | 活跃 | 3 (168 Hours) | 96 | PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH | 1.283V~1.45V | BOTTOM | 1 | 1.35V | 0.8mm | 1.45V | 1.283V | 4Gb 256M x 16 | 1 | SYNCHRONOUS | 800MHz | 20ns | DRAM | Parallel | 16b | 256MX16 | 16 | 15ns | 1.2mm | 13mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 24FC64T-I/SN | Microchip Technology | 数据表 | 30105 In Stock | - | 最小起订量: 1 最小包装量: 1 | 6 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2010 | e3 | yes | 活跃 | 3 (168 Hours) | 8 | EAR99 | 1.7V~5.5V | DUAL | 260 | 1 | 2.5V | 1.27mm | 40 | 24FC64 | 8 | 5.5V | 2/5V | 1.7V | I2C, Serial | 64Kb 8K x 8 | 3mA | 1MHz | 400ns | EEPROM | I2C | 8 | 5ms | 64 kb | 0.000001A | I2C | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE | 1010DDDR | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 24AA04T/SN | Microchip Technology | 数据表 | 146 In Stock | - | 最小起订量: 1 最小包装量: 1 | 14 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | 0°C~70°C TA | Tape & Reel (TR) | 2007 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | 2-WIRE SERIAL INTERFACE; DATA RETENTION > 200 YEARS; 1000000 ERASE/WRITE CYCLES GUARANTEED | 1.7V~5.5V | DUAL | 260 | 1 | 3V | 1.27mm | 40 | 24AA04 | 8 | 5.5V | 2/5V | I2C, Serial | 4Kb 256 x 8 x 2 | 3mA | 400kHz | 900ns | EEPROM | I2C | OPEN-DRAIN | 8 | 5ms | 4 kb | 0.00003A | I2C | 1000000 Write/Erase Cycles | 10ms | 200 | HARDWARE | 1010XXMR | 1.75mm | 4.9mm | 3.9mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 25AA128T-I/SM | Microchip Technology | 数据表 | 1451 In Stock | - | 最小起订量: 1 最小包装量: 1 | 2 Weeks | Tin | 表面贴装 | 表面贴装 | 8-SOIC (0.209, 5.30mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2011 | e3 | 活跃 | 1 (Unlimited) | 8 | EAR99 | 1.8V~5.5V | DUAL | 260 | 1 | 2.5V | 1.27mm | 40 | 25AA128 | 8 | 5V | SPI, Serial | 128Kb 16K x 8 | 5mA | 10MHz | 160 ns | EEPROM | SPI | 8 | 5ms | 128 kb | 0.000001A | SPI | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 2.03mm | 5.26mm | 5.25mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
BR24G08FVT-3GE2 | ROHM Semiconductor | 数据表 | 7283 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 10 Weeks | Tin | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2013 | 活跃 | 1 (Unlimited) | 8 | 1.6V~5.5V | DUAL | 未说明 | 1 | 2.5V | 0.65mm | 未说明 | BR24G08 | 不合格 | 5.5V | 1.6V | 2-Wire, I2C, Serial | 8Kb 1K x 8 | SYNCHRONOUS | 400kHz | 900 ns | EEPROM | I2C | 1 | 5ms | 8 kb | 0.000002A | I2C | 1000000 Write/Erase Cycles | 5ms | 40 | HARDWARE | 1010DMMR | 1.2mm | 4.4mm | 3mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 25LC320AT-I/ST | Microchip Technology | 数据表 | 10000 In Stock | - | 最小起订量: 1 最小包装量: 1 | 6 Weeks | 表面贴装 | 表面贴装 | 8-TSSOP (0.173, 4.40mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2008 | e3 | yes | 活跃 | 1 (Unlimited) | 8 | EAR99 | Matte Tin (Sn) | 2.5V~5.5V | DUAL | 260 | 1 | 5V | 0.65mm | 40 | 25LC320A | 8 | 5V | SPI, Serial | 32Kb 4K x 8 | 5mA | 10MHz | 50 ns | EEPROM | SPI | 8 | 5ms | 32 kb | 0.000001A | SPI | 1000000 Write/Erase Cycles | 5ms | 200 | HARDWARE/SOFTWARE | 1.2mm | 4.4mm | 3mm | 无 | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
CY7C1518KV18-300BZXC | Cypress Semiconductor Corp | 数据表 | 2817 In Stock | - | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 表面贴装 | 165-LBGA | 165 | Volatile | 0°C~70°C TA | Tray | 2003 | e1 | 活跃 | 3 (168 Hours) | 165 | Tin/Silver/Copper (Sn/Ag/Cu) | 流水线结构 | 1.7V~1.9V | BOTTOM | 260 | 1 | 1.8V | 30 | CY7C1518 | 165 | 1.8V | 72Mb 4M x 18 | 1 | 490mA | 300MHz | 450 ps | SRAM | Parallel | 3-STATE | 18 | 22b | 72 Mb | COMMON | Synchronous | 18b | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
FM24V01-GTR | Cypress Semiconductor Corp | 数据表 | 2500 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | 8 | Non-Volatile | -40°C~85°C TA | Tape & Reel (TR) | 2008 | F-RAM™ | e4 | Obsolete | 1 (Unlimited) | 8 | EAR99 | 镍钯金 | 2V~3.6V | DUAL | 260 | 1 | 3.3V | 1.27mm | 20 | FM24V01 | 8 | 3.3V | 3.6V | 2V | 2-Wire, I2C, Serial | 128Kb 16K x 8 | 1mA | 3.4MHz | 130ns | FRAM | I2C | 8b | 8 | 128 kb | 0.00015A | 8b | 1.75mm | 4.9mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M29DW323DB70ZE6E | Micron Technology Inc. | 数据表 | 205 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 48-TFBGA | YES | 48 | Non-Volatile | -40°C~85°C TA | Tray | 2004 | e1 | yes | Obsolete | 3 (168 Hours) | 48 | SMD/SMT | 3A991.B.1.A | Tin/Silver/Copper (Sn/Ag/Cu) | 底部启动区块 | 8542.32.00.51 | 2.7V~3.6V | BOTTOM | 260 | 1 | 3V | 0.8mm | 30 | M29DW323 | 48 | 3/3.3V | 2.7V | 32Mb 4M x 8 2M x 16 | 10mA | FLASH | Parallel | 2MX16 | 16 | 70ns | 32 Mb | 0.0001A | 70 ns | Asynchronous | 8 | YES | YES | YES | 863 | 8K64K | YES | BOTTOM | YES | 1.2mm | 8mm | 6mm | 无 | 无SVHC | ROHS3 Compliant |
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5.998746
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1.061520
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