N/A

-

表面贴装

240-BFQFP Exposed Pad

YES

182

0°C~70°C TA

Tray

FLEX-10KS®

e0

Obsolete

3 (168 Hours)

240

3A991

Tin/Lead (Sn/Pb)

8542.39.00.01

2.375V~2.625V

QUAD

鸥翼

220

2.5V

0.5mm

compliant

30

EPF10K200

S-PQFP-G240

182

不合格

2.52.5/3.3V

0.8 ns

182

可加载 PLD

9984

98304

513000

1248

MIXED

4.1mm

32mm

32mm

Non-RoHS Compliant

930 In Stock

-

表面贴装

表面贴装

100-TQFP

100

77

0°C~85°C TJ

Tray

1999

XC4000E/X

e0

Obsolete

3 (168 Hours)

100

锡铅

3V~3.6V

QUAD

鸥翼

225

3.3V

0.5mm

30

XC4005XL

100

112

3.3V

784B

200MHz

现场可编程门阵列

466

6272

5000

196

1

616

196

196

3000

无

Non-RoHS Compliant

含铅

903 In Stock

• 1: ¥6,343.258923
• 10: ¥5,984.206533
• 100: ¥5,645.477863
• 500: ¥5,325.922508
查看所有的价格

-

10 Weeks

表面贴装

表面贴装

672-BBGA, FCBGA

672

352

-40°C~100°C TJ

Tray

1999

Virtex®-4 FX

e0

no

活跃

4 (72 Hours)

672

3A991.D

Tin/Lead (Sn63Pb37)

8542.39.00.01

1.14V~1.26V

BOTTOM

BALL

225

1.2V

1mm

30

XC4VFX40

672

352

不合格

1.2V

324kB

现场可编程门阵列

41904

2654208

4656

11

3mm

27mm

27mm

Non-RoHS Compliant

34 In Stock

-

8 Weeks

表面贴装

表面贴装

256-BGA

256

190

0°C~85°C TJ

Tray

2008

ECP2

e1

yes

活跃

3 (168 Hours)

256

EAR99

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

1.14V~1.26V

BOTTOM

BALL

250

1.2V

1mm

not_compliant

30

LFE2-6

256

190

不合格

1.2V

8.4kB

11.5kB

420MHz

现场可编程门阵列

6000

56320

750

0.304 ns

2.1mm

17mm

17mm

ROHS3 Compliant

无铅

609 In Stock

-

8 Weeks

表面贴装

表面贴装

100-LQFP

100

FLASH

79

0°C~85°C TJ

Tray

2012

MachXO2

yes

活跃

3 (168 Hours)

100

EAR99

Matte Tin (Sn)

8542.39.00.01

1.14V~1.26V

QUAD

鸥翼

260

1.2V

0.5mm

104MHz

30

LCMXO2-2000

80

不合格

1.2V

21.3kB

80μA

9.3kB

10.21 ns

现场可编程门阵列

2112

74 kb

75776

264

1056

1.6mm

14mm

14mm

无SVHC

ROHS3 Compliant

无铅

576 In Stock

-

8 Weeks

表面贴装

1517-BBGA, FCBGA

YES

696

-40°C~100°C TJ

Tray

Stratix® V GX

活跃

3 (168 Hours)

8542.39.00.01

0.82V~0.88V

BOTTOM

BALL

0.85V

1mm

5SGXEA7

S-PBGA-B1517

696

不合格

0.851.52.52.5/31.2/3V

696

23472 CLBS

现场可编程门阵列

622000

51200000

234720

3.5mm

40mm

40mm

符合RoHS标准

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

This product may require additional documentation to export from the United States.

N

341 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

231 MHz

有

微芯片技术

60

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3PE3000

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-40 °C

1.5 V

30

85 °C

无

M1A3PE3000-FG484I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

-40 to 85 °C

Tray

M1A3PE3000

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

341

不合格

1.5 V

1.5/3.3 V

INDUSTRIAL

341

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

STD

75264

75264

3000000

1.73 mm

23 mm

23 mm

N/A

-

Production (Last Updated: 2 months ago)

Lead, Silver, Tin

表面贴装

表面贴装

FPBGA-256

YES

256

256-FPBGA (17x17)

400.011771 mg

256

90

微芯片技术

Fusion

0.014110 oz

Tray

AFS600

活跃

1.575 V

8542310000, 8542390000, 8542390000/8542390000, 8542390000/8542390000/8542390000

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

85 °C

无

AFS600-FG256I

LBGA

SQUARE

活跃

MICROSEMI CORP

1.73

N

119 I/O

1.425 V

- 40 C

+ 100 C

SMD/SMT

1098.9 MHz

有

-40°C ~ 100°C (TJ)

Tray

AFS600

e0

3A001.A.7.A

Tin/Lead (Sn/Pb)

85 °C

-40 °C

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

1.0989 GHz

S-PBGA-B256

不合格

1.5 V

INDUSTRIAL

1.575 V

1.425 V

13.5 kB

600000 GATES

1.7 mm

现场可编程门阵列

110592

600000

1.0989 GHz

STD

13824

600000

1.2 mm

17 mm

17 mm

无

N/A

-

表面贴装

FPBGA-256

YES

256-FPBGA (17x17)

256

Details

This product may require additional documentation to export from the United States.

1.5000 V

1.425 V

1.575 V

微芯片技术

178

Tray

M1A3P400

活跃

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

40

1.425 V

100 °C

有

M1A3P400-2FGG256I

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.24

ProASIC3

90

有

SMD/SMT

-40 to 85 °C

Tray

M1A3P400

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

INDUSTRIAL

9216 CLBS, 400000 GATES

1.8 mm

现场可编程门阵列

55296

400000

STD

9216

400000

17 mm

17 mm

N/A

-

表面贴装

PQFP-208

YES

208-PQFP (28x28)

208

24

ProASIC3

1.5000 V

1.425 V

1.575 V

微芯片技术

151

Tray

M1A3P400

活跃

FQFP,

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

1.5 V

40

1.425 V

85 °C

有

M1A3P400-PQG208

350 MHz

FQFP

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.24

This product may require additional documentation to export from the United States.

Details

SMD/SMT

有

0 to 85 °C

Tray

M1A3P400

e3

Matte Tin (Sn)

8542.39.00.01

CMOS

1.425V ~ 1.575V

QUAD

鸥翼

245

0.5 mm

compliant

S-PQFP-G208

不合格

COMMERCIAL

9216 CLBS, 400000 GATES

4.1 mm

现场可编程门阵列

55296

400000

STD

9216

400000

28 mm

28 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

This product may require additional documentation to export from the United States.

N

280 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

310 MHz

有

微芯片技术

60

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3PE1500

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-40 °C

1.5 V

30

85 °C

无

M1A3PE1500-2FG484I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

-40 to 85 °C

Tray

M1A3PE1500

e0

锡铅

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

280

不合格

1.5 V

1.5/3.3 V

INDUSTRIAL

280

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

2

38400

38400

1500000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

FPBGA-256

YES

256-FPBGA (17x17)

256

Tray

M1A3P400

微芯片技术

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

1.5 V

40

1.425 V

85 °C

有

M1A3P400-1FGG256

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.24

This product may require additional documentation to export from the United States.

Details

SMD/SMT

有

90

ProASIC3

178

0°C ~ 85°C (TJ)

Tray

M1A3P400

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B256

不合格

COMMERCIAL

9216 CLBS, 400000 GATES

1.8 mm

现场可编程门阵列

55296

400000

9216

400000

17 mm

17 mm

N/A

-

表面贴装

FPBGA-144

YES

144-FPBGA (13x13)

144

Tray

M1A3P400

微芯片技术

活跃

13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

40

1.425 V

85 °C

有

M1A3P400-1FGG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.24

This product may require additional documentation to export from the United States.

Details

SMD/SMT

有

160

ProASIC3

97

0°C ~ 85°C (TJ)

Tray

M1A3P400

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

260

1 mm

compliant

S-PBGA-B144

不合格

COMMERCIAL

9216 CLBS, 400000 GATES

1.55 mm

现场可编程门阵列

55296

400000

9216

400000

13 mm

13 mm

N/A

-

表面贴装

FPBGA-144

YES

144-FPBGA (13x13)

144

Tray

M1A3P400

微芯片技术

活跃

LBGA,

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

1.425 V

85 °C

无

M1A3P400-1FG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

1.575 V

5.24

This product may require additional documentation to export from the United States.

N

SMD/SMT

有

160

ProASIC3

97

0°C ~ 85°C (TJ)

Tray

M1A3P400

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

COMMERCIAL

9216 CLBS, 400000 GATES

1.55 mm

现场可编程门阵列

55296

400000

9216

400000

13 mm

13 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

97 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

231 MHz

有

160

微芯片技术

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3P250

活跃

13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

M1A3P250-FG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

N

0 to 70 °C

Tray

M1A3P250

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

COMMERCIAL

6144 CLBS, 250000 GATES

1.55 mm

现场可编程门阵列

36864

250000

STD

6144

250000

1.05 mm

13 mm

13 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

This product may require additional documentation to export from the United States.

N

341 I/O

1.14 V

0 C

+ 70 C

SMD/SMT

892.86 MHz

有

微芯片技术

60

ProASIC3

0.014110 oz

1.2000 V

1.14 V

1.26 V

Tray

M1A3PE3000

活跃

1.26 V

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

30

70 °C

无

M1A3PE3000L-1FG484

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

0 to 70 °C

Tray

M1A3PE3000L

e0

锡铅

8542.39.00.01

CMOS

1.14V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

341

不合格

1.5 V

1.5/3.3 V

COMMERCIAL

341

75264 CLBS, 3000000 GATES

2.44 mm

现场可编程门阵列

516096

3000000

1

75264

75264

3000000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

FBGA

256-FPBGA (17x17)

微芯片技术

Details

119 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

1098.9 MHz

有

90

Fusion

0.014110 oz

1.575 V

Tray

M7AFS600

活跃

-40°C ~ 85°C (TA)

Tray

M7AFS600

1.425V ~ 1.575V

1.5 V

110592

600000

STD

1.2 mm

17 mm

17 mm

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

This product may require additional documentation to export from the United States.

N

300 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

231 MHz

有

微芯片技术

60

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3P1000

活跃

BGA,

网格排列

3

PLASTIC/EPOXY

-40 °C

1.5 V

30

100 °C

无

M1A3P1000-FG484I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

1.48

-40 to 85 °C

Tray

M1A3P1000

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B484

不合格

1.5 V

INDUSTRIAL

24576 CLBS, 1000000 GATES

2.44 mm

现场可编程门阵列

147456

1000000

STD

24576

1000000

23 mm

23 mm

N/A

-

表面贴装

BGA-536

536-CSPBGA (16x16)

微芯片技术

This product may require additional documentation to export from the United States.

Details

300000 LE

300 I/O

970 mV/1.02 V

- 40 C

+ 100 C

SMD/SMT

有

1

20.6 Mbit

PolarFire

1.03 V/1.08 V

Tray

MPF300

活跃

-40°C ~ 100°C (TJ)

Tray

MPF300TS

0.97V ~ 1.08V

1.05 V

12.7 Gb/s

300000

21094400

N/A

-

表面贴装

400-LFBGA

400-VFBGA (17x17)

微芯片技术

Tray

M2GL050

活跃

This product may require additional documentation to export from the United States.

Details

有

90

IGLOO2

207

-40°C ~ 100°C (TJ)

Tray

M2GL050TS

1.14V ~ 2.625V

56340

1869824

201 In Stock

-

8 Weeks

表面贴装

1152-BBGA, FCBGA

YES

744

0°C~85°C TJ

Tray

Stratix® III E

活跃

4 (72 Hours)

3A001.A.7.A

IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY

8542.39.00.01

0.86V~1.15V

BOTTOM

BALL

0.9V

1mm

EP3SE260

S-PBGA-B1152

744

不合格

1.2/3.3V

717MHz

744

现场可编程门阵列

255000

16672768

10200

3.9mm

35mm

35mm

符合RoHS标准

N/A

-

表面贴装

208-BFQFP

YES

147

0°C~70°C TA

Tray

ACEX-1K®

e3

Obsolete

3 (168 Hours)

208

EAR99

Matte Tin (Sn)

8542.39.00.01

2.375V~2.625V

QUAD

鸥翼

245

2.5V

0.5mm

compliant

40

EP1K30

S-PQFP-G208

147

不合格

2.52.5/3.3V

37.5MHz

0.4 ns

147

可加载 PLD

1728

24576

119000

216

MIXED

4.1mm

28mm

28mm

符合RoHS标准

N/A

-

表面贴装

652-BBGA

YES

488

0°C~85°C TJ

Tray

APEX-20KC®

e0

Obsolete

3 (168 Hours)

652

3A001.A.7.A

Tin/Lead (Sn/Pb)

8542.39.00.01

1.71V~1.89V

BOTTOM

BALL

220

1.8V

1.27mm

compliant

30

EP20K1000

S-PBGA-B652

480

不合格

1.81.8/3.3V

2.02 ns

480

可加载 PLD

38400

327680

1772000

3840

MACROCELL

4

3.5mm

45mm

45mm

Non-RoHS Compliant

60 In Stock

-

8 Weeks

表面贴装

1152-BBGA, FCBGA Exposed Pad

YES

544

0°C~85°C TJ

Tray

Arria V GX

e1

活跃

3 (168 Hours)

3A001.A.7.A

锡银铜

8542.39.00.01

1.07V~1.13V

BOTTOM

BALL

未说明

1.1V

1mm

未说明

5AGXBB7

S-PBGA-B1152

544

不合格

1.11.2/3.32.5V

500MHz

544

现场可编程门阵列

504000

27695104

23780

2.7mm

35mm

35mm

符合RoHS标准

5000 In Stock

-

8 Weeks

表面贴装

1517-BBGA, FCBGA

YES

696

-40°C~100°C TJ

Tray

Stratix® V GX

活跃

3 (168 Hours)

8542.39.00.01

0.87V~0.93V

BOTTOM

BALL

0.9V

1mm

5SGXMA9

S-PBGA-B1517

696

不合格

0.91.52.52.5/31.2/3V

696

31700 CLBS

现场可编程门阵列

840000

53248000

317000

3.9mm

45mm

45mm

符合RoHS标准