类别是'category.应用特定微控制器' (5057)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 表面安装 | 终端数量 | Date Of Intro | JESD-609代码 | 无铅代码 | ECCN 代码 | 端子表面处理 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 资历状况 | 温度等级 | 端口的数量 | uPs/uCs/外围ICs类型 | 电源电流-最大值 | 座位高度-最大 | 地址总线宽度 | 主时钟/晶体频率-名 | 边界扫描 | 低功率模式 | 外部数据总线宽度 | 输出时钟频率-最大值 | 内存(字) | 串行I/O数 | 总线兼容性 | 最大数据传输率 | 通信协议 | 数据编码/解码方式 | 显示配置 | 长度 | 宽度 | ||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | XCZU3EG-2LSFVC784I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 784 | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | BGA784,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | 0.85 V | 有 | 活跃 | ADVANCED MICRO DEVICES INC | FCBGA-784 | e1 | 锡银铜 | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B784 | INDUSTRIAL | PROGRAMMABLE SoC | 3.32 mm | CAN, I2C, SPI, UART | 23 mm | 23 mm | |||||||||||||||||||||||||||
![]() | ICS8MH0-150.000AJT | Integrated Device Technology Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete | INTEGRATED DEVICE TECHNOLOGY INC | 无 | EAR99 | 8542.39.00.01 | unknown | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPC9855VF | Integrated Device Technology Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 100 | INTEGRATED DEVICE TECHNOLOGY INC | BGA | MAPBGA-100 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | BGA100,10X10,40 | SQUARE | GRID ARRAY, LOW PROFILE | 3.465 V | 3.135 V | 3.3 V | 无 | Obsolete | e0 | 无 | EAR99 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 mm | not_compliant | 100 | S-PBGA-B100 | 不合格 | INDUSTRIAL | CLOCK GENERATOR, PROCESSOR SPECIFIC | 200 mA | 1.7 mm | 250 MHz | 200 MHz | 11 mm | 11 mm | ||||||||||||||||||||
![]() | MPC9855VF | Freescale Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 100 | Transferred | FREESCALE SEMICONDUCTOR INC | BGA | 11 X 11 MM, 1 MM PITCH, MAPBGA-100 | 3 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | BGA100,10X10,40 | SQUARE | GRID ARRAY, LOW PROFILE | 3.465 V | 3.135 V | 3.3 V | 无 | e0 | EAR99 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | BOTTOM | BALL | 245 | 1 mm | not_compliant | 30 | 100 | S-PBGA-B100 | 不合格 | INDUSTRIAL | CLOCK GENERATOR, PROCESSOR SPECIFIC | 200 mA | 1.7 mm | 250 MHz | 200 MHz | 11 mm | 11 mm | ||||||||||||||||||
![]() | XCZU19EG-3FFVD1760I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1760 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 0.9 V | 有 | 活跃 | ADVANCED MICRO DEVICES INC | FCBGA-1760 | 4 | e1 | 锡银铜 | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B1760 | INDUSTRIAL | PROGRAMMABLE SoC | 3.71 mm | 42.5 mm | 42.5 mm | |||||||||||||||||||||||||||||
![]() | XCZU19EG-3FFVD1760I | AMD Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1760 | 2017-02-15 | -40 °C | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 0.9 V | 有 | Transferred | XILINX INC | BGA, | 4 | 100 °C | e1 | 锡银铜 | 8542.31.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1760 | INDUSTRIAL | PROGRAMMABLE SoC | 3.71 mm | 42.5 mm | 42.5 mm | |||||||||||||||||||||||||||||
![]() | XCZU6EG-2LFFVB1156E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1156 | 110 °C | PLASTIC/EPOXY | BGA | BGA1156,34X34,40 | SQUARE | 网格排列 | 0.85 V | 有 | 活跃 | ADVANCED MICRO DEVICES INC | FCBGA-1156 | 4 | e1 | 锡银铜 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1156 | OTHER | PROGRAMMABLE SoC | 3.42 mm | CAN, I2C, SPI, UART | 35 mm | 35 mm | ||||||||||||||||||||||||||||||
![]() | XQ7Z030-1RF900Q | AMD Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 900 | PLASTIC/EPOXY | BGA | BGA900,30X30,40 | SQUARE | 网格排列 | 无 | Transferred | XILINX INC | 31 X 31 MM, 1 MM PITCH, BGA-900 | 125 °C | -40 °C | e0 | 锡铅 | 8542.31.00.01 | BOTTOM | BALL | 1 mm | not_compliant | S-PBGA-B900 | 不合格 | AUTOMOTIVE | PROGRAMMABLE SoC | 3.44 mm | 31 mm | 31 mm | ||||||||||||||||||||||||||||||
![]() | XCZU9CG-2LFFVC900E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 900 | 110 °C | PLASTIC/EPOXY | BGA | BGA900,30X30,40 | SQUARE | 网格排列 | 0.85 V | 有 | 活跃 | ADVANCED MICRO DEVICES INC | FCBGA-900 | 4 | e1 | 锡银铜 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B900 | OTHER | PROGRAMMABLE SoC | 3.42 mm | CAN, I2C, SPI, UART | 31 mm | 31 mm | ||||||||||||||||||||||||||||||
![]() | MD2202-D32-V3-X-P | SanDisk Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 32 | DIP | DIP, | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | 3.6 V | 3 V | 3.3 V | 有 | Obsolete | SANDISK CORP | 8542.31.00.01 | DUAL | THROUGH-HOLE | 未说明 | unknown | 未说明 | 32 | R-PDIP-T32 | 不合格 | INDUSTRIAL | SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE | 8 | |||||||||||||||||||||||||||||
![]() | XCZU6CG-2SBVA484I | AMD Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 484 | FBGA, BGA484,22X22,32 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | 0.876 V | 0.825 V | 0.85 V | 有 | Transferred | XILINX INC | 8542.31.00.01 | BOTTOM | BALL | 0.8 mm | unknown | S-PBGA-B484 | INDUSTRIAL | PROGRAMMABLE SoC | 2.61 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 19 mm | 19 mm | |||||||||||||||||||||||||||||
![]() | XCZU6CG-2SBVA484I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 484 | ADVANCED MICRO DEVICES INC | BGA-484 | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | 0.876 V | 0.825 V | 0.85 V | 有 | 活跃 | e1 | 锡银铜 | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B484 | INDUSTRIAL | PROGRAMMABLE SoC | 2.61 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 19 mm | 19 mm | |||||||||||||||||||||||||
![]() | XCZU9CG-1SFVC784I | AMD Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 784 | XILINX INC | FBGA, BGA78428X28,32 | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | BGA78428X28,32 | SQUARE | GRID ARRAY, FINE PITCH | 0.876 V | 0.825 V | 0.85 V | 有 | Transferred | 锡银铜 | 8542.31.00.01 | BOTTOM | BALL | 250 | 0.8 mm | unknown | 30 | S-PBGA-B784 | INDUSTRIAL | PROGRAMMABLE SoC | 3.32 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 23 mm | 23 mm | |||||||||||||||||||||||||
![]() | XCZU9CG-1SFVC784I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 784 | ADVANCED MICRO DEVICES INC | BGA-784 | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | BGA78428X28,32 | SQUARE | GRID ARRAY, FINE PITCH | 0.876 V | 0.825 V | 0.85 V | 有 | 活跃 | e1 | 锡银铜 | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B784 | INDUSTRIAL | PROGRAMMABLE SoC | 3.32 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 23 mm | 23 mm | |||||||||||||||||||||||||
![]() | PSD813F2-12JI | Waferscale Integration Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 52 | 26.3 MHz | 27 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | SQUARE | CHIP CARRIER | 5.5 V | 4.5 V | 5 V | Obsolete | WAFERSCALE INTEGRATION INC | PLASTIC, LDCC-52 | QUAD | J BEND | unknown | S-PQCC-J52 | 不合格 | INDUSTRIAL | 4 | PARALLEL IO PORT, GENERAL PURPOSE | 4.57 mm | 16 | 19.1 mm | 19.1 mm | |||||||||||||||||||||||||||||
![]() | SCC66470AAB | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 120 | QFP | QFP120,1.2SQ,32 | SQUARE | FLATPACK | 5 V | Obsolete | NXP SEMICONDUCTORS | QFP, QFP120,1.2SQ,32 | 85 °C | -40 °C | PLASTIC/EPOXY | 8542.31.00.01 | QUAD | 鸥翼 | 0.8 mm | unknown | S-PQFP-G120 | 不合格 | INDUSTRIAL | 100 mA | |||||||||||||||||||||||||||||||||||
![]() | SCC66470AAB | Philips Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 120 | -40 °C | PLASTIC/EPOXY | QFP | QFP120,1.2SQ,32 | SQUARE | FLATPACK | 5 V | 无 | Transferred | 飞利浦半导体 | QFP, QFP120,1.2SQ,32 | 85 °C | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | QUAD | 鸥翼 | 0.8 mm | unknown | S-PQFP-G120 | 不合格 | INDUSTRIAL | 100 mA | ||||||||||||||||||||||||||||||||
![]() | S1100 | Desco Industries Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SC26C198A1A | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 84 | NXP SEMICONDUCTORS | LCC | QCCJ, LDCC84,1.2SQ | 8 MHz | 3 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | LDCC84,1.2SQ | SQUARE | CHIP CARRIER | 5.5 V | 4.5 V | 5 V | Obsolete | 8542.31.00.01 | QUAD | J BEND | 1.27 mm | unknown | 84 | S-PQCC-J84 | 不合格 | INDUSTRIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | 200 mA | 4.57 mm | 8 | NO | YES | 8 | 0 | 8 | 0.06103515625 MBps | ASYNC, BIT | NRZ | 29.3116 mm | 29.3116 mm | ||||||||||||||||
![]() | TMS9928ANL | Texas Instruments | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 40 | TEXAS INSTRUMENTS INC | Obsolete | 无 | IN-LINE | RECTANGULAR | DIP40,.6 | DIP | PLASTIC/EPOXY | 70 °C | DIP, DIP40,.6 | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | not_compliant | R-PDIP-T40 | 不合格 | COMMERCIAL | |||||||||||||||||||||||||||||||||||||
![]() | AM8052-6JC/50 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 68 | QCCJ | LDCC68,1.0SQ | SQUARE | CHIP CARRIER | 5 V | 无 | Obsolete | ADVANCED MICRO DEVICES INC | QCCJ, LDCC68,1.0SQ | 70 °C | PLASTIC/EPOXY | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | QUAD | J BEND | 1.27 mm | unknown | S-PQCC-J68 | 不合格 | COMMERCIAL | ||||||||||||||||||||||||||||||||||
![]() | THGBM5G6A2JBAIRYFJ | Toshiba America Electronic Components | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SC1004A | Micro Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 16 | 5.5 V | 2.7 V | 5 V | 接触制造商 | MICRO ELECTRONICS LTD | MODULE | , | UNSPECIFIED | RECTANGULAR | 微电子组件 | 8542.31.00.01 | DUAL | PIN/PEG | unknown | 16 | R-XDMA-P16 | 不合格 | DISPLAY CONTROLLER, DOT MATRIX LCD DRIVER | 8 | 5 X 7 DOTS | |||||||||||||||||||||||||||||||||||
![]() | R6551P | Conexant Systems Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 28 | 康讯系统 | DIP | PLASTIC, DIP-28 | 1 MHz | 70 °C | PLASTIC/EPOXY | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | 5.25 V | 4.75 V | 5 V | 无 | Obsolete | e0 | 锡铅 | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | compliant | 28 | R-PDIP-T28 | 不合格 | COMMERCIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | 5.588 mm | 2 | NO | NO | 8 | 0 | 1 | R65C00; R6500 | 0.00234375 MBps | ASYNC, BIT | NRZ | 36.957 mm | 15.24 mm | |||||||||||||||
![]() | SED1341F0E | Epson Electronics America Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 80 | QFP | DFP, FL(UNSPEC) | 70 °C | PLASTIC/EPOXY | DFP | FL(UNSPEC) | RECTANGULAR | FLATPACK | 5.25 V | 4.75 V | 5 V | 无 | Obsolete | S-MOS SYSTEMS | e0 | 锡铅 | 8542.31.00.01 | QUAD | 鸥翼 | unknown | 80 | R-PQFP-G80 | 不合格 | COMMERCIAL | DISPLAY CONTROLLER, CRT TO LCD CONVERTER | 40 mA | 3 | 4 | 720 X 400 DOTS |
XCZU3EG-2LSFVC784I
AMD
分类:Embedded - Microcontrollers - Application Specific
ICS8MH0-150.000AJT
Integrated Device Technology Inc
分类:Embedded - Microcontrollers - Application Specific
MPC9855VF
Integrated Device Technology Inc
分类:Embedded - Microcontrollers - Application Specific
MPC9855VF
Freescale Semiconductor
分类:Embedded - Microcontrollers - Application Specific
XCZU19EG-3FFVD1760I
AMD
分类:Embedded - Microcontrollers - Application Specific
XCZU19EG-3FFVD1760I
AMD Xilinx
分类:Embedded - Microcontrollers - Application Specific
XCZU6EG-2LFFVB1156E
AMD
分类:Embedded - Microcontrollers - Application Specific
XQ7Z030-1RF900Q
AMD Xilinx
分类:Embedded - Microcontrollers - Application Specific
XCZU9CG-2LFFVC900E
AMD
分类:Embedded - Microcontrollers - Application Specific
MD2202-D32-V3-X-P
SanDisk Corporation
分类:Embedded - Microcontrollers - Application Specific
XCZU6CG-2SBVA484I
AMD Xilinx
分类:Embedded - Microcontrollers - Application Specific
XCZU6CG-2SBVA484I
AMD
分类:Embedded - Microcontrollers - Application Specific
XCZU9CG-1SFVC784I
AMD Xilinx
分类:Embedded - Microcontrollers - Application Specific
XCZU9CG-1SFVC784I
AMD
分类:Embedded - Microcontrollers - Application Specific
PSD813F2-12JI
Waferscale Integration Inc
分类:Embedded - Microcontrollers - Application Specific
SCC66470AAB
NXP Semiconductors
分类:Embedded - Microcontrollers - Application Specific
SCC66470AAB
Philips Semiconductors
分类:Embedded - Microcontrollers - Application Specific
S1100
Desco Industries Inc
分类:Embedded - Microcontrollers - Application Specific
SC26C198A1A
NXP Semiconductors
分类:Embedded - Microcontrollers - Application Specific
TMS9928ANL
Texas Instruments
分类:Embedded - Microcontrollers - Application Specific
AM8052-6JC/50
AMD
分类:Embedded - Microcontrollers - Application Specific
THGBM5G6A2JBAIRYFJ
Toshiba America Electronic Components
分类:Embedded - Microcontrollers - Application Specific
SC1004A
Micro Electronics Corporation
分类:Embedded - Microcontrollers - Application Specific
R6551P
Conexant Systems Inc
分类:Embedded - Microcontrollers - Application Specific
SED1341F0E
Epson Electronics America Inc
分类:Embedded - Microcontrollers - Application Specific
