category.集成电路IC_category.集成电路IC品牌厂家，型号_价格_规格

类别是'category.PLDs（可编程逻辑器件）' (2797)

所有品牌

产品型号	品牌	数据表	库存	价格(含增值税)	数量	表面安装	终端数量																			JESD-609代码	无铅代码	ECCN 代码	端子表面处理	附加功能	HTS代码	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	Reach合规守则	时间@峰值回流温度-最大值(s)	引脚数量	JESD-30代码	输出的数量	资历状况	温度等级	传播延迟	建筑学	输入数量	组织结构	座位高度-最大	可编程逻辑类型	筛选水平	输出功能	宏细胞数	JTAG BST	专用输入数量	系统内可编程	产品条款数量	长度	宽度
XCR3320-10BG256C	AMD Xilinx	数据表	557 In Stock	-	最小起订量: 1 最小包装量: 1	YES	256	Obsolete	XILINX INC	BGA	PLASTIC, BGA-256	87 MHz	3	3	70 °C	PLASTIC/EPOXY	BGA	BGA256,20X20,50	SQUARE	网格排列	3.6 V	3 V	3.3 V	无	e0			锡铅	YES	8542.39.00.01	BOTTOM	BALL	225	1.27 mm	not_compliant	30	256	S-PBGA-B256		不合格	COMMERCIAL	10 ns			12 DEDICATED INPUTS, 3 I/O	2.55 mm	可加载 PLD		MACROCELL	320	YES	12	YES		27 mm	27 mm
PZ5128CS10BE-T	NXP Semiconductors	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	128	96	70 °C	PLASTIC/EPOXY	LFQFP	QFP128,.63X.87,20	RECTANGULAR	FLATPACK, LOW PROFILE, FINE PITCH	5.25 V	4.75 V	5 V	Transferred	NXP SEMICONDUCTORS	LFQFP,	71 MHz					128 MACROCELLS	8542.39.00.01	QUAD	鸥翼		0.5 mm	unknown			R-PQFP-G128		不合格	COMMERCIAL	12 ns			2 DEDICATED INPUTS, 96 I/O	1.6 mm	EE PLD		MACROCELL			2			20 mm	14 mm
XC7236-25PC44I	AMD Xilinx	数据表	134 In Stock	-	最小起订量: 1 最小包装量: 1	YES	44	无	Obsolete	XILINX INC	LCC	PLASTIC, LCC-44	33 MHz	3	30	85 °C	-40 °C	PLASTIC/EPOXY	QCCJ	LDCC44,.7SQ	SQUARE	CHIP CARRIER	5.5 V	4.5 V	5 V	e0			锡铅	36 MACROCELLS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V; 3 EXTERNAL CLOCKS	8542.39.00.01	QUAD	J BEND	225	1.27 mm	not_compliant	30	44	S-PQCC-J44		不合格	INDUSTRIAL	40 ns			2 DEDICATED INPUTS, 30 I/O	4.57 mm	OT PLD		MACROCELL	36	NO	2	NO		16.5862 mm	16.5862 mm
EPM9560RC240-25	Altera Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	240	66.7 MHz	191	70 °C	PLASTIC/EPOXY	HFQFP	SQUARE	FLATPACK, HEAT SINK/SLUG, FINE PITCH	5.25 V	4.75 V	5 V	Obsolete	ALTERA CORP	QFP	HFQFP,	e3			哑光锡	560 MACROCELLS; 772 FLIP FLOPS; CONFIGURABLE I/O OPERATION - 3.3V OR 5V	8542.39.00.01	QUAD	鸥翼		0.5 mm	unknown		240	S-PQFP-G240		不合格	COMMERCIAL	25 ns			0 DEDICATED INPUTS, 191 I/O	4.1 mm	EE PLD		MACROCELL						32 mm	32 mm
PAL16R8DMJ/883B	Rochester Electronics LLC	数据表	N/A	-	最小起订量: 1 最小包装量: 1	NO	20	4.5 V	5 V	DIP	CERAMIC, GLASS-SEALED	-55 °C	125 °C	37 MHz	DIP,	ROCHESTER ELECTRONICS LLC	活跃	DIP20,.3	RECTANGULAR	IN-LINE	5.5 V			3A001.A.2.C			8542.39.00.01	DUAL	THROUGH-HOLE	未说明		unknown	未说明		R-GDIP-T20			MILITARY	12 ns			8 DEDICATED INPUTS, 0 I/O		OT PLD		REGISTERED			8
PAL16R8DMJ/883B	AMD	数据表	506 In Stock	-	最小起订量: 1 最小包装量: 1	NO	20	ADVANCED MICRO DEVICES INC	DIP	DIP, DIP20,.3	37 MHz	125 °C	-55 °C	CERAMIC, GLASS-SEALED	DIP	DIP20,.3	RECTANGULAR	IN-LINE	5.5 V	4.5 V	5 V	无	Obsolete	e0		3A001.A.2.C	锡铅		8542.39.00.01	DUAL	THROUGH-HOLE		2.54 mm	unknown		20	R-GDIP-T20	8	不合格	MILITARY	12 ns	PAL-TYPE	8	8 DEDICATED INPUTS, 0 I/O		OT PLD	38535Q/M;38534H;883B	REGISTERED			8		64
XH95180-10HQG208I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	208	HFQFP	SQUARE	FLATPACK, HEAT SINK/SLUG, FINE PITCH	5 V	有	Obsolete	ADVANCED MICRO DEVICES INC	HEAT SINK, QFP-208	3	168	PLASTIC/EPOXY	e3			哑光锡			QUAD	鸥翼	245	0.5 mm	compliant	30		S-PQFP-G208		不合格					0 DEDICATED INPUTS, 168 I/O	4.1 mm	MASK PLD		MACROCELL						28 mm	28 mm
P3Z22V10-DDH	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	24	PLASTIC/EPOXY	TSSOP	TSSOP24,.25	RECTANGULAR	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	3.3 V	无	Obsolete	XILINX INC	TSSOP, TSSOP24,.25	80 MHz	70 °C	e0			Tin/Lead (Sn/Pb)		8542.39.00.01	DUAL	鸥翼		0.635 mm	unknown			R-PDSO-G24	10	不合格	COMMERCIAL	10 ns	PAL-TYPE	22			EE PLD		MACROCELL					132
P3Z22V10-DDH	NXP Semiconductors	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	24	4.40 MM, PLASTIC, SOT-355-1, TSSOP-24	83 MHz	10	70 °C	PLASTIC/EPOXY	TSSOP	TSSOP24,.25	RECTANGULAR	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	3.6 V	3 V	3.3 V	Obsolete	NXP SEMICONDUCTORS	TSSOP						8542.39.00.01	DUAL	鸥翼		0.65 mm	unknown		24	R-PDSO-G24		不合格	COMMERCIAL	10 ns			11 DEDICATED INPUTS, 10 I/O	1.1 mm	EE PLD		MACROCELL			11			7.8 mm	4.4 mm
5962-87539023A	Teledyne e2v	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	28	125 °C	-55 °C	CERAMIC, METAL-SEALED COFIRED	WQCCN	LCC28,.45SQ	SQUARE	CHIP CARRIER, WINDOW	5.5 V	4.5 V	5 V	活跃	TELEDYNE E2V (UK) LTD	25 MHz	10	e0		3A001.A.2.C	锡铅	10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; VARIABLE PRODUCT TERMS	8542.39.00.01	QUAD	无铅		1.27 mm	compliant			S-CQCC-N28	10	Qualified	MILITARY	30 ns	PAL-TYPE	22	11 DEDICATED INPUTS, 10 I/O	2.8956 mm	UV PLD	38535Q/M;38534H;883B	MACROCELL			11		132	11.43 mm	11.43 mm
5962-87539023A	Cypress Semiconductor	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	28	WQCCN,	25 MHz	10	125 °C	-55 °C	CERAMIC, METAL-SEALED COFIRED	WQCCN	SQUARE	CHIP CARRIER, WINDOW	5.5 V	4.5 V	5 V	Obsolete	CYPRESS SEMICONDUCTOR CORP	QLCC	e0		3A001.A.2.C	锡铅	10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; VARIABLE PRODUCT TERMS	8542.39.00.01	QUAD	无铅		1.27 mm	unknown		28	S-CQCC-N28		不合格	MILITARY	30 ns			11 DEDICATED INPUTS, 10 I/O	2.8956 mm	UV PLD		MACROCELL			11			11.43 mm	11.43 mm
PZ3128IS12BP-T	NXP Semiconductors	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	100	80	85 °C	-40 °C	PLASTIC/EPOXY	TFQFP	SQUARE	FLATPACK, THIN PROFILE, FINE PITCH	3.6 V	3 V	3.3 V	Transferred	NXP SEMICONDUCTORS	TFQFP,	66 MHz						8542.39.00.01	QUAD	鸥翼		0.5 mm	unknown			S-PQFP-G100		不合格	INDUSTRIAL	14.5 ns			2 DEDICATED INPUTS, 80 I/O	1.2 mm	EE PLD		MACROCELL			2			14 mm	14 mm
PZ3128IS12BP-T	AMD Xilinx	数据表	294 In Stock	-	最小起订量: 1 最小包装量: 1	YES	100	TFQFP,	69 MHz	80	85 °C	-40 °C	PLASTIC/EPOXY	TFQFP	SQUARE	FLATPACK, THIN PROFILE, FINE PITCH	3.63 V	2.97 V	3.3 V	Obsolete	XILINX INC	QFP					128 MACROCELLS	8542.39.00.01	QUAD	鸥翼		0.5 mm	unknown		100	S-PQFP-G100		不合格	INDUSTRIAL	14.5 ns			2 DEDICATED INPUTS, 80 I/O	1.2 mm	EE PLD		MACROCELL			2			14 mm	14 mm
XC7272-30WC84I	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	84	LDCC84,1.2SQ	SQUARE	CHIP CARRIER	5 V	无	Obsolete	XILINX INC	85 °C	-40 °C	CERAMIC	QCCJ					NO	8542.39.00.01	QUAD	J BEND		1.27 mm	unknown			S-XQCC-J84		不合格	INDUSTRIAL	48 ns					UV PLD			72	NO		NO
XC7272A-16WC84I	AMD Xilinx	数据表	542 In Stock	-	最小起订量: 1 最小包装量: 1	YES	84	无	Obsolete	XILINX INC	QFJ	WQCCJ, LDCC84,1.2SQ	55 MHz	1	42	85 °C	-40 °C	CERAMIC, METAL-SEALED COFIRED	WQCCJ	LDCC84,1.2SQ	SQUARE	CHIP CARRIER, WINDOW	5.5 V	4.5 V	5 V					PAL BLOCKS INTERCONNECTED BY PIA; 72 MACROCELLS	8542.39.00.01	QUAD	J BEND		1.27 mm	unknown		84	S-CQCC-J84		不合格	INDUSTRIAL	25 ns			12 DEDICATED INPUTS, 42 I/O	4.826 mm	UV PLD		MACROCELL	72	NO	12	NO		29.21 mm	29.21 mm
PZ5032-6A44-T	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	44	105 MHz	32	70 °C	PLASTIC/EPOXY	QCCJ	SQUARE	CHIP CARRIER	5.25 V	4.75 V	5 V	Obsolete	XILINX INC	LPCC	QCCJ,					32 MACROCELLS	8542.39.00.01	QUAD	J BEND		1.27 mm	unknown		44	S-PQCC-J44		不合格	COMMERCIAL	8 ns			2 DEDICATED INPUTS, 32 I/O	4.57 mm	EE PLD		MACROCELL			2			16.5862 mm	16.5862 mm
AMPAL16H8LDC	AMD	数据表	537 In Stock	-	最小起订量: 1 最小包装量: 1	NO	20	DIP	DIP, DIP20,.3	6	75 °C	CERAMIC, GLASS-SEALED	DIP	DIP20,.3	RECTANGULAR	IN-LINE	5.25 V	4.75 V	5 V	无	Obsolete	ADVANCED MICRO DEVICES INC	e0			锡铅		8542.39.00.01	DUAL	THROUGH-HOLE		2.54 mm	unknown		20	R-GDIP-T20	8	不合格	商业扩展	35 ns	PAL-TYPE	16	10 DEDICATED INPUTS, 6 I/O		OT PLD		COMBINATORIAL			10		64
PZ5128NS10BE	Philips Semiconductors	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	128	QFP128,.63X.87,20	RECTANGULAR	FLATPACK	5 V	无	Transferred	飞利浦半导体	85 °C	-40 °C	PLASTIC/EPOXY	QFP	e0			Tin/Lead (Sn/Pb)	YES	8542.39.00.01	QUAD	鸥翼		0.5 mm	unknown			R-PQFP-G128		不合格	INDUSTRIAL	12 ns					EE PLD			128	YES		YES
EPM2210F324I4N	Altera Corporation	数据表	791 In Stock	-	最小起订量: 1 最小包装量: 1	YES	324	BGA	BGA, BGA324,18X18,40	3	272	PLASTIC/EPOXY	BGA	BGA324,18X18,40	SQUARE	网格排列	2.625 V	2.375 V	2.5 V	有	Transferred	ALTERA CORP	e1	有	3A991.D	锡银铜	IT CAN ALSO OPERATE AT 3.3V	8542.39.00.01	BOTTOM	BALL	245	1 mm	compliant		324	S-PBGA-B324		不合格		9.1 ns			0 DEDICATED INPUTS, 272 I/O	2.2 mm	闪存 PLD		MACROCELL	1700	YES		YES		19 mm	19 mm
EPM2210F324I4N	Intel Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	324	INTEL CORP	19 X 19 MM, 1 MM PITCH, LEAD FREE, FBGA-324	172.4 MHz	272	100 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA324,18X18,40	SQUARE	网格排列	2.625 V	2.375 V	2.5 V	有	活跃	e1		3A991.D	锡银铜	IT CAN ALSO OPERATE AT 3.3V	8542.39.00.01	BOTTOM	BALL		1 mm	compliant			S-PBGA-B324	272	不合格		9.1 ns		272	0 DEDICATED INPUTS, 272 I/O	2.2 mm	闪存 PLD		MACROCELL	1700	YES		YES		19 mm	19 mm
XH95432-10HQ304C	AMD Xilinx	数据表	269 In Stock	-	最小起订量: 1 最小包装量: 1	YES	304	232	PLASTIC/EPOXY	HFQFP	SQUARE	FLATPACK, HEAT SINK/SLUG, FINE PITCH	5 V	无	Transferred	XILINX INC	QFP	HEAT SINK, QFP-304	3	e0	无	3A991.D	锡铅		8542.39.00.01	QUAD	鸥翼		0.5 mm	compliant		304	S-PQFP-G304		不合格					0 DEDICATED INPUTS, 232 I/O	4.5 mm	MASK PLD		MACROCELL						40 mm	40 mm
5962-8983904RA	Teledyne e2v	数据表	N/A	-	最小起订量: 1 最小包装量: 1	NO	20	125 °C	-55 °C	CERAMIC, GLASS-SEALED	DIP	DIP20,.3	RECTANGULAR	IN-LINE	5.5 V	4.5 V	5 V	活跃	TELEDYNE E2V (UK) LTD	58.8 MHz	8	e0		3A001.A.2.C	锡铅	1 EXTERNAL CLOCK; REGISTER PRELOAD	8542.39.00.01	DUAL	THROUGH-HOLE		2.54 mm	compliant			R-GDIP-T20	8	Qualified	MILITARY	10 ns	PAL-TYPE	18	8 DEDICATED INPUTS, 8 I/O	5.08 mm	EE PLD	38535Q/M;38534H;883B	MACROCELL			8		64	25.27 mm	7.62 mm
PEEL18LV8ZJ-25L	Anachip Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	20	QCCJ	LDCC20,.4SQ	SQUARE	CHIP CARRIER	有	Transferred	ANACHIP CORP	QCCJ, LDCC20,.4SQ	33.3 MHz	70 °C	PLASTIC/EPOXY						8542.39.00.01	QUAD	J BEND	260	1.27 mm	unknown			S-PQCC-J20	8	不合格	COMMERCIAL	30 ns	PAL-TYPE	18			EE PLD		MACROCELL					113
PEEL18LV8ZJ-25L	Diodes Incorporated	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	20	Obsolete	DIODES INC	QLCC	LEAD FREE, PLASTIC, LCC-20	25 MHz	3	10	70 °C	PLASTIC/EPOXY	QCCJ	LDCC20,.4SQ	SQUARE	CHIP CARRIER	3.6 V	2.7 V	3 V	有	e3		EAR99	哑光锡		8542.39.00.01	QUAD	J BEND	260	1.27 mm	unknown		20	S-PQCC-J20	8	不合格	COMMERCIAL	25 ns	PAL-TYPE	18	7 DEDICATED INPUTS, 10 I/O	4.369 mm	EE PLD		MACROCELL			7		113	8.9662 mm	8.9662 mm
EPM5128AGC-20	Altera Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1	NO	68	Obsolete	ALTERA CORP	PGA	WPGA, PGA68,11X11	66.7 MHz	1	52	70 °C	CERAMIC, METAL-SEALED COFIRED	WPGA	PGA68,11X11	SQUARE	GRID ARRAY, WINDOW	5.25 V	4.75 V	5 V	无	e0	无		锡铅	LABS INTERCONNECTED BY PIA; 8 LABS; 128 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK	8542.39.00.01	PERPENDICULAR	PIN/PEG	220	2.54 mm	unknown		68	S-CPGA-P68		不合格	COMMERCIAL	33 ns			7 DEDICATED INPUTS, 52 I/O	3.81 mm	UV PLD		MACROCELL	128	NO	7	NO		27.94 mm	27.94 mm