类别是'category.应用特定微控制器' (5057)

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品牌

数据表

库存

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Rohs

表面安装

终端数量

Date Of Intro

JESD-609代码

无铅代码

ECCN 代码

端子表面处理

HTS代码

端子位置

终端形式

峰值回流焊温度(摄氏度)

端子间距

Reach合规守则

时间@峰值回流温度-最大值(s)

引脚数量

JESD-30代码

资历状况

温度等级

端口的数量

uPs/uCs/外围ICs类型

电源电流-最大值

座位高度-最大

地址总线宽度

主时钟/晶体频率-名

边界扫描

低功率模式

外部数据总线宽度

输出时钟频率-最大值

内存(字)

串行I/O数

总线兼容性

最大数据传输率

通信协议

数据编码/解码方式

显示配置

长度

宽度

XCZU3EG-2LSFVC784I
XCZU3EG-2LSFVC784I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

784

4

100 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA784,28X28,32

SQUARE

GRID ARRAY, FINE PITCH

0.85 V

活跃

ADVANCED MICRO DEVICES INC

FCBGA-784

e1

锡银铜

BOTTOM

BALL

250

0.8 mm

compliant

30

S-PBGA-B784

INDUSTRIAL

PROGRAMMABLE SoC

3.32 mm

CAN, I2C, SPI, UART

23 mm

23 mm

ICS8MH0-150.000AJT
ICS8MH0-150.000AJT
Integrated Device Technology Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Obsolete

INTEGRATED DEVICE TECHNOLOGY INC

EAR99

8542.39.00.01

unknown

MPC9855VF
MPC9855VF
Integrated Device Technology Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

100

INTEGRATED DEVICE TECHNOLOGY INC

BGA

MAPBGA-100

85 °C

-40 °C

PLASTIC/EPOXY

LBGA

BGA100,10X10,40

SQUARE

GRID ARRAY, LOW PROFILE

3.465 V

3.135 V

3.3 V

Obsolete

e0

EAR99

锡铅

8542.39.00.01

BOTTOM

BALL

1 mm

not_compliant

100

S-PBGA-B100

不合格

INDUSTRIAL

CLOCK GENERATOR, PROCESSOR SPECIFIC

200 mA

1.7 mm

250 MHz

200 MHz

11 mm

11 mm

MPC9855VF
MPC9855VF
Freescale Semiconductor 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

100

Transferred

FREESCALE SEMICONDUCTOR INC

BGA

11 X 11 MM, 1 MM PITCH, MAPBGA-100

3

85 °C

-40 °C

PLASTIC/EPOXY

LBGA

BGA100,10X10,40

SQUARE

GRID ARRAY, LOW PROFILE

3.465 V

3.135 V

3.3 V

e0

EAR99

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

BOTTOM

BALL

245

1 mm

not_compliant

30

100

S-PBGA-B100

不合格

INDUSTRIAL

CLOCK GENERATOR, PROCESSOR SPECIFIC

200 mA

1.7 mm

250 MHz

200 MHz

11 mm

11 mm

XCZU19EG-3FFVD1760I
XCZU19EG-3FFVD1760I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

1760

100 °C

-40 °C

PLASTIC/EPOXY

BGA

SQUARE

网格排列

0.9 V

活跃

ADVANCED MICRO DEVICES INC

FCBGA-1760

4

e1

锡银铜

BOTTOM

BALL

245

1 mm

compliant

30

S-PBGA-B1760

INDUSTRIAL

PROGRAMMABLE SoC

3.71 mm

42.5 mm

42.5 mm

XCZU19EG-3FFVD1760I
XCZU19EG-3FFVD1760I
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

1760

2017-02-15

-40 °C

PLASTIC/EPOXY

BGA

SQUARE

网格排列

0.9 V

Transferred

XILINX INC

BGA,

4

100 °C

e1

锡银铜

8542.31.00.01

BOTTOM

BALL

1 mm

compliant

S-PBGA-B1760

INDUSTRIAL

PROGRAMMABLE SoC

3.71 mm

42.5 mm

42.5 mm

XCZU6EG-2LFFVB1156E
XCZU6EG-2LFFVB1156E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

1156

110 °C

PLASTIC/EPOXY

BGA

BGA1156,34X34,40

SQUARE

网格排列

0.85 V

活跃

ADVANCED MICRO DEVICES INC

FCBGA-1156

4

e1

锡银铜

BOTTOM

BALL

1 mm

compliant

S-PBGA-B1156

OTHER

PROGRAMMABLE SoC

3.42 mm

CAN, I2C, SPI, UART

35 mm

35 mm

XQ7Z030-1RF900Q
XQ7Z030-1RF900Q
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

900

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

网格排列

Transferred

XILINX INC

31 X 31 MM, 1 MM PITCH, BGA-900

125 °C

-40 °C

e0

锡铅

8542.31.00.01

BOTTOM

BALL

1 mm

not_compliant

S-PBGA-B900

不合格

AUTOMOTIVE

PROGRAMMABLE SoC

3.44 mm

31 mm

31 mm

XCZU9CG-2LFFVC900E
XCZU9CG-2LFFVC900E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

900

110 °C

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

网格排列

0.85 V

活跃

ADVANCED MICRO DEVICES INC

FCBGA-900

4

e1

锡银铜

BOTTOM

BALL

1 mm

compliant

S-PBGA-B900

OTHER

PROGRAMMABLE SoC

3.42 mm

CAN, I2C, SPI, UART

31 mm

31 mm

MD2202-D32-V3-X-P
MD2202-D32-V3-X-P
SanDisk Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

32

DIP

DIP,

85 °C

-40 °C

PLASTIC/EPOXY

DIP

RECTANGULAR

IN-LINE

3.6 V

3 V

3.3 V

Obsolete

SANDISK CORP

8542.31.00.01

DUAL

THROUGH-HOLE

未说明

unknown

未说明

32

R-PDIP-T32

不合格

INDUSTRIAL

SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE

8

XCZU6CG-2SBVA484I
XCZU6CG-2SBVA484I
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

484

FBGA, BGA484,22X22,32

100 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA484,22X22,32

SQUARE

GRID ARRAY, FINE PITCH

0.876 V

0.825 V

0.85 V

Transferred

XILINX INC

8542.31.00.01

BOTTOM

BALL

0.8 mm

unknown

S-PBGA-B484

INDUSTRIAL

PROGRAMMABLE SoC

2.61 mm

I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)

19 mm

19 mm

XCZU6CG-2SBVA484I
XCZU6CG-2SBVA484I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

484

ADVANCED MICRO DEVICES INC

BGA-484

4

100 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA484,22X22,32

SQUARE

GRID ARRAY, FINE PITCH

0.876 V

0.825 V

0.85 V

活跃

e1

锡银铜

BOTTOM

BALL

250

0.8 mm

compliant

30

S-PBGA-B484

INDUSTRIAL

PROGRAMMABLE SoC

2.61 mm

I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)

19 mm

19 mm

XCZU9CG-1SFVC784I
XCZU9CG-1SFVC784I
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

784

XILINX INC

FBGA, BGA78428X28,32

4

100 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA78428X28,32

SQUARE

GRID ARRAY, FINE PITCH

0.876 V

0.825 V

0.85 V

Transferred

锡银铜

8542.31.00.01

BOTTOM

BALL

250

0.8 mm

unknown

30

S-PBGA-B784

INDUSTRIAL

PROGRAMMABLE SoC

3.32 mm

I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)

23 mm

23 mm

XCZU9CG-1SFVC784I
XCZU9CG-1SFVC784I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

784

ADVANCED MICRO DEVICES INC

BGA-784

4

100 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA78428X28,32

SQUARE

GRID ARRAY, FINE PITCH

0.876 V

0.825 V

0.85 V

活跃

e1

锡银铜

BOTTOM

BALL

250

0.8 mm

compliant

30

S-PBGA-B784

INDUSTRIAL

PROGRAMMABLE SoC

3.32 mm

I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)

23 mm

23 mm

PSD813F2-12JI
PSD813F2-12JI
Waferscale Integration Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

52

26.3 MHz

27

85 °C

-40 °C

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

5.5 V

4.5 V

5 V

Obsolete

WAFERSCALE INTEGRATION INC

PLASTIC, LDCC-52

QUAD

J BEND

unknown

S-PQCC-J52

不合格

INDUSTRIAL

4

PARALLEL IO PORT, GENERAL PURPOSE

4.57 mm

16

19.1 mm

19.1 mm

SCC66470AAB
SCC66470AAB
NXP Semiconductors 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

120

QFP

QFP120,1.2SQ,32

SQUARE

FLATPACK

5 V

Obsolete

NXP SEMICONDUCTORS

QFP, QFP120,1.2SQ,32

85 °C

-40 °C

PLASTIC/EPOXY

8542.31.00.01

QUAD

鸥翼

0.8 mm

unknown

S-PQFP-G120

不合格

INDUSTRIAL

100 mA

SCC66470AAB
SCC66470AAB
Philips Semiconductors 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

120

-40 °C

PLASTIC/EPOXY

QFP

QFP120,1.2SQ,32

SQUARE

FLATPACK

5 V

Transferred

飞利浦半导体

QFP, QFP120,1.2SQ,32

85 °C

e0

Tin/Lead (Sn/Pb)

8542.31.00.01

QUAD

鸥翼

0.8 mm

unknown

S-PQFP-G120

不合格

INDUSTRIAL

100 mA

S1100
S1100
Desco Industries Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

SC26C198A1A
SC26C198A1A
NXP Semiconductors 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

84

NXP SEMICONDUCTORS

LCC

QCCJ, LDCC84,1.2SQ

8 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

QCCJ

LDCC84,1.2SQ

SQUARE

CHIP CARRIER

5.5 V

4.5 V

5 V

Obsolete

8542.31.00.01

QUAD

J BEND

1.27 mm

unknown

84

S-PQCC-J84

不合格

INDUSTRIAL

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

200 mA

4.57 mm

8

NO

YES

8

0

8

0.06103515625 MBps

ASYNC, BIT

NRZ

29.3116 mm

29.3116 mm

TMS9928ANL
TMS9928ANL
Texas Instruments 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

40

TEXAS INSTRUMENTS INC

Obsolete

IN-LINE

RECTANGULAR

DIP40,.6

DIP

PLASTIC/EPOXY

70 °C

DIP, DIP40,.6

8542.31.00.01

DUAL

THROUGH-HOLE

2.54 mm

not_compliant

R-PDIP-T40

不合格

COMMERCIAL

AM8052-6JC/50
AM8052-6JC/50
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

68

QCCJ

LDCC68,1.0SQ

SQUARE

CHIP CARRIER

5 V

Obsolete

ADVANCED MICRO DEVICES INC

QCCJ, LDCC68,1.0SQ

70 °C

PLASTIC/EPOXY

e0

Tin/Lead (Sn/Pb)

8542.31.00.01

QUAD

J BEND

1.27 mm

unknown

S-PQCC-J68

不合格

COMMERCIAL

THGBM5G6A2JBAIRYFJ
THGBM5G6A2JBAIRYFJ
Toshiba America Electronic Components 数据表

N/A

-

最小起订量: 1

最小包装量: 1

SC1004A
SC1004A
Micro Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

16

5.5 V

2.7 V

5 V

接触制造商

MICRO ELECTRONICS LTD

MODULE

,

UNSPECIFIED

RECTANGULAR

微电子组件

8542.31.00.01

DUAL

PIN/PEG

unknown

16

R-XDMA-P16

不合格

DISPLAY CONTROLLER, DOT MATRIX LCD DRIVER

8

5 X 7 DOTS

R6551P
R6551P
Conexant Systems Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

28

康讯系统

DIP

PLASTIC, DIP-28

1 MHz

70 °C

PLASTIC/EPOXY

DIP

DIP28,.6

RECTANGULAR

IN-LINE

5.25 V

4.75 V

5 V

Obsolete

e0

锡铅

8542.31.00.01

DUAL

THROUGH-HOLE

2.54 mm

compliant

28

R-PDIP-T28

不合格

COMMERCIAL

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

5.588 mm

2

NO

NO

8

0

1

R65C00; R6500

0.00234375 MBps

ASYNC, BIT

NRZ

36.957 mm

15.24 mm

SED1341F0E
SED1341F0E
Epson Electronics America Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

80

QFP

DFP, FL(UNSPEC)

70 °C

PLASTIC/EPOXY

DFP

FL(UNSPEC)

RECTANGULAR

FLATPACK

5.25 V

4.75 V

5 V

Obsolete

S-MOS SYSTEMS

e0

锡铅

8542.31.00.01

QUAD

鸥翼

unknown

80

R-PQFP-G80

不合格

COMMERCIAL

DISPLAY CONTROLLER, CRT TO LCD CONVERTER

40 mA

3

4

720 X 400 DOTS