类别是'category.内存模块' (5401)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 表面安装 | 终端数量 | JESD-609代码 | 无铅代码 | ECCN 代码 | 类型 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 资历状况 | 电源电压-最大值(Vsup) | 温度等级 | 电源电压-最小值(Vsup) | 操作模式 | 电源电流-最大值 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 待机电流-最大值 | 记忆密度 | 并行/串行 | I/O类型 | 内存IC类型 | 编程电压 | 串行总线类型 | 耐力 | 数据保持时间 | 写入保护 | 备用内存宽度 | 数据轮询 | 拨动位 | 命令用户界面 | 扇区/尺寸数 | 行业规模 | 页面尺寸 | 准备就绪/忙碌 | 引导模块 | 通用闪存接口 | 长度 | 宽度 | ||||||||||||||||||
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![]() | PM49FL004T-33VC | Integrated Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 32 | 120 ns | 524288 words | 512000 | 85 °C | PLASTIC/EPOXY | TSSOP | TSSOP32,.56,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 3.3 V | 无 | Obsolete | INTEGRATED SILICON SOLUTION INC | 8 X 14 MM, VSOP-32 | EAR99 | NOR型号 | 顶靴 | 8542.32.00.51 | DUAL | 鸥翼 | 1 | 0.5 mm | compliant | R-PDSO-G32 | 不合格 | 3.6 V | OTHER | 3 V | SYNCHRONOUS | 0.02 mA | 512KX8 | 1.2 mm | 8 | 0.0005 A | 4194304 bit | PARALLEL | FLASH | 3.3 V | YES | YES | YES | 128 | 4K | TOP | 12.4 mm | 8 mm | ||||||||||||||||||||||
![]() | SST39VF040-70-4C-N | Microchip Technology Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5962-9461302HXC | White Microelectronics | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 66 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | SQUARE | 微电子组件 | 5 V | Obsolete | WHITE MICROELECTRONICS | HEX-IN-LINE, SINGLE CAVITY, WITH STANDOFFS-66 | 100 ns | 4194304 words | 4000000 | e4 | GOLD | CONFIGURABLE AS 2M X 16 OR 1M X 32 | HEX | PIN/PEG | 1 | unknown | S-CHMA-P66 | 不合格 | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 4MX8 | 8 | 33554432 bit | PARALLEL | FLASH MODULE | 12 V | |||||||||||||||||||||||||||||||||||||
![]() | S25FL004A0LMAI003 | Spansion | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | SPANSION INC | SOIC | SOP, SOP8,.25 | 50 MHz | 524288 words | 512000 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP8,.25 | SQUARE | 小概要 | 3 V | 无 | Obsolete | e0 | EAR99 | NOR型号 | 锡铅 | 8542.32.00.51 | DUAL | 鸥翼 | 1 | 1.27 mm | compliant | 8 | S-PDSO-G8 | 不合格 | 3.6 V | INDUSTRIAL | 2.7 V | SYNCHRONOUS | 0.013 mA | 512KX8 | 2.159 mm | 8 | 0.00005 A | 4194304 bit | SERIAL | FLASH | 3 V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 5.283 mm | 5.283 mm | ||||||||||||||||||||
![]() | SST27VF020-70-3C-WHE | Greenliant Systems Ltd | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete | GREENLIANT SYSTEMS LTD | , | EAR99 | 8542.32.00.51 | compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S29GL128S90FAI020 | Spansion | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Transferred | SPANSION INC | , | 3A991.B.1.A | 8542.32.00.51 | unknown | FLASH | 3 V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MX29LV002NCBTC-70 | Macronix International Co Ltd | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 32 | TSOP1 | TSOP1, TSSOP32,.8,20 | 70 ns | 262144 words | 256000 | 70 °C | PLASTIC/EPOXY | TSOP1 | TSSOP32,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | 3 V | 无 | Obsolete | MACRONIX INTERNATIONAL CO LTD | e0 | EAR99 | NOR型号 | Tin/Lead (Sn/Pb) | 8542.32.00.51 | DUAL | 鸥翼 | 1 | 0.5 mm | unknown | 32 | R-PDSO-G32 | 不合格 | 3.6 V | COMMERCIAL | 2.7 V | ASYNCHRONOUS | 0.03 mA | 256KX8 | 1.2 mm | 8 | 0.000005 A | 2097152 bit | PARALLEL | FLASH | 3 V | 100000 Write/Erase Cycles | YES | YES | YES | 1,2,1,3 | 16K,8K,32K,64K | BOTTOM | 18.4 mm | 8 mm | ||||||||||||||||||
![]() | KFG5616Q1A-DEB5 | Samsung Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 67 | SAMSUNG SEMICONDUCTOR INC | FBGA, BGA67,8X10,32 | 14.5 ns | 1 | 16777216 words | 16000000 | 85 °C | -30 °C | PLASTIC/EPOXY | FBGA | BGA67,8X10,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | 1.8 V | 有 | Obsolete | e3 | 有 | EAR99 | SLC NAND类型 | 哑光锡 | 8542.32.00.51 | BOTTOM | BALL | 0.8 mm | compliant | R-PBGA-B67 | 不合格 | OTHER | 0.04 mA | 16MX16 | 16 | 0.00005 A | 262144 bit | PARALLEL | FLASH | NO | NO | YES | 512 | 32K | 512 words | YES | |||||||||||||||||||||||||
![]() | XC1764-CD8C | AMD Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 8 | DIP, DIP8,.3 | 2.5 MHz | 65536 words | 64000 | 85 °C | -40 °C | CERAMIC | DIP | DIP8,.3 | RECTANGULAR | IN-LINE | 5 V | 无 | Obsolete | XILINX INC | EAR99 | 8542.32.00.71 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-XDIP-T8 | 不合格 | INDUSTRIAL | 0.01 mA | 64KX1 | 3-STATE | 1 | 0.0005 A | 65536 bit | COMMON | 配置存储器 | ||||||||||||||||||||||||||||||||||||
![]() | S29GL064M11FAIS10 | Spansion | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SST45VF010-10-4C-SA | Silicon Storage Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | SOIC | 4.90 X 6 MM, SOIC-8 | 10 MHz | 1048576 words | 1000000 | 70 °C | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | 小概要 | 3 V | 无 | Obsolete | SILICON STORAGE TECHNOLOGY INC | e0 | EAR99 | NOR型号 | Tin/Lead (Sn/Pb) | 8542.32.00.51 | DUAL | 鸥翼 | 1 | 1.27 mm | unknown | 8 | R-PDSO-G8 | 不合格 | 3.6 V | COMMERCIAL | 2.7 V | SYNCHRONOUS | 0.03 mA | 1MX1 | 1.75 mm | 1 | 0.000015 A | 1048576 bit | SERIAL | FLASH | 2.7 V | SPI | 10000 Write/Erase Cycles | 100 | HARDWARE | 4.9 mm | 3.9 mm | |||||||||||||||||||||
![]() | S29GL512N11FAI020 | Spansion | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 64 | Obsolete | SPANSION INC | BGA | 13 X 11 MM, FBGA-64 | 110 ns | 3 | 33554432 words | 32000000 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | 3 V | 无 | e0 | 无 | 3A991.B.1.A | NOR型号 | 锡铅 | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 1 mm | not_compliant | 64 | R-PBGA-B64 | 不合格 | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.09 mA | 32MX16 | 1.4 mm | 16 | 0.000005 A | 536870912 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 512 | 128K | 8/16 words | YES | YES | 13 mm | 11 mm | ||||||||||||
![]() | S29GL512N11FAI020 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 64 | 110 ns | 33554432 words | 32000000 | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA64,8X8,40 | SQUARE | 网格排列 | 无 | Transferred | ADVANCED MICRO DEVICES INC | BGA, BGA64,8X8,40 | e0 | EAR99 | NOR型号 | Tin/Lead (Sn/Pb) | 8542.32.00.51 | BOTTOM | BALL | 1 mm | unknown | S-PBGA-B64 | 不合格 | INDUSTRIAL | 0.09 mA | 32MX16 | 16 | 0.000005 A | 536870912 bit | PARALLEL | FLASH | 8 | YES | YES | YES | 512 | 128K | 8/16 words | YES | YES | ||||||||||||||||||||||||||
![]() | AM29SL800DT90WAF | Spansion | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 48 | Obsolete | SPANSION INC | BGA | 8.15 X 6.15 MM, 0.80 MM PITCH, LEAD FREE, FBGA-48 | 90 ns | 3 | 524288 words | 512000 | 85 °C | -40 °C | PLASTIC/EPOXY | TFBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | 1.8 V | 有 | e1 | EAR99 | NOR型号 | 锡银铜 | TOP BOOT BLOCK | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 0.8 mm | unknown | 40 | 48 | R-PBGA-B48 | 不合格 | 2.2 V | INDUSTRIAL | 1.7 V | ASYNCHRONOUS | 0.03 mA | 512KX16 | 1.2 mm | 16 | 0.000005 A | 8388608 bit | PARALLEL | FLASH | 1.8 V | 1000000 Write/Erase Cycles | 8 | YES | YES | YES | 1,2,1,15 | 16K,8K,32K,64K | YES | TOP | 8.15 mm | 6.15 mm | |||||||||||
![]() | AM29F200BB-55SC | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 44 | SOIC | SOP, SOP44,.63 | 55 ns | 131072 words | 128000 | 70 °C | PLASTIC/EPOXY | SOP | SOP44,.63 | RECTANGULAR | 小概要 | 5 V | 无 | Transferred | ADVANCED MICRO DEVICES INC | e0 | EAR99 | NOR型号 | Tin/Lead (Sn/Pb) | MINIMUM 1000K WRITE/ERASE CYCLE ;20 YEAR DATA RETENTION | 8542.32.00.51 | DUAL | 鸥翼 | 1 | 1.27 mm | unknown | 44 | R-PDSO-G44 | 不合格 | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.06 mA | 128KX16 | 2.8 mm | 16 | 0.000005 A | 2097152 bit | PARALLEL | FLASH | 5 V | 1000000 Write/Erase Cycles | 20 | 8 | YES | YES | YES | 1,2,1,3 | 16K,8K,32K,64K | YES | BOTTOM | 28.2 mm | 13.3 mm | ||||||||||||||
![]() | AM29F200BB-55SC | Spansion | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 44 | SPANSION INC | SOIC | SOP, SOP44,.63 | 55 ns | 3 | 131072 words | 128000 | 70 °C | PLASTIC/EPOXY | SOP | SOP44,.63 | RECTANGULAR | 小概要 | 5 V | 无 | Obsolete | e0 | 无 | EAR99 | NOR型号 | 锡铅 | MIN 1000K WRITE/ERASE CYCLE ;20 YEAR DATA RETENTION; BOTTOM BOOT BLOCK | 8542.32.00.51 | DUAL | 鸥翼 | 260 | 1 | 1.27 mm | unknown | 44 | R-PDSO-G44 | 不合格 | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.06 mA | 128KX16 | 2.8 mm | 16 | 0.000005 A | 2097152 bit | PARALLEL | FLASH | 5 V | 1000000 Write/Erase Cycles | 20 | 8 | YES | YES | YES | 1,2,1,3 | 16K,8K,32K,64K | YES | BOTTOM | 28.2 mm | 13.3 mm | |||||||||||
![]() | X-7656-21407 | TE Connectivity | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | K9F3208U0B-TCB0 | Samsung Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 40 | 4194304 words | 4000000 | 70 °C | PLASTIC/EPOXY | TSOP2 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | 3.3 V | Obsolete | SAMSUNG SEMICONDUCTOR INC | TSOP2 | TSOP2, | 35 ns | EAR99 | 8542.32.00.51 | DUAL | 鸥翼 | 1 | 0.8 mm | compliant | 44 | R-PDSO-G40 | 不合格 | 3.6 V | COMMERCIAL | 2.7 V | ASYNCHRONOUS | 4MX8 | 1.2 mm | 8 | 33554432 bit | PARALLEL | FLASH | 2.7 V | 18.41 mm | 10.16 mm | ||||||||||||||||||||||||||||||||
![]() | MX29LV004CBTI-90G | Macronix International Co Ltd | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 40 | Obsolete | MACRONIX INTERNATIONAL CO LTD | TSOP1 | TSOP1, TSSOP40,.8,20 | 90 ns | 3 | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSOP1 | TSSOP40,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | 3 V | 有 | e6 | EAR99 | NOR型号 | 锡铋 | 8542.32.00.51 | DUAL | 鸥翼 | 1 | 0.5 mm | unknown | 40 | R-PDSO-G40 | 不合格 | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.03 mA | 4MX8 | 1.2 mm | 8 | 0.000005 A | 33554432 bit | PARALLEL | FLASH | 3 V | YES | YES | YES | 1,2,1,7 | 16K,8K,32K,64K | YES | BOTTOM | YES | 18.4 mm | 10 mm | |||||||||||||||
![]() | K9F1G16Q0M-YCB0 | Samsung Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 48 | TSOP1 | 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48 | 30 ns | 67108864 words | 64000000 | 70 °C | PLASTIC/EPOXY | TSOP1 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | 1.8 V | 无 | Obsolete | SAMSUNG SEMICONDUCTOR INC | e0 | 无 | EAR99 | SLC NAND类型 | 锡铅 | CONTAINS ADDITIONAL 32M BIT NAND FLASH | 8542.32.00.51 | DUAL | 鸥翼 | 1 | 0.5 mm | compliant | 48 | R-PDSO-G48 | 不合格 | 1.95 V | COMMERCIAL | 1.65 V | ASYNCHRONOUS | 0.015 mA | 64MX16 | 1.2 mm | 16 | 0.00005 A | 1073741824 bit | PARALLEL | FLASH | 1.8 V | NO | NO | YES | 1K | 64K | 1K words | YES | 18.4 mm | 12 mm | ||||||||||||||||
![]() | TBP38S030-25N | Texas Instruments | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 16 | 25 ns | 32 words | 32 | 70 °C | PLASTIC/EPOXY | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | 5 V | 无 | Obsolete | TEXAS INSTRUMENTS INC | DIP, DIP16,.3 | EAR99 | 8542.32.00.71 | DUAL | THROUGH-HOLE | 未说明 | 2.54 mm | not_compliant | 未说明 | R-PDIP-T16 | 不合格 | COMMERCIAL | 0.125 mA | 32X8 | 8 | OTP ROM | |||||||||||||||||||||||||||||||||||||||
![]() | PA28F008S3-150 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 44 | SOIC | 13.30 X 28.20 MM, PLASTIC, SOP-44 | 150 ns | 1048576 words | 1000000 | 70 °C | PLASTIC/EPOXY | SOP | SOP44,.63 | RECTANGULAR | 小概要 | 3.3 V | 无 | Obsolete | INTEL CORP | e0 | EAR99 | NOR型号 | 锡铅 | USER-SELECTABLE 3.3V OR 12V VPP | 8542.32.00.51 | DUAL | 鸥翼 | 1 | 1.27 mm | unknown | 44 | R-PDSO-G44 | 不合格 | 3.6 V | COMMERCIAL | 3 V | ASYNCHRONOUS | 0.04 mA | 1MX8 | 2.95 mm | 8 | 0.00001 A | 8388608 bit | PARALLEL | FLASH | 2.7 V | NO | NO | YES | 16 | 64K | YES | 28.2 mm | 13.3 mm | ||||||||||||||||||
![]() | S29GL128M10TFIR10 | Spansion | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 56 | Obsolete | SPANSION INC | TSOP1 | LEAD FREE, MO-142EC, TSOP-56 | 100 ns | 3 | 8388608 words | 8000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 3.3 V | 有 | e3 | 有 | EAR99 | NOR型号 | 哑光锡 | 8542.32.00.51 | DUAL | 鸥翼 | 260 | 1 | 0.5 mm | unknown | 40 | 56 | R-PDSO-G56 | 不合格 | 3.6 V | INDUSTRIAL | 3 V | ASYNCHRONOUS | 0.06 mA | 8MX16 | 1.2 mm | 16 | 0.000005 A | 134217728 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 256 | 64K | 4/8 words | YES | YES | 18.4 mm | 14 mm | |||||||||||
![]() | S29GL128M10TFIR10 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 56 | 8000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 有 | Transferred | ADVANCED MICRO DEVICES INC | 100 ns | 8388608 words | EAR99 | NOR型号 | 8542.32.00.51 | DUAL | 鸥翼 | 0.5 mm | unknown | R-PDSO-G56 | 不合格 | INDUSTRIAL | 0.06 mA | 8MX16 | 16 | 0.000005 A | 134217728 bit | PARALLEL | FLASH | 8 | YES | YES | YES | 256 | 64K | 4/8 words | YES | YES | |||||||||||||||||||||||||||||
![]() | AT27LV512R-25RC | Atmel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 28 | ATMEL CORP | SOIC | SOP, SOP28,.5 | 250 ns | 2 | 65536 words | 64000 | 70 °C | PLASTIC/EPOXY | SOP | SOP28,.5 | RECTANGULAR | 小概要 | 5 V | 无 | Obsolete | e0 | 无 | EAR99 | 锡铅 | 8542.32.00.71 | DUAL | 鸥翼 | 225 | 1 | 1.27 mm | compliant | 28 | R-PDSO-G28 | 不合格 | 5.5 V | COMMERCIAL | 3 V | ASYNCHRONOUS | 0.02 mA | 64KX8 | 3-STATE | 2.79 mm | 8 | 0.00002 A | 524288 bit | PARALLEL | COMMON | OTP ROM | 18.25 mm | 8.74 mm |
PM49FL004T-33VC
Integrated Silicon Solution Inc
分类:Memory - Modules
SST39VF040-70-4C-N
Microchip Technology Inc
分类:Memory - Modules
5962-9461302HXC
White Microelectronics
分类:Memory - Modules
S25FL004A0LMAI003
Spansion
分类:Memory - Modules
SST27VF020-70-3C-WHE
Greenliant Systems Ltd
分类:Memory - Modules
S29GL128S90FAI020
Spansion
分类:Memory - Modules
MX29LV002NCBTC-70
Macronix International Co Ltd
分类:Memory - Modules
KFG5616Q1A-DEB5
Samsung Semiconductor
分类:Memory - Modules
XC1764-CD8C
AMD Xilinx
分类:Memory - Modules
S29GL064M11FAIS10
Spansion
分类:Memory - Modules
SST45VF010-10-4C-SA
Silicon Storage Technology
分类:Memory - Modules
S29GL512N11FAI020
Spansion
分类:Memory - Modules
S29GL512N11FAI020
AMD
分类:Memory - Modules
AM29SL800DT90WAF
Spansion
分类:Memory - Modules
AM29F200BB-55SC
AMD
分类:Memory - Modules
AM29F200BB-55SC
Spansion
分类:Memory - Modules
X-7656-21407
TE Connectivity
分类:Memory - Modules
K9F3208U0B-TCB0
Samsung Semiconductor
分类:Memory - Modules
MX29LV004CBTI-90G
Macronix International Co Ltd
分类:Memory - Modules
K9F1G16Q0M-YCB0
Samsung Semiconductor
分类:Memory - Modules
TBP38S030-25N
Texas Instruments
分类:Memory - Modules
PA28F008S3-150
Intel Corporation
分类:Memory - Modules
S29GL128M10TFIR10
Spansion
分类:Memory - Modules
S29GL128M10TFIR10
AMD
分类:Memory - Modules
AT27LV512R-25RC
Atmel Corporation
分类:Memory - Modules
