类别是'category.片上系统(SoC)' (7695)
- 所有品牌
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 安装类型 | 包装/外壳 | 表面安装 | 供应商器件包装 | 终端数量 | 厂商 | 操作温度 | 包装 | 系列 | 零件状态 | 湿度敏感性等级(MSL) | HTS代码 | 子类别 | 端子位置 | 终端形式 | 端子间距 | Reach合规守则 | JESD-30代码 | 工作电源电压 | 温度等级 | 振荡器类型 | 速度 | 内存大小 | 电压 - 供电 (Vcc/Vdd) | 核心处理器 | 周边设备 | 程序存储器类型 | 芯尺寸 | 程序内存大小 | 连接方式 | 建筑学 | 座位高度-最大 | 可编程逻辑类型 | 产品类别 | EEPROM 大小 | 主要属性 | 核数量 | 闪光大小 | 产品类别 | 长度 | 宽度 | RoHS状态 | |||||||||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | AGFA023R24C3E3V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2340-BFBGA Exposed Pad | 2340-BGA (45x42) | 480 | 0°C ~ 100°C (TJ) | Tray | Agilex F | 活跃 | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA006R24C2I1VB | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2340-BFBGA Exposed Pad | 2340-BGA (45x42) | 576 | -40°C ~ 100°C (TJ) | Tray | Agilex F | 活跃 | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 573K Logic Elements | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA008R24C2E1VB | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2340-BFBGA Exposed Pad | 2340-BGA (45x42) | 576 | 0°C ~ 100°C (TJ) | Tray | Agilex F | 活跃 | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 764K Logic Elements | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AMA3B1KK-KCR-TB | Ambiq Micro, Inc. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 66-UFBGA, CSPBGA | 66-CSP (3.38x3.25) | 37 | AMA3B1KK | -40°C ~ 85°C (TA) | Tape & Reel (TR) | Apollo3 Blue | 活跃 | 96MHz | 384KB | ARM® Cortex®-M4F | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | I2C, SPI, UART/USART | MCU | 1MB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS048H2F34I1HG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 11 Weeks | 1152-BBGA, FCBGA | 492 | -40°C~100°C TJ | Tray | Arria 10 SX | 活跃 | 3 (168 Hours) | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 480K Logic Elements | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVH1542-2LLELSVA4737 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1 | Xilinx | Xilinx | + 110 C | 0 C | SOC - Systems on a Chip | 700 mV | System-On-Modules - SOM | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFB014R24B3E3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | Intel | Intel | Details | 768 | Tray | 活跃 | 3 | 0°C ~ 100°C (TJ) | Tray | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | - | Intel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1802-2MLIVFVC1760-5189 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1 | Xilinx | Xilinx | + 110 C | - 40 C | SOC - Systems on a Chip | 800 mV | System-On-Modules - SOM | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1802-1LSIVFVC1760-5189 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1 | Xilinx | Xilinx | + 110 C | - 40 C | SOC - Systems on a Chip | 700 mV | System-On-Modules - SOM | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1802-1LLIVFVC1760-5189 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1 | Xilinx | Xilinx | + 110 C | - 40 C | SOC - Systems on a Chip | 700 mV | System-On-Modules - SOM | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1802-1MLIVFVC1760-5189 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1 | Xilinx | Xilinx | + 110 C | - 40 C | SOC - Systems on a Chip | 800 mV | System-On-Modules - SOM | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1802-1MSIVFVC1760-5189 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1 | Xilinx | Xilinx | + 110 C | - 40 C | SOC - Systems on a Chip | 800 mV | System-On-Modules - SOM | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS160T-1FCVG784T2 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | 微芯片技术 | 活跃 | MCU - 136, FPGA - 312 | Tray | -40°C ~ 125°C (TJ) | - | - | 1.4125MB | RISC-V | DMA, PCI, PWM | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 161K Logic Modules | 128KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA027R31C2E1V | Intel | 数据表 | 564 In Stock |
- | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 720 | 活跃 | Tray | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA027R25A2E3V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 活跃 | 624 | Tray | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU7EV-L1FBVB900I | AMD | 数据表 | 683 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | 204 | Tray | XCZU7 | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EV | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1502-1MSEVSVA1596 | AMD | 数据表 | 573 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1596-BFBGA, FCBGA | AMD | 活跃 | Tray | 478 | 0°C ~ 100°C (TJ) | Versal™ AI Core | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 800k Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY8C4147LQA-S283 | Infineon | 数据表 | 29 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Surface Mount, Wettable Flank | 40-UFQFN Exposed Pad | 40-QFN (6x6) | Infineon Technologies | 34 | Tray | CY8C4147 | A/D 16x10b, 20x12b SAR | 活跃 | 有 | 4900 | Infineon | Infineon Technologies | Details | -40°C ~ 85°C (TA) | Tray | Automotive, AEC-Q100, PSOC® 4 CY8C4100S Plus | SOC - Systems on a Chip | External, Internal | 24MHz | 16K x 8 | 1.71V ~ 5.5V | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT | FLASH | 32-Bit | 128KB (128K x 8) | CANbus, FIFO, I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART | ARM Microcontrollers - MCU | - | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY8C4146LQE-S263T | Infineon | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Surface Mount, Wettable Flank | 40-UFQFN Exposed Pad | 40-QFN (6x6) | Infineon Technologies | Tape & Reel (TR) | A/D 16x10b, 16x12b SAR; D/A 2x7b | 活跃 | 有 | 2500 | Infineon | Infineon Technologies | Details | 34 | -40°C ~ 125°C (TA) | Reel | Automotive, AEC-Q100, PSOC® 4 CY8C4100S Plus | SOC - Systems on a Chip | External, Internal | 48MHz | 8K x 8 | 1.71V ~ 5.5V | ARM® Cortex®-M0+ | Brown-out Detect/Reset, CapSense, DMA, POR, PWM, Temp Sensor, WDT | FLASH | 32-Bit | 64KB (64K x 8) | FIFO, I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART | ARM Microcontrollers - MCU | - | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY8C4126LQS-S453 | Infineon | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Surface Mount, Wettable Flank | 40-UFQFN Exposed Pad | 40-QFN (6x6) | Infineon Technologies | Tray | A/D 16x10b, 20x12b SAR | 活跃 | 有 | 4900 | Infineon | Infineon Technologies | Details | 34 | -40°C ~ 105°C (TA) | Tray | Automotive, AEC-Q100, PSOC® 4 CY8C4100S Plus | SOC - Systems on a Chip | External, Internal | 24MHz | 8K x 8 | 1.71V ~ 5.5V | ARM® Cortex®-M0+ | Brown-out Detect/Reset, CapSense, DMA, LCD, POR, PWM, Temp Sensor, WDT | FLASH | 32-Bit | 64KB (64K x 8) | FIFO, I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART | ARM Microcontrollers - MCU | - | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY8C4126LQS-S453T | Infineon | 数据表 | 30 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Surface Mount, Wettable Flank | 40-UFQFN Exposed Pad | 40-QFN (6x6) | Infineon Technologies | Tape & Reel (TR) | A/D 16x10b, 20x12b SAR | 活跃 | 有 | 2500 | Infineon | Infineon Technologies | Details | 34 | -40°C ~ 105°C (TA) | Reel | Automotive, AEC-Q100, PSOC® 4 CY8C4100S Plus | SOC - Systems on a Chip | Internal | 24MHz | 8K x 8 | 1.71V ~ 5.5V | ARM® Cortex®-M0+ | Brown-out Detect/Reset, CapSense, LCD, POR, PWM, WDT | FLASH | 32-Bit | 64KB (64K x 8) | I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART | ARM Microcontrollers - MCU | - | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY8C4147LQE-S263 | Infineon | 数据表 | 29 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Surface Mount, Wettable Flank | 40-UFQFN Exposed Pad | 40-QFN (6x6) | Infineon Technologies | 34 | Tray | CY8C4147 | A/D 16x10b, 20x12b SAR | 活跃 | 有 | 4900 | Infineon | Infineon Technologies | Details | -40°C ~ 125°C (TA) | Tray | Automotive, AEC-Q100, PSOC® 4 CY8C4100S Plus | SOC - Systems on a Chip | External, Internal | 24MHz | 16K x 8 | 1.71V ~ 5.5V | ARM® Cortex®-M0+ | Brown-out Detect/Reset, CapSense, DMA, POR, PWM, Temp Sensor, WDT | FLASH | 32-Bit | 128KB (128K x 8) | FIFO, I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART | ARM Microcontrollers - MCU | - | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS066K3F40E2SG | ALTERA | 数据表 | 672 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | YES | 1517-FBGA (40x40) | 1517 | 1.2 GHz | 660000 LE | 0.176370 oz | 1 | SMD/SMT | 82500 LAB | 973542 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | - | BGA, | 网格排列 | PLASTIC/EPOXY | 0.9 V | 0.87 V | 100 °C | 有 | 10AS066K3F40E2SG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.46 | 696 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | 活跃 | 8542.39.00.01 | SOC - Systems on a Chip | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1517 | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3.5 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 660K Logic Elements | 2 Core | -- | SoC FPGA | 40 mm | 40 mm | |||||||||||||||||||
![]() | 10AS048E3F29E2LG | ALTERA | 数据表 | 656 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FBGA-780 | 360 | 2 x 32 kB | 1.2 GHz | 480000 LE | 0.176370 oz | SMD/SMT | 60000 LAB | 973488 | Intel | Intel / Altera | Arria 10 SoC | 2 x 32 kB | - | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | 活跃 | SOC - Systems on a Chip | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | FPGA - 480K Logic Elements | 2 Core | -- | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 1SX065HH3F35E3VG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | Intel | 活跃 | 392 | Tray | 0°C ~ 100°C (TJ) | Stratix® 10 SX | 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 650K Logic Elements | - |
AGFA023R24C3E3V
Intel
分类:Embedded - System On Chip (SoC)
AGFA006R24C2I1VB
Intel
分类:Embedded - System On Chip (SoC)
AGFA008R24C2E1VB
Intel
分类:Embedded - System On Chip (SoC)
AMA3B1KK-KCR-TB
Ambiq Micro, Inc.
分类:Embedded - System On Chip (SoC)
10AS048H2F34I1HG
Intel
分类:Embedded - System On Chip (SoC)
XCVH1542-2LLELSVA4737
Xilinx
分类:Embedded - System On Chip (SoC)
AGFB014R24B3E3E
Intel
分类:Embedded - System On Chip (SoC)
XCVM1802-2MLIVFVC1760-5189
Xilinx
分类:Embedded - System On Chip (SoC)
XCVM1802-1LSIVFVC1760-5189
Xilinx
分类:Embedded - System On Chip (SoC)
XCVM1802-1LLIVFVC1760-5189
Xilinx
分类:Embedded - System On Chip (SoC)
XCVM1802-1MLIVFVC1760-5189
Xilinx
分类:Embedded - System On Chip (SoC)
XCVM1802-1MSIVFVC1760-5189
Xilinx
分类:Embedded - System On Chip (SoC)
MPFS160T-1FCVG784T2
Microchip
分类:Embedded - System On Chip (SoC)
AGFA027R31C2E1V
Intel
分类:Embedded - System On Chip (SoC)
249,563.464370
AGFA027R25A2E3V
Intel
分类:Embedded - System On Chip (SoC)
XCZU7EV-L1FBVB900I
AMD
分类:Embedded - System On Chip (SoC)
25,841.419719
XCVC1502-1MSEVSVA1596
AMD
分类:Embedded - System On Chip (SoC)
95,557.832305
CY8C4147LQA-S283
Infineon
分类:Embedded - System On Chip (SoC)
39.444907
CY8C4146LQE-S263T
Infineon
分类:Embedded - System On Chip (SoC)
CY8C4126LQS-S453
Infineon
分类:Embedded - System On Chip (SoC)
CY8C4126LQS-S453T
Infineon
分类:Embedded - System On Chip (SoC)
46.511438
CY8C4147LQE-S263
Infineon
分类:Embedded - System On Chip (SoC)
45.638773
10AS066K3F40E2SG
ALTERA
分类:Embedded - System On Chip (SoC)
37,149.710314
10AS048E3F29E2LG
ALTERA
分类:Embedded - System On Chip (SoC)
23,623.812862
1SX065HH3F35E3VG
Intel
分类:Embedded - System On Chip (SoC)
