类别是'category.片上系统(SoC)' (7695)

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对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

安装类型

包装/外壳

表面安装

越来越多的功能

引脚数

外壳材料

供应商器件包装

插入材料

终端数量

后壳材料,电镀

厂商

操作温度

包装

系列

尺寸/尺寸

容差

JESD-609代码

零件状态

终止次数

终端

温度系数

连接器类型

类型

电阻

定位的数量

端子表面处理

最高工作温度

最小工作温度

组成

颜色

应用

性别

功率(瓦特)

HTS代码

电容量

紧固类型

子类别

额定电流

技术

端子位置

方向

终端形式

屏蔽/屏蔽

峰值回流焊温度(摄氏度)

入口保护

端子间距

Reach合规守则

频率

外壳完成

外壳尺寸-插入

终端样式

JESD-30代码

输出的数量

资历状况

接头数量

触点性别

工作电源电压

电介质

失败率

引线间距

电源

温度等级

注意

界面

电路数量

端口的数量

速度

内存大小

外壳尺寸,MIL

引线样式

核心处理器

周边设备

程序内存大小

连接方式

电缆开口

家人

建筑学

输入数量

组织结构

座位高度-最大

可编程逻辑类型

产品类别

核心架构

收发器数量

主要属性

逻辑块数量

外壳电镀

逻辑单元数

核数量

等效门数

闪光大小

产品

特征

产品类别

应力消除

产品长度(mm)

高度

座位高度(最大)

长度

宽度

厚度(最大)

触点表面处理厚度 - 配套

产品高度(mm)

材料可燃性等级

评级结果

AGFB012R24C2I1V
AGFB012R24C2I1V
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

Intel

744

Tray

活跃

-40°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.2M Logic Elements

-

A2F500M3G-FGG256M
A2F500M3G-FGG256M
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

256-LBGA

256

256-FPBGA (17x17)

PEI-Genesis

MCU - 25, FPGA - 66

A2F500

3

A2F500M3G-FGG256M

Microsemi Corporation

活跃

MICROSEMI CORP

5.81

Bulk

活跃

Compliant

-55°C ~ 125°C (TJ)

*

125 °C

-55 °C

compliant

80 MHz

EBI/EMI, Ethernet, I2C, SPI, UART, USART

80MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

ARM

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

512KB

AGFA023R25A2I3E
AGFA023R25A2I3E
Intel 数据表

532 In Stock

-

最小起订量: 1

最小包装量: 1

-

-

Intel

480

Tray

活跃

-40°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.3M Logic Elements

-

STID337CYCB
STID337CYCB
STMicroelectronics 数据表

N/A

-

最小起订量: 1

最小包装量: 1

24

Straight

250VDC/200VAC

Not Required(mm)

24-28

-55C to 200C

Crimp

49.86(mm)

Cable

铍铜

24Signal

Circular

PL

24(POS)

PIN

1(Port)

MS

化学镍

53.98(mm)

Not Required(mm)

AGFB023R25A1I1V
AGFB023R25A1I1V
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

Intel

Non-Compliant

480

Tray

活跃

-40°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.3M Logic Elements

-

AGID019R18A2E2V
AGID019R18A2E2V
Intel 数据表

628 In Stock

-

最小起订量: 1

最小包装量: 1

-

-

Intel

480

Tray

活跃

0°C ~ 100°C (TJ)

Agilex I

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.9M Logic Elements

-

AGFB022R25A2E4F
AGFB022R25A2E4F
Intel 数据表

937 In Stock

-

最小起订量: 1

最小包装量: 1

Surface Mount, MLCC

1206 (3216 Metric)

-

Vishay Vitramon

Tape & Reel (TR)

CDR32

活跃

50V

624

-55°C ~ 125°C

Military, MIL-PRF-55681, CDR32

0.126 L x 0.063 W (3.20mm x 1.60mm)

±10%

BX

高可靠性

0.022 µF

R (0.01%)

-

1.4GHz

256KB

-

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.2M Logic Elements

-

-

-

0.051 (1.30mm)

-

AGFA027R31C2E2VAA
AGFA027R31C2E2VAA
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Surface Mount, MLCC

0402 (1005 Metric)

-

Vishay Vitramon

Tape & Reel (TR)

VJ0402

活跃

50V

720

-55°C ~ 125°C

VJ HIFREQ

0.040 L x 0.020 W (1.02mm x 0.51mm)

±0.25pF

C0G, NP0

RF, Microwave, High Frequency

8.2 pF

-

1.4GHz

256KB

-

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.7M Logic Elements

-

High Q, Low Loss

-

0.024 (0.61mm)

-

10AS048H2F34I1HG
10AS048H2F34I1HG
ALTERA 数据表

633 In Stock

-

最小起订量: 1

最小包装量: 1

Free Hanging (In-Line)

1152-BBGA, FCBGA

-

Aluminum

1152-FBGA (35x35)

Thermoplastic

-

TE Connectivity Deutsch 连接器

活跃

INTEL CORP

5.68

-

Bulk

Metal

D38999/26FC

Discontinued at Digi-Key

Copper Alloy

Gold

492

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

480000 LE

+ 100 C

- 40 C

24

SMD/SMT

60000 LAB

964982

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-

10AS048H2F34I1HG

-65°C ~ 200°C

Tray

Military, MIL-DTL-38999 Series III, DTS

活跃

Crimp

Plug, Female Sockets

22

Silver

Military

Threaded

SOC - Systems on a Chip

5A

D

Shielded

抗环境干扰

unknown

Nickel

13-35

950 mV

1.5GHz

256KB

C

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

-

MCU, FPGA

SoC FPGA

24 Transceiver

FPGA - 480K Logic Elements

2 Core

--

自锁

SoC FPGA

50.0µin (1.27µm)

-

XCZU19EG-2FFVD1760E
XCZU19EG-2FFVD1760E
AMD 数据表

807 In Stock

-

最小起订量: 1

最小包装量: 1

1760-BBGA, FCBGA

1760-FCBGA (42.5x42.5)

AMD

308

Tray

XCZU19

活跃

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells

-

AGFB022R31C2E3VAA
AGFB022R31C2E3VAA
Intel 数据表

754 In Stock

-

最小起订量: 1

最小包装量: 1

-

-

Intel

720

Tray

活跃

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.2M Logic Elements

-

AGFA014R24B2I2V
AGFA014R24B2I2V
Intel 数据表

834 In Stock

-

最小起订量: 1

最小包装量: 1

-

-

Intel

Non-Compliant

768

Tray

活跃

-40°C ~ 100°C (TJ)

Agilex F

直角

12

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.4M Logic Elements

-

M2S060T-VFG784
M2S060T-VFG784
Microchip 数据表

2868 In Stock

-

最小起订量: 1

最小包装量: 1

784-FBGA

784-VFBGA (23x23)

微芯片技术

Tray

活跃

56500 LE

+ 85 C

0 C

0°C ~ 85°C (TJ)

SmartFusion®2

166MHz

ARM® Cortex®-M3

DDR, PCIe, SERDES

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 60K Logic Modules

PIMX8QX6AVLFZAA
PIMX8QX6AVLFZAA
NXP 数据表

5 In Stock

-

最小起订量: 1

最小包装量: 1

1206 (3216 Metric)

1206

Vishay Dale

Tape & Reel (TR)

活跃

-55°C ~ 125°C

TNPU e3

0.126 L x 0.063 W (3.20mm x 1.60mm)

±0.05%

2

±5ppm/°C

105 Ohms

Thin Film

0.25W, 1/4W

-

Anti-Sulfur, Automotive AEC-Q200, Moisture Resistant

0.026 (0.65mm)

AEC-Q200

AGFA012R24C2I3V
AGFA012R24C2I3V
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

Intel

744

Tray

活跃

-40°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.2M Logic Elements

-

XCZU3EG-1SFVC784I
XCZU3EG-1SFVC784I
AMD 数据表

861 In Stock

-

最小起订量: 1

最小包装量: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

252

Tray

XCZU3

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

-

AGFB019R25A2E3V
AGFB019R25A2E3V
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

Intel

480

Tray

活跃

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.9M Logic Elements

-

AGFB022R31C3E3V
AGFB022R31C3E3V
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

Intel

活跃

Tray

720

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.2M Logic Elements

-

10AS027H2F35I1SG
10AS027H2F35I1SG
ALTERA 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1152-BBGA, FCBGA

YES

1152-FBGA (35x35)

1152

-40 °C

0.9 V

0.87 V

100 °C

10AS027H2F35I1SG

BGA

SQUARE

Intel Corporation

Obsolete

INTEL CORP

0.93 V

5.64

n/a

DFN16

384

35 X 35 MM, ROHS COMPLIANT, FBGA-1152

网格排列

PLASTIC/EPOXY

0...+70°C

Tray

n/a

Discontinued at Digi-Key

8542.39.00.01

BOTTOM

BALL

1 mm

compliant

S-PBGA-B1152

INDUSTRIAL

n/a

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

3.5 mm

现场可编程门阵列

FPGA - 270K Logic Elements

--

35 mm

35 mm

10AS016E3F27E2SG
10AS016E3F27E2SG
ALTERA 数据表

600 In Stock

-

最小起订量: 1

最小包装量: 1

FBGA-672

YES

672

0.87 V

100 °C

10AS016E3F27E2SG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

1.96

2 x 32 kB

1.2 GHz

160000 LE

9.819566 oz

1

SMD/SMT

20000 LAB

964690

Intel

Intel / Altera

Arria 10 SoC

2 x 32 kB

-

BGA, BGA672,26X26,40

网格排列

PLASTIC/EPOXY

BGA672,26X26,40

0.9 V

未说明

Tray

Arria 10 SX 160

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B672

240

不合格

0.9 V

OTHER

-

240

3.25 mm

现场可编程门阵列

SoC FPGA

160000

2 Core

SoC FPGA

27 mm

27 mm

XCZU49DR-1FFVF1760I
XCZU49DR-1FFVF1760I
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

面板安装

1760-BBGA, FCBGA

Bulkhead - Front Side Nut

Aluminum

1760-FCBGA (42.5x42.5)

Thermoplastic

-

Amphenol Aerospace Operations

Copper Alloy

Gold

622

-

Bulk

Metal

TV07RQDZ

活跃

-65°C ~ 175°C

MIL-DTL-38999 Series III, Tri-Start™ TV

Crimp

Receptacle, Male Pins

39 (38 + 1 Quadrax)

Black

Aviation, Marine, Military

Threaded

-

N (Normal)

Unshielded

抗环境干扰

黑锌镍

17-2

500MHz, 1.2GHz

256KB

-

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

-

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

-

50.0µin (1.27µm)

-

XCVC1802-1LSEVSVD1760
XCVC1802-1LSEVSVD1760
Xilinx 数据表

3000 In Stock

-

最小起订量: 1

最小包装量: 1

1210 (3225 Metric)

1210

KOA Speer Electronics, Inc.

Tape & Reel (TR)

活跃

692

-55°C ~ 155°C

SG73S-RT

0.126 L x 0.102 W (3.20mm x 2.60mm)

±2%

2

±200ppm/°C

12 kOhms

厚膜

1W

-

400MHz, 1GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.5M Logic Cells

-

Anti-Sulfur, Automotive AEC-Q200, Moisture Resistant, Pulse Withstanding

0.028 (0.70mm)

-

XCVC1802-1MSEVSVA2197
XCVC1802-1MSEVSVA2197
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

2197-BFBGA, FCBGA

2197-FCBGA (45x45)

Knowles Syfer

Tape & Reel (TR)

活跃

770

0°C ~ 100°C (TJ)

*

600MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.5M Logic Cells

-

XC7Z035-L2FFG676I
XC7Z035-L2FFG676I
AMD 数据表

864 In Stock

-

最小起订量: 1

最小包装量: 1

0805 (2012 metric)

676-FCBGA (27x27)

AMD

活跃

AEC-Q200

0805

2012

+ 150 C

- 55 C

1000

Vishay

500 VDC

Vishay / Vitramon

N

Class 1

130

Tray

XC7Z035

-40°C ~ 100°C (TJ)

Reel

VJ....32

0.1 pF

Standard

Lead-Bearing Finish MLCCs

3.3 pF

Capacitors

SMD/SMT

C0G (NP0)

800MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

陶瓷电容器

Kintex™-7 FPGA, 275K Logic Cells

-

通用型MLCC

Multilayer Ceramic Capacitors MLCC - SMD/SMT

1.45 mm

2 mm

1.25 mm

A2F060M3E-1CS288I
A2F060M3E-1CS288I
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

288

155523-4500

ITT Cannon

ITT Cannon

Details

TFBGA, BGA288,21X21,20

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA288,21X21,20

1.5 V

20

1.425 V

5.24

1.575 V

MICROSEMI CORP

Obsolete

SQUARE

TFBGA

100 MHz

A2F060M3E-1CS288I

1

e0

锡铅银

8542.39.00.01

Circular Connectors

CMOS

BOTTOM

BALL

235

0.5 mm

compliant

S-PBGA-B288

68

不合格

1.5,1.8,2.5,3.3 V

68

1536 CLBS, 60000 GATES

1.05 mm

现场可编程门阵列

军规圆形连接器

1536

1536

60000

军规圆形连接器

11 mm

11 mm