类别是'category.专用模块' (1062)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 表面安装 | 终端数量 | Concurrent Operation | Default Read Mode | DTR | JESD-609代码 | 无铅代码 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 资历状况 | 电源电压-最大值(Vsup) | 温度等级 | 电源电压-最小值(Vsup) | 电压 | 端口的数量 | 操作模式 | 电源电流-最大值 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 密度 | 待机电流-最大值 | 记忆密度 | 并行/串行 | I/O类型 | 内存IC类型 | 待机电压-最小值 | 输出启用 | 混合内存类型 | 温度 | 长度 | 宽度 | |||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | W25R64JVSSIN | Winbond | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | SOP - 8 | 208mil | 133MHz | 2.7 ~ 3.6V | 64Mb | -40~+85˚C | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | HYG0UEG0AF1P-6SS0E | SK Hynix Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 149 | -30 °C | PLASTIC/EPOXY | LFBGA | RECTANGULAR | GRID ARRAY, LOW PROFILE, FINE PITCH | 1.8 V | 活跃 | SK HYNIX INC | FBGA-149 | 33554432 words | 32000000 | 85 °C | EAR99 | IT ALSO CONTAINS 512MBIT(64MBIT X 8) MOBILE DDR SDRAM OPERATES AT 2.7V NOM SUPPLY | 8542.32.00.71 | BOTTOM | BALL | 1 | 0.8 mm | compliant | R-PBGA-B149 | 1.95 V | OTHER | 1.7 V | SYNCHRONOUS | 32MX16 | 1.4 mm | 16 | 536870912 bit | 存储器电路 | 14 mm | 10 mm | ||||||||||||||||||||||||||||||||||
![]() | DS1235YW | Dallas Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | DALLAS SEMICONDUCTOR | Obsolete | EAR99 | 8542.32.00.71 | unknown | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S63256 | Asahi Kasei Microsystems Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 活跃 | ASAHI KASEI MICRODEVICES CORP | , | EAR99 | 8542.32.00.71 | unknown | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M4-4102S-Z2 | Moujen Switch | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SN74LS219AN | Rochester Electronics LLC | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 16 | 16 | 70 °C | PLASTIC/EPOXY | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | 5 V | 活跃 | ROCHESTER ELECTRONICS LLC | , | 80 ns | 16 words | EAR99 | LG_MAX | 8542.32.00.41 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-PDIP-T16 | 5.25 V | 4.75 V | 1 | ASYNCHRONOUS | 0.06 mA | 16X4 | 3-STATE | 5.08 mm | 4 | 64 bit | PARALLEL | SEPARATE | 标准SRAM | 4.75 V | NO | 19.8 mm | 7.62 mm | |||||||||||||||||||||||||||
![]() | AM2764A | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete | ADVANCED MICRO DEVICES INC | , | EAR99 | 8542.32.00.71 | unknown | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TMS4C1060-30N | Texas Instruments | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 16 | PLASTIC/EPOXY | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | 5 V | 无 | Obsolete | TEXAS INSTRUMENTS INC | DIP, DIP16,.3 | 25 ns | 70 °C | EAR99 | 8542.32.00.71 | DUAL | THROUGH-HOLE | 未说明 | 2.54 mm | not_compliant | 未说明 | R-PDIP-T16 | 不合格 | COMMERCIAL | 0.05 mA | 0.01 A | 存储器电路 | ||||||||||||||||||||||||||||||||||||||||
![]() | TH50VSF0302BAXB | Toshiba America Electronic Components | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 48 | TOSHIBA CORP | BGA | LBGA, BGA48,6X8,40 | 100 ns | 1048576 words | 1000000 | 85 °C | -20 °C | PLASTIC/EPOXY | LBGA | BGA48,6X8,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | 3 V | 无 | Obsolete | e0 | EAR99 | Tin/Lead (Sn/Pb) | SRAM IS ORGANISED AS 128K X 8 | 8542.32.00.71 | BOTTOM | BALL | 1 | 1 mm | unknown | 48 | R-PBGA-B48 | 不合格 | 3.6 V | OTHER | 2.7 V | ASYNCHRONOUS | 0.04 mA | 1MX8 | 1.6 mm | 8 | 0.00003 A | 8388608 bit | 存储器电路 | FLASH+SRAM | 12 mm | 10 mm | |||||||||||||||||||||||
![]() | S71WS256NC0BFWAP2 | Spansion | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 84 | SPANSION INC | BGA | 8 X 11.60 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-84 | 80 ns | 3 | 16777216 words | 16000000 | 85 °C | -25 °C | PLASTIC/EPOXY | TFBGA | BGA84,10X12,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | 1.8 V | 有 | Obsolete | e1 | EAR99 | 锡银铜 | PSRAM IS ORGANIZED AS 4M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE | 8542.32.00.71 | BOTTOM | BALL | 260 | 1 | 0.8 mm | unknown | 40 | 84 | R-PBGA-B84 | 不合格 | 1.95 V | OTHER | 1.7 V | ASYNCHRONOUS | 0.054 mA | 16MX16 | 1.2 mm | 16 | 0.00007 A | 268435456 bit | 存储器电路 | FLASH+PSRAM | 11.6 mm | 8 mm | ||||||||||||||||||||
![]() | S71PL129NB0HFW4B0 | Spansion | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 64 | SPANSION INC | BGA | 8 X 11.60 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-64 | 70 ns | 3 | 8388608 words | 8000000 | 85 °C | -25 °C | PLASTIC/EPOXY | TFBGA | BGA64,10X12,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | 3 V | 有 | Obsolete | e1 | EAR99 | 锡银铜 | 8542.32.00.71 | BOTTOM | BALL | 260 | 1 | 0.8 mm | unknown | 40 | 64 | R-PBGA-B64 | 不合格 | 3.1 V | OTHER | 2.7 V | ASYNCHRONOUS | 8MX16 | 1.2 mm | 16 | 134217728 bit | 存储器电路 | FLASH+PSRAM | 11.6 mm | 8 mm | |||||||||||||||||||||||
![]() | TH50VSF3581AASB | Toshiba America Electronic Components | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 69 | LFBGA, BGA69,10X12,32 | 90 ns | 2097152 words | 2000000 | 85 °C | -30 °C | PLASTIC/EPOXY | LFBGA | BGA69,10X12,32 | RECTANGULAR | GRID ARRAY, LOW PROFILE, FINE PITCH | 3 V | Transferred | TOSHIBA CORP | BGA | e0 | EAR99 | 锡铅 | USER CONFIGURABLE AS 4M X 8 FLASH AND CONTAINS SRAM CONFIGURED AS 512K X 16 OR 1M X 8 | 8542.32.00.71 | BOTTOM | BALL | 1 | 0.8 mm | unknown | 69 | R-PBGA-B69 | 不合格 | 3.3 V | OTHER | 2.67 V | ASYNCHRONOUS | 0.05 mA | 2MX16 | 1.4 mm | 16 | 33554432 bit | 存储器电路 | FLASH+SRAM | 12 mm | 9 mm | |||||||||||||||||||||||||
![]() | TC518128AFL-10 | Toshiba America Electronic Components | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 32 | 131072 words | 128000 | 70 °C | PLASTIC/EPOXY | SOP | RECTANGULAR | 小概要 | 5 V | 无 | Obsolete | TOSHIBA CORP | SOIC | 100 ns | CE/AUTO/SELF REFRESH | DUAL | 鸥翼 | 1 | 1.27 mm | unknown | 32 | R-PDSO-G32 | 不合格 | 5.5 V | COMMERCIAL | 4.5 V | 1 | ASYNCHRONOUS | 128KX8 | 3-STATE | 2.8 mm | 8 | 1048576 bit | PARALLEL | PSEUDO STATIC RAM | YES | 20.6 mm | 8.8 mm | |||||||||||||||||||||||||||||
![]() | XC17S30VOG8C | AMD Xilinx | 数据表 | 702 In Stock | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | TSOP2, | 3 | 247968 words | 247968 | 70 °C | PLASTIC/EPOXY | TSOP2 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | 5 V | 有 | Obsolete | XILINX INC | TSOP | e3 | 有 | EAR99 | Matte Tin (Sn) | 8542.32.00.71 | DUAL | 鸥翼 | 260 | 1 | 1.27 mm | compliant | 30 | 8 | R-PDSO-G8 | 不合格 | 5.25 V | COMMERCIAL | 4.75 V | SYNCHRONOUS | 247968X1 | 1.2 mm | 1 | 247968 bit | 存储器电路 | 4.9 mm | 3.9 mm | ||||||||||||||||||||||||||
![]() | S72NS512PD0AHGL43 | Spansion | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | , | 有 | Obsolete | SPANSION INC | EAR99 | 8542.32.00.71 | 260 | unknown | 40 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | PF38F5060M0Y0B0 | Micron Technology Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 105 | MICRON TECHNOLOGY INC | BGA | TFBGA, BGA105,9X12,32 | 96 ns | 33554432 words | 32000000 | 85 °C | -30 °C | PLASTIC/EPOXY | TFBGA | BGA105,9X12,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | 1.8 V | 有 | Obsolete | 有 | EAR99 | PSEUDO SRAM IS ORGANIZED AS 8M X 16 | 8542.32.00.71 | BOTTOM | BALL | 260 | 1 | 0.8 mm | compliant | 30 | 105 | R-PBGA-B105 | 不合格 | 2 V | OTHER | 1.7 V | SYNCHRONOUS | 32MX16 | 1.2 mm | 16 | 0.00016 A | 536870912 bit | 存储器电路 | FLASH+PSRAM | 11 mm | 9 mm | |||||||||||||||||||||||
![]() | PF38F5060M0Y0B0 | Numonyx Memory Solutions | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 105 | NUMONYX | BGA | TFBGA, BGA105,9X12,32 | 96 ns | 3 | 33554432 words | 32000000 | 85 °C | -30 °C | PLASTIC/EPOXY | TFBGA | BGA105,9X12,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | 1.8 V | 有 | Transferred | e1 | EAR99 | 锡银铜 | PSEUDO SRAM IS ORGANIZED AS 8M X 16 | 8542.32.00.71 | BOTTOM | BALL | 1 | 0.8 mm | unknown | 105 | R-PBGA-B105 | 不合格 | 2 V | OTHER | 1.7 V | SYNCHRONOUS | 32MX16 | 1.2 mm | 16 | 0.00016 A | 536870912 bit | 存储器电路 | FLASH+PSRAM | 11 mm | 9 mm | |||||||||||||||||||||||
![]() | W25X20CLSVIG | Winbond | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 无 | Buffer | 无 | 8-VSOP | Serial (SPI, Dual SPI) | 150mil | x1/x2 | 80/104MHz | 2.3 ~ 3.6V | 2Mb | -40~+85˚C | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | W25X40CLSVIG | Winbond | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 无 | Buffer | 无 | VSOP - 8 | Serial (SPI, Dual SPI) | 150mil | x1/x2 | 80/104MHz | 2.3 ~ 3.6V | 4Mb | -40~+85˚C | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | W29N01HVBINA | Winbond | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | VFBGA - 63 | 9X11mm2 | 40MHz | 2.7 ~ 3.6V | 1Gb | -40~+85˚C | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | W29N01HVBINF | Winbond | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | VFBGA - 63 | 9X11mm2 | 40MHz | 2.7 ~ 3.6V | 1Gb | -40~+85˚C | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | W29N01HVSINF | Winbond | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TSOPI - 48 | 12X20mm2 | 40MHz | 2.7 ~ 3.6V | 1Gb | -40~+85˚C | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | W29N01HWBINF | Winbond | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | VFBGA - 63 | 9X11mm2 | 40MHz | 1.7 ~ 1.95V | 1Gb | -40~+85˚C | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | W29N01HZBINA | Winbond | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | VFBGA - 63 | 9X11mm2 | 40MHz | 1.7 ~ 1.95V | 1Gb | -40~+85˚C | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | W29N01HZSINF | Winbond | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TSOPI - 48 | 12X20mm2 | 40MHz | 1.7 ~ 1.95V | 1Gb | -40~+85˚C |
W25R64JVSSIN
Winbond
分类:Specialized
HYG0UEG0AF1P-6SS0E
SK Hynix Inc
分类:Specialized
DS1235YW
Dallas Semiconductor
分类:Specialized
S63256
Asahi Kasei Microsystems Corporation
分类:Specialized
M4-4102S-Z2
Moujen Switch
分类:Specialized
SN74LS219AN
Rochester Electronics LLC
分类:Specialized
AM2764A
AMD
分类:Specialized
TMS4C1060-30N
Texas Instruments
分类:Specialized
TH50VSF0302BAXB
Toshiba America Electronic Components
分类:Specialized
S71WS256NC0BFWAP2
Spansion
分类:Specialized
S71PL129NB0HFW4B0
Spansion
分类:Specialized
TH50VSF3581AASB
Toshiba America Electronic Components
分类:Specialized
TC518128AFL-10
Toshiba America Electronic Components
分类:Specialized
XC17S30VOG8C
AMD Xilinx
分类:Specialized
S72NS512PD0AHGL43
Spansion
分类:Specialized
PF38F5060M0Y0B0
Micron Technology Inc
分类:Specialized
PF38F5060M0Y0B0
Numonyx Memory Solutions
分类:Specialized
W25X20CLSVIG
Winbond
分类:Specialized
W25X40CLSVIG
Winbond
分类:Specialized
W29N01HVBINA
Winbond
分类:Specialized
W29N01HVBINF
Winbond
分类:Specialized
W29N01HVSINF
Winbond
分类:Specialized
W29N01HWBINF
Winbond
分类:Specialized
W29N01HZBINA
Winbond
分类:Specialized
W29N01HZSINF
Winbond
分类:Specialized
