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产品型号	品牌	数据表	库存	价格(含增值税)	数量	安装类型	包装/外壳	表面安装	引脚数	供应商器件包装	终端数量																			厂商																										操作温度	包装	系列	零件状态	温度系数	类型	电阻	最高工作温度	最小工作温度	应用	性别	HTS代码	子类别	额定功率	技术	端子位置	峰值回流焊温度（摄氏度）	端子间距	电阻器类型	Reach合规守则	频率	基本部件号	引脚数量	JESD-30代码	输出的数量	资历状况	工作电源电压	电源	内存大小	核心处理器	电源线保护	连接方式	建筑学	数据总线宽度
AGFB008R24C2E4X	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel					576	Tray	活跃	0°C ~ 100°C (TJ)		Agilex F																										1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT			EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG					MPU, FPGA														FPGA - 764K Logic Elements			-
5CSEBA2U19I7SN	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-FBGA	YES	484	484-UBGA (19x19)	484	Molex		活跃	121050	Bulk	MCU - 151, FPGA - 66	8542390000	Compliant	FBGA, BGA484,22X22,32	GRID ARRAY, FINE PITCH	PLASTIC/EPOXY	BGA484,22X22,32	1.1 V	未说明	1.07 V	有	5CSEBA2U19I7SN	FBGA	SQUARE	Intel Corporation	活跃	INTEL CORP	1.13 V	2	-40°C ~ 100°C (TJ)	Tray	Brad 121050 mPm	活跃		100 °C	-40 °C			8542.39.00.01	现场可编程门阵列		CMOS	BOTTOM	BALL	未说明	0.8 mm		compliant	800 MHz	5CSEBA2		S-PBGA-B484	66	不合格	1.1 V	1.1,1.2/3.3,2.5 V	CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	1.5 MB	800MHz	64KB	Single ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT			CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG				MCU, FPGA			66	1.9 mm	现场可编程门阵列	25000			ARM		FPGA - 25K Logic Elements	25000	--	19 mm	19 mm
XCZU4EV-3SFVC784E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	784-BFBGA, FCBGA	784-FCBGA (23x23)	AMD				252	Tray	XCZU4	活跃		0°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EV																										600MHz, 1.5GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT			CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG					MCU, FPGA												3		Zynq®UltraScale+™ FPGA, 192K+ Logic Cells			-
XCZU11EG-L2FFVB1517E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)	AMD				488	Tray	XCZU11	活跃		0°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG																										533MHz, 600MHz, 1.3GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG					MCU, FPGA														Zynq®UltraScale+™ FPGA, 653K+ Logic Cells			-
AGFA027R25A1E1V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	表面贴装	DO-214AB, SMC	DO-214AB (SMCJ)	MDE Semiconductor Inc				Tape & Reel (TR)	活跃	624	-55°C ~ 150°C (TJ)		5.0SMDJ			Zener				通用型																			1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT	无		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	86.7V	5000W (5kW)	39.7A	126V	MPU, FPGA		78V						1		-				FPGA - 2.7M Logic Elements			-
XCZU46DR-DIE4058	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1
XCZU47DR-1FFVG1517IES9819	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1		-	2 x 32 kB, 4 x 32 kB	2 x 32 kB, 4 x 32 kB	533 MHz, 1.3 GHz	930300 LE									XCZU47DR																																-																						6 Core
SOM-2533AN0C-S0A1	Advantech Corp	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Module		8						0°C ~ 60°C	Box	SMARC	活跃																									3.4GHz	4GB	Intel® N50	HDMI, LCD, LVDS, SATA			CANbus, Ethernet, I2C, I2S, MMC/SD/SDIO, PCIe, SPDIF, SPI, UART, USB					MPU
AMA3B1KK-KQR-B0	Ambiq Micro, Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	64-WFQFN Exposed Pad	64-QFN (8x8)						37	-40°C ~ 85°C (TA)	Tape & Reel (TR);Cut Tape (CT);Digi-Reel®	Apollo3 Blue	活跃																									96MHz	384KB	ARM® Cortex®-M4F	Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT			I2C, SPI, UART/USART					MCU																		1MB
AGFA023R24C3E3V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	2340-BFBGA Exposed Pad	2340-BGA (45x42)						480	0°C ~ 100°C (TJ)	Tray	Agilex F	活跃																									1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT			EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG					MPU, FPGA														FPGA - 2.3M Logic Elements
AGFA006R24C2I1VB	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	2340-BFBGA Exposed Pad	2340-BGA (45x42)						576	-40°C ~ 100°C (TJ)	Tray	Agilex F	活跃																									1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT			EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG					MPU, FPGA														FPGA - 573K Logic Elements
AGFA008R24C2E1VB	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	2340-BFBGA Exposed Pad	2340-BGA (45x42)						576	0°C ~ 100°C (TJ)	Tray	Agilex F	活跃																									1.4GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT			EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG					MPU, FPGA														FPGA - 764K Logic Elements
AGFD019R31C2E3V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	3184-BFBGA Exposed Pad	3184-BGA (56x45)						480	0°C ~ 100°C (TJ)	Tray	Agilex F	活跃																									1.4GHz	256KB	Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point	DMA, WDT			EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG					MPU, FPGA														FPGA - 1.9M Logic Elements
AGIB019R18A2I3E	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1805-BBGA Exposed Pad	1805-BGA (42.5x42.5)						480	-40°C ~ 100°C (TJ)	Tray	Agilex I	活跃																									1.4GHz	256KB	Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point	DMA, WDT			EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG					MPU, FPGA														FPGA - 1.9M Logic Elements
AGIA035R39A2E3E	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	3948-BFBGA Exposed Pad	3948-BGA (56x56)						576	0°C ~ 100°C (TJ)	Tray	Agilex I	活跃																									1.4GHz	256KB	Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point	DMA, WDT			EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG					MPU, FPGA														FPGA - 3.54M Logic Elements
XC7Z100-1FF900I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	900-BBGA, FCBGA	900-FCBGA (31x31)	AMD				Straight	Solder	法兰安装	RISC	1.5, 2, 2.5 V	FBGA	2	CAN/I2C/SPI/UART	130	Tray	XC7Z100	活跃		-40 to 100 °C		Zynq®-7000								Plug											900				1, 1.8 V			667MHz	256 KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA			CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG					MCU, FPGA	32 Bit												Kintex™-7 FPGA, 444K Logic Cells				-		86.1 mm	ARM Cortex A9
XA7Z010-1CLG400I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	400-LFBGA, CSPBGA	400-CSPBGA (17x17)	AMD	130	Tray	活跃					RISC	1.8, 3.3 V	CSBGA	1	CAN/GPIO/SPI/UART	表面贴装	-40 to 100 °C		Automotive, AEC-Q100, Zynq®-7000 XA																			400				1 V			667MHz	256 KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA			CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG					MCU, FPGA	32 Bit												Artix™-7 FPGA, 28K Logic Cells				-				ARM Cortex A9
AGIA040R39A1I2VB	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	3948-BFBGA Exposed Pad	3948-BGA (56x56)						576	-40°C ~ 100°C (TJ)	Tray	Agilex I	活跃																									1.4GHz	256KB	Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point	DMA, WDT			EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG					MPU, FPGA														FPGA - 4.047M Logic Elements
XC7Z035-1FFG900I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	900-BBGA, FCBGA	900-FCBGA (31x31)	AMD				275,000	FCBGA	1.0000 V	0.95 V	362	1.05 V	表面贴装	130	Tray	XC7Z035	活跃	Industrial grade		-40 to 100 °C		Zynq®-7000																			900							667MHz	256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA			CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG					MCU, FPGA										Industrial	1		Kintex™-7 FPGA, 275K Logic Cells	343,800			-
AGFA023R31C3E3V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	3184-BFBGA Exposed Pad	3184-BGA (56x45)						480	0°C ~ 100°C (TJ)	Tray	Agilex F	活跃																									1.4GHz	256KB	Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point	DMA, WDT			EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG					MPU, FPGA														FPGA - 2.3M Logic Elements
AGFB023R31C2E3E	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	3184-BFBGA Exposed Pad	3184-BGA (56x45)						480	0°C ~ 100°C (TJ)	Tray	Agilex F	活跃																									1.4GHz	256KB	Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point	DMA, WDT			EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG					MPU, FPGA														FPGA - 2.3M Logic Elements
R8A77970LA01BA#GB	Renesas Electronics Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1									Tray		活跃
AGIC035R39A2E3E	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	3948-BFBGA Exposed Pad	3948-BGA (56x56)						576	0°C ~ 100°C (TJ)	Tray	Agilex I	活跃																									1.4GHz	256KB	Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point	DMA, WDT			EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG					MPU, FPGA														FPGA - 3.54M Logic Elements
XCVM2902-1LSEVFVF1760	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1		+ 100 C	0 C	1	Xilinx	Xilinx																			SOC - Systems on a Chip													700 mV																						System-On-Modules - SOM											SoC FPGA
XCVM1302-2LLEVFVC1596	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1596-BFBGA	1596-BGA (37.5x37.5)	AMD 赛灵思				+ 110 C	0 C	1	Xilinx	Xilinx	532	Tray	活跃		0°C ~ 100°C (TJ)		Versal™ Prime		50 ppm/°C		162 kOhm						SOC - Systems on a Chip	0.25 W					高可靠性							700 mV			450MHz, 1.08GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe			CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG					MPU, FPGA							System-On-Modules - SOM					1	Versal™ Prime FPGA, 70k Logic Cells				-	SoC FPGA	3.2	1.6