category.集成电路IC_category.集成电路IC品牌厂家，型号_价格_规格

类别是'category.片上系统（SoC）' (7695)

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产品型号	品牌	数据表	库存	价格(含增值税)	数量	包装/外壳	供应商器件包装					厂商							操作温度	包装	系列	零件状态	温度系数	电阻	子类别	额定功率	电阻器类型	工作电源电压	速度	内存大小	核心处理器	周边设备	连接方式	建筑学	产品类别	电阻公差	主要属性	闪光大小
XQVP1202-1LSIVSQA2785	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	150 V	+ 110 C	- 40 C		1	Xilinx	Xilinx			AEC-Q200					100 ppm/K	49.9	SOC - Systems on a Chip	0.125 W	通用型	700 mV							System-On-Modules - SOM	1			SoC FPGA	2 mm	1.25 mm
XCVP1702-2MLELSVC4072-ES9749	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Xilinx		Xilinx			+ 110 C	0 C	1					50.0000 ppm/°C	25.5 kOhm	SOC - Systems on a Chip	0.1 W		800 mV							System-On-Modules - SOM	1			SoC FPGA	7.06
XCVE2102-2LLESBVA625	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	0 C	1		Xilinx	Xilinx			AEC-Q200	+ 110 C					100 ppm/K	68 kOhm	SOC - Systems on a Chip	0.1 W	通用型	700 mV							System-On-Modules - SOM	1			SoC FPGA	1.55 mm	0.85 mm
XCVE2202-1LSISFVA784	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Xilinx		Xilinx			+ 110 C	- 40 C	1					100 ppm/K	9.09 kOhm	SOC - Systems on a Chip	0.05 W	通用型	700 mV							System-On-Modules - SOM	1			SoC FPGA	0.6 mm	0.3 mm
XQVC1902-2MSIVSQA2197	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Xilinx		Xilinx			+ 110 C	- 40 C	1							SOC - Systems on a Chip	125 mW	High Reliability, MIL-PRF-55182	800 mV							System-On-Modules - SOM	0.5			SoC FPGA
XCVE2102-1LLISBVA625	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	- 40 C	1		Xilinx	Xilinx			32 V	+ 110 C							SOC - Systems on a Chip			700 mV							System-On-Modules - SOM				SoC FPGA
XCVE1752-1LSEVSVA2197	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	2197-BFBGA, FCBGA	2197-FCBGA (45x45)	1	Xilinx	AMD 赛灵思	Xilinx	608	Tray	活跃	+ 100 C	0 C	0°C ~ 100°C (TJ)		Versal™ AI Core		100 ppm/K	91 Ohm	SOC - Systems on a Chip	1 W	Pulse Proof, High Power	700 mV	400MHz, 1GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA	System-On-Modules - SOM	1	Versal™ AI Core FPGA, 1M Logic Cells	-	SoC FPGA
XCZU55DR-2FFVE1156I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	AMD 赛灵思	Tray	活跃	1	Xilinx	Xilinx	-	-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ RFSoC DR		100.0000 ppm/°C	392 kOhm	SOC - Systems on a Chip	0.25 W			533MHz, 1.3GHz	-	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA	1	Zynq® UltraScale+™ RFSoC	-	SoC FPGA	10.8
XCVE2002-2MLISBVA484	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Xilinx		Xilinx			+ 110 C	- 40 C	1					50.0000 ppm/°C	1.5	SOC - Systems on a Chip	10.0000 W		800 mV							System-On-Modules - SOM	1			SoC FPGA	32.51 mm
XCZU65DR-1FFVE1156I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1				700 V	1	Xilinx	Xilinx							SOC - Systems on a Chip													SoC FPGA
XCVM2202-2MSIVSVC2197	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Xilinx		Xilinx			+ 110 C	- 40 C	1					50.0000 ppm/°C	634 Ohm	SOC - Systems on a Chip	0.5 W	Industrial	800 mV							System-On-Modules - SOM	1			SoC FPGA	6.1
XCZU55DR-1FSVE1156I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	AMD 赛灵思	Tray	活跃	1	Xilinx	Xilinx	-	-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ RFSoC DR		100 ppm/K	680 Ohm	SOC - Systems on a Chip	0.05 W	通用型		500MHz, 1.2GHz	-	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA	1	Zynq® UltraScale+™ RFSoC	-	SoC FPGA	0.6 mm	0.3 mm
XQVP1202-1MLIVSQA2785	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	- 40 C	1		Xilinx	Xilinx			AEC-Q200	+ 110 C					100 ppm/K	2.2 Ohm	SOC - Systems on a Chip	0.75 W	通用型	800 mV							System-On-Modules - SOM	1			SoC FPGA	5 mm	2.5 mm
XCVE2002-1MSESBVA625	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	AEC-Q200	+ 100 C	0 C		1	Xilinx	Xilinx			75 V					50 ppm/K	18	SOC - Systems on a Chip	0.1 W	Semi-Precision	800 mV							System-On-Modules - SOM	0.5			SoC FPGA	1.55 mm	0.85 mm
XCVE2102-2MLESBVA625	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Xilinx		Xilinx			+ 110 C	0 C	1							SOC - Systems on a Chip	125 mW	High Reliability, MIL-PRF-39017	800 mV							System-On-Modules - SOM	1			SoC FPGA
XCVM2502-2MSEVSVC2197	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	0 C	1		Xilinx	Xilinx			250 V	+ 110 C					25.0000 ppm/°C	100	SOC - Systems on a Chip	0.25 W	High Reliability, MIL-PRF-55182	800 mV							System-On-Modules - SOM	0.1			SoC FPGA	8.89 mm
XCZU67DR-L1FFVE1156I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1		1	Xilinx	Xilinx									SOC - Systems on a Chip													SoC FPGA
AGIA035R39A1E2VB	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	3948-BFBGA Exposed Pad	3948-BGA (56x56)	576		0°C ~ 100°C (TJ)	Tray	Agilex I	活跃							1.4GHz	256KB	Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point	DMA, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA			FPGA - 3.54M Logic Elements
AGFD023R31C2E4X	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	3184-BFBGA Exposed Pad	3184-BGA (56x45)	480		0°C ~ 100°C (TJ)	Tray	Agilex F	活跃							1.4GHz	256KB	Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point	DMA, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA			FPGA - 2.3M Logic Elements
AGFB023R31C2I3E	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	3184-BFBGA Exposed Pad	3184-BGA (56x45)	480		-40°C ~ 100°C (TJ)	Tray	Agilex F	活跃							1.4GHz	256KB	Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point	DMA, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA			FPGA - 2.3M Logic Elements
AGIA035R39A2I1VB	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	3948-BFBGA Exposed Pad	3948-BGA (56x56)	576		-40°C ~ 100°C (TJ)	Tray	Agilex I	活跃							1.4GHz	256KB	Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point	DMA, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA			FPGA - 3.54M Logic Elements
AGFA023R31C2E4X	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	3184-BFBGA Exposed Pad	3184-BGA (56x45)	480		0°C ~ 100°C (TJ)	Tray	Agilex F	活跃							1.4GHz	256KB	Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point	DMA, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA			FPGA - 2.3M Logic Elements
AGIA040R39A2E2VB	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	3948-BFBGA Exposed Pad	3948-BGA (56x56)	576		0°C ~ 100°C (TJ)	Tray	Agilex I	活跃							1.4GHz	256KB	Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point	DMA, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA			FPGA - 4.047M Logic Elements
AGFB008R24D1E2V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	2340-BFBGA Exposed Pad	2340-BGA (45x42)			0°C ~ 100°C (TJ)	Tray	Agilex F	活跃							1.4GHz	256KB	Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point	DMA, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA			FPGA - 764K Logic Elements
AGFB019R31C3I3E	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	3184-BFBGA Exposed Pad	3184-BGA (56x45)	480		-40°C ~ 100°C (TJ)	Tray	Agilex F	活跃							1.4GHz	256KB	Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point	DMA, WDT	EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA			FPGA - 1.9M Logic Elements